CN109890124A - The incorgruous penetration type conductive fabric glue of multilayer and the FPC reinforcement shielding construction for using it - Google Patents
The incorgruous penetration type conductive fabric glue of multilayer and the FPC reinforcement shielding construction for using it Download PDFInfo
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- CN109890124A CN109890124A CN201711275157.5A CN201711275157A CN109890124A CN 109890124 A CN109890124 A CN 109890124A CN 201711275157 A CN201711275157 A CN 201711275157A CN 109890124 A CN109890124 A CN 109890124A
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- adhesive layer
- conductive adhesive
- metal
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- 239000004744 fabric Substances 0.000 title claims abstract description 104
- 239000003292 glue Substances 0.000 title claims abstract description 48
- 230000035515 penetration Effects 0.000 title claims abstract description 23
- 230000002787 reinforcement Effects 0.000 title claims abstract description 16
- 238000010276 construction Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 139
- 239000002184 metal Substances 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims abstract description 106
- 239000012790 adhesive layer Substances 0.000 claims abstract description 91
- 239000002245 particle Substances 0.000 claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 241000555268 Dendroides Species 0.000 claims abstract 2
- 239000000843 powder Substances 0.000 claims description 38
- 229910000831 Steel Inorganic materials 0.000 claims description 34
- 239000010959 steel Substances 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000004840 adhesive resin Substances 0.000 claims description 17
- 229920006223 adhesive resin Polymers 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000007800 oxidant agent Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 238000003825 pressing Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 239000002313 adhesive film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- 230000009172 bursting Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- -1 amido formate Chemical compound 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 206010003084 Areflexia Diseases 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004836 Glue Stick Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Abstract
The invention discloses a kind of incorgruous penetration type conductive fabric glue of multilayer and use its FPC reinforcement shielding construction, wherein conductive fabric glue includes upper conductive adhesive layer, lower conductive adhesive layer and is formed in ultra-thin conductive layer of cloth between the two, upper conductive adhesive layer with a thickness of 15-25 μm, lower conductive adhesive layer with a thickness of 35-45 μm, upper and lower conductive adhesive layer all includes metal conductive particles, metal conductive particles be dendroid, chain, it is needle-shaped, laminar and spherical at least two, the partial sizes of metal conductive particles is 40-100 μm；Ultra-thin conductive layer of cloth with a thickness of 5-15 μm.The present invention can be in the case where FPC be without reserved ground hole, fabulous earthing effect and effectiveness are formed in conjunction with supporting material and EMI film, and there are the characteristics such as electrical characteristic is good, Bonding strength is good, solderability is good, reliability is good, and flame resistance is good, and production process can be reduced, save production cost.
Description
Technical field
The invention belongs to printed wiring board conductive fabric technical field, in particular to a kind of incorgruous penetration type conductive fabric of multilayer
Glue and reinforcement shielding construction.
Background technique
The development trend of electronics and communication product requires circuit substrate component towards light and short and highly integrated development, passes
Defeated signal frequency band is more and more wider, causes electromagnetic interference increasingly severe；Simultaneously in view of electric circuitry packages are using safe
Property, new demand had also been proposed to circuit unit ground connection reliability and board design freedom degree in electronic product, in existing market
Will appear using more universal conducting resinl product completely influences the design installation of other assemblies because conducting resinl will be grounded aperture filling too
Or filling is discontented that coupling part is caused when Reflow Soldering the defects of plate bursting occur there are gap.
In addition, the FPC reinforcement shielding construction of the prior art, as shown in Figure 1, steel disc 200, FPC 300, the first ground hole
301, EMI film 400 and conductive adhesive film 600, FPC open up the first ground hole 301, the top covering of the first ground hole and part FPC
Conductive adhesive film, the top of conductive adhesive film press steel disc, and after hot pressing, the glue-line melting of conductive adhesive film flows into ground hole and leads with FPC
It is logical, it is used for earth shield, since the requirement in existing market in FPC processing procedure to ground connection aperture is smaller and smaller, downstream punching technology
Technical requirements are higher and higher, but because of the reasons such as the excessive glue mobility of glue itself, turn-on effect of the conducting resinl material to very low pore size
It is all ideal not to the utmost, it is badly in need of a new material and improves very low pore size (≤0.5mm) earthing effect and stability.There are also new at present
Technology and patent refer to the conduction that the thin coat of metal is embedded in conductive adhesion coating and improves conducting resinl product, reduce powder and contain
Amount is theoretically set up completely with reducing cost, but since metal flexibility itself is bad in actual production process, product after pressing
Filling perforation can not achieve the desired results, it is possible to it is even worse, while the coat of metal because its gas permeability it is bad, in FPC (printed wire
Plate) SMT (surface mounting technology) is crossed in processing procedure that plate bursting hidden danger can occur.
We devise a kind of incorgruous type height comprising ultra-thin conductive layer of cloth being made of variform metal powder and lead thus
General character multilayer conductive cloth glue.
Summary of the invention
It is used herein the invention mainly solves the technical problem of providing a kind of incorgruous penetration type conductive fabric glue of multilayer
Conductive fabric glue can be tied in the case where FPC is without reserved ground hole (traditional need reserved ground hole) with supporting material and EMI
Conjunction forms fabulous earthing effect and effectiveness, with electrical characteristic is good, Bonding strength is good, solderability is good, reliability
Good, the characteristics such as flame resistance is good compare general conducting resinl, can in the case where FPC is without reserved ground hole, with supporting material and
EMI (electromagnetic interference) is combined and is formed splendid turn-on effect and shielding action, and can reduce production process, saves production cost,
Market application prospect is extensive.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: the present invention provides a kind of multilayer is different
To penetration type conductive fabric glue, including upper conductive adhesive layer, ultra-thin conductive layer of cloth and lower conductive adhesive layer, the ultra-thin conductive
Layer of cloth is formed between the upper conductive adhesive layer and the lower conductive adhesive layer；
The upper conductive adhesive layer with a thickness of 15-25 μm, the lower conductive adhesive layer with a thickness of 35-45 μm,
The upper conductive adhesive layer and the lower conductive adhesive layer all include metal conductive particles, and the metal conductive particles are tree
At least two in dendrite metallic powder, chain-like metal powder, needle-like metal powder, platelet-like metal powder and ball-type metal powder
Kind, the partial size of the metal conductive particles is 40-100 μm；
The ultra-thin conductive layer of cloth with a thickness of 5-15 μm, the upper and lower surface of the ultra-thin conductive layer of cloth or in which one side
For the coat of metal.
Further say, the upper conductive adhesive layer and the lower conductive adhesive layer be all including adhesive resin and
The ratio of the thermosetting property glue-line of the metal conductive particles, the adhesive resin is 20-75% (weight ratio), and the metal is led
The ratio of charged particle is 25-70% (weight ratio), and the metal conductive particles and the adhesive resin ratio are 1:1-4:1
(weight ratio).
It further says, the ultra-thin conductive layer of cloth is fiber cloth, and the fiber cloth is grid cloth, flat fabric or nonwoven
Cloth, the size of the micropore of the fiber cloth allow the smallest metal in the upper conductive adhesion coating and the lower conductive adhesion coating to lead
Charged particle passes through.
Preferably, size >=5 μm of the micropore of the fiber cloth.
It further says, the coat of metal of the ultrathin conductive fabric layer surface is copper facing nickel layer, copper facing cobalt layers, plating copper and tin
Layer, copper facing silver layer, plating copper and iron nickel layer, copper facing layer gold or copper plate.
Further to say, the metal conductive particles are two kinds of mixing of needle-like metal powder and ball-type metal powder,
The ratio of the needle-like metal powder and ball-type metal powder is 1:4-4:1 (weight ratio).
It further says, the metal conductive particles include alloy conductive particle.
It further says, is covered each by above the lower section of the lower conductive adhesive layer and the upper conductive adhesive layer
Have release film layer or a carrier layer, the release film layer or carrier layer with a thickness of 25-100 μm；The release film layer is PET
Fluorine moulds release film layer, PET silicate-containing oil release film layer, PET matt release film layer, PE release film layer or PE lamination paper layer；It is described from
Type film layer is two-sided release film layer or single-sided parting film layer.
The present invention also provides a kind of FPC reinforcement shielding construction using the incorgruous penetration type conductive fabric glue of multilayer,
Including steel disc, EMI film and FPC, for the conductive fabric sticker together in the lower surface of the steel disc, the EMI film fits in described lead
The lower surface of electric cloth glue, the FPC fit in the lower surface of the EMI film；
The steel disc with a thickness of 0.05-0.2mm；
The EMI film includes ink layer and conductive adhesive layer, and the ink layer is located at the top of the conductive adhesive layer, described
The overall thickness of EMI film be 10-20 μm, and the ink layer with a thickness of 5-10 μm, the conductive adhesive layer with a thickness of 5-10 μm.
It further says, the steel disc is nickel plating steel disc, and the overall thickness of the nickel plating steel disc is 0.05-0.2mm.
Invention further provides the production methods of the incorgruous penetration type conductive fabric glue of multilayer described in one kind, including walk as follows
It is rapid:
Step 1:, will by the powder of the metal conductive particles of each shape respectively after screening screening obtains required partial size
The metal conductive particles of each shape are uniformly mixed, and obtain metal conductive particles mixture；
Step 2: adding metal conductive particles and adhesive resin in proportion, mixes them thoroughly uniformly；
Step 3: it is specified in release film layer or carrier layer i.e. lower conductive viscous from mixture made from shape face application step two
Oxidant layer；
Step 4: the one side fitting of ultra-thin conductive layer of cloth is solidified to the table of the lower conductive adhesive layer described in step 3
Face；
Step 5: in the other one side i.e. upper conductive adhesion of mixture made from application step two again of ultra-thin conductive layer of cloth
Oxidant layer, then release film layer or carrier layer are bonded on the surface of upper conductive adhesive layer；
Step 6: solidification, winding, slitting are to get finished product.
The beneficial effects of the present invention are: of the invention has at least the following advantages:
One, using the metal conductive particles to come in every shape in multilayer conductive cloth glue of the invention, and be partial size be 40-100 μ
The bulky grain metal conductive particles of m, because ultra-thin conductive layer of cloth is relatively thin, the conductive fabric glue in conjunction with steel disc after through downstream press make
Cheng Hou forms FPC reinforcement shielding construction, on the one hand, wherein metal conductive particles can be realized by the ground hole in conductive fabric
The connection of lower conductive adhesive layer, is on the one hand, closes with EMI membrane pressure in FPC, and ink layer in EMI film is pierced through, realize with
Not the effect that conductive adhesive layer is directly connected in EMI film can be saved and reserve this program of the ground hole of small-bore in present FPC, i.e.,
Need punching that the effect of ground connection and electromagnetic shielding can be realized in such a way that steel disc fitting conductive fabric glue is sticked on close EMI film again,
Compared with current existing conductive adhesive film, it can effectively solve it and encounter very low pore size in FPC processing procedureConduction
And the insufficient defect of stability, while this processing procedure process of punching is saved, cost and manpower are saved for FPC making technology；
Certainly, it is suitable for the case where reserving the ground hole of small-bore in FPC, turn-on effect, which is better than, in such cases adopts
Turn-on effect when with common conductive film；
It two, include the metallic conduction of at least two shapes in upper conductive adhesive layer and lower conductive adhesive layer of the invention
Particle can tend to multi-direction flowing when being generated deformation by hot pressing, make since metal conductive particles have various shapes
After pressing distribution of the metal conductive particles in conductive adhesive layer have multidirectional and polymolecularity, and then on soft board
Ground hole forms turning circuit, so that upper conductive adhesive layer and lower conductive adhesive layer have good Anisotropically conductive, greatly
Width promotes electric conductivity, can reduce the impedance ground value of soft board；
Three, ultra-thin conductive layer of cloth of the invention be conducive in conductive adhesive layer up and down because of its threadiness or reticular structure plus
The metal conductive particles entered realize the connection of conductive adhesive layer up and down by micropore therein, while because its is good ventilative
Property, in the processing procedure of the downstream FPC by SMT be not in plate bursting phenomenon, can effectively solve present market circulation conducting resinl and
Bury the plate bursting problem that coat of metal conducting resinl can encounter；
Four, ultra-thin conductive layer of cloth of the invention is because using fiber cloth as substrate, having good flexibility and wearability, in this way
It will not be deformed because hardness is excessive when FPC is by hot pressing, cause material property bad, while up and down in conductive adhesive layer
Metal conductive particles realize incorgruous conducting because adhesive resin material is generated due to deformation is flowed by hot pressing, can effectively avoid tradition
Conducting resinl and the bad defect of the thin metal mold conducting resinl turn-on effect of addition；
Five, since ultra-thin conductive layer of cloth itself of the invention passes through the processing of plating metal coating, in the feelings of equally conducting power
Under condition, the metal conductive particles ratio being added in upper conductive adhesive layer and lower conductive adhesive layer can be reduced accordingly, can be reduced
Dust pollution reduces cost, and product Bonding strength can increase substantially；
Six, after pressing, through a period of time high-temperature maturing, the metal conductive particles of multidirectional can promote adhesive resin and reach
Electrical resistance and mechanical properties after to fully crosslinked solidification；
Seven, when the metal parts such as conductive fabric glue of the invention and steel disc formation strengthening part is posted to printed wiring board,
Because having good ground connection stability that can realize the purpose of effectively shielding extraneous electromagnetic wave interference；
Eight, when metal conductive particles of the invention include alloy conductive particle, there is splendid inoxidizability and conduction
Property, it is carried convenient for product storage, and will not influence the physical property of product, keeps product stabilization, reliability higher；
Nine, conductive fabric glue of the invention is applied to composition FPC reinforcement after be bonded in FPC with steel disc or stiffening plate etc. and shields
Structure can effectively prevent deforming installation position because of reasons such as bendings, while because steel disc stiffening property is preferably conducive to operation and FPC
The operations such as components installation carrying；It can reach by pressing and wherein the puncture effect of big metallic and do not reserved in FPC
Ground hole is directly grounded the effect with shielding extraneous signal interference.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the FPC reinforcement shielding construction of the film containing common conductive of the prior art；
Fig. 2 is the structural schematic diagram of the conductive fabric glue of the embodiment of the present invention 1 (without release film layer or carrier layer)；
Fig. 3 is the structural schematic diagram of the conductive fabric glue of the embodiment of the present invention 1 (containing release film layer or carrier layer)；
Fig. 4-1 is the structural schematic diagram of the FPC reinforcement shielding construction of the embodiment of the present invention 2；
Fig. 4-2 is the structural schematic diagram of the FPC reinforcement shielding construction of the embodiment of the present invention 3；
Fig. 5 is the structural schematic diagram of present invention test one；
The structural schematic diagram of Fig. 6 present invention test two；
Description of symbols:
100-conductive fabric glue；
101-upper conductive adhesive layers；
1011- metal conductive particles；
1012- adhesive resin；
102-ultra-thin conductive layer of cloths；
Conductive adhesive layer under 103-；
104- release film layer or carrier layer；
200-steel discs；
300—FPC；
301-the first ground hole；
The second ground hole of 302-；
400-EMI films；
401-ink layers；
402-conductive adhesive layers；
500-single-side coated copper plates；
600- conductive adhesive film.
Specific embodiment
Illustrate a specific embodiment of the invention below by way of particular specific embodiment, those skilled in the art can be by this
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also give in further, different ways
Implement, that is, can be in different modification and change under the scope of revealed without departing substantially from this present invention.
Embodiment 1: a kind of incorgruous penetration type conductive fabric glue 100 of multilayer, as shown in Figures 2 and 3, including upper conductive adhesive
Layer 101, ultra-thin conductive layer of cloth 102 and lower conductive adhesive layer 103, the ultra-thin conductive layer of cloth 102 are formed in the upper conduction
Between adhering agent layer and the lower conductive adhesive layer；
The upper conductive adhesive layer 101 with a thickness of 15-25 μm, the lower conductive adhesive layer 103 with a thickness of 35-
45 μm, the upper conductive adhesive layer and the lower conductive adhesive layer all include metal conductive particles, the metallic conduction grain
Son is in dendritic metal powder, chain-like metal powder, needle-like metal powder, platelet-like metal powder and ball-type metal powder
At least two, the partial size of the metal conductive particles is 40-100 μm；
The ultra-thin conductive layer of cloth 102 with a thickness of 5-15 μm, the upper and lower surface of the ultra-thin conductive layer of cloth or in which it
It is on one side the coat of metal.
Ultra-thin conductive layer of cloth is too thick to be will lead to metal conductive particles in conductive adhesive layer up and down and can not contact, and is contacted up and down
It is bad, it is too thin to be unfavorable for producing, increase production cost, and ultra-thin conductive layer of cloth has splendid flexibility and wearability, it can be with
Improve product reliability and shielding properties.
Preferably, the partial size of the metal conductive particles is 40-80 μm；It is furthermore preferred that the grain of the metal conductive particles
Diameter is 51-80 μm；The metal conductive particles are needle-like metal powder and two kinds of ball-type metal powder mixing, wherein the needle
The ratio of shape metal powder and ball-type metal powder is 1:4-4:1 (weight ratio).When ratio is lower than 1:1, conduction is bad, gluing
Agent resin more the problems such as will cause downstream process haftplatte, when ratio is higher than 4:1, powder ratio is higher, to powder dispersing technology
More demanding, adherence and Bonding strength can all receive influence.
It is preferred that the overall thickness of the ultra-thin conductive layer of cloth, upper conductive adhesion coating and lower conductive adhesion coating is 40-
60um, conductive adhesive layer is too thin, and shield effectiveness is bad, and glue-line is too thick, is not suitable with slimming and requires, and coating waste water requirement
It is higher, increase production cost indirectly.
The traditionally only conducting particles of single shape in conductive adhesive layer and lower conductive adhesive layer, is dispersing and is pressing
Interflow all tends to same direction movement and arrangement when dynamic, conductive adhesive layer can be made to tend to same direction in conduction, caused
Conductive adhesive layer entirety conduction is bad, and then causes the shield effectiveness of conductive adhesive layer bad, and the present invention uses more
The metal conductive particles of kind shape tend to multi-direction stream after generating deformation when being dispersed to conductive adhesive layer and by hot pressing
Dynamic and arrangement makes branch of the metal conductive particles in conductive adhesive layer after pressing have multidirectional and polymolecularity, from
And make conductive adhesive layer that there is preferable incorgruous conduction, promote shielding properties.
The upper conductive adhesive layer and the lower conductive adhesive layer are all to lead including adhesive resin and the metal
The thermosetting property glue-line of charged particle, the ratio of the adhesive resin are 20-75% (weight ratio), the ratio of the metal conductive particles
Example is 25-70% (weight ratio), and the metal conductive particles and the adhesive resin ratio are 1:1-4:1 (weight ratio).This
Some auxiliary materials (such as curing agent or adhesion agent may also be contained in the upper conductive adhesive layer and lower conductive adhesive layer of invention
Deng) and radio frequency particle (such as graphite or conductive compound etc.).
Preferably, it is preferred that metal conductive particles in the upper conductive adhesive layer and the lower conductive adhesive layer
Ratio is 35-55% (weight ratio).
The adhesive resin be epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin,
Gather in ring diformazan benzene series resin, bismaleimide amine system resin, phenolic resin, melamine resin and polyimide resin
It is at least one.It is preferred that acrylic resin.
The very little viscosity of adhesive resin is too low, is unfavorable for online production, and the product viscosity produced too much is stronger, and metal
It is bad that the reduction of conducting particles relative amount will lead to conduction.
The ultra-thin conductive layer of cloth 102 is fiber cloth, and the fiber cloth is grid cloth, flat fabric or non-woven fabrics, the fibre
The size for tieing up the micropore of cloth allows the smallest metal conductive particles in the upper conductive adhesion coating and the lower conductive adhesion coating logical
It crosses.
The coat of metal of the ultrathin conductive fabric layer surface be copper facing nickel layer, copper facing cobalt layers, copper facing tin layers, copper facing silver layer,
Plate copper and iron nickel layer, copper facing layer gold or copper plate.
Preferably, the coat of metal of the ultrathin conductive fabric layer surface is copper facing nickel layer or copper facing silver layer.
The metal conductive particles are two kinds of mixing of needle-like metal powder and ball-type metal powder, the needle-like metal
The ratio of powder and ball-type metal powder is 1:4-4:1 (weight ratio).
The metal conductive particles include alloy conductive particle.The metal conductive particles are monometallic conducting particles and conjunction
At least one of golden conducting particles.Preferably, the metal conductive particles include alloy conductive particle.
Wherein, the monometallic conducting particles can be at least one in gold particle, silver particles, copper particle and nickel particles
Kind, but not limited to this；The alloy conductive particle can be silver plated copper particles, silver-plated gold particle, silver-plated nickel particles, gold-plated copper particle
At least one of son and gold-plated nickel particle, but not limited to this.
The inoxidizability and conductibility of alloy conductive particle are preferable, and product is carried convenient for storage, and will not influence product
Physical property stablizes product, and reliability is high.
The lower section of the lower conductive adhesive layer 103 and the top of the upper conductive adhesive layer 101 be respectively formed with from
Type film layer or carrier layer 104, the release film layer or carrier layer 104 with a thickness of 25-100 μm；The release film layer is
PET fluorine moulds release film layer, PET silicate-containing oil release film layer, PET matt release film layer, PE release film layer or PE lamination paper layer；It is described
Release film layer is two-sided release film layer or single-sided parting film layer.
The release film layer can two-sided or single side it is release, with it is two-sided it is release be preferred, thickness is preferred with 25-100 μm, too thin
Or the too thick following process that is unfavorable for is punched.
The fractal film layer color is pure white, milky or Transparent color, preferentially selects pure white or milky.Numerical control is certainly
When dynamicization equipment carves route, infrared induction, white areflexia optical issue can be positioned with fast accurate, process operation, and people
When work handwork, white has recognition reaction, prevents from artificially leaking and tear.
The production method of the incorgruous penetration type conductive fabric glue of the multilayer, includes the following steps:
Step 1:, will by the powder of the metal conductive particles of each shape respectively after screening screening obtains required partial size
The metal conductive particles of each shape are uniformly mixed, and when mixing can take ball milling, and (rotational speed of ball-mill is not easy excessively high, otherwise can lead metal
Charged particle surface layer alloy damage layer, preferentially selects 200-300r/min) or agitating mode (revolving speed 700-2000r/min, revolving speed height
A little mixing uniformity can be preferable), metal conductive particles mixture is obtained after mixing；
Step 2: adding metal conductive particles and adhesive resin in proportion, mixes them thoroughly uniformly, needs Bian Tianjia golden
Belong to the mixing of conducting particles side, mixing condition is similar with step 1；
Step 3: it is specified in release film layer or carrier layer i.e. lower conductive viscous from mixture made from shape face application step two
Oxidant layer；
Step 4: the one side fitting of ultra-thin conductive layer of cloth is solidified to the surface of the lower conductive adhesive layer described in step 3
(precuring temperature no more than adhesive resin itself solidification temperature, the present invention in precuring temperature selection at 80-100 DEG C
Subsequent production is convenient in centre) remove carrier later, i.e., ultra-thin conductive layer of cloth is formed on lower conductive adhesive layer；
Step 5: in the other one side i.e. upper conductive adhesion of mixture made from application step two again of ultra-thin conductive layer of cloth
Oxidant layer, then release film layer or carrier layer are bonded on the surface of upper conductive adhesive layer；
Step 6: with reference to the solidification of step 4 precuring condition, winding, slitting to get finished product.
Embodiment 2: as shown in Fig. 4-1, a kind of FPC reinforcement shielding using the incorgruous penetration type conductive fabric glue of multilayer
Structure, including steel disc 200, EMI film 400 and FPC 300, lower surface of the conductive fabric sticker together in the steel disc, the EMI
Film fits in the lower surface of the conductive fabric glue, and the FPC fits in the lower surface of the EMI film；
The steel disc with a thickness of 0.05-0.2mm；
The EMI film 400 includes ink layer 401 and conductive adhesive layer 402, and the ink layer is located at the upper of the conductive adhesive layer
Side, the overall thickness of the EMI film are 10-20 μm, and the ink layer with a thickness of 5-10 μm, the conductive adhesive layer with a thickness of
5-10μm。
The steel disc is nickel plating steel disc, and the overall thickness of the nickel plating steel disc is 0.05-0.2mm.
Preferably, the overall thickness of the nickel plating steel disc is 0.1mm.
It is preferred that on the FPC and being located at the lower section of the conductive fabric glue without reserved ground hole 301.
In FPC reinforcement shielding construction, after steel disc pressing, the metal conductive particles in conductive fabric glue pierce through the oil of EMI film
Layer of ink is directly connected with the conductive adhesive layer of EMI film, and is transferred to the second ground hole that FPC offers large aperture by conductive adhesive layer
302 position, earth-continuity, therefore FPC can be saved and be located at the first ground hole 301 of the reserved small-bore in lower section of EMI film (as schemed
Shown in 1) this program, that is, do not need punching steel disc be bonded conductive fabric glue stick on again close EMI film by way of can be realized and connect
The effect on ground and electromagnetic shielding can effectively solve it and encounter very low pore size in FPC processing procedure compared with current existing conductive adhesive filmConduction and the insufficient defect of stability, while this processing procedure process of punching is saved, it is FPC making technology
Save cost and manpower.
Embodiment 3: as shown in the Fig. 4-2, the FPC reinforcement shielding construction includes steel disc 200, the ground connection of FPC 300, first
Hole 301, EMI film 400 and conductive fabric glue 100, FPC open up the first ground hole 301 and the second ground hole 302, steel disc 200 and FPC
Between have conductive fabric glue.I.e. the top of the first ground hole 301 and part FPC cover conductive fabric glue, the top pressure of conductive fabric glue
Close steel disc.
After hot pressing, the upper and lower conductive adhesive layer melting of conducting adhesive cloth glue flows into the first ground hole 301 and is connected with FPC,
It is solved compared to background technique using the reasons such as the excessive glue mobility of common conductive glue film itself, such feelings for earth shield
Turn-on effect when turn-on effect is also better than using common conductive film under condition.
Test one: as shown in figure 5, carrying out conduction point to the incorgruous penetration type conductive fabric glue of the multilayer after release film layer is removed
Analysis test: conduction analysis test is carried out with high bridge tester, in upper conductive adhesive layer 101 and lower conductive adhesive layer 103
After surface is bonded the steel disc 200 and FPC 300 of nickel coating respectively, test sample crosses conduction before and after Reflow Soldering respectively for pressing solidification
Resistance value data, will make test as embodiment to the present invention, in kind the electric conductivity of test common product as than
Compared with example, the conduction result measured is reported in Table 1 below.
Test two: as shown in fig. 6, equally being shelled to the incorgruous penetration type conductive fabric glue of multilayer after the two-sided release film of removing
It analyzes and tests from power: peeling force analysis test is carried out with tensilon, in upper conductive adhesive layer and lower conductive adhesive layer
Respectively after the steel disc 200 and single-side coated copper plate 500 of false patch nickel coating, test removing force value is taken out in pressing solidification on surface, will be to this
Invention makees test as embodiment, and in kind the peeling force of test common product is as comparative example, the conducting that will be measured
Property result is recorded in table 1.
Table 1
As seen from the above table, the incorgruous penetration type conductive fabric glue of multilayer of the invention has good really compared to common product
Conductive effect, stability and good Bonding strength.Because of non-aperture, no puncture effect is not turned on general conducting resinl.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields, similarly
It is included within the scope of the present invention.
Claims (10)
1. a kind of incorgruous penetration type conductive fabric glue of multilayer, it is characterised in that: including upper conductive adhesive layer, ultra-thin conductive layer of cloth and
Lower conductive adhesive layer, the ultra-thin conductive layer of cloth be formed in the upper conductive adhesive layer and the lower conductive adhesive layer it
Between；
The upper conductive adhesive layer with a thickness of 15-25 μm, the lower conductive adhesive layer with a thickness of 35-45 μm, it is described
Upper conductive adhesive layer and the lower conductive adhesive layer all include metal conductive particles, and the metal conductive particles are dendroid
At least two in metal powder, chain-like metal powder, needle-like metal powder, platelet-like metal powder and ball-type metal powder,
The partial size of the metal conductive particles is 40-100 μm；
The ultra-thin conductive layer of cloth with a thickness of 5-15 μm, the upper and lower surface of the ultra-thin conductive layer of cloth or in which one side be gold
Belong to coating.
2. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1, it is characterised in that: the upper conductive adhesive layer
It is all the thermosetting property glue-line including adhesive resin and the metal conductive particles, the gluing with the lower conductive adhesive layer
The ratio of agent resin is 20-75% (weight ratio), and the ratio of the metal conductive particles is 25-70% (weight ratio), the gold
Belong to conducting particles and the adhesive resin ratio is 1:1-4:1 (weight ratio).
3. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1, it is characterised in that: the ultra-thin conductive layer of cloth is
Fiber cloth, the fiber cloth are grid cloth, flat fabric or non-woven fabrics, and the size of the micropore of the fiber cloth allows the upper conduction
The smallest metal conductive particles pass through in adhesion coating and the lower conductive adhesion coating.
4. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1, it is characterised in that: the ultra-thin conductive layer of cloth table
The coat of metal in face is copper facing nickel layer, copper facing cobalt layers, copper facing tin layers, copper facing silver layer, plating copper and iron nickel layer, copper facing layer gold or copper facing
Layer.
5. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1, it is characterised in that: the metal conductive particles
For two kinds of mixing of needle-like metal powder and ball-type metal powder, the ratio of the needle-like metal powder and ball-type metal powder is
1:4-4:1 (weight ratio).
6. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1, it is characterised in that: the metal conductive particles packet
Include alloy conductive particle.
7. the incorgruous penetration type conductive fabric glue of multilayer according to claim 1 or 2, it is characterised in that: the lower conductive adhesion
Release film layer or carrier layer, the release film layer have been covered each by above the lower section of oxidant layer and the upper conductive adhesive layer
Or carrier layer with a thickness of 25-100 μm；The release film layer be PET fluorine mould release film layer, PET silicate-containing oil release film layer,
PET matt release film layer, PE release film layer or PE lamination paper layer；The release film layer is two-sided release film layer or single-sided parting film
Layer.
8. a kind of FPC reinforcement shielding construction using the incorgruous penetration type conductive fabric glue of multilayer described in claim 1, feature exist
In: including steel disc, EMI film and FPC, together in the lower surface of the steel disc, the EMI film fits in described the conductive fabric sticker
The lower surface of conductive fabric glue, the FPC fit in the lower surface of the EMI film；
The steel disc with a thickness of 0.05-0.2mm；
The EMI film includes ink layer and conductive adhesive layer, and the ink layer is located at the top of the conductive adhesive layer, the EMI film
Overall thickness be 10-20 μm, and the ink layer with a thickness of 5-10 μm, the conductive adhesive layer with a thickness of 5-10 μm.
9. FPC reinforcement shielding construction according to claim 8, it is characterised in that: the steel disc is nickel plating steel disc, the plating
The overall thickness of nickel steel piece is 0.05-0.2mm.
10. a kind of production method of the incorgruous penetration type conductive fabric glue of multilayer according to claim 7, it is characterised in that: packet
Include following steps:
Step 1: by the powder of the metal conductive particles of each shape respectively after screening screening obtains required partial size, by each shape
The metal conductive particles of shape are uniformly mixed, and obtain metal conductive particles mixture；
Step 2: adding metal conductive particles and adhesive resin in proportion, mixes them thoroughly uniformly；
Step 3: it is specified in release film layer or carrier layer and descends conductive adhesive from mixture made from shape face application step two
Layer；
Step 4: the one side fitting of ultra-thin conductive layer of cloth is solidified to the surface of the lower conductive adhesive layer described in step 3；
Step 5: in the other one side i.e. upper conductive adhesive of mixture made from application step two again of ultra-thin conductive layer of cloth
Layer, then release film layer or carrier layer are bonded on the surface of upper conductive adhesive layer；
Step 6: solidification, winding, slitting are to get finished product.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711275157.5A CN109890124B (en) | 2017-12-06 | 2017-12-06 | Multilayer anisotropic puncture type conductive cloth adhesive and FPC reinforcing shielding structure using same |
| TW107129958A TWI681035B (en) | 2017-12-06 | 2018-08-28 | Multi-layered anisotropically piercing conductive adhesive tape and preparing method and fpc with shield-enhanced structure using the same |
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|---|---|---|---|
| CN201711275157.5A CN109890124B (en) | 2017-12-06 | 2017-12-06 | Multilayer anisotropic puncture type conductive cloth adhesive and FPC reinforcing shielding structure using same |
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| CN113613482A (en) * | 2021-08-06 | 2021-11-05 | 保定乐凯新材料股份有限公司 | Electromagnetic wave shielding film suitable for grounding of extremely-small grounding hole, preparation method and application |
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