CN102311713A - Nanometer conductive adhesive - Google Patents
Nanometer conductive adhesive Download PDFInfo
- Publication number
- CN102311713A CN102311713A CN2010102156069A CN201010215606A CN102311713A CN 102311713 A CN102311713 A CN 102311713A CN 2010102156069 A CN2010102156069 A CN 2010102156069A CN 201010215606 A CN201010215606 A CN 201010215606A CN 102311713 A CN102311713 A CN 102311713A
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- conductive
- conductive adhesive
- carbon nanotube
- nano silver
- nano
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Abstract
The invention relates to a nanometer conductive adhesive, which belongs to the field of material preparation and electronic packaging. A carbon nanotube is used as a template, a layer of nano silver is chemically plated on the surface of the carbon nanotube after being subjected to surface chemical modification, then an obtained composite nano silver wires are used as conductive functives, and epoxy resin is used as a substrate to prepare the conductive adhesive with excellent conductivity. The conductive adhesive not only has excellent mechanical properties, corrosion resistance and inoxidizability, but also has wide application prospects in the electronic packaging industry.
Description
(1) technical field
The present invention relates to a kind of conductive nano tackiness agent, belong to material prepn and Electronic Packaging field.
(2) technical background
Along with electronic devices and components develop to miniaturized, lightness direction gradually, the Sn/Pb scolder that tradition is used in the Electronic Packaging industry has exposed its shortcoming: (1) linear resolution is too low, can only in pitch is the scope more than the 0.65mm, use in recent years; (2) from the environment protection angle, the use of Pb is under an embargo in American-European countries, and the application of Sn/Pb scolder is restricted; (3) because the too high easy damage device of scolder welding temperature.Conductive resin can improve the linear resolution of connection because what use is metal-powder (have even reached nano level) conduction; Matrix is a macromolecular material, can be used for flexible base, board; Have series of advantages such as coating process is simple, solidification value is low, make conductive resin be widely used in microelectronics Packaging industries such as SMT, SMD, PCD as the substitute of Sn/Pb.Electro-conductive adhesive comprises two big types, isotropy homogeneous electro-conductive adhesive (ICA) and anisotropy conductiving glue stick (ACA).ICA is meant the tackiness agent that all directions are all conducted electricity, and ACA is then different, is meant the tackiness agent in Z direction conduction like Z-axle ACA, and is then non-conductive at X and Y direction.Current research mainly concentrates on the ICA aspect.The present invention utilizes carbon nanotube to be template exactly, prepares silver-colored nano combined line with electroless plating method, is that conductive functional filler has prepared the compound silver nanometer conductive resin with the silver-colored nm-class conducting wire of preparing again.Monodimension nanometer material is owing to have particular structural and unique electric property, mechanical property and good chemicalstability and by broad research and application.Wherein nano silver wire is owing to radius-of-curvature little suitable " point discharge ", and it is less to have good field emissivity and threshold field, and emission is higher with the emission bit density.Accurate one dimension nano silver wire both can have been given full play to the advantage of the fibrous texture of nano wire as the conductive filler material of conductive resin; In the resin matrix of conductive resin, form conductive network better, can bring into play a tunnel conduction effect and an emission conductive effect of nanoparticle again.
(3) summary of the invention
The present invention is a conductive functional filler with compound silver nanometer particle (accurate one dimension nano silver wire), is that caking agent has prepared conductivity and all very excellent electro-conductive adhesive of adhesiveproperties with epoxy resin.
Of the present invention to the effect that is template with the carbon nanotube; Behind surface chemical modification at its surface chemical plating last layer nanometer silver; Be conductive functional filler with the composite nano silver line that obtains again; With epoxy resin is that matrix prepares electro-conductive adhesive, below 100 ℃ or self-vulcanizing, can obtain electroconductibility (volume specific resistance≤10
-6Ω cm) and tensile shear strength (>=50MPa) equal good electro-conductive adhesive, and the content of silver is less than 45% (disregarding solvent).
(4) embodiment
Explain below in conjunction with specific embodiment:
Take by weighing certain quantity of carbon nanometer pipe; After a series of chemical treatments, make its surface connect sulfydryl; The method of using electroless plating then is " plating " last layer nano-Ag particles on its surface; Institute's " plating " silver is 1: 1 with the mass ratio of carbon nanotube, is conductive functional filler with this composite nano silver line then, promptly gets product of the present invention with 2: 1～3: 1 ratios and E-51 type epoxy resin thorough mixing.Add an amount of epoxy curing agent during use, promptly can be used for the bonding of electric elements and the encapsulation of circuit card after mixing, 60 ℃～100 ℃ curing promptly obtain.
Claims (1)
1. conductive nano tackiness agent; Its essential characteristic is: be template with the carbon nanotube; Behind surface chemical modification, at its surface chemical plating last layer nanometer silver, being conductive functional filler with the composite Nano gold thread that obtains again, is the electro-conductive adhesive of matrix with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102156069A CN102311713A (en) | 2010-07-02 | 2010-07-02 | Nanometer conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102156069A CN102311713A (en) | 2010-07-02 | 2010-07-02 | Nanometer conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102311713A true CN102311713A (en) | 2012-01-11 |
Family
ID=45425290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102156069A Pending CN102311713A (en) | 2010-07-02 | 2010-07-02 | Nanometer conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102311713A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103265924A (en) * | 2013-05-16 | 2013-08-28 | 伍淑华 | Silvered carbon nano-tube and epoxy resin conductive adhesive |
| CN103289622A (en) * | 2013-05-16 | 2013-09-11 | 伍淑华 | Preparation method of silver-plated carbon nano-tube epoxy resin conductive adhesive |
| GB2510133A (en) * | 2013-01-24 | 2014-07-30 | Bae Systems Plc | Conductive bonded composites |
| CN104830031A (en) * | 2015-05-15 | 2015-08-12 | 华中科技大学 | Epoxy resin composite material with heat conduction and antistatic properties and preparation method thereof |
| WO2019165581A1 (en) * | 2018-02-27 | 2019-09-06 | 苏州大学张家港工业技术研究院 | Super-hydrophobic electrothermal epoxy resin composite material and preparation and self-repairing method therefor |
| CN114350300A (en) * | 2022-02-22 | 2022-04-15 | 江苏特丽亮镀膜科技有限公司 | Novel low-VOC conductive adhesive for chip packaging and preparation method thereof |
-
2010
- 2010-07-02 CN CN2010102156069A patent/CN102311713A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2510133A (en) * | 2013-01-24 | 2014-07-30 | Bae Systems Plc | Conductive bonded composites |
| GB2510133B (en) * | 2013-01-24 | 2017-08-30 | Bae Systems Plc | Conductive bonded composites |
| CN103265924A (en) * | 2013-05-16 | 2013-08-28 | 伍淑华 | Silvered carbon nano-tube and epoxy resin conductive adhesive |
| CN103289622A (en) * | 2013-05-16 | 2013-09-11 | 伍淑华 | Preparation method of silver-plated carbon nano-tube epoxy resin conductive adhesive |
| CN104830031A (en) * | 2015-05-15 | 2015-08-12 | 华中科技大学 | Epoxy resin composite material with heat conduction and antistatic properties and preparation method thereof |
| WO2019165581A1 (en) * | 2018-02-27 | 2019-09-06 | 苏州大学张家港工业技术研究院 | Super-hydrophobic electrothermal epoxy resin composite material and preparation and self-repairing method therefor |
| US11739067B2 (en) | 2018-02-27 | 2023-08-29 | Soochow University | Super-hydrophobic electrothermal epoxy resin composite material and preparation and self-repairing method therefor |
| CN114350300A (en) * | 2022-02-22 | 2022-04-15 | 江苏特丽亮镀膜科技有限公司 | Novel low-VOC conductive adhesive for chip packaging and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120111 |