CN106413250B - A kind of different side's conductive adhesive film of multilayer containing nano wire - Google Patents
A kind of different side's conductive adhesive film of multilayer containing nano wire Download PDFInfo
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- CN106413250B CN106413250B CN201610889940.XA CN201610889940A CN106413250B CN 106413250 B CN106413250 B CN 106413250B CN 201610889940 A CN201610889940 A CN 201610889940A CN 106413250 B CN106413250 B CN 106413250B
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- nano wire
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- 239000002070 nanowire Substances 0.000 title claims abstract description 108
- 239000002313 adhesive film Substances 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 72
- 239000012790 adhesive layer Substances 0.000 claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002159 nanocrystal Substances 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000004840 adhesive resin Substances 0.000 claims abstract description 14
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 57
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 19
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 229920000767 polyaniline Polymers 0.000 claims description 19
- 239000001993 wax Substances 0.000 claims description 19
- 150000008065 acid anhydrides Chemical class 0.000 claims description 18
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 13
- 239000005977 Ethylene Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000010023 transfer printing Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 229920000297 Rayon Polymers 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 230000001464 adherent effect Effects 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 abstract description 2
- 238000004804 winding Methods 0.000 abstract description 2
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 14
- 150000001336 alkenes Chemical class 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention relates to a kind of different side's conductive adhesive films of multilayer containing nano wire, including the first nano wire conductive adhesive layer, metal layer and the second nano wire conductive adhesive layer, nano-silver thread and NANO CRYSTAL COPPER WIRE are increased in adhesive resin in first and second nano wire conductive adhesive layer, the big major diameter effect of nano-silver thread and NANO CRYSTAL COPPER WIRE, so that product of the invention has excellent electric conductivity and flexibility, the proportion of adhesive resin reasonable composition, so that product of the invention has good mechanical strength after hot pressing;Metal layer is gold-plated or silver-plated thin copper layer, has stronger conduction and lower resistivity;It will be further appreciated that the release film of use, which can effectively avoid product, there is adherent phenomenon in winding.The folded structure of product of the present invention is simple, and production method is simple, is suitble to large-scale production.The excellent properties such as the different side's conductive film of the multilayer containing nano wire of the invention has resistivity low, and electromagnetic wave shielding performance is good, electric conductivity is strong and flexibility is good.
Description
Technical field
The invention belongs to conductive adhesive film technical fields, more specifically to a kind of multi-layer nano fiber conductive adhesive film.
Background technique
Anisotropic conductive film is to make to lead with the electrode of substrate between the two using conducting particles connection IC chip
It is logical, while it being avoided that conducting short circuit between adjacent two electrode again, and reach the only purpose in the conducting of z-axis direction, it can solve
The microscopic wire connectivity problem that previous connector can not be handled.
Wherein, for the mostly polyimide copper foil substrate of flexible printed wiring board, single sided board or two-sided is generally divided into
Plate.In general, polyimide copper foil substrate is in the composition and its thickness for being limited to polyimide material using upper problem.Small electrical
The wiring material of sub- product mostly uses greatly design freedom height, the good flexible printed wiring board (Flexible of bendability
Printed Circuit, hereinafter referred to as FPC), and formulated while constantly to high speedization, high flexure development various
The countermeasure of thickness, workability.In this case, just the conductive adhesive film for this kind of flexible printed wiring board is proposed higher
Requirement, do not need only to have good conduction, preferable electromagnetic wave shielding performance should also have good flexibility and bending resistance
Folding endurance is only in this way just able to satisfy market to conductive adhesive film increasingly higher demands.
Summary of the invention
In order to solve the above technical problems, the object of the present invention is to provide a kind of different side's conductive adhesive film of multilayer containing nano wire,
Not only have resistivity low, electromagnetic wave shielding performance is good and electric conductivity waits by force excellent properties, and has preferable flexibility.
A kind of different side's conductive adhesive film of multilayer containing nano wire of the invention, including the first nano wire conductive adhesive layer, metal layer,
Second nano wire conductive adhesive layer and release film layer, the second nano wire conductive adhesive layer are formed in above the release film layer, institute
It states metal layer to be formed in above the second nano wire conductive adhesive layer, the first nano wire conductive adhesive layer is formed in the metal
Layer top;The first nano wire conductive adhesive layer and the second nano wire conductive adhesive layer be all include nano wire and adhesive resin
The material layer of layer;The diameter of the nano wire is 60-100 nanometers, and the draw ratio of the nano wire is 200-300;
The first nano wire conductive adhesive layer with a thickness of 25-50 microns;
The metal layer with a thickness of 4-8 microns;
The second nano wire conductive adhesive layer with a thickness of 30-60 microns.
Further say, the nano wire includes NANO CRYSTAL COPPER WIRE and nano-silver thread, the adhesive resin layer include ethylene glycol,
Tertiary butyl alcohol, ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent.
It further says, the parts by weight of each component are as follows:
The number of the NANO CRYSTAL COPPER WIRE is 15-20 parts;The number of the nano-silver thread is 20-35 parts;The ethylene glycol
Number is 30-40 parts;The number of the tertiary butyl alcohol is 10-25 parts;The number of the ethylene waxes is 5-8 parts;The polyaniline
Number be 10-20 parts;The number of the butyl titanate is 3-5 parts;The number of the acid anhydride type curing agent is 4-7 parts.
It further says, the metal layer is two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
Further say, the release film layer with a thickness of 30-80 microns.
It further says, the release film layer is that PET fluorine moulds release film, PET silicate-containing oil release film, PET matt release film
Or PE release film.
It further says, the diameter of the nano wire is 75-100 nanometers, and the draw ratio of the nano wire is 250-300.
It further says, the diameter of the nano wire is 90-100 nanometers, and the draw ratio of the nano wire is 280-300.
It further says, the production method of the different side's conductive adhesive film of a kind of multilayer containing nano wire, according to following steps
It is rapid to carry out:
Step 1: three roller mixings are added in the NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol in parts by weight
Machine, three 80-100 revs/min of revolving speed of roller batch mixers, time 30-40 minute are then allowed to stand 1-1.5 hours, are uniformly mixed it,
Obtain mixture A;
Step 2: ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three rollers in parts by weight and mixed
Material machine is mixed with mixture A made from step 1, three 60-80 revs/min of revolving speed of roller batch mixers, time 60-90 minute, keeps it mixed
It closes uniformly, is then allowed to stand 36-48 hours, obtains mixture B;
Step 3: mixture B made from application step two i.e. the second nano wire conductive adhesive layer on release film layer uses
180-220 DEG C of low-temperature setting molding;
Step 4: using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, metal layer is obtained;
Step 5: metal layer made from step 4 is fitted on the second nano wire conductive adhesive layer surface;
Step 6: mixture B i.e. the first nano wire conductive adhesive layer made from rapid two is formed in gold with coating or transfer printing
Belong in layer surface, is formed using 80-180 DEG C of low-temperature setting, obtain the different side's conductive adhesive film of multilayer containing nano wire.
The beneficial effects of the present invention are: the present invention includes that the first nano wire conductive adhesive layer, metal layer and the second nano wire are led
Nano-silver thread is increased in adhesive resin layer contained by electric glue-line, the first nano wire conductive adhesive layer and the second nano wire conductive adhesive layer
And NANO CRYSTAL COPPER WIRE, the big major diameter effect of nano-silver thread and NANO CRYSTAL COPPER WIRE so that product of the invention have excellent electric conductivity and
Flexibility, the proportion of adhesive resin reasonable composition, so that product of the invention has good mechanical strength after hot pressing;Gold
Category layer is gold-plated or silver-plated thin copper layer, has stronger conduction and lower resistivity;It will be further appreciated that use
Release film can effectively avoid product and adherent phenomenon occurs in winding.The different side's conductive film of multilayer containing nano wire of the invention has
The excellent properties such as resistivity is low, and electromagnetic wave shielding performance is good, electric conductivity is strong and flexibility is good.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, it is described in detail below with presently preferred embodiments of the present invention.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention;
Fig. 2 is structural schematic diagram of the present invention after removing release film layer;
The appended drawing reference of each section is as follows in figure:
First nano wire conductive adhesive layer 1, metal layer 2, the second nano wire conductive adhesive layer 3 and release film 4.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
Illustrate the present invention, but is not intended to limit the scope of the invention.
Referring to Fig. 1, the different side's conductive adhesive film of a kind of multilayer containing nano wire of the present invention, including the first nano wire are conductive
Glue-line 1, metal layer 2, the second nano wire conductive adhesive layer 3 and release film layer 4, the second nano wire conductive adhesive layer 3 are formed in institute
4 top of release film layer is stated, the metal layer 2 is formed in 3 top of the second nano wire conductive adhesive layer, and first nano wire is led
Electric glue-line 1 is formed in 2 top of metal layer;The first nano wire conductive adhesive layer 1 and the second nano wire conductive adhesive layer 3
It is all the material layer for including nano wire and adhesive resin layer;The diameter of the nano wire is 60-100 nanometers, the nano wire
Draw ratio is 200-300.Preferably, the diameter of the nano wire is 75-100 nanometers, and the draw ratio of the nano wire is 250-
300.Most preferably, the diameter of the nano wire is 90-100 nanometers, and the draw ratio of the nano wire is 280-300;
The first nano wire conductive adhesive layer 1 with a thickness of 25-50 microns;
The metal layer 2 with a thickness of 4-8 microns;
The second nano wire conductive adhesive layer 3 with a thickness of 30-60 microns.
The metal layer 2 is two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
The release film layer 4 with a thickness of 30-80 microns.
The release film layer 4 is that PET fluorine moulds release film, PET silicate-containing oil release film, PET matt release film or PE release film.
Embodiment 1 all contains identical structure to embodiment 6, and difference is as follows:
Embodiment 1: the diameter of the nano wire is 60 nanometers, and the draw ratio of the nano wire is 280.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 15 parts;The number of the nano-silver thread is 23 parts;The number of the ethylene glycol is 35 parts;The number of the tertiary butyl alcohol
It is 12 parts;The number of the ethylene waxes is 6 parts;The number of the polyaniline is 10 parts;The number of the butyl titanate is 3
Part;The number of the acid anhydride type curing agent is 6 parts.
Embodiment 2: the diameter of the nano wire is 70 nanometers, and the draw ratio of the nano wire is 300.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 20 parts;The number of the nano-silver thread is 35 parts;The number of the ethylene glycol is 30 parts;The number of the tertiary butyl alcohol
It is 23 parts;The number of the ethylene waxes is 5 parts;The number of the polyaniline is 20 parts;The number of the butyl titanate is 5
Part;The number of the acid anhydride type curing agent is 4 parts.
Embodiment 3: the diameter of the nano wire is 75 nanometers, and the draw ratio of the nano wire is 250.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 18 parts;The number of the nano-silver thread is 20 parts;The number of the ethylene glycol is 40 parts;The number of the tertiary butyl alcohol
It is 25 parts;The number of the ethylene waxes is 8 parts;The number of the polyaniline is 15 parts;The number of the butyl titanate is 4
Part;The number of the acid anhydride type curing agent is 5 parts.
Embodiment 4: the diameter of the nano wire is 60 nanometers, and the draw ratio of the nano wire is 200.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 19 parts;The number of the nano-silver thread is 21 parts;The number of the ethylene glycol is 32 parts;The number of the tertiary butyl alcohol
It is 10 parts;The number of the ethylene waxes is 7 parts;The number of the polyaniline is 18 parts;The number of the butyl titanate is 5
Part;The number of the acid anhydride type curing agent is 7 parts.
Embodiment 5: the diameter of the nano wire is 100 nanometers, and the draw ratio of the nano wire is 290.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 18 parts;The number of the nano-silver thread is 28 parts;The number of the ethylene glycol is 36 parts;The number of the tertiary butyl alcohol
It is 15 parts;The number of the ethylene waxes is 6 parts;The number of the polyaniline is 17 parts;The number of the butyl titanate is 4
Part;The number of the acid anhydride type curing agent is 5 parts.
Embodiment 6: the diameter of the nano wire is 95 nanometers, and the draw ratio of the nano wire is 260.
The nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of each component are as follows: the NANO CRYSTAL COPPER WIRE
Number is 17 parts;The number of the nano-silver thread is 32 parts;The number of the ethylene glycol is 36 parts;The number of the tertiary butyl alcohol
It is 21 parts;The number of the ethylene waxes is 7 parts;The number of the polyaniline is 12 parts;The number of the butyl titanate is 5
Part;The number of the acid anhydride type curing agent is 6 parts.
Embodiment 1 arrive embodiment 6, a kind of production method of the different side's conductive adhesive film of multilayer containing nano wire, according to
Following step carries out:
Step 1: three roller mixings are added in the NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol in parts by weight
Machine, three 80-100 revs/min of revolving speed of roller batch mixers, time 30-40 minute are then allowed to stand 1-1.5 hours, are uniformly mixed it,
Obtain mixture A;
Step 2: ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three rollers in parts by weight and mixed
Material machine is mixed with mixture A made from step 1, three 60-80 revs/min of revolving speed of roller batch mixers, time 60-90 minute, keeps it mixed
It closes uniformly, is then allowed to stand 36-48 hours, obtains mixture B;
Step 3: mixture B made from application step two i.e. the second nano wire conductive adhesive layer on release film layer uses
180-220 DEG C of low-temperature setting molding;
Step 4: using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, metal layer is obtained;
Step 5: metal layer made from step 4 is fitted on the second nano wire conductive adhesive layer surface;
Step 6: mixture B i.e. the first nano wire conductive adhesive layer made from rapid two is formed in gold with coating or transfer printing
Belong in layer surface, is formed using 80-180 DEG C of low-temperature setting, obtain the different side's conductive adhesive film of multilayer containing nano wire.
To the different side's conductive adhesive film of the multilayer containing the nanometer progress conduction analysis (as shown in Figure 2) after the two-sided release film of removing
Test: carrying out conduction analysis test with high bridge tester, in the false patch plating respectively of the first and second nano wire conductive adhesive layer upper and lower surface
Nickel steel piece is with after FPC, and test sample crosses conduction resistance value data before and after Reflow Soldering respectively for pressing solidification, will survey to the present invention
It studies as embodiment, the electric conductivity in kind testing common product is used as comparative example, by the conduction result measured note
It records in table 1.
Peeling force analysis test is carried out to the different side's conductive adhesive film of the multilayer containing nanometer after two-sided release film is removed: with omnipotent
Puller system carries out peeling force analysis test, the false patch nickel plating steel disc of difference and copper foil base on the first and second nano wire conductive adhesive layer two sides
After plate, test removing force value is taken out in pressing solidification, will make test to the present invention as embodiment, and in kind test it and lead
The conduction result measured is reported in Table 1 below by the peeling force of electric glue as comparative example.
Flexibility test is carried out to the different side's conductive adhesive film of novel nano multilayer after the two-sided release film of removing: slide unit will be used
Tester carries out.Test condition: using voltage: AC220V, tests the angle R: 0.8mm, frequency: 30 beats/min, shift motion:
32mm;It will make test to the present invention as embodiment, and in kind test the flexibility of its conducting resinl as comparative example, incite somebody to action
The flexibility result measured is reported in Table 1 below.
Table 1
The different side's conductive adhesive film of a kind of multilayer containing nano wire provided by the invention, after toasted, resistance is low and stablizes, not only
Also there is good flexibility and mechanical strength with good conductive effect and electromagnetic wave shielding performance.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of different side's conductive adhesive film of multilayer containing nano wire, it is characterised in that: including the first nano wire conductive adhesive layer, metal
Layer, the second nano wire conductive adhesive layer and release film layer, the second nano wire conductive adhesive layer are formed in above the release film layer,
The metal layer is formed in above the second nano wire conductive adhesive layer, and the first nano wire conductive adhesive layer is formed in the gold
Belong to above layer;The first nano wire conductive adhesive layer and the second nano wire conductive adhesive layer be all include nano wire and viscose glue tree
The material layer of rouge layer;The diameter of the nano wire is 60-100 nanometers, and the draw ratio of the nano wire is 200-300;
The first nano wire conductive adhesive layer with a thickness of 25-50 microns;
The metal layer with a thickness of 4-8 microns;
The second nano wire conductive adhesive layer with a thickness of 30-60 microns;
The nano wire includes NANO CRYSTAL COPPER WIRE and nano-silver thread, and the adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, ethylene
Wax, polyaniline, butyl titanate and acid anhydride type curing agent;
The parts by weight of each component are as follows: the number of the NANO CRYSTAL COPPER WIRE is 15-20 parts;The number of the nano-silver thread is
20-35 parts;The number of the ethylene glycol is 30-40 parts;The number of the tertiary butyl alcohol is 10-25 parts;Part of the ethylene waxes
Number is 5-8 parts;The number of the polyaniline is 10-20 parts;The number of the butyl titanate is 3-5 parts;The anhydride is solid
The number of agent is 4-7 parts;
The metal layer is two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
2. the different side's conductive adhesive film of a kind of multilayer containing nano wire according to claim 1, it is characterised in that: the release film
Layer with a thickness of 30-80 microns.
3. the different side's conductive adhesive film of a kind of multilayer containing nano wire according to claim 1, it is characterised in that: the release film
Layer is that PET fluorine moulds release film, PET silicate-containing oil release film, PET matt release film or PE release film.
4. the different side's conductive adhesive film of a kind of multilayer containing nano wire according to claim 1, it is characterised in that: the nano wire
Diameter be 75-100 nanometer, the draw ratio of the nano wire is 250-300.
5. the different side's conductive adhesive film of a kind of multilayer containing nano wire according to claim 1, it is characterised in that: the nano wire
Diameter be 90-100 nanometer, the draw ratio of the nano wire is 280-300.
6. a kind of production method of the different side's conductive adhesive film of multilayer containing nano wire according to claim 1, it is characterised in that:
It carries out as steps described below:
Step 1: being added three roller batch mixers for the NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol in parts by weight,
Three 80-100 revs/min of revolving speed of roller batch mixers, time 30-40 minute are then allowed to stand 1-1.5 hours, are uniformly mixed it, obtain
Mixture A;
Step 2: ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three roller batch mixers in parts by weight
It is mixed with mixture A made from step 1, three 60-80 revs/min of revolving speed of roller batch mixers, time 60-90 minute, keeps its mixing equal
It is even, it is then allowed to stand 36-48 hours, obtains mixture B;
Step 3: mixture B made from application step two i.e. the second nano wire conductive adhesive layer on release film layer, using 180-
220 DEG C of low-temperature setting moldings;
Step 4: using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, metal layer is obtained;
Step 5: metal layer made from step 4 is fitted on the second nano wire conductive adhesive layer surface;
Step 6: mixture B i.e. the first nano wire conductive adhesive layer made from rapid two is formed in metal layer with coating or transfer printing
On surface, is formed using 80-180 DEG C of low-temperature setting, obtain the different side's conductive adhesive film of multilayer containing nano wire.
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CN109462937B (en) * | 2019-01-08 | 2020-09-08 | 昆山域之光电子有限公司 | Anisotropic conductive film and manufacturing method thereof |
CN112904625B (en) * | 2021-01-25 | 2022-09-27 | 北海惠科光电技术有限公司 | Preparation method of conductive frame glue, conductive frame glue and display panel |
CN114283965A (en) * | 2021-12-31 | 2022-04-05 | 深圳市华科创智技术有限公司 | Composite conductive slurry and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
CN103144376A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof |
CN103694924A (en) * | 2013-10-24 | 2014-04-02 | 明基材料有限公司 | Metacrylic acid ester copolymer with tetracyclic ether group and anisotropic conductive film |
CN105567112A (en) * | 2016-01-18 | 2016-05-11 | 杨宜丰 | Anisotropic conductive adhesive and preparation method thereof |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
CN103144376A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof |
CN103694924A (en) * | 2013-10-24 | 2014-04-02 | 明基材料有限公司 | Metacrylic acid ester copolymer with tetracyclic ether group and anisotropic conductive film |
CN105567112A (en) * | 2016-01-18 | 2016-05-11 | 杨宜丰 | Anisotropic conductive adhesive and preparation method thereof |
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