TWI681035B - Multi-layered anisotropically piercing conductive adhesive tape and preparing method and fpc with shield-enhanced structure using the same - Google Patents
Multi-layered anisotropically piercing conductive adhesive tape and preparing method and fpc with shield-enhanced structure using the same Download PDFInfo
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本發明係關於印刷電路板用導電布技術領域,尤係關於一種多層異向穿刺型導電膠布及補強屏蔽結構。 The invention relates to the technical field of conductive cloth for printed circuit boards, in particular to a multi-layer anisotropic puncture type conductive adhesive tape and a reinforced shielding structure.
隨著電子及通訊產品的發展,電路基板元件朝向輕薄短小及高集成化發展,傳輸信號頻率帶越來越寬,導致電磁干擾越來越嚴重;此外,電子電路元件的使用安全性亦列入考量,針對電子產品中電路元件接地可靠度及電路板設計自由度又提出了新要求,目前市面上普及的導電膠產品常有因導電膠將接地孔填充太滿進而影響其他組件的設計安裝,又或是導電膠未填滿導致回流焊時連接部分存在空隙,產生爆板等缺陷。 With the development of electronic and communication products, circuit board components are becoming lighter, thinner, shorter, and more highly integrated. The frequency band of transmitted signals is becoming wider and wider, resulting in more and more serious electromagnetic interference. In addition, the safety of electronic circuit components is also included In consideration, new requirements have been put forward for the reliability of circuit component grounding in electronic products and the freedom of circuit board design. At present, the popular conductive adhesive products on the market often fill the grounding hole too much with conductive adhesive and affect the design and installation of other components. Or the conductive adhesive is not filled, resulting in gaps in the connection part during reflow soldering, and defects such as bursting.
第1圖係繪示現有技術的軟性印刷電路板(FPC)補強屏蔽結構,包括鋼片200;軟性印刷電路板300;第一接地孔301,係形成於軟性印刷電路板300;電磁波屏蔽(EMI)
膜400;以及導電膠膜600;其中,該導電膠膜600覆蓋於該第一接地孔301及部分軟性印刷電路板300之上,並於該導電膠膜600之上壓合該鋼片200,經熱壓後,該導電膠膜600熔融流入該第一接地孔301與該軟性印刷電路板300形成導通,俾用以接地屏蔽。然而,目前市場中的FPC製程,對接地孔徑之要求越來越小,其下游沖孔工藝技術要求亦越趨嚴謹,惟導電膠之溢膠流動性等因素影響,致使導電膠材料於極小孔徑的導通效果皆不盡理想,有鑑於此,亟需針對極小之接地孔(其孔徑小於或等於0.5毫米)提供一款新材料以提高接地效果及穩定性。雖現有部分新技術及專利己揭露於導電黏著層內設置一薄金屬鍍層來提高導電膠產品的導通性,以使粉體含量減少且成本降低,但實際生產過程中,卻因金屬本身柔韌性不佳,造成壓合後產品填孔性無法達預期效果或甚至更糟,同時因該薄金屬鍍層之透氣性不佳,故在軟性印刷電路板之SMT(表面貼裝技術)製程存在有爆板的風險。
FIG. 1 shows a prior art flexible printed circuit board (FPC) reinforced shielding structure, including a
為此,本發明提供了一種包括超薄導電布層及多種形狀之複數金屬粒子之具高導通性之異向型多層導電膠布。 To this end, the present invention provides an anisotropic multilayer conductive tape with high conductivity including an ultra-thin conductive cloth layer and multiple metal particles of various shapes.
本發明主要解決的技術問題是提供一種多層異向穿刺型導電膠布,應用本發明的導電膠布於軟性印刷電路板,即便該FPC無預留接地孔,仍可獲得良好的接地及電磁波屏蔽之效果。與一般導電膠相比,本發明的導電膠布具有良好的電氣特性、接著強度佳、焊錫性好、信賴度高及耐 燃性佳等特性,且其製法可減少生產工序,節約生產成本,其市場應用前景廣泛。 The main technical problem solved by the present invention is to provide a multi-layer anisotropic puncture type conductive adhesive tape. Applying the conductive adhesive tape of the present invention to a flexible printed circuit board, even if the FPC has no reserved ground hole, good grounding and electromagnetic wave shielding effects can still be obtained . Compared with the general conductive adhesive, the conductive adhesive tape of the present invention has good electrical characteristics, good adhesion strength, good solderability, high reliability and resistance It has good flammability and other characteristics, and its preparation method can reduce the production process and save production costs, and its market application prospects are broad.
為解決上述技術問題,本發明採用一種多層異向穿刺型導電膠布,係包括:上導電黏著劑層,其厚度為15至25微米;下導電黏著劑層,其厚度為35至45微米,其中,該上導電黏著劑層及該下導電黏著劑層皆包括粒徑為40至100微米之複數導電金屬粒子,且該複數導電金屬粒子具有選自樹枝狀、鏈狀、針狀、薄片狀及球狀所組成群組之至少二種形狀;以及5至15微米厚且具上下兩面之超薄導電布層,係形成於該上導電黏著劑層與該下導電黏著劑層之間,其中,該超薄導電布層之至少一面具有金屬鍍層。 In order to solve the above technical problems, the present invention uses a multi-layer anisotropic puncture type conductive adhesive tape, which includes: an upper conductive adhesive layer with a thickness of 15 to 25 microns; a lower conductive adhesive layer with a thickness of 35 to 45 microns, wherein , The upper conductive adhesive layer and the lower conductive adhesive layer both include a plurality of conductive metal particles with a particle size of 40 to 100 microns, and the plurality of conductive metal particles have a shape selected from dendritic, chain, needle, flake and At least two shapes of a group consisting of spheres; and an ultra-thin conductive cloth layer 5 to 15 microns thick with upper and lower sides, formed between the upper conductive adhesive layer and the lower conductive adhesive layer, wherein, At least one side of the ultra-thin conductive cloth layer has a metal plating layer.
於一具體實施態樣中,所述上導電黏著劑層和所述下導電黏著劑層皆為熱固性膠層,且各包括膠黏劑樹脂及該複數導電金屬粒子,其中,各該上導電黏著劑層和該下導電黏著劑層之該膠黏劑樹脂含量為20至75重量%,該複數導電金屬粒子的含量為25至70重量%,且該複數導電金屬粒子與該膠黏劑樹脂的重量比為1:1至4:1。 In a specific embodiment, the upper conductive adhesive layer and the lower conductive adhesive layer are both thermosetting adhesive layers, and each includes an adhesive resin and the plurality of conductive metal particles, wherein each of the upper conductive adhesive The adhesive resin content of the adhesive layer and the lower conductive adhesive layer is 20 to 75% by weight, the content of the plurality of conductive metal particles is 25 to 70% by weight, and the plurality of conductive metal particles and the adhesive resin The weight ratio is 1:1 to 4:1.
於一具體實施態樣中,所述超薄導電布層為纖維布,且該纖維布可選自網格布、平織布或無紡布所組成群組之其中一種,其中,該纖維布具有尺寸容許該上導電黏著劑層和該下導電黏著劑層中之最小的導電金屬粒子通過該纖維布的複數微孔。 In a specific embodiment, the ultra-thin conductive cloth layer is a fiber cloth, and the fiber cloth may be selected from a group consisting of mesh cloth, plain woven cloth, or non-woven cloth, wherein the fiber cloth Having a size allows the smallest conductive metal particles in the upper conductive adhesive layer and the lower conductive adhesive layer to pass through the plurality of micropores of the fiber cloth.
於另一具體實施態樣中,所述纖維布的複數微孔的尺寸係不小於5微米。 In another specific embodiment, the size of the plurality of micropores of the fiber cloth is not less than 5 microns.
於一具體實施態樣中,所述超薄導電布層表面之金屬鍍層可為鍍銅鎳層、鍍銅鈷層、鍍銅錫層、鍍銅銀層、鍍銅鐵鎳層、鍍銅金層或鍍銅層。 In a specific embodiment, the metal plating layer on the surface of the ultra-thin conductive cloth layer may be a copper-nickel plating layer, a copper-cobalt plating layer, a copper-tin plating layer, a copper-silver plating layer, a copper-iron-nickel plating layer, a copper-plated gold layer Layer or copper layer.
於一具體實施態樣中,所述複數導電金屬粒子係由複數針狀導電金屬粒子及複數球狀導電金屬粒子混合而組成,且該複數針狀導電金屬粒子與該複數球狀導電金屬粒子的重量比為1:4至4:1。 In an embodiment, the plurality of conductive metal particles are composed of a plurality of needle-shaped conductive metal particles and a plurality of spherical conductive metal particles, and the plurality of needle-shaped conductive metal particles and the plurality of spherical conductive metal particles The weight ratio is 1:4 to 4:1.
於另一具體實施態樣中,所述複數導電金屬粒子之材質包括合金導電粒子。 In another embodiment, the material of the plurality of conductive metal particles includes alloy conductive particles.
於一具體實施態樣中,所述導電膠布復包括分別形成於該下導電黏著劑層之下方和該上導電黏著劑層之上方之25至100微米厚之二離型層,各該離型層可為單面離型膜或雙面離型膜,且該離型層可為含氟聚酯離型層、含矽油聚酯離型層、啞光聚酯離型層、聚乙烯離型層或聚乙烯淋膜紙層。 In an embodiment, the conductive tape includes two release layers of 25 to 100 micrometers thick formed below the lower conductive adhesive layer and above the upper conductive adhesive layer, each of the release The layer can be a single-sided release film or a double-sided release film, and the release layer can be a fluorine-containing polyester release layer, a silicone oil-containing polyester release layer, a matte polyester release layer, and a polyethylene release layer Layer or polyethylene coated paper layer.
本發明復提供一種軟性印刷電路板(FPC)補強屏蔽結構,係包括:鋼片,其厚度為0.05至0.2毫米;10至20微米厚之電磁波屏蔽(EMI)膜,係包括5至10微米厚之導電膠層及位於該導電膠層之上的5至10微米厚之油墨層;本發明之導電膠布,係位於該電磁波屏蔽膜和該鋼片之間;以及軟性印刷電路板,係貼合於該電磁波屏蔽膜的下表面,使該電磁波屏蔽膜位於該導電膠布與軟性印刷電路板之間。 The invention further provides a flexible printed circuit board (FPC) reinforced shielding structure, which includes: a steel sheet with a thickness of 0.05 to 0.2 mm; an electromagnetic wave shielding (EMI) film with a thickness of 10 to 20 microns, which includes a thickness of 5 to 10 microns The conductive adhesive layer and the ink layer 5 to 10 microns thick on top of the conductive adhesive layer; the conductive adhesive tape of the present invention is located between the electromagnetic wave shielding film and the steel sheet; and the flexible printed circuit board is attached On the lower surface of the electromagnetic wave shielding film, the electromagnetic wave shielding film is located between the conductive tape and the flexible printed circuit board.
於一具體實施態樣中,所述鋼片為0.05至0.2毫米厚 之鍍鎳鋼片。 In a specific embodiment, the steel sheet is 0.05 to 0.2 mm thick Of nickel-plated steel.
本發明復提供一種製備上述多層異向穿刺型導電膠布之方法,係包括:以1:1至4:1之重量比混合粒徑為40至100微米之複數導電金屬粒子及膠黏劑樹脂,以形成混合物,其中,該複數導電金屬粒子係具有選自樹枝狀、鏈狀、針狀、薄片狀及球狀所組成群組之至少二種形狀;將該混合物塗佈於離型層之指定離型面,形成下導電黏著劑層;將超薄導電布層貼合固化於該下導電黏著劑層之表面;於該超薄導電布層之另一面塗佈以1:1至4:1之重量比混合粒徑為40至100微米之複數導電金屬粒子及膠黏劑樹脂之另一混合物,以形成上導電黏著劑層;以及於該上導電黏著劑層的表面貼合離型層。 The invention further provides a method for preparing the above-mentioned multi-layer anisotropic puncture type conductive adhesive tape, which comprises: mixing a plurality of conductive metal particles with a particle size of 40 to 100 microns and an adhesive resin in a weight ratio of 1:1 to 4:1, To form a mixture, wherein the plurality of conductive metal particles have at least two shapes selected from the group consisting of dendrite, chain, needle, flake, and sphere; the mixture is applied to the release layer The release surface forms the lower conductive adhesive layer; the ultra-thin conductive cloth layer is adhered and cured on the surface of the lower conductive adhesive layer; the other side of the ultra-thin conductive cloth layer is coated with 1:1 to 4:1 The weight ratio is to mix another mixture of a plurality of conductive metal particles with a particle size of 40 to 100 microns and an adhesive resin to form an upper conductive adhesive layer; and attach a release layer on the surface of the upper conductive adhesive layer.
本發明之效果至少具有下列幾點:一、本發明的多層導電膠布係包括至少兩種形狀的複數導電金屬粒子,且其粒徑為40至100微米之大顆粒的導電金屬粒子,由於該複數導電金屬粒子係為多種形狀,且該超薄導電布層之厚度極薄,因此,在經壓合形成FPC補強屏蔽結構之時,其導電膠布中的複數導電金屬粒子受熱壓通過該超薄導電布層之複數微孔,使該上導電黏著劑層和下導電黏著劑層形成導通;另一方面,於壓合時,該導電膠布內之導電金屬粒子可刺穿該EMI膜之油墨層直接與EMI膜之導電膠層形成導通,與現有技術相比,可省去在FPC中預留接地孔之工序,即不需沖孔通過FPC補強屏蔽結構的工序,亦具接地與電磁波屏蔽之效果,有效解決 FPC製程中關於極小之接地孔(其孔徑小於或等於0.5毫米)所致之導通性及穩定性不足的缺陷,且因省去原有之沖孔工序,同時也節省了FPC工藝製程之成本及人力;當然,本發明也適用於FPC製程中預留小孔徑之接地孔的情況,於此種情況下,其導通效果更優於普通導電膜;二、本發明的上導電黏著劑層和下導電黏著劑層中包括至少兩種形狀的複數導電金屬粒子,由於該複數導電金屬粒子係為多種形狀,因此在加工受到熱壓產生形變時會趨向多方向流動,使壓合後,複數導電金屬粒子在導電膠層中的分佈具有多方向性和高分散性,進而與軟板上的接地孔形成導通電路,使得上導電黏著劑層和下導電黏著劑層具有良好的異向導通性,大幅提升導電性能,並降低軟板的接地阻抗值;三、本發明的超薄導電布層因其纖維狀或網狀結構有利於上導電黏著劑層及下導電黏著劑層中的複數導電金屬粒子通過其微孔,實現上下導電黏著劑層的導通,同時因該導電布層具良好的透氣性,故在軟性印刷電路板之表面貼裝技術製程不會出現爆板現象,可有效解決現有導電膠及導入薄金屬層之導電膠所面臨的爆板問題;四、由於本發明的導電布層以纖維布為基材,具有良好的柔韌性與耐磨性,如此可以避免導電膠因硬度過大在軟性電路板受熱壓時產生形變,影響性能,同時該上導電黏著劑層及下導電黏著劑層之複數導電金屬粒子經熱壓致使該膠黏劑樹脂材料產生形變流動而實現異向導通,可有 效避兔傳統導電膠及導入薄金屬層之導電膠導通效果不佳的缺陷;五、由於本發明之超薄導電布層之表面係以電鍍金屬鍍層處理形成金屬鍍層,故在同樣導通力的情況下,上導電黏著劑層及下導電黏著劑層之複數導電金屬粒子之使用量可相應降低,並降低粉塵污染,減少成本,且大幅度提高產品接著強度;六、經一段時間高溫熟化壓合後,多方向性的複數導電金屬粒子可提升膠黏劑樹脂達到完全交聯固化後的電氣性及機械物性;七、當使用本發明之導電膠布與鋼片等金屬部件覆貼於印刷電路板上形成加強部件之時,因具有良好的接地穩定性可有效遮蔽外來電磁波干擾;八、本發明之導電金屬粒子可包含複數合金導電粒子,其具有極佳的抗氧化性及傳導性,利於產品存儲搬運,不影響產品物性,使產品具穩定性佳及信賴度高之特性;以及九、將本發明之導電膠布與鋼片或其他補強部件貼合,即形成軟性印刷電路板(FPC)補強屏蔽結構,可有效防止因彎折等因素致使安裝部位產生形變,且由於該鋼片具良好的挺性,係有利於FPC零部件安裝、搬運等操作;藉由壓合及該導電膠布內之複數大顆粒之導電金屬粒子之刺穿效應,即便該FPC無預留接地孔,亦具良好的接地及屏蔽外來信號干擾之效果。 The effect of the present invention has at least the following points: 1. The multilayer conductive adhesive tape of the present invention includes a plurality of conductive metal particles of at least two shapes, and large-size conductive metal particles with a particle size of 40 to 100 microns. The conductive metal particles are in various shapes, and the thickness of the ultra-thin conductive cloth layer is extremely thin. Therefore, when the FPC reinforced shielding structure is formed by lamination, a plurality of conductive metal particles in the conductive tape are heated and pressed through the ultra-thin The plurality of micropores in the conductive cloth layer make the upper conductive adhesive layer and the lower conductive adhesive layer form a connection; on the other hand, when pressed, the conductive metal particles in the conductive adhesive cloth can pierce the ink layer of the EMI film Direct connection with the conductive adhesive layer of the EMI film, compared with the prior art, the process of reserving the ground hole in the FPC can be omitted, that is, the process of reinforcing the shielding structure through the FPC without punching, and also has the grounding and electromagnetic wave shielding Effect, effective solution In the FPC process, the defect of insufficient continuity and stability caused by the extremely small ground hole (the diameter of which is less than or equal to 0.5 mm), and the original punching process is saved, and the cost and cost of the FPC process are also saved. Manpower; of course, the present invention is also applicable to the case where a small-diameter grounding hole is reserved in the FPC process. In this case, the conduction effect is better than the ordinary conductive film; Second, the upper conductive adhesive layer and the lower of the present invention The conductive adhesive layer includes at least two shapes of plural conductive metal particles. Since the plural conductive metal particles are of various shapes, they tend to flow in multiple directions when deformed by hot pressing during processing. After pressing, the plural conductive metal particles The distribution of particles in the conductive adhesive layer has multi-directionality and high dispersion, and then forms a conductive circuit with the ground hole on the flexible board, so that the upper conductive adhesive layer and the lower conductive adhesive layer have good anisotropic conductivity, greatly Improve the conductive performance and reduce the grounding resistance value of the flexible board; 3. The ultra-thin conductive cloth layer of the present invention is beneficial to the plural conductive metal particles in the upper conductive adhesive layer and the lower conductive adhesive layer because of its fibrous or mesh structure Through its micro-holes, the conduction of the upper and lower conductive adhesive layers is achieved. At the same time, because the conductive cloth layer has good breathability, the board mounting technology process will not occur on the surface of the flexible printed circuit board, which can effectively solve the existing conductive The bursting problem faced by the adhesive and the conductive adhesive introduced into the thin metal layer; Fourth, because the conductive cloth layer of the present invention uses fiber cloth as the base material, it has good flexibility and wear resistance, so it can avoid the excessive hardness of the conductive adhesive When the flexible circuit board is deformed by heat and pressure, the performance is affected, and at the same time, the plurality of conductive metal particles of the upper conductive adhesive layer and the lower conductive adhesive layer are deformed by hot pressing to cause the adhesive resin material to deform and flow to achieve anisotropic conduction ,may have To avoid the defect of poor conduction effect of the traditional conductive adhesive of rabbit and the conductive adhesive introduced into the thin metal layer; Fifth, because the surface of the ultra-thin conductive cloth layer of the present invention is processed by electroplating metal plating to form a metal plating layer, it has the same conduction force. Under the circumstances, the use amount of the plurality of conductive metal particles of the upper conductive adhesive layer and the lower conductive adhesive layer can be correspondingly reduced, and reduce dust pollution, reduce costs, and greatly improve the product strength; six, after a period of high temperature aging pressure After closing, the multi-directional plural conductive metal particles can improve the electrical and mechanical properties of the adhesive resin to achieve complete cross-linking and curing; 7. When using the conductive adhesive tape and steel sheet and other metal parts of the present invention to cover the printed circuit When the reinforcing component is formed on the board, it can effectively shield the external electromagnetic wave interference due to its good grounding stability; 8. The conductive metal particles of the present invention can include a plurality of alloy conductive particles, which have excellent oxidation resistance and conductivity, which is beneficial to Product storage and transportation, does not affect the physical properties of the product, so that the product has the characteristics of good stability and high reliability; and Nine, the conductive adhesive tape of the present invention is attached to a steel sheet or other reinforcing parts to form a flexible printed circuit board (FPC) Reinforced shielding structure can effectively prevent the deformation of the installation site due to bending and other factors, and because the steel sheet has good stiffness, it is conducive to FPC parts installation, transportation and other operations; by pressing and inside the conductive tape The piercing effect of the conductive metal particles of multiple large particles, even if the FPC does not have a reserved ground hole, it also has a good grounding and shielding effect of external signal interference.
上述說明僅是本發明技術之概述,為了能夠更清楚瞭 解本發明之技術手段,並可依照說明書的內容予以實施,以下以本發明的具體實施態樣並配合附圖詳細說明如後。 The above description is only an overview of the technology of the present invention, in order to be more clear The technical means of the present invention can be understood and implemented in accordance with the contents of the description. The following is a detailed description of the present invention and the accompanying drawings in detail.
100‧‧‧導電膠布 100‧‧‧ conductive tape
101‧‧‧上導電黏著劑層 101‧‧‧Upper conductive adhesive layer
102‧‧‧超薄導電布層 102‧‧‧Ultra-thin conductive cloth layer
103‧‧‧下導電黏著劑層 103‧‧‧Lower conductive adhesive layer
104‧‧‧離型層 104‧‧‧ Release layer
200‧‧‧鋼片 200‧‧‧Steel sheet
300‧‧‧軟性印刷電路板(FPC) 300‧‧‧flexible printed circuit board (FPC)
301‧‧‧第一接地孔 301‧‧‧First ground hole
302‧‧‧第二接地孔 302‧‧‧Second grounding hole
400‧‧‧電磁波屏蔽(EMI)膜 400‧‧‧Electromagnetic wave shielding (EMI) film
401‧‧‧油墨層 401‧‧‧Ink layer
402‧‧‧導電膠層 402‧‧‧ conductive adhesive layer
500‧‧‧單面覆銅板 500‧‧‧Single-sided copper clad laminate
600‧‧‧導電膠膜 600‧‧‧ conductive film
1011‧‧‧導電金屬粒子 1011‧‧‧ conductive metal particles
1012‧‧‧膠黏劑樹脂 1012‧‧‧adhesive resin
透過例示性之參考附圖說明本發明的實施方式:第1圖係習知含普通導電膜之FPC補強屏蔽結構之剖示圖;第2圖係本發明之第一實施例之不含離型層的導電膠布之剖示圖;第3圖係本發明之第一實施例之含離型層的導電膠布之剖示圖;第4A圖係本發明之第二實施例的FPC補強屏蔽結構之剖示圖;第4B圖係本發明之第三實施例的FPC補強屏蔽結構之剖示圖;第5圖係本發明多層異向穿刺型導電膠布進行測試一之示意圖;以及第6圖係本發明多層異向穿刺型導電膠布進行測試二之示意圖。 Exemplary embodiments of the present invention will be described with reference to the accompanying drawings: FIG. 1 is a cross-sectional view of a conventional FPC reinforced shielding structure including a common conductive film; FIG. 2 is a first embodiment of the present invention without release The cross-sectional view of the conductive tape of the layer; FIG. 3 is the cross-sectional view of the conductive tape containing the release layer of the first embodiment of the present invention; FIG. 4A is the FPC reinforced shielding structure of the second embodiment of the present invention Figure 4B is a cross-sectional view of the FPC reinforced shielding structure of the third embodiment of the present invention; Figure 5 is a schematic diagram of the test of the multilayered anisotropic puncture type conductive adhesive tape of the present invention; and Figure 6 is the present Invented a multi-layered anisotropic puncture type conductive adhesive tape for the second schematic test.
以下係藉由特定的具體實施例說明本發明之實施方式,熟習此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之優點及功效。 The following describes the implementation of the present invention by specific specific examples. Those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝 之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「一」、「下」及「上」亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。此外,本文所有範圍和值都係包含及可合併的。落在本文中所述的範圍內之任何數值或點,例如任何整數都可以作為最小值或最大值以導出下位範圍等。 It should be noted that the structure, ratio, size, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification, so as to familiarize yourself with this skill. The understanding and reading of the person is not used to limit the limitations of the invention, so it has no technical significance. Any structural modification, proportional relationship change or size adjustment does not affect what the invention can produce. Both the efficacy and the objectives that can be achieved should still fall within the scope of the technical content disclosed by the present invention. At the same time, the references such as "one", "lower" and "upper" in this specification are only for the convenience of description, and are not used to limit the scope of the invention. The relative relationship is changed or adjusted. Substantially changing the technical content should also be regarded as the scope of the invention. In addition, all ranges and values herein are inclusive and combinable. Any value or point that falls within the range described herein, for example, any integer can be used as the minimum or maximum value to derive the lower range.
一種多層異向穿刺型導電膠布100,如第2圖及第3圖所示,係包括:上導電黏著劑層101,其厚度為15至25微米;下導電黏著劑層103,其厚度為35至45微米,其中,該上導電黏著劑層101及該下導電黏著劑層103皆包括粒徑為40至100微米之複數導電金屬粒子1011和膠黏劑樹脂1012,且該複數導電金屬粒子1011具有選自樹枝狀、鏈狀、針狀、薄片狀及球狀所組成群組之至少二種形狀;以及5至15微米厚且具上下兩面之超薄導電布層102,係形成於該上導電黏著劑層101與該下導電黏著劑層103之間,其中,該超薄導電布層之至少一面具有金屬鍍層。
A multi-layer anisotropic puncture type conductive
若所述超薄導電布層太厚,則會導致該上導電黏著劑層101及該下導電黏著劑層103中的複數導電金屬粒子1011無法接觸,而接觸不良;若所述超薄導電布層102太
薄,則不利於生產,提高生產成本。
If the ultra-thin conductive cloth layer is too thick, it will cause the plurality of
於一具體實施態樣中,所述複數導電金屬粒子的粒徑為40至80微米;於另一具體實施態樣中,所述複數導電金屬粒子的粒徑為51至80微米;其中,該複數導電金屬粒子係由複數針狀導電金屬粒子及複數球狀導電金屬粒子混合而組成,且該複數針狀導電金屬粒子與複數球狀導電金屬粒子的重量比為1:4至4:1。若該複數導電金屬粒子與該膠黏劑樹脂的重量比低於1:1,則導通性不佳,過多的膠黏劑樹脂致使其下游操作發生黏板等問題;若該複數導電金屬粒子與該膠黏劑樹脂的重量比高於4:1,則不利於粉體之分散,且該導電膠布之密著性及接著強度亦皆會受其影響。 In one embodiment, the particle diameter of the plurality of conductive metal particles is 40 to 80 microns; in another embodiment, the particle diameter of the plurality of conductive metal particles is 51 to 80 microns; wherein, the The plural conductive metal particles are composed of plural needle-shaped conductive metal particles and plural spherical conductive metal particles, and the weight ratio of the plural needle conductive metal particles to the plural spherical conductive metal particles is 1:4 to 4:1. If the weight ratio of the plural conductive metal particles to the adhesive resin is less than 1:1, the conductivity is not good, and too much adhesive resin causes problems such as sticking to the downstream operation of the plural conductive metal particles; If the weight ratio of the adhesive resin is higher than 4:1, it is not conducive to the dispersion of the powder, and the adhesion and subsequent strength of the conductive adhesive tape will also be affected by it.
若導電黏著劑層太薄,則屏蔽效果不佳;若導電黏著劑層太厚,則不符合薄型化要求,且不利塗佈加工性,間接增加生產成本。 If the conductive adhesive layer is too thin, the shielding effect is not good; if the conductive adhesive layer is too thick, it does not meet the requirements for thinning, and it is unfavorable for coating processability, which indirectly increases production costs.
典型之上導電黏著劑層和下導電黏著劑層中僅有單一形狀的導電粒子,在分散和壓合流動時皆趨於同一方向流動和分布,俾使該導電黏著劑層在導通性上趨於同一方向,造成整體導電黏著劑層之導通性不佳,進而影響導電黏著劑層的屏蔽效果,本發明採用的多種形狀的複數導電金屬粒子,在分散至導電黏著劑層時以及經熱壓產生形變,而呈多方向性流動和分布,從而使導電黏著劑層具有較好的異向導通性,提升屏蔽性能。 Typically, there is only a single shape of conductive particles in the upper conductive adhesive layer and the lower conductive adhesive layer, which tend to flow and distribute in the same direction when dispersed and pressed together, so that the conductive adhesive layer tends to be conductive In the same direction, the conductivity of the entire conductive adhesive layer is poor, which further affects the shielding effect of the conductive adhesive layer. The multiple conductive metal particles of various shapes used in the present invention are dispersed in the conductive adhesive layer and subjected to hot pressing It is deformed and flows and distributes in multiple directions, so that the conductive adhesive layer has better anisotropic conductivity and improves the shielding performance.
所述上導電黏著劑層和所述下導電黏著劑層皆為熱 固性膠層,且各包括膠黏劑樹脂及該複數導電金屬粒子,其中,各該上導電黏著劑層和該下導電黏著劑層之該膠黏劑樹脂含量為20至75重量%,該複數導電金屬粒子的含量為25至70重量%,且該複數導電金屬粒子與該膠黏劑樹脂的重量比為1:1至4:1。本發明的上導電黏著劑層和下導電黏著劑層中復可包括一些輔料(例如硬化劑或黏稠劑等)和非導電金屬粒子(例如石墨或導電化合物等)。 The upper conductive adhesive layer and the lower conductive adhesive layer are both heat A solid adhesive layer, each including an adhesive resin and the plurality of conductive metal particles, wherein the adhesive resin content of each of the upper conductive adhesive layer and the lower conductive adhesive layer is 20 to 75% by weight, the The content of the plurality of conductive metal particles is 25 to 70% by weight, and the weight ratio of the plurality of conductive metal particles to the adhesive resin is 1:1 to 4:1. The upper conductive adhesive layer and the lower conductive adhesive layer of the present invention may include some auxiliary materials (such as hardener or thickener, etc.) and non-conductive metal particles (such as graphite or conductive compound, etc.).
於一具體實施態樣中,各該上導電黏著劑層和該下導電黏著劑層之複數導電金屬粒子之含量為35至55重量%。 In a specific embodiment, the content of the plurality of conductive metal particles in each of the upper conductive adhesive layer and the lower conductive adhesive layer is 35 to 55% by weight.
所述膠黏劑樹脂係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、酚醛樹脂、三聚氰胺樹脂及聚醯亞胺樹脂所組成群組之至少一種,其中尤以丙烯酸系樹脂為佳。 The adhesive resin is selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, phenol resin, At least one of the group consisting of melamine resin and polyimide resin, especially acrylic resin.
若膠黏劑樹脂太少,則黏度太低,不利於上線生產;若膠黏劑樹脂太多,生產出的產品黏性較強,且相對地該複數導電金屬粒子之含量降低,致使導通性不佳。 If the adhesive resin is too little, the viscosity is too low, which is not conducive to on-line production; if the adhesive resin is too much, the product produced has a strong viscosity, and the content of the plurality of conductive metal particles is relatively reduced, resulting in conductivity Not good.
所述超薄導電布層102為纖維布,且該纖維布可選自網格布、平織布或無紡布所組成群組之其中一種,其中,該纖維布具有複數微孔,且其尺寸容許該上導電黏著劑層和該下導電黏著劑層中之最小的導電金屬粒子通過該纖維布。
The ultra-thin
所述超薄導電布層表面之金屬鍍層可為鍍銅鎳層、鍍 銅鈷層、鍍銅錫層、鍍銅銀層、鍍銅鐵鎳層、鍍銅金層或鍍銅層。 The metal plating layer on the surface of the ultra-thin conductive cloth layer may be a copper-nickel plating layer, a plating Copper-cobalt layer, copper-tin plated layer, copper-plated silver layer, copper-plated iron-nickel layer, copper-plated gold layer or copper-plated layer.
於一具體實施態樣中,所述超薄導電布層表面的金屬鍍層為鍍銅鎳層或鍍銅銀層。 In a specific embodiment, the metal plating layer on the surface of the ultra-thin conductive cloth layer is a copper-plated nickel layer or a copper-plated silver layer.
所述複數導電金屬粒子係由複數針狀導電金屬粒子及複數球狀導電金屬粒子混合而組成,且該複數針狀導電金屬粒子與該複數球狀導電金屬粒子的重量比為1:4至4:1。 The plural conductive metal particles are composed of plural needle-shaped conductive metal particles and plural spherical conductive metal particles, and the weight ratio of the plural needle conductive metal particles to the plural spherical conductive metal particles is 1:4 to 4 :1.
所述複數導電金屬粒子之材質包括合金導電粒子。形成該複數導電金屬粒子之材質包括單金屬之導電金屬粒子和合金導電粒子中之至少一者,又,該複數導電金屬粒子尤以合金導電粒子為佳。 The material of the plurality of conductive metal particles includes alloy conductive particles. The material for forming the plurality of conductive metal particles includes at least one of single metal conductive metal particles and alloy conductive particles. Furthermore, the plurality of conductive metal particles are preferably alloy conductive particles.
其中,該單金屬之導電金屬粒子可選自金粒子、銀粒子、銅粒子和鎳粒子所組成群組中之至少一種,但不限於此;該合金導電粒子係可選自鍍銀銅粒子、鍍銀金粒子、鍍銀鎳粒子、鍍金銅粒子及鍍金鎳粒子所組成群組中之至少一種,但不限於此。 Wherein, the conductive metal particles of the single metal can be selected from at least one of the group consisting of gold particles, silver particles, copper particles and nickel particles, but not limited to this; the alloy conductive particles can be selected from silver-plated copper particles, At least one of the group consisting of silver-plated gold particles, silver-plated nickel particles, gold-plated copper particles, and gold-plated nickel particles, but is not limited thereto.
合金導電粒子的抗氧化性和傳導性較好,且產品利於存儲搬運,對產品物性不造成影響,使產品具穩定性佳及信賴度高之特性。 The conductive particles of the alloy have good oxidation resistance and conductivity, and the product is convenient for storage and transportation, and does not affect the physical properties of the product, so that the product has the characteristics of good stability and high reliability.
所述導電膠布100復包括分別形成於該下導電黏著劑層103之下方和該上導電黏著劑層101之上方之25至100微米厚之二離型層104,各該離型層可為單面離型膜或雙面離型膜,且該離型層可為含氟聚酯離型層、含矽油聚酯
離型層、啞光聚酯離型層、聚乙烯離型層或聚乙烯淋膜紙層。
The conductive
於一具體實施態樣中,所述離型層尤以25至100微米厚之雙面離型膜為佳,其厚度太薄或太厚皆不利於後續加工沖切。 In a specific embodiment, the release layer is preferably a double-sided release film with a thickness of 25 to 100 microns, and its thickness is too thin or too thick, which is not conducive to subsequent processing and punching.
該離型層的顏色為純白色、乳白色或透明色,其中尤以純白色離型膜或乳白色離型膜為佳,由於數控自動化設備雕刻線路時,在紅外線感應下,純白色離型膜或乳白色離型膜無光反射之問題,可以快速精准定位,加工作業,且人工作業時,純白色或乳白色具識別作用,減少人為漏撕之情況。 The color of the release layer is pure white, milky white or transparent color, of which pure white release film or milky white release film is especially preferred, because when the CNC automatic equipment engraves the circuit, under infrared induction, the pure white release film or milky white The problem of the light reflection of the release film can be quickly and accurately positioned, and the processing operation, and during manual operation, pure white or milky white has a recognition effect, reducing the situation of artificial leakage.
本發明復提供一種製備上述多層異向穿刺型導電膠布之方法,包括:步驟一:以篩分篩選各形狀的導電金屬粒子的粉體得到所需粒徑後,使各形狀的導電金屬粒子混合均勻,混合時可選擇球磨方式,且球磨轉速不宜過高(轉速尤以200至300轉/分鐘為佳),否則將破壞金屬粒子之表層合金層,或者選擇使用攪拌方式(轉速以700至2000轉/分鐘為佳),攪拌之轉速高者混合均勻性佳,經混合後得到複數導電金屬粒子混合物;步驟二:按比例於膠黏劑樹脂中加入上述的複數導電金屬粒子混合物並充分混合均勻,而混合期間係需一邊添加複數導電金屬粒子一邊攪拌混合,其混合條件與步驟一相似; 步驟三:將步驟二所得混合物塗佈在離型層的指定離型面,即形成下導電黏著劑層;步驟四:於下導電黏著劑層貼合附載體之超薄導電布層並預固化該下導電黏著劑層,預固化溫度不宜超過膠黏劑樹脂本身之固化溫度,本發明中所選之預固化溫度位於80至100℃之間,於預固化後撕除載體,即形成超薄導電布層;步驟五:於超薄導電布層之另一面塗佈步驟二製得之混合物,形成上導電黏著劑層。當然,也可以另外調配不同組成和比例之另一混合物;步驟六:以步驟四的預固化條件固化該上導電黏著劑層後收卷,即得成品。 The invention further provides a method for preparing the above-mentioned multi-layer anisotropic puncture type conductive adhesive tape, which comprises: Step 1: sieving the powder of conductive metal particles of various shapes to obtain a desired particle size, and then mixing the conductive metal particles of various shapes Uniform, the ball milling method can be selected during mixing, and the ball milling speed should not be too high (the speed is particularly preferably 200 to 300 rpm), otherwise the surface alloy layer of the metal particles will be destroyed, or the use of the stirring method (the speed is 700 to 2000 Rpm is better), the one with higher stirring speed has better mixing uniformity, and after mixing, a plurality of conductive metal particle mixtures are obtained; Step 2: Add the above-mentioned plurality of conductive metal particle mixtures to the adhesive resin in proportion and mix thoroughly and uniformly During the mixing, it is necessary to add a plurality of conductive metal particles while stirring and mixing, the mixing conditions are similar to step one; Step 3: Apply the mixture obtained in Step 2 to the designated release surface of the release layer to form the lower conductive adhesive layer; Step 4: Paste the ultra-thin conductive cloth layer with carrier on the lower conductive adhesive layer and pre-cure The pre-curing temperature of the lower conductive adhesive layer should not exceed the curing temperature of the adhesive resin itself. The pre-curing temperature selected in the present invention is between 80 and 100°C. After the pre-curing, the carrier is torn off to form an ultra-thin Conductive cloth layer; Step 5: Apply the mixture prepared in Step 2 on the other side of the ultra-thin conductive cloth layer to form an upper conductive adhesive layer. Of course, another mixture with different compositions and ratios can be additionally prepared; Step 6: The upper conductive adhesive layer is cured under the pre-curing conditions of Step 4 and then rolled up to obtain the finished product.
如第4A圖所示,本發明復提供一種軟性印刷電路板(FPC)補強屏蔽結構,係包括:鋼片200,其厚度為0.05至0.2毫米;10至20微米厚之電磁波屏蔽(EMI)膜400,係包括5至10微米厚之油墨層401及5至10微米厚之導電膠層402,本態樣中,該油墨層401係位於該導電膠層402之上,當然也可相反設置;本發明之導電膠布100係位於該電磁波屏蔽膜400和該鋼片200之間,且該導電膠布係貼合於該鋼片200的下表面;以及軟性印刷電路板300,係貼合於該電磁波屏蔽膜400的下表面。
As shown in FIG. 4A, the present invention further provides a flexible printed circuit board (FPC) reinforced shielding structure, which includes: a
於一具體實施態樣中,所述鋼片為0.05至0.2毫米厚之鍍鎳鋼片。於一具體實施態樣中,該鍍鎳鋼片的總厚度為0.1毫米。 In a specific embodiment, the steel sheet is a nickel-plated steel sheet with a thickness of 0.05 to 0.2 mm. In a specific embodiment, the total thickness of the nickel-plated steel sheet is 0.1 mm.
第4A圖所示之具體實施態樣中,位於所述導電膠布的下方之所述軟性印刷電路板300上並無預留接地孔,係不同於第1圖典型的軟性印刷電路板(FPC)補強屏蔽結構。
In the specific embodiment shown in FIG. 4A, the flexible printed
於FPC補強屏蔽結構中,所述導電膠布100經與鋼片200壓合後,膠黏劑樹脂1012內的導電金屬粒子1011刺穿EMI膜之油墨層401直接與EMI膜之導電膠層402導通,並通過導電膠層402傳遞至設於軟性印刷電路板300之未被導電膠布100和EMI膜覆蓋之大孔徑的第二接地孔302,進而接地導通,與典型的FPC補強屏蔽結構相比,如圖1所示,可省去於典型的FPC補強屏蔽結構之EMI膜覆蓋範圍下方預留小孔徑的第一接地孔301之工序,即不需沖孔通過FPC補強屏蔽結構的工序,亦具接地與電磁波屏蔽之效果,有效解決FPC製程中關於極小之接地孔(其孔徑小於或等於0.5毫米)所致之導通性及穩定性不足的缺陷,且因省去原有之沖孔工序,同時也節省了FPC工藝製程之成本及人力。
In the FPC reinforced shielding structure, after the
於另一具體實施態樣中,一種軟性印刷電路板(FPC)補強屏蔽結構係如第4B圖所示包括:鋼片200;電磁波屏蔽(EMI)膜400,係包括油墨層401及導電膠層402,其中,該油墨層401係位於該導電膠層402之上;軟性印刷電路板300,係包括第一接地孔301及第二接地孔302;以及上述之導電膠布100,係覆蓋於該第一接地孔301及部分該軟性印刷電路板300之上,且於該導電膠布100壓合該鋼
片200。
In another embodiment, a flexible printed circuit board (FPC) reinforced shielding structure, as shown in FIG. 4B, includes: a
經熱壓合後,該導電膠布之上導電黏著劑層及下導電黏著劑層熔融流入第一接地孔301,與該FPC形成導通,俾用以接地屏蔽,相較於現有技術,本發明可避免普通導電膠膜本身的溢膠流動性,且本發明之導通效果也更優於採用普通導電膜。
After hot pressing, the upper conductive adhesive layer and the lower conductive adhesive layer of the conductive tape melt into the
測試方法1:導通性分析Test Method 1: Continuity Analysis
如第5圖所示,用高橋測試儀對撕除離型層後的多層異向穿刺型導電膠布進行導通性分析測試,在上導電黏著劑層101和下導電黏著劑層103表面分別貼合鍍鎳層的鋼片200與軟性印刷電路板300後,經壓合固化後,分別測試樣片過回流焊前後導通性阻值,本發明作為實施例,以同樣方法測試一般產品的導電性能作為比較例,將測得的導通性結果記錄於表1中。
As shown in Figure 5, conduct a continuity analysis test on the multi-layer anisotropic puncture type conductive adhesive tape after the release layer is removed by using a Takahashi tester, and respectively adhere to the surfaces of the upper conductive
測試方法2:剝離力分析Test Method 2: Peeling force analysis
如第6圖所示,用萬能拉力機進行對剝離雙面離型膜後的多層異向穿刺型導電膠布進行剝離力測試,在上導電黏著劑層101和下導電黏著劑層103表面分別假貼鍍鎳層的鋼片200與單面覆銅板500後,經壓合固化後,取出樣片測試剝離力值,本發明作為實施例,以同樣方法測試一般產品的剝離力作為比較例,將測得的剝離力結果記錄於表1中。
As shown in Figure 6, the multi-layer anisotropic puncture type conductive adhesive tape after peeling the double-sided release film was tested with a universal tensile machine, and the surfaces of the upper conductive
由表1可知,本發明的多層異向穿刺型導電膠布相較於一般產品,確實具有良好的導電效果、穩定性及良好的接著強度。反觀一般導電膠由於FPC未開孔且無刺穿效果,故不導通。 It can be seen from Table 1 that the multi-layer anisotropic puncture type conductive adhesive tape of the present invention does have a good conductive effect, stability and good adhesive strength compared to general products. In contrast, the general conductive adhesive is not conductive because the FPC has no holes and no piercing effect.
上述實施例僅為例示性說明,而非用於限制本發明。凡是利用本發明說明書及附圖內容所作的等效結構,或直接或間接運用在其他相關的技術領域,均同理包括在本發明的專利保護範圍內。 The above-mentioned embodiments are only illustrative and not intended to limit the present invention. Any equivalent structure made by using the description and drawings of the present invention, or directly or indirectly used in other related technical fields, is also included in the patent protection scope of the present invention.
100‧‧‧導電膠布 100‧‧‧ conductive tape
101‧‧‧上導電黏著劑層 101‧‧‧Upper conductive adhesive layer
102‧‧‧超薄導電布層 102‧‧‧Ultra-thin conductive cloth layer
103‧‧‧下導電黏著劑層 103‧‧‧Lower conductive adhesive layer
104‧‧‧離型層 104‧‧‧ Release layer
1011‧‧‧導電金屬粒子 1011‧‧‧ conductive metal particles
Claims (9)
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CN201721679289.X | 2017-12-06 | ||
CN201711275157.5A CN109890124B (en) | 2017-12-06 | 2017-12-06 | Multilayer anisotropic puncture type conductive cloth adhesive and FPC reinforcing shielding structure using same |
CN201711275157.5 | 2017-12-06 | ||
??201711275157.5 | 2017-12-06 | ||
??201721679289.X | 2017-12-06 | ||
CN201721679289.XU CN207652761U (en) | 2017-12-06 | 2017-12-06 | The incorgruous penetration type conductive fabric glue of multilayer and use its FPC reinforcement shielding constructions |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086837A1 (en) * | 2003-03-25 | 2004-10-07 | Shin-Etsu Polymer Co., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods |
JP2005072343A (en) * | 2003-08-26 | 2005-03-17 | Nitto Denko Corp | Adhesive sheet for manufacturing semiconductor device |
TW200920207A (en) * | 2007-10-30 | 2009-05-01 | Asia Electronic Material Co | Protected film of printed circuit board and surface adhesive processing for using protective film of printed circuit board |
TW200927493A (en) * | 2007-12-31 | 2009-07-01 | 3M Innovative Properties Co | Electromagnetic shielding mat and method of filling gap in electromagnetic shielding system |
US20100089626A1 (en) * | 2005-04-27 | 2010-04-15 | Hitachi Chemical Company, Ltd. | Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
-
2018
- 2018-08-28 TW TW107129958A patent/TWI681035B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086837A1 (en) * | 2003-03-25 | 2004-10-07 | Shin-Etsu Polymer Co., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods |
JP2005072343A (en) * | 2003-08-26 | 2005-03-17 | Nitto Denko Corp | Adhesive sheet for manufacturing semiconductor device |
US20100089626A1 (en) * | 2005-04-27 | 2010-04-15 | Hitachi Chemical Company, Ltd. | Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
TW200920207A (en) * | 2007-10-30 | 2009-05-01 | Asia Electronic Material Co | Protected film of printed circuit board and surface adhesive processing for using protective film of printed circuit board |
TW200927493A (en) * | 2007-12-31 | 2009-07-01 | 3M Innovative Properties Co | Electromagnetic shielding mat and method of filling gap in electromagnetic shielding system |
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