CN106634668A - Nano multilayer composite conductive adhesive film and manufacturing method thereof - Google Patents
Nano multilayer composite conductive adhesive film and manufacturing method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
The invention relates to a nano multilayer composite conductive adhesive film which comprises a first conductive adhesive layer, a nano layer, a second conductive adhesive layer and a release film layer. The nano layer comprises rare earth, polyaniline, organic solvents and additives besides nano particles. The nano layer additionally arranged between the first conductive adhesive layer and the second conductive adhesive layer is made under high-temperature high-pressure conditions and is stable in performance, resistant to high temperature and corrosion, high in conductivity and remarkable in electromagnetic wave shielding performance, electrical resistivity is 0.37omega.cm<2>, and an electromagnetic wave shielding rate is up to 90.23%, so that the conductive adhesive film with the nano layer has great conductivity, electromagnetic wave shielding performance and mechanical strength. The nano multilayer composite conductive adhesive film has excellent performances such as low electrical resistivity, excellent electromagnetic wave shielding performance and high conductivity. In addition, product structural simplicity is achieved, a manufacturing method is simple, and high processability is realized.
Description
Technical field
The invention belongs to conductive adhesive film technical field, more particularly, it relates to a kind of different side's conductive adhesive film of novel multi-layer.
Background technology
Anisotropic conductive is to be coated with to fit between a kind of base material a and base material b, and current limit can only be by vertical axis z directions
Circulate in a kind of special coating substance between base material a, b.Have unilateal conduction and glued fixed function concurrently, can solve
The microscopic wire connectivity problem that in the past connector cannot be processed.
At present the main composition of anisotropic conductive includes resin adhesive agent, conducting particles two large divisions.Resin adhesive agent
Function is except blocks moisture, then, electrode relative position between predominantly fixed ic chips and substrate outside heat-resisting and insulation function.Leading
Charged particle aspect, different side's conductive characteristic depends primarily on the pack completeness of conducting particles.Although anisotropic conductive its conductance meeting
Improve with the increase of conducting particles pack completeness, but short-circuit probability caused while can also lift conducting particles and contact with each other,
Conductive characteristic has been affected.Particle diameter is also required simultaneously, big conducting particles can reduce the population of each electrode contact,
Also easily cause adjacent electrode conducting particles simultaneously to contact and the situation of short circuit；The easy row of too little conducting particles is into particle buildup
Problem, cause particle distribution density unequal, electromagnetic wave shielding performance is poor, resistivity height, poorly conductive, and such conducting resinl
Film due to lacking supporting layer, with being easily deformed, it has not been convenient to transport and the shortcomings of store.It is an object of the invention to provide a kind of energy
Overcome the different side's conductive adhesive film of Nano type multilayer of disadvantages mentioned above.
The content of the invention
To solve above-mentioned technical problem, it is an object of the invention to provide a kind of Nano type Multi-layer composite conductive glued membrane, this is received
Rice type Multi-layer composite conductive glued membrane has resistivity low, and electromagnetic wave shielding performance is good, supportive is good and the electric conductivity excellent properties such as by force.
A kind of Nano type Multi-layer composite conductive glued membrane of the present invention, including the first conductive adhesive layer, nanometer layer, the second conducting resinl
Layer and release film layer, second conductive adhesive layer is formed at the release film layer top, and the nanometer layer is formed at described second
Conductive adhesive layer top, first conductive adhesive layer is formed at the nanometer layer top；
The nanometer layer includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and nanometer-level silver
At least one in grain；The particle diameter of the nano-scale particle is 20-100 nanometers.
Further say, the mass percent of each component is in the nanometer layer：The nano-scale particle is 80-85%,
The polyaniline is 5-10%, and the rare earth is 3-6%, and the organic solvent is 3-4%, and the additive is 0.5-3%.
Further say, the thickness of first conductive adhesive layer is 20-40 microns；The thickness of the nanometer layer is that 1-5 is micro-
Rice；The thickness of second conductive adhesive layer is 40-80 microns；The thickness of the release film layer is 30-120 microns.
Further say, the rare earth is at least one in monazite powder, bastnaesite powder and xenotime powder.
Further say, the rare earth is mixed and weight ratio by monazite powder, bastnaesite powder and xenotime powder
For 1:1-2:1-1：5.
Further say, first conductive adhesive layer and second conductive adhesive layer all include acrylic resin, span
Bismaleimide resin, styrene monomer, hydroxy propyl methacrylate, ethylene glycol dimethacrylate, metal conductive particles and
Metallic conduction fiber；The mass percent of each component is：The acrylic resin be 10-20%, the BMI
Resin is 5-15%, the styrene monomer be 8-20%, the hydroxy propyl methacrylate be 5-10%, the ethylene glycol two
Methacrylate is 8-15%, and the metal conductive particles are 15-20%, and the metallic conduction fiber is 10-20%.
Further say, the metallic conduction Fiber Materials are copper, silver or nickel.
Further say, the additive is methylhexahydrophthalic anhydride, PDU, aminopropyl imidazoles and first
At least one in base imidazoles.
Further say that a kind of preparation method of described Nano type Multi-layer composite conductive glued membrane is entered as steps described below
OK：
Step one：The nano-scale particle, rare earth, polyaniline, organic solvent and additive are proportionally added into into mixer,
30-50 rev/min of mixer rotating speed, minute time 20-30, stands 1-2 hours so as to be well mixed, Jing high-temperature laminatings are obtained
Nanometer layer；
Step 2：By olefin(e) acid system resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, second two
Alcohol dimethylacrylate, metal conductive particles and metallic conduction fiber are proportionally added into mixer, mixer rotating speed 40-50
Rev/min, minute time 30-40, stand 3-4 hours so as to be well mixed, obtain conducting resinl；
Step 3：Conducting resinl obtained in application step two is the second conductive adhesive layer on release film layer, using 150-200 DEG C
Low-temperature setting is molded；
Step 4：Nanometer layer obtained in step one is fitted on the second conductive adhesive layer surface；
Step 5：It is that the first conductive adhesive layer is formed at a nanometer layer surface by conducting resinl obtained in rapid two with coating or transfer printing
On, it is molded using 150-200 DEG C of low-temperature setting, obtain the different side's conductive adhesive film of the Nano type multilayer.
The invention has the beneficial effects as follows：Nanometer layer is increased between former first, second conductive adhesive layer, the nanometer layer is profit
It is fabricated to high-temperature and high-pressure conditions, stable performance, not only high temperature resistant, corrosion-resistant, and with good electric conductivity, resistivity
As little as 0.37 Ω cm^2, with superpower electromagnetic wave shielding performance, electromagnetic wave shielding rate is up to 90.23%, so that containing
The conductive adhesive film of the nanometer layer has good conductive effect and electromagnetic wave shielding performance and with good mechanical strength, while tool
There are preferable supportive, convenient transport and storage.More preferably, the nano-scale particle particle diameter for adopting for 20-50 nanometers, Jing high temperature
During pressing, can be fully contacted between nano-scale particle, will not be breaking, more enhance its shielding.It will be further appreciated that, adopt
Mould release membrance can be prevented effectively from product winding when there is adherent phenomenon.The Nano type Multi-layer composite conductive glued membrane of the present invention has
Resistivity is low, and electromagnetic wave shielding performance is good to wait by force excellent properties with electric conductivity.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, it is described in detail with presently preferred embodiments of the present invention below.
Description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is structural representation of the present invention after release film layer is peeled off；
The reference of each several part is as follows in figure：
First conductive adhesive layer 1, nanometer layer 2, the second conductive adhesive layer 3 and release film layer 4.
Specific embodiment
With reference to embodiment, the specific embodiment of the present invention is described in further detail.Following examples are used for
The present invention is illustrated, but is not limited to the scope of the present invention.
Referring to Fig. 1, a kind of Nano type Multi-layer composite conductive glued membrane described in embodiment, including the first conductive adhesive layer 1, nanometer
The 2, second conductive adhesive layer 3 of layer and release film layer 4, second conductive adhesive layer 3 is formed at the top of the release film layer 4, described to receive
Rice layer 2 is formed at the top of second conductive adhesive layer 3, and first conductive adhesive layer 1 is formed at the top of the nanometer layer 2；
The nanometer layer 2 includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and nanometer-level silver
At least one in grain；The particle diameter of the nano-scale particle is 20-100 nanometers.Preferably, the particle diameter of the nano-scale particle is
20-50 nanometers.
The mass percent of each component is in the nanometer layer 2：The nano-scale particle be 80-85%, the polyaniline
For 5-10%, the rare earth is 3-6%, and the organic solvent is 3-4%, and the additive is 0.5-3%.
The thickness of first conductive adhesive layer 1 is 20-40 microns；
The thickness of the nanometer layer 2 is 1-5 microns；
The thickness of second conductive adhesive layer 3 is 40-80 microns；
The thickness of the release film layer 4 is 30-120 microns.
The rare earth is at least one in monazite powder, bastnaesite powder and xenotime powder.
The rare earth is mixed by monazite powder, bastnaesite powder and xenotime powder and weight ratio is 1:1-2:1-1：
5。
First conductive adhesive layer 1 and second conductive adhesive layer 3 all include acrylic resin, BMI tree
Fat, styrene monomer, hydroxy propyl methacrylate, ethylene glycol dimethacrylate, metal conductive particles and metallic conduction are fine
Dimension；The mass percent of each component is：The acrylic resin is 10-20%, and the bimaleimide resin is 5-
15%, the styrene monomer be 8-20%, the hydroxy propyl methacrylate be 5-10%, the ethylene glycol dimethyl propylene
Acid esters is 8-15%, and the metal conductive particles are 15-20%, and the metallic conduction fiber is 10-20%.
The metallic conduction Fiber Materials are copper, silver or nickel.
The additive is in methylhexahydrophthalic anhydride, PDU, aminopropyl imidazoles and methylimidazole
It is at least one.
The formula such as table 1 that embodiment 1 is adopted to the nanometer layer of embodiment 5；Embodiment 1 to embodiment the first conductive adhesive layer and
The formula that second conductive adhesive layer is adopted such as table 2.
Embodiment 1 arrives embodiment 5, the preparation method of described a kind of Nano type Multi-layer composite conductive glued membrane, according to following
Step is carried out：
Step one：The nano-scale particle, rare earth, polyaniline, organic solvent and additive are proportionally added into into mixer,
30-50 rev/min of mixer rotating speed, minute time 20-30, stands 1-2 hours so as to be well mixed, Jing high-temperature laminatings are obtained
Nanometer layer；
Step 2：By olefin(e) acid system resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, second two
Alcohol dimethylacrylate, metal conductive particles and metallic conduction fiber are proportionally added into mixer, mixer rotating speed 40-50
Rev/min, minute time 30-40, stand 3-4 hours so as to be well mixed, obtain conducting resinl；
Step 3：Conducting resinl obtained in application step two is the second conductive adhesive layer on release film layer, using 150-200 DEG C
Low-temperature setting is molded；
Step 4：Nanometer layer obtained in step one is fitted on the second conductive adhesive layer surface；
Step 5：It is that the first conductive adhesive layer is formed at a nanometer layer surface by conducting resinl obtained in rapid two with coating or transfer printing
On, it is molded using 150-200 DEG C of low-temperature setting, obtain the different side's conductive adhesive film of the Nano type multilayer.
Nano type Multi-layer composite conductive glued membrane after to peeling off mould release membrance carries out conduction analysis test：Use high bridge tester
Carry out conduction analysis to test, in the first conductive adhesive layer and the second conductive adhesive layer upper and lower surface, respectively vacation pastes nickel plating steel disc with flexibility
After wiring board, respectively test sample crosses conduction resistance data before and after Reflow Soldering for pressing solidification, will make test to the present invention and make
For embodiment, the result for measuring is reported in Table 3 below.
Nano type Multi-layer composite conductive glued membrane after to peeling off two-sided mould release membrance carries out peeling force analysis test：Use omnipotent drawing
Power machine carries out peeling force analysis test, and on the first conductive adhesive layer and the second conductive adhesive layer two sides, respectively nickel plating steel disc and Copper Foil are pasted in vacation
After substrate, pressing solidification is taken out test and peels off force value, and the present invention will be tested as embodiment, in kind tests it
The peeling force of conducting resinl is reported in Table 3 below the result for measuring as comparative example.
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Nano-scale particle (%) | 80 | 85 | 82 | 84 | 83 |
| Polyaniline (%) | 10 | 5 | 8 | 9 | 7 |
| Rare earth (%) | 6 | 3 | 6 | 3 | 5 |
| Organic solvent (%) | 3.5 | 4 | 3 | 3 | 3 |
| Additive (%) | 0.5 | 3 | 1 | 1 | 2 |
Note：The middle rare earth of embodiment 1 is monazite powder, and additive is methylhexahydrophthalic anhydride；It is dilute in embodiment 2
Soil is bastnaesite powder, and additive is PDU；The middle rare earth of embodiment 3 is xenotime powder, and additive is aminopropyl imidazoles；
The middle rare earth of embodiment 4 is monazite powder and bastnaesite powder, and ratio is 1:1, additive is methylimidazole；It is dilute in embodiment 5
Soil is bastnaesite powder and xenotime powder, and ratio is 1:5, additive is aminopropyl imidazoles.
Table 2
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Acrylic resin (%) | 10 | 20 | 20 | 17 | 18 |
| Bimaleimide resin (%) | 15 | 10 | 14 | 12 | 5 |
| Styrene monomer (%) | 20 | 15 | 8 | 17 | 19 |
| Hydroxy propyl methacrylate (%) | 10 | 5 | 10 | 6 | 9 |
| Ethylene glycol dimethacrylate (%) | 15 | 15 | 8 | 11 | 14 |
| Metal conductive particles (%) | 20 | 15 | 20 | 18 | 19 |
| Metallic conduction fiber (%) | 10 | 20 | 20 | 19 | 16 |
Table 3
The present invention provide a kind of Nano type Multi-layer composite conductive glued membrane, it is toasted after, resistivity is stable, with good
Conductive effect and electromagnetic wave shielding performance and with good mechanical strength.
The above is only the preferred embodiment of the present invention, is not limited to the present invention, it is noted that for this skill
For the those of ordinary skill in art field, on the premise of without departing from the technology of the present invention principle, can also make it is some improvement and
Modification, these are improved and modification also should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of Nano type Multi-layer composite conductive glued membrane, it is characterised in that：Including the first conductive adhesive layer, nanometer layer, second conductive
Glue-line and release film layer, second conductive adhesive layer is formed at release film layer top, and the nanometer layer is formed at described the
Two conductive adhesive layers top, first conductive adhesive layer is formed at the nanometer layer top；
The nanometer layer includes nano-scale particle, rare earth, polyaniline, organic solvent and additive；
The nano-scale particle is in nanoscale graphite particle, nanosized copper particle, nanoscale nickel particle and Silver Nanoparticles
At least one；The particle diameter of the nano-scale particle is 20-100 nanometers.
2. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：It is each in the nanometer layer
The mass percent of component is：The nano-scale particle is 80-85%, and the polyaniline is 5-10%, and the rare earth is 3-
6%, the organic solvent is 3-4%, and the additive is 0.5-3%.
3. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：
The thickness of first conductive adhesive layer is 20-40 microns；
The thickness of the nanometer layer is 1-5 microns；
The thickness of second conductive adhesive layer is 40-80 microns；
The thickness of the release film layer is 30-120 microns.
4. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：The rare earth is phosphorus cerium
At least one in lanthanum breeze, bastnaesite powder and xenotime powder.
5. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 4, it is characterised in that：The rare earth is by phosphorus cerium
Lanthanum breeze, bastnaesite powder and xenotime powder are mixed and weight ratio is 1:1-2:1-1：5.
6. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：First conducting resinl
Layer and second conductive adhesive layer all include acrylic resin, bimaleimide resin, styrene monomer, methacrylic acid
Hydroxypropyl acrylate, ethylene glycol dimethacrylate, metal conductive particles and metallic conduction fiber；The mass percent of each component is：
The acrylic resin is 10-20%, and the bimaleimide resin is 5-15%, and the styrene monomer is 8-
20%, the hydroxy propyl methacrylate is 5-10%, and the ethylene glycol dimethacrylate is 8-15%, and the metal is led
Charged particle is 15-20%, and the metallic conduction fiber is 10-20%.
7. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：The metallic conduction is fine
Dimension material is copper, silver or nickel.
8. a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：The additive is first
At least one in base hexahydrophthalic anhydride, PDU, aminopropyl imidazoles and methylimidazole.
9. the preparation method of a kind of Nano type Multi-layer composite conductive glued membrane according to claim 1, it is characterised in that：According to
Following step is carried out：
Step one：The nano-scale particle, rare earth, polyaniline, organic solvent and additive are proportionally added into into mixer, are stirred
30-50 rev/min of machine rotating speed, minute time 20-30, stands 1-2 hours so as to be well mixed, Jing high-temperature laminatings obtain nanometer
Layer；
Step 2：By olefin(e) acid system resin, bimaleimide resin, styrene monomer, hydroxy propyl methacrylate, ethylene glycol two
Methacrylate, metal conductive particles and metallic conduction fiber are proportionally added into mixer, 40-50 rev/min of mixer rotating speed
Clock, minute time 30-40, stands 3-4 hours so as to be well mixed, obtain conducting resinl；
Step 3：Conducting resinl obtained in application step two is the second conductive adhesive layer on release film layer, using 150-200 DEG C of low temperature
Curing molding；
Step 4：Nanometer layer obtained in step one is fitted on the second conductive adhesive layer surface；
Step 5：It is that the first conductive adhesive layer is formed in nanometer layer surface by conducting resinl obtained in rapid two with coating or transfer printing,
It is molded using 150-200 DEG C of low-temperature setting, obtains the different side's conductive adhesive film of the Nano type multilayer.
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| CN201610890065.7A CN106634668B (en) | 2016-10-12 | 2016-10-12 | A kind of Nano type Multi-layer composite conductive glue film and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408342A (en) * | 2019-06-10 | 2019-11-05 | 江西蓝海芯科技集团有限公司 | A kind of preparation method of double curing conductive adhesive tapes of Nano carbon balls filling and its application in electromagnetic shielding adhesive tape |
| CN115785840A (en) * | 2023-02-02 | 2023-03-14 | 江苏元京电子科技有限公司 | Shading electromagnetic shielding adhesive tape |
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| CN205124112U (en) * | 2015-10-26 | 2016-03-30 | 昆山雅森电子材料科技有限公司 | Novel thermoset conductive film |
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| CN110408342A (en) * | 2019-06-10 | 2019-11-05 | 江西蓝海芯科技集团有限公司 | A kind of preparation method of double curing conductive adhesive tapes of Nano carbon balls filling and its application in electromagnetic shielding adhesive tape |
| CN115785840A (en) * | 2023-02-02 | 2023-03-14 | 江苏元京电子科技有限公司 | Shading electromagnetic shielding adhesive tape |
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