CN106634668B - A kind of Nano type Multi-layer composite conductive glue film and preparation method thereof - Google Patents
A kind of Nano type Multi-layer composite conductive glue film and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/02—Elements
- C08K3/08—Metals
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The present invention relates to a kind of Nano type Multi-layer composite conductive glue film, including the first conductive adhesive layer, nanometer layer, the second conductive adhesive layer and release film layer, nanometer layer further includes rare earth, polyaniline, organic solvent and additive except nano-scale particle is contained.Nanometer layer is increased between the first conductive adhesive layer and the second conductive adhesive layer, the nanometer layer is fabricated to using high-temperature and high-pressure conditions, performance is stablized, not only high temperature resistant, corrosion-resistant, and there is good electric conductivity, resistivity is down to 0.37 Ω cm^2, electromagnetic wave shielding performance with super strength, electromagnetic wave shielding rate is up to 90.23%, so that the conductive adhesive film containing the nanometer layer is with good conductive effect and electromagnetic wave shielding performance and has good mechanical strength.Nano type Multi-layer composite conductive glue film of the invention has resistivity low, and electromagnetic wave shielding performance is good and electric conductivity waits by force excellent properties, while the folded structure of product of the invention is simple, and production method is simple, and has good processability.
Description
Technical field
The invention belongs to conductive adhesive film technical fields, more specifically to a kind of different side's conductive adhesive film of novel multi-layer.
Background technique
Anisotropic conductive adhesive paste is to be coated with to be bonded between a kind of substrate a and substrate b, and current limit can only be by the direction vertical axis z
Circulate in a kind of special coating substance between substrate a, b.Unilateal conduction and glued fixed function are had both, can solve
The microscopic wire connectivity problem that previous connector can not be handled.
The main composition of anisotropic conductive adhesive paste includes resin adhesive agent, conducting particles two large divisions at present.Resin adhesive agent
Function is in addition to blocks moisture, then, electrode relative position between predominantly fixed ic chip and substrate outside heat-resisting and insulation function.It is leading
In terms of charged particle, different side's conductive characteristic depends primarily on the pack completeness of conducting particles.Although its conductivity meeting of anisotropic conductive adhesive paste
It is improved with the increase of conducting particles pack completeness, but can also promote conducting particles simultaneously and contact with each other the probability for causing short circuit,
Conductive characteristic is influenced.Partial size is also required simultaneously, big conducting particles can reduce the population of each electrode contact,
Also it be easy to cause adjacent electrode conducting particles to contact simultaneously and the situation of short circuit；Too small conducting particles is easy row into particle buildup
The problem of, cause particle distribution density unequal, electromagnetic wave shielding performance is poor, and resistivity is high, poorly conductive, and such conducting resinl
Film has and is easily deformed due to lacking supporting layer, it has not been convenient to the disadvantages of transporting and storing.The object of the present invention is to provide a kind of energy
Overcome the different side's conductive adhesive film of the Nano type multilayer of disadvantages mentioned above.
Summary of the invention
In order to solve the above technical problems, this is received the object of the present invention is to provide a kind of Nano type Multi-layer composite conductive glue film
The excellent properties such as rice type Multi-layer composite conductive glue film has resistivity low, and electromagnetic wave shielding performance is good, supportive is good and electric conductivity is strong.
A kind of Nano type Multi-layer composite conductive glue film of the invention, including the first conductive adhesive layer, nanometer layer, the second conducting resinl
Layer and release film layer, second conductive adhesive layer are formed in above the release film layer, and the nanometer layer is formed in described second
Above conductive adhesive layer, first conductive adhesive layer is formed in above the nanometer layer；
The nanometer layer includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and nanometer-level silver
At least one of grain；The partial size of the nano-scale particle is 20-100 nanometers.
It further says, the mass percent of each component in the nanometer layer are as follows: the nano-scale particle is 80-85%,
The polyaniline is 5-10%, and the rare earth is 3-6%, and the organic solvent is 3-4%, and the additive is 0.5-3%.
Further say, first conductive adhesive layer with a thickness of 20-40 microns；The nanometer layer it is micro- with a thickness of 1-5
Rice；Second conductive adhesive layer with a thickness of 40-80 microns；The release film layer with a thickness of 30-120 microns.
It further says, the rare earth is at least one of monazite powder, bastnaesite powder and xenotime powder.
It further says, the rare earth is by monazite powder, bastnaesite powder and xenotime powder mixes and weight ratio
For 1:1-2:1-1:5.
It further says, first conductive adhesive layer and second conductive adhesive layer all include acrylic resin, span
Bismaleimide resin, styrene monomer, hydroxy propyl methacrylate, ethylene glycol dimethacrylate, metal conductive particles and
Metallic conduction fiber；The mass percent of each component are as follows: the acrylic resin is 10-20%, the bismaleimide
Resin is 5-15%, and the styrene monomer is 8-20%, and the hydroxy propyl methacrylate is 5-10%, the ethylene glycol two
Methacrylate is 8-15%, and the metal conductive particles are 15-20%, and the metallic conduction fiber is 10-20%.
It further says, the metallic conduction Fiber Materials are copper, silver or nickel.
It further says, the additive is methylhexahydrophthalic anhydride, phenyl dimethylurea, aminopropyl imidazoles and first
At least one of base imidazoles.
Further say, a kind of production method of Nano type Multi-layer composite conductive glue film, as steps described below into
Row:
Step 1: being proportionally added into blender for the nano-scale particle, rare earth, polyaniline, organic solvent and additive,
30-50 revs/min of blender revolving speed, time 20-30 minute stand 1-2 hours, are uniformly mixed it, through high-temperature laminating, obtain
Nanometer layer；
Step 2: by olefin(e) acid system resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, second two
Alcohol dimethylacrylate, metal conductive particles and metallic conduction fiber are proportionally added into blender, blender revolving speed 40-50
Rev/min, time 30-40 minute stands 3-4 hours, is uniformly mixed it, obtains conducting resinl；
Step 3: conducting resinl made from application step two i.e. the second conductive adhesive layer on release film layer, using 150-200 DEG C
Low-temperature setting molding；
Step 4: nanometer layer made from step 1 is fitted on the second conductive adhesive layer surface；
Step 5: conducting resinl i.e. the first conductive adhesive layer made from rapid two is formed in a nanometer layer surface with coating or transfer printing
On, it is formed using 150-200 DEG C of low-temperature setting, obtains the different side's conductive adhesive film of the Nano type multilayer.
The beneficial effects of the present invention are: increasing nanometer layer between former first, second conductive adhesive layer, which is benefit
It is fabricated to high-temperature and high-pressure conditions, performance is stablized, not only high temperature resistant, corrosion-resistant, but also has good electric conductivity, resistivity
Down to 0.37 Ω cm^2, electromagnetic wave shielding performance with super strength, electromagnetic wave shielding rate is up to 90.23%, so that containing
The conductive adhesive film of the nanometer layer is with good conductive effect and electromagnetic wave shielding performance and has good mechanical strength, has simultaneously
There are preferable supportive, convenient transportation and storage.More preferably, the nano-scale particle partial size used is 20-50 nanometer, through high temperature
When pressing, it can be come into full contact between nano-scale particle, will not be breaking, more enhance its shielding.It will be further appreciated that using
Release film can effectively avoid product winding when there is adherent phenomenon.Nano type Multi-layer composite conductive glue film of the invention has
Resistivity is low, and electromagnetic wave shielding performance is good to wait by force excellent properties with electric conductivity.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, it is described in detail below with presently preferred embodiments of the present invention.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is structural schematic diagram of the present invention after removing release film layer；
The appended drawing reference of each section is as follows in figure:
First conductive adhesive layer 1, nanometer layer 2, the second conductive adhesive layer 3 and release film layer 4.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
Illustrate the present invention, but is not intended to limit the scope of the invention.
Referring to Fig. 1, a kind of Nano type Multi-layer composite conductive glue film described in embodiment, including the first conductive adhesive layer 1, nanometer
The 2, second conductive adhesive layer 3 of layer and release film layer 4, second conductive adhesive layer 3 is formed in 4 top of release film layer, described to receive
Rice layer 2 is formed in 3 top of the second conductive adhesive layer, and first conductive adhesive layer 1 is formed in 2 top of nanometer layer；
The nanometer layer 2 includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and nanometer-level silver
At least one of grain；The partial size of the nano-scale particle is 20-100 nanometers.Preferably, the partial size of the nano-scale particle is
20-50 nanometers.
The mass percent of each component in the nanometer layer 2 are as follows: the nano-scale particle is 80-85%, the polyaniline
For 5-10%, the rare earth is 3-6%, and the organic solvent is 3-4%, and the additive is 0.5-3%.
First conductive adhesive layer 1 with a thickness of 20-40 microns；
The nanometer layer 2 with a thickness of 1-5 microns；
Second conductive adhesive layer 3 with a thickness of 40-80 microns；
The release film layer 4 with a thickness of 30-120 microns.
The rare earth is at least one of monazite powder, bastnaesite powder and xenotime powder.
The rare earth is mixed by monazite powder, bastnaesite powder and xenotime powder and weight ratio is 1:1-2:1-1:
5。
First conductive adhesive layer 1 and second conductive adhesive layer 3 all include acrylic resin, bismaleimide tree
Rouge, styrene monomer, hydroxy propyl methacrylate, ethylene glycol dimethacrylate, metal conductive particles and metallic conduction are fine
Dimension；The mass percent of each component are as follows: the acrylic resin is 10-20%, and the bimaleimide resin is 5-
15%, the styrene monomer is 8-20%, and the hydroxy propyl methacrylate is 5-10%, the ethylene glycol dimethyl propylene
Acid esters is 8-15%, and the metal conductive particles are 15-20%, and the metallic conduction fiber is 10-20%.
The metallic conduction Fiber Materials are copper, silver or nickel.
The additive is in methylhexahydrophthalic anhydride, phenyl dimethylurea, aminopropyl imidazoles and methylimidazole
It is at least one.
Embodiment 1 arrives the formula such as table 1 that 5 nanometer layer of embodiment uses；Embodiment 1 to embodiment the first conductive adhesive layer and
Formula such as table 2 used by second conductive adhesive layer.
Embodiment 1 arrives embodiment 5, the production method of a kind of Nano type Multi-layer composite conductive glue film, according to following
Step carries out:
Step 1: being proportionally added into blender for the nano-scale particle, rare earth, polyaniline, organic solvent and additive,
30-50 revs/min of blender revolving speed, time 20-30 minute stand 1-2 hours, are uniformly mixed it, through high-temperature laminating, obtain
Nanometer layer；
Step 2: by olefin(e) acid system resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, second two
Alcohol dimethylacrylate, metal conductive particles and metallic conduction fiber are proportionally added into blender, blender revolving speed 40-50
Rev/min, time 30-40 minute stands 3-4 hours, is uniformly mixed it, obtains conducting resinl；
Step 3: conducting resinl made from application step two i.e. the second conductive adhesive layer on release film layer, using 150-200 DEG C
Low-temperature setting molding；
Step 4: nanometer layer made from step 1 is fitted on the second conductive adhesive layer surface；
Step 5: conducting resinl i.e. the first conductive adhesive layer made from rapid two is formed in a nanometer layer surface with coating or transfer printing
On, it is formed using 150-200 DEG C of low-temperature setting, obtains the different side's conductive adhesive film of the Nano type multilayer.
Conduction analysis test is carried out to the Nano type Multi-layer composite conductive glue film after removing release film: using high bridge tester
It carries out conduction analysis to test, in the first conductive adhesive layer and the false patch nickel plating steel disc of the second conductive adhesive layer upper and lower surface difference and flexibility
After wiring board, test sample crosses conduction resistance value data before and after Reflow Soldering respectively for pressing solidification, will make test to the present invention and make
For embodiment, the result measured is reported in Table 3 below.
Peeling force analysis test is carried out to the Nano type Multi-layer composite conductive glue film after the two-sided release film of removing: with omnipotent drawing
Power machine carries out peeling force analysis test, in the first conductive adhesive layer and the false patch nickel plating steel disc of the second conductive adhesive layer two sides difference and copper foil
After substrate, test removing force value is taken out in pressing solidification, will make test to the present invention as embodiment, and in kind test it
The result measured is reported in Table 3 below by the peeling force of conducting resinl as comparative example.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Nano-scale particle (%) | 80 | 85 | 82 | 84 | 83 |
| Polyaniline (%) | 10 | 5 | 8 | 9 | 7 |
| Rare earth (%) | 6 | 3 | 6 | 3 | 5 |
| Organic solvent (%) | 3.5 | 4 | 3 | 3 | 3 |
| Additive (%) | 0.5 | 3 | 1 | 1 | 2 |
Note: rare earth is monazite powder in embodiment 1, and additive is methylhexahydrophthalic anhydride；It is dilute in embodiment 2
Soil is bastnaesite powder, and additive is phenyl dimethylurea；Rare earth is xenotime powder in embodiment 3, and additive is aminopropyl imidazoles；
Rare earth is monazite powder and bastnaesite powder in embodiment 4, and ratio 1:1, additive is methylimidazole；It is dilute in embodiment 5
Soil is bastnaesite powder and xenotime powder, and ratio 1:5, additive is aminopropyl imidazoles.
Table 2
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Acrylic resin (%) | 10 | 20 | 20 | 17 | 18 |
| Bimaleimide resin (%) | 15 | 10 | 14 | 12 | 5 |
| Styrene monomer (%) | 20 | 15 | 8 | 17 | 19 |
| Hydroxy propyl methacrylate (%) | 10 | 5 | 10 | 6 | 9 |
| Ethylene glycol dimethacrylate (%) | 15 | 15 | 8 | 11 | 14 |
| Metal conductive particles (%) | 20 | 15 | 20 | 18 | 19 |
| Metallic conduction fiber (%) | 10 | 20 | 20 | 19 | 16 |
Table 3
A kind of Nano type Multi-layer composite conductive glue film provided by the invention, after toasted, resistivity is stablized, and has good
Conductive effect and electromagnetic wave shielding performance and have good mechanical strength.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (2)
1. a kind of Nano type Multi-layer composite conductive glue film, it is characterised in that: including the first conductive adhesive layer, nanometer layer, the second conduction
Glue-line and release film layer, second conductive adhesive layer are formed in above the release film layer, and the nanometer layer is formed in described the
Above two conductive adhesive layers, first conductive adhesive layer is formed in above the nanometer layer；
The nanometer layer includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is in nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and Silver Nanoparticles
At least one；The partial size of the nano-scale particle is 20-100 nanometers；
The mass percent of each component in the nanometer layer are as follows: the nano-scale particle is 80-85%, and the polyaniline is 5-
10%, the rare earth is 3-6%, and the organic solvent is 3-4%, and the additive is 0.5-3%；
First conductive adhesive layer with a thickness of 20-40 microns；The nanometer layer with a thickness of 1-5 microns；Described second is conductive
Glue-line with a thickness of 40-80 microns；The release film layer with a thickness of 30-120 microns；
The rare earth is at least one of monazite powder, bastnaesite powder and xenotime powder；
First conductive adhesive layer and second conductive adhesive layer all include acrylic resin, bimaleimide resin, benzene
Vinyl monomer, hydroxy propyl methacrylate, ethylene glycol dimethacrylate, metal conductive particles and metallic conduction fiber；Respectively
The mass percent of component are as follows: the acrylic resin is 10-20%, and the bimaleimide resin is 5-15%, institute
Stating styrene monomer is 8-20%, and the hydroxy propyl methacrylate is 5-10%, and the ethylene glycol dimethacrylate is
8-15%, the metal conductive particles are 15-20%, and the metallic conduction fiber is 10-20%；
The metallic conduction Fiber Materials are copper, silver or nickel；
The additive be in methylhexahydrophthalic anhydride, phenyl dimethylurea, aminopropyl imidazoles and methylimidazole at least
It is a kind of.
2. a kind of production method of Nano type Multi-layer composite conductive glue film according to claim 1, it is characterised in that: according to
Following step carries out:
Step 1: being proportionally added into blender for the nano-scale particle, rare earth, polyaniline, organic solvent and additive, stirring
30-50 revs/min of machine revolving speed, time 20-30 minute stand 1-2 hours, are uniformly mixed it, through high-temperature laminating, obtain nanometer
Layer；
Step 2: by acrylic resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, ethylene glycol
Dimethylacrylate, metal conductive particles and metallic conduction fiber are proportionally added into blender, and blender revolving speed 40-50 turns/
Minute, time 30-40 minute stands 3-4 hours, is uniformly mixed it, obtains conducting resinl；
Step 3: conducting resinl made from application step two i.e. the second conductive adhesive layer on release film layer, using 150-200 DEG C of low temperature
Curing molding；
Step 4: nanometer layer made from step 1 is fitted on the second conductive adhesive layer surface；
Conducting resinl i.e. the first conductive adhesive layer made from rapid two: being formed in nanometer layer surface by step 5 with coating or transfer printing,
It is formed using 150-200 DEG C of low-temperature setting, obtains the different side's conductive adhesive film of the Nano type multilayer.
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| CN110408342B (en) * | 2019-06-10 | 2020-12-08 | 江西蓝海芯科技集团有限公司 | Preparation method of carbon nanosphere-filled dual-curing conductive adhesive tape and application of carbon nanosphere-filled dual-curing conductive adhesive tape in electromagnetic shielding adhesive tape |
| CN115785840A (en) * | 2023-02-02 | 2023-03-14 | 江苏元京电子科技有限公司 | Shading electromagnetic shielding adhesive tape |
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| CN101157799A (en) * | 2007-07-16 | 2008-04-09 | 西北师范大学 | Polyaniline/nano graphite lamella/Eu[3+] nano film material and method for making same |
| JP2010241638A (en) * | 2009-04-06 | 2010-10-28 | Riichi Murakami | Thin film laminate with metal nanoparticle layer interposed |
| CN103131337A (en) * | 2011-11-25 | 2013-06-05 | 昆山超邦胶粘制品有限公司 | Anisotropic electric conduction adhesive tape/film |
| CN205124112U (en) * | 2015-10-26 | 2016-03-30 | 昆山雅森电子材料科技有限公司 | Novel thermoset conductive film |
| CN105567112B (en) * | 2016-01-18 | 2018-06-19 | 杨宜丰 | A kind of anisotropy conductiving glue and preparation method thereof |
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