JP4890053B2 - Anisotropic conductive film for microcircuit inspection - Google Patents

Description

  The present invention relates to an anisotropic conductive film for microcircuit inspection that is excellent in microcircuit inspection properties, and has excellent inspection stability and repetitive inspection properties, as well as a manufacturing method and an inspection method thereof.

Up to now, regarding inspection methods for continuity inspection of connection electrode groups possessed by semiconductor elements, electronic components, etc., various materials are used for inspection members, in particular connection members of connection portions with connection electrode groups possessed by inspection circuit boards. The form and configuration have been studied.
Particularly in flat panel display control LSIs (for bare chip mounting), the area of each bump (hereinafter referred to as “connection bump”) constituting the connection electrode group becomes smaller as the definition becomes higher, and the interval between the connection bumps. Becomes narrower. Accordingly, the connecting members used for the inspection are required to have contradictory performances such as reliable connection of minute connection bumps and ensuring insulation at a narrow bump interval.

  In response to these problems, instead of the conventional method in which probe pins are arranged at the wiring positions, a connection member has been proposed as a connection member for circuit inspection, in which metal thin wires are regularly arranged to form a conduction path (Patent Document 1). 2). However, thin metal wires are limited in thinning due to processing problems. In addition, when a connection member using a thin metal wire is connected by applying a load at the time of inspection, there is a risk of damaging the connection electrode group to be inspected by biting into the connection electrode group to be inspected. Furthermore, in the case of a connecting member using a fine metal wire, the metal fine wire is plastically deformed in accordance with the height variation of the connection electrode group by connecting with a load, and therefore the height variation of the fine metal wire is likely to occur. There was a problem that repeated use was difficult.

On the other hand, anisotropic conductive films in which conductive particles are regularly arranged are known, but they are connection members for permanently connecting electrode groups, and can be used repeatedly for anisotropic circuit for microcircuit inspection. There was no disclosure of the contents relating to the adhesive film (see, for example, Patent Documents 3 and 4).
International Publication No. 99/048110 Pamphlet JP 2005-85634 A International Publication No. 2005/953888 Pamphlet JP-T-2002-519473

  An object of the present invention is to provide an anisotropic conductive film for microcircuit inspection that can be used repeatedly and can be inspected with a low connection load, corresponding to fine wiring of 40 μm or less.

  As a result of intensive studies to solve the above problems, the present inventors have penetrated a support base material containing an insulating resin in the thickness direction with a plurality of conductive particles insulated from each other. The conductive particles are substantially spherical having protruding portions protruding from the front and back surfaces of the support substrate, the average particle size of the conductive particles is 5 to 40 μm, and the maximum particle size is 5 to 50 μm. It has been found that the above problem can be solved by using an anisotropic conductive film for microcircuit inspection, in which the average interval is 0.5 to 5 times the average particle size of the conductive particles.

That is, the present invention is as follows.
(1) A support base material containing an insulating resin penetrates in the thickness direction with a plurality of conductive particles insulated from each other, and each conductive particle has protruding portions protruding from the front surface and the back surface of the support base material. The conductive particles have an average particle size of 5 to 40 μm and a maximum particle size of 5 to 50 μm. The average interval between the conductive particles is 0.5 to 5 of the average particle size of the conductive particles. An anisotropic conductive film for microcircuit inspection.
(2) The anisotropic conductive film for microcircuit inspection according to (1), wherein the conductive particles have a compression recovery rate of 2% to 100% at 25 ° C.
(3) The anisotropic conductive film for microcircuit inspection according to any one of (1) to (2), wherein the conductive particles are metal-coated resin particles.
(4) The average height of the protruding part of the conductive particles from the surface of the support substrate and the average height of the protruding part of the conductive particles from the back surface are 2 to 30% of the average particle diameter of the conductive particles. The anisotropic conductive film for microcircuit inspection according to any one of (1) to (3), wherein the anisotropic conductive film is in a range.

(5) The anisotropic conductive film for microcircuit inspection according to any one of (1) to (4), wherein the elastic modulus of the supporting substrate at 40 ° C. is smaller than the elastic modulus of the conductive particles. .
(6) Any one of (1) to (5), wherein the average height of the protruding portion of the conductive particles from the surface of the support substrate is different from the average height of the protruding portion of the conductive particles from the back surface. 1. An anisotropic conductive film for microcircuit inspection according to item 1.
(7) A step of forming a release layer containing a thermoplastic resin on a support, a support comprising at least a curing agent and a curable insulating resin and having a thickness of 0.4 to 0.96 times the average particle diameter of the conductive particles Forming a layer on the release layer, forming a laminate by forming an adhesive layer on a biaxially stretchable film, and attaching conductive particles by attaching substantially spherical conductive particles on the laminate A film is prepared, and the conductive particle-adhered film is biaxially stretched so that the average interval between the conductive particles is 0.5 to 5 times the average particle diameter of the conductive particles, and a stretched film is prepared. (1)-(characterizing) including the process of hold | maintaining, the process of laminating | stacking the electroconductive particle surface of the stretched film hold | maintained on the support layer surface, transferring the electroconductive particle to a support layer, and the process of hardening a support layer. 6) Anisotropic conductivity for microcircuit inspection according to any one of For producing a conductive film.

(8) In the step of producing and holding a stretched film, the thickness of the adhesive layer after stretching is 2 to 30% of the average particle diameter of the conductive particles, for microcircuit inspection according to (7) A method for producing an anisotropic conductive film.
(9) Between the connection electrode group that the semiconductor element or electronic component has the anisotropic conductive film for microcircuit inspection according to any one of (1) to (6) and the connection electrode group that the inspection circuit board has A method for inspecting a semiconductor element or electronic component, wherein a load is applied between the two connection electrode groups to inspect electrical continuity between the two connection electrode groups.
(10) A load sandwiched in a state where the higher average surface of the protruding portion of each conductive particle included in the anisotropic conductive film for microcircuit inspection is opposed to a connection electrode group made of a material having lower hardness (9) The method for inspecting a semiconductor element or electronic component according to (9).
(11) A state in which the surface with the higher average height of the protruding portion of each conductive particle included in the anisotropic conductive film for microcircuit inspection is opposed to the connection electrode group with the larger variation in electrode height. (9) The method for inspecting a semiconductor element or electronic component according to (9), wherein a load is applied by sandwiching between.

  The anisotropic conductive film for microcircuit inspection and the inspection method using the same according to the present invention have an effect that it can be used repeatedly and can be inspected with a low connection load, corresponding to fine wiring of 40 μm or less. Further, when the conductive particles are metal-coated resin particles, there is an effect that damage to the inspection electrode can be prevented.

Hereinafter, the present invention will be specifically described.
The anisotropic conductive film for microcircuit inspection according to the present invention penetrates a supporting substrate containing an insulating resin in the thickness direction with a plurality of conductive particles insulated from each other, and each conductive particle is a supporting group. It has a substantially spherical shape having protruding portions protruding from the front and back surfaces of the material, the conductive particles have an average particle size of 5 to 40 μm and a maximum particle size of 5 to 50 μm. It is an anisotropic conductive film for microcircuit inspection which is 0.5 to 5 times the average particle size of the conductive particles.

  By using the anisotropic conductive film for microcircuit inspection, it is possible to perform continuity inspection of semiconductor elements or electronic components. That is, a connection electrode group (hereinafter also referred to as “inspected electrode”) included in the semiconductor element or electronic component and a connection electrode group (hereinafter also referred to as “inspection electrode”) included in the corresponding inspection circuit board. An anisotropic conductive film for microcircuit inspection is arranged, a load is applied from the upper part thereof, and a conductive part is formed by contacting the conductive particles in the anisotropic conductive film for microcircuit inspection with these electrodes, A continuity test can be performed.

First, the conductive particles in the anisotropic conductive film for microcircuit inspection of the present invention will be described.
Since the electroconductive particle in this invention is substantially spherical shape and has penetrated the support base material in the thickness direction, it has the protrusion part which protruded from the surface and back surface of the support base material. Therefore, the contact portion with the connection electrode group is substantially spherical and the contact area is small. Compared with the case where the contact portion with the electrode to be inspected is flat as in the metal thin wire described in Patent Document 1 or 2 described above, It is possible to electrically connect to the electrode to be inspected with a very low load.
The conductive particles only need to have a conductor so as to connect the protruding portions of the front surface and the back surface of the support substrate, and the conductive particles as a whole may be a metal that is a conductor, for example, metal-coated resin particles. In this way, the conductive particles may contain non-conductors.
As the conductive particles, it is preferable to use one or more selected from metal-coated resin particles, noble metal-coated metal particles, metal particles, noble metal-coated alloy particles, and alloy particles.

  As the metal-coated resin particles, for example, substantially spherical particles made of one or more resin particles selected from polystyrene, benzoguanamine, polymethyl methacrylate, etc., coated with a metal such as nickel or gold are used. It is preferable. From the viewpoint of lowering the contact resistance of the contact portion of the conductive particles, the metal coating the resin particles is preferably a noble metal, more preferably gold, and even more preferably a two-layer of nickel and gold. As a coating method, a thin film forming method such as a vapor deposition method or a sputtering method, a coating method using a dry blend method, a wet method such as an electroless plating method or an electrolytic plating method can be used. From the viewpoint of mass productivity, the electroless plating method is preferable.

As the metal particles coated with the noble metal, it is preferable to use metal particles, for example, substantially spherical particles made of nickel or copper and coated with a noble metal such as gold, palladium or rhodium on the outermost layer. As a coating method, a thin film forming method such as a vapor deposition method or a sputtering method, a coating method using a dry blend method, a wet method such as an electroless plating method or an electrolytic plating method can be used. From the viewpoint of mass productivity, the electroless plating method is preferable.
As the metal particles, for example, substantially spherical particles made of silver, copper, or nickel are preferable.
The alloy particles coated with the noble metal include alloys, for example, two or more metals selected from gold, silver, copper, nickel, tin, zinc, bismuth, indium, cobalt, titanium, aluminum, and manganese, or shape memory. It is preferable to use a substantially spherical particle made of an alloy coated with a noble metal such as gold, palladium or rhodium on the outermost layer. As a method for coating, the above method can be used.

The alloy particles include an alloy, for example, two or more metals selected from gold, silver, copper, nickel, tin, zinc, bismuth, indium, cobalt, titanium, aluminum, and manganese, or a shape memory alloy. Spherical particles can be used.
The compression recovery rate at 25 ° C. of the conductive particles is preferably 2% to 100%, and more preferably 10% to 90%. From the viewpoint of conduction stability at the time of inspection, 2% or more is preferable, and from the viewpoint of repeated use of the anisotropic conductive film for microcircuit inspection, it is preferably 100% or less.

  In the anisotropic conductive film for microcircuit inspection of the present invention, the compression recovery rate is measured by a micro compression tester or the like that can measure the load displacement amount at a constant compression load and the unloading displacement amount at the time of unloading. Can do. For example, it can be measured by a micro compression tester MCT-W500 (manufactured by Shimadzu Corporation). As an example of measurement conditions, one arbitrary conductive particle (conductive particle length d) is selected, the load displacement (l1) is measured by applying a load of 1 mN, and the unloading displacement (l2) after unloading. , And the compression restoration rate Rr = ((11−12) / d) × 100 can be calculated.

As the conductive particles for obtaining the compression recovery rate, it is preferable to use metal-coated resin particles, shape memory alloy particles, noble metal-coated shape memory alloy particles, and the like.
The metal-coated resin particles are as described above.
The shape memory alloy particles are preferably substantially spherical particles made of a copper-zinc-tin alloy-based, copper-aluminum-manganese-based, titanium-nickel-based shape memory alloy, and exhibit shape elasticity at room temperature. Particularly preferred are substantially spherical particles made of an alloy.
As the shape memory alloy particles coated with the noble metal, those obtained by coating the above shape memory alloy particles with the noble metal by the method described above are preferable.

Depending on the hardness of the connecting electrode group to be connected (hereinafter also referred to as “electrode hardness”), resin particles coated with noble metal can be formed using softer resin particles.
When the electrode hardness is less than 50 Hv in terms of Vickers hardness, it is preferable to use flexible resin particles such as polymethyl methacrylate resin. Further, when the electrode hardness is 50 Hv or more, it is preferable to use hard resin particles such as benzoguanamine resin.
The ratio of the average particle size to the maximum particle size of the conductive particles is preferably 2 or less, and more preferably 1.5 or less. The particle size distribution of the conductive particles is preferably narrower, and the geometric standard deviation of the particle size distribution of the conductive particles is preferably 1.2 to 2.5, and preferably 1.2 to 1.4. Is particularly preferred. When the geometric standard deviation is the above value, the variation in particle size is reduced. In general, it is considered that the conductive particles function more effectively as the particle diameters become uniform.

  The geometric standard deviation of the particle size distribution is a value obtained by dividing the σ value of the particle size distribution (particle size value of 84.13% cumulative) by the particle size value of 50% cumulative. When the particle size distribution (logarithm) is set on the horizontal axis of the particle size distribution graph and the cumulative value (%, cumulative number ratio, logarithm) is set on the vertical axis, the particle size distribution is almost linear, and the particle size distribution is lognormal distribution. Follow. The cumulative value indicates the number ratio of particles having a certain particle size or less with respect to the total number of particles, and is expressed in%. The sharpness of the particle size distribution is expressed by the ratio of σ (the cumulative particle size value of 84.13%) and the average particle size (the cumulative particle size value of 50%). The σ value is an actual measurement value or a read value from the plot value of the graph.

The average particle size and particle size distribution can be measured using a known method and apparatus, and a wet particle size distribution meter, a laser particle size distribution meter, or the like can be used. Alternatively, the average particle size and particle size distribution may be calculated by observing the particles with an electron microscope or the like.
The average particle size and the maximum particle size of the conductive particles in the present invention are obtained by taking an enlarged photograph of the anisotropic conductive film for microcircuit inspection of the present invention with an optical microscope and selecting any 100 conductive particles. The maximum particle size is obtained by measuring the maximum particle size of the conductive particles, and the average particle size is obtained by calculating the average of them.

The average particle size of the conductive particles is preferably 5 to 40 μm, and more preferably 10 to 30 μm. 40 μm or less is preferable from the viewpoint of handling microcircuits, and 5 μm or more is preferable from the viewpoint of low resistance of conductive particles.
The maximum particle size of the conductive particles is 5 μm or more and 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less. It is preferable that it is 50 micrometers or less from a viewpoint of corresponding to a fine circuit.
The average interval between the conductive particles is preferably 0.5 to 5 times the average particle size of the conductive particles, and more preferably in the range of 1 to 3 times. It is preferably 0.5 times or more from the viewpoint of holding the conductive particles in the support substrate and ensuring insulation between adjacent conductive particles, and is 5 times or less from the viewpoint of dealing with fine circuits. It is preferable.

The average interval between the conductive particles in the present invention is determined as follows.
First, the photograph which expanded the anisotropic conductive film for microcircuit inspection of this invention with the optical microscope is image | photographed. Next, arbitrary 20 conductive particles are selected, and the shortest distance between the 6 adjacent conductive particles closest to the respective conductive particles and the conductive particles (the surface of the conductive particle and the adjacent The shortest distance from the surface of the conductive particles) is measured, and the average of the six values is defined as the interval between the conductive particles. Next, the average value of the intervals between the 20 conductive particles is obtained and set as the average interval between the conductive particles. It is preferable that the variation in the interval between the conductive particles is small, and the standard deviation of the interval between the conductive particles is preferably 10% or less of the average interval between the conductive particles.

  In order to ensure contact between the electrode to be inspected and the inspection electrode, it is preferable that the conductive particles of the anisotropic conductive film for microcircuit inspection have protruding portions protruding from the front surface and the back surface of the support substrate. The average height of the protruding portion of the conductive particles from the surface of the support base and the average height of the protruding portion of the conductive particles from the back surface are in the range of 2 to 30% of the average length of the conductive particles, respectively. It is preferable that there is, and more preferably, it is in the range of 5 to 20%.

In order to stably ensure contact with each electrode, it is preferably 2% or more, and preferably 30% or less from the viewpoint of stably holding the conductive particles in the support.
In the anisotropic conductive film for microcircuit inspection according to the present invention, the average height of the protruding portion of the conductive particles from the support base can be selected from any 100 conductive particles, and the displacement in the focal direction can be measured. It can obtain | require by measuring each with a laser microscope and averaging. At the same time, the length of the conductive particles can be measured by measuring the height from the reference plane. When the displacement in the focal direction is measured using the laser microscope, the displacement measurement resolution is preferably 0.02 μm or less, and particularly preferably 0.01 μm or less.

  The protruding portion of the conductive particles from the support substrate may be the same as or different from the average protruding height of the protruding portion on one side of the front surface or the back surface. However, in order to ensure contact and conduction between the electrode to be inspected and the inspection electrode and the conductive particles, the surface having the higher average height of the protruding portion of each conductive particle included in the anisotropic conductive film for microcircuit inspection is an electrode. It is preferable to apply a load by sandwiching the connecting electrode group facing the larger connecting electrode group. Also, a load is applied by sandwiching the surface with the higher average height of the protruding portion of each conductive particle of the anisotropic conductive film for microcircuit inspection facing the connection electrode group made of a material with lower hardness. It is also preferable to add.

Next, the support base material used for this invention is illustrated.
The supporting substrate in the present invention may be a known material as long as it has sufficient insulation, is not damaged during inspection, and has sufficient strength to hold conductive particles. However, it is preferable that an insulating resin is included from the point of workability.
The elastic modulus of the supporting substrate is preferably smaller than the elastic modulus of the conductive particles at 40 ° C. When the conductive particles are made of a rigid material such as metal, the elastic modulus of the support substrate is determined by the conductivity of the support substrate to prevent damage caused by deformation of the conductive particles in the anisotropic conductive film for microcircuit inspection. It is preferably smaller than the elastic modulus of the particles. In particular, when the conductive particles are metal-coated resin particles, the elastic modulus of the support substrate should be smaller than the elastic modulus of the resin particles in order to relieve the elastic strain of the conductive particles at the time of inspection and use repeatedly. preferable. As each elastic modulus, a value obtained by measuring the elastic modulus of a material used for each of the elastic modulus by a known method can be used.

The insulating resin used for the support substrate of the anisotropic conductive film for microcircuit inspection of the present invention is a curable resin such as a thermosetting resin, a photocurable resin, a light and thermosetting resin, or an electron beam curable resin. An insulating resin obtained by curing the insulating resin or a thermoplastic insulating resin can be used. In view of ease of handling, it is preferable to use an insulating resin obtained by curing a thermosetting resin. As the thermosetting resin, for example, an epoxy resin, an acrylic resin, and a silicone resin can be used, and a silicone resin and an epoxy resin are particularly preferable.
When using a silicone resin, it is preferable to use a catalyst-curable curable silicone resin.

  The epoxy resin is a compound having two or more epoxy groups in one molecule, such as a compound having a glycidyl ether group, a glycidyl ester group, an alicyclic epoxy group, or a compound in which a double bond in the molecule is epoxidized. preferable. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, novolac phenol type epoxy resin, or modified epoxy resins thereof can be used. As the modified epoxy resin, a rubber-modified epoxy resin excellent in flexibility is preferable.

  The curing agent used for curing the curable insulating resin may be any one that can cure the curable insulating resin. When a thermosetting resin is used as the curable insulating resin, a resin that can be cured by reacting with the thermosetting resin at 100 ° C. or higher is preferable. In the case of an epoxy resin, a latent curing agent is preferable from the viewpoint of storage stability. For example, an imidazole curing agent, a capsule type imidazole curing agent, a cationic curing agent, a radical curing agent, a Lewis acid curing agent. An agent, an amine imide curing agent, a polyamine salt curing agent, a hydrazide curing agent, and the like can be used. From the viewpoint of storage stability and low-temperature reactivity, capsule-type imidazole curing agents are preferred.

  As the insulating resin used for the support substrate of the anisotropic conductive film for microcircuit inspection, an insulating resin obtained by curing a composition in which a thermoplastic insulating resin is blended with a curable insulating resin may be used. A support base material can be easily formed in a sheet shape by mix | blending a thermoplastic insulating resin. The blending amount of the thermoplastic insulating resin is preferably 0 to 200 parts by mass, and more preferably 0 to 100 parts by mass with respect to 100 parts by mass of the components including the curing agent and the curable insulating resin.

  Thermoplastic insulating resins that can be blended in the above composition are phenoxy resin, polyvinyl acetal resin, polyvinyl butyral resin, alkylated cellulose resin, polyester resin, acrylic resin, styrene resin, urethane resin, polyethylene terephthalate resin, silicone resin, etc. , One or two or more resins selected from them may be combined. Among these resins, a resin having a polar group such as a hydroxyl group or a carboxyl group is preferable from the viewpoint of adhesive strength. The thermoplastic insulating resin preferably contains at least one thermoplastic resin having a glass transition temperature of 80 ° C. or higher and 300 ° C. or lower.

  In the above composition, an additive may be blended with the above-described components. In order to increase the flexibility of the anisotropic conductive film for microcircuit inspection, an elastomer component can be blended as an additive. As the elastomer component, synthetic rubber resins, natural rubber resins, and modified resins thereof can be used. The form may be either one that can be uniformly dissolved or one that can be blended as fine particles. When blended as fine particles, the average particle size is preferably 0.001-1 μm, and more preferably 0.001-0.1 μm. The blending amount of the elastomer component is preferably 0.01 to 10 parts by mass in 100 parts by mass of the composition. 0.01 mass part or more is preferable from a viewpoint of a softness | flexibility improvement, and 10 mass parts or less are preferable from a viewpoint of electroconductive particle retainability.

  The thickness of the supporting substrate is preferably 3 μm or more and 40 μm or less, and more preferably 5 μm or more and 35 μm or less. From the viewpoint of mechanical connection strength, 3 μm or more is preferable, and from the viewpoint of alignment accuracy at the time of inspection, it is preferably 40 μm or less.

Next, the preferable manufacturing method of the anisotropic conductive film for microcircuit inspection of this invention is illustrated.
The anisotropic conductive film for microcircuit inspection of the present invention is preferably obtained through the following steps [1] to [5].
[1] A step of forming a release layer containing a thermoplastic resin on a support
[2] A step of forming on the release layer a support layer comprising at least a curing agent and a curable insulating resin and having a thickness of 0.4 to 0.96 times the average particle diameter of the conductive particles.
[3] An adhesive layer is provided on a biaxially stretchable film to form a laminate, and substantially spherical conductive particles are adhered on the laminate to produce a conductive particle-attached film. Step of producing and holding a stretched film by biaxially stretching the particle-adhered film so that the average interval between the conductive particles is 0.5 to 5 times the average particle size of the conductive particles
[4] Step of laminating the conductive particle surface of the stretched film held on the support layer surface and transferring the conductive particles to the support layer
[5] As the order of the process steps for curing the support layer, the steps [1] to [5] may be performed in order, or the step [3] is performed first, followed by the steps [1], [2], Subsequently, the steps [4] and [5] may be performed.

Hereinafter, each step will be described.
[1] Step of forming a release layer containing a thermoplastic resin on a support As a support, a support made of a smooth substrate having excellent adhesion to the release layer, such as a plastic film, a metal plate, glass, etc. A plate can be used.
As the resin used for the release layer (hereinafter also referred to as “release layer resin”), a known resin can be used as the thermoplastic resin. Since it becomes easy to control the protruding height of the conductive particles by causing the conductive particles to bite into the release layer during transfer of the conductive particles, the release layer resin is preferably a flexible resin. Moreover, in order to peel easily the anisotropic conductive film for microcircuit inspection, it is preferable that it is resin which is hard to carry out hardening reaction with the curable resin component in a support layer.
Specifically, the release layer resin is preferably a curable silicone pressure-sensitive adhesive, an addition-type silicone pressure-sensitive adhesive, a styrene-butadiene based synthetic rubber, an ethylene-vinyl acetate copolymer resin, or a water-soluble polyvinyl butyral resin. In order to facilitate peeling between the support layer after curing and the support, it is also preferable to use a water-soluble resin that is easily dissolved in a solvent in which the support layer after curing is difficult to dissolve, such as water, as the release layer resin. It is. It is also possible to apply a stripping solution or the like on the release layer in advance before laminating the support layer. Examples of the stripper include silicone oil, long chain fatty acid derivatives such as stearic acid derivatives, silane coupling agents, and the like.

[2] A step of forming on the release layer a support layer comprising at least a curing agent and a curable insulating resin and having a thickness of 0.4 to 0.96 times the average particle diameter of the conductive particles. Lamination of the release layer and the support layer A known method can be used as the method of performing. Specifically, after forming the release layer, a solution in which the support layer component is a solution is applied or dried, or a support layer is formed on a pre-releasable substrate and laminated with the release layer, It is possible to use a method of peeling and removing a peelable substrate.
The thickness of the support layer is preferably 0.4 to 0.96 times the average particle diameter of the conductive particles. From the viewpoint of holding conductive particles, the thickness of the support layer is preferably 0.4 times or more of the average particle diameter,
From the viewpoint of contact between the electrode to be inspected and the conductive particles at the time of microcircuit inspection, it is preferably 0.96 times or less.

[3] An adhesive layer is provided on a biaxially stretchable film to form a laminate, and substantially spherical conductive particles are adhered on the laminate to produce a conductive particle-attached film. Step of biaxially stretching the particle-adhered film so that the average distance between the conductive particles is 0.5 to 5 times the average particle size of the conductive particles to produce and hold a stretched film Biaxially stretchable As the film, a known resin film or the like can be used, but a polyethylene resin, a polypropylene resin, a polyester resin, a polyvinyl butyral resin, a polyvinyl alcohol resin, a polyvinylidene chloride resin or the like alone or a copolymer, or a nitrile rubber It is preferable to use a flexible and stretchable resin film such as a rubber sheet such as butadiene rubber or silicone rubber. Polypropylene resin and polyester resin are particularly preferable. The shrinkage after stretching is preferably 10% or less.

When an adhesive sheet made of at least a curing agent and a curable insulating resin is used as the adhesive layer, it is preferable to stretch at a lower temperature, so that a biaxially stretchable film such as polyethylene resin or silicone rubber is used. Is preferred. In this case, in order to facilitate the transfer of the adhesive sheet, it is preferable to perform a peeling treatment on the film in advance.
As the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer, a known one can be used, but when biaxial stretching is performed while heating, it is preferable to use a non-thermal crosslinkable pressure-sensitive adhesive. Specifically, natural rubber-based adhesives, synthetic rubber-based adhesives, synthetic resin emulsion-based adhesives, silicone-based adhesives, ethylene-vinyl acetate copolymer adhesives, and the like can be used alone or in combination. . From the viewpoint of conductive particle retention before stretching, uniformity of conductive particle dispersion during stretching, and transferability of conductive particles after stretching, a pressure-sensitive adhesive obtained by graft polymerization of a natural rubber-based pressure-sensitive adhesive with acrylate is particularly preferable. Furthermore, it is preferable to heat-process for 1 minute to 5 minutes below extending | stretching temperature before extending | stretching from the point of the uniformity at the time of heating extending | stretching.

  As the method for forming an adhesive layer, a method in which an adhesive dispersed or dissolved in a solvent or water is applied by a known method such as a gravure coater, a die coater, a knife coater, a bar coater, or a spray coat and dried can be used. . When a hot-melt type pressure-sensitive adhesive is used, it can be roll-coated without a solvent.

  As a method for arranging and fixing substantially spherical conductive particles in a single layer on a biaxially stretchable film, a known method can be used. For example, a method in which an adhesive layer containing at least a thermoplastic resin is formed on the biaxially stretchable film, conductive particles are brought into contact therewith and adhered, and a single layer is arranged by applying a load with a rubber roll or the like. Can be taken. In this case, a method of repeating the adhesion-roll operation several times is preferable for filling without gaps. In the case of spherical conductive particles, since the closest packing is the most stable structure, it can be filled relatively easily. Alternatively, an adhesive is formed on the biaxially stretchable film to form an adhesive layer, and conductive particles are adhered on the adhesive layer. If necessary, the adhesion is repeated several times, and a method of arranging in a single layer is used. be able to.

  In applying the conductive particles to the pressure-sensitive adhesive layer, it is preferable to arrange the conductive particles in a single layer with almost no gap (hereinafter also referred to as “dense packing”). As a method for dense packing, the above-described method of dispersing and arranging conductive particles on a biaxially stretchable film can be used. In addition, close packing shall mean filling so that the average space | interval between the filled particles may be 1/2 or less of an average particle diameter. More preferably, the average interval between the filled particles is 1/5 or less of the average particle size.

  As a method for stretching a biaxially stretchable film in which conductive particles are arranged in a single layer, a known method can be used, but a biaxial stretching device is preferably used from the viewpoint of uniform dispersion alignment. From the viewpoint of particle spacing, the degree of stretching is preferably 50% or more and 500% or less, and more preferably 100% or more and 300% or less. In addition, 100% stretching means that the length of the portion stretched along the stretching direction is 100% of the length before stretching. The stretching direction is arbitrary, but biaxial stretching with a stretching angle of 90 ° is preferable, and simultaneous stretching is preferable. In the case of biaxial stretching, the degree of stretching in each direction may be the same or different.

As the biaxial stretching apparatus, a simultaneous biaxial continuous stretching apparatus is preferable.
As the simultaneous biaxial continuous stretching apparatus, a known one can be used, but a tenter type stretching machine that continuously stretches by fixing the long side with a chuck fitting and simultaneously stretching the distance in the vertical and horizontal directions is preferable. As a method for adjusting the degree of stretching, a screw method or a pantograph method can be used, but a pantograph method is more preferable from the viewpoint of accuracy of adjustment. When stretching while heating, it is preferable to provide a preheating zone before the stretched portion and a heat setting zone behind the stretched portion.

The film thickness of the biaxially stretched film is preferably 1/10 to 1 times the total thickness of the support layer, release layer and support, and preferably 1/5 to 1/2. Particularly preferred. From the viewpoint of handling properties of the stretched film, it is preferably 1/10 or more, and from the viewpoint of transfer of conductive particles to the support substrate after stretching, it is preferably 1 time or less.
In this case, the thickness of the adhesive layer after stretching is preferably 2% to 30% of the particle diameter of the conductive particles, and the protrusion height from the support substrate is controlled by controlling this film thickness. Can do. Similarly, the thickness of the release layer is also preferably 2% to 30% of the particle diameter of the conductive particles. By changing the thickness of the adhesive layer and the thickness of the release layer, the average height of the protruding portions of the conductive particles can be changed. It is preferable that an anisotropic conductive film for microcircuit inspection different in can be produced.

[4] Step of laminating conductive particle surface of stretched film held on support layer surface and transferring conductive particles to support layer It is preferable to use a laminator for conductive particle transfer, and vacuum laminator It is particularly preferable to use In order to facilitate transfer, it is possible to heat at the time of transfer. In that case, it is preferably 25 to 80 ° C., more preferably 25 to 50 ° C. from the viewpoint of transferability.

[5] Step of curing the support layer From the viewpoint of obtaining sufficient film strength when peeling the anisotropic conductive film for microcircuit inspection from the release layer, the conductive particles are held in a state of being transferred to the support layer. The support layer is preferably cured as it is.
As a method for curing, a known method for curing a curable insulating resin with heat, ultraviolet rays, or an electron beam is used. The degree of cure is preferably such that the consumption rate of reactive functional groups is 90% or more.
Thereafter, a method of removing the stretched film and peeling the anisotropic conductive film for microcircuit inspection from the release layer is preferable. In the case where the anisotropic conductive film for microcircuit inspection is a thin film, a form in which the anisotropic conductive film is laminated on a support and is peeled off during use is preferable because it can prevent damage and the like.

It is also preferable to form a pressure-sensitive adhesive layer by applying a re-peelable pressure-sensitive adhesive to one or both surfaces of the anisotropic conductive film for microcircuit inspection of the present invention. By forming the adhesive layer, the anisotropic conductive film for microcircuit inspection can be prevented from moving during inspection, which is preferable.
The connecting member using the anisotropic conductive film for microcircuit inspection of the present invention is used in combination with an inspection circuit board to inspect a wiring board of a display device such as a liquid crystal display device, a plasma display device, an electroluminescence display device, and the like. It can be used for inspection of semiconductor elements such as LSIs or electronic parts, and for inspection of wiring boards of other equipment. Among the above display devices, it is preferable to use for inspection of LSIs for small liquid crystal devices that require fine circuit inspection and circuit boards used in them.

The present invention also relates to an inspection method using an anisotropic conductive film for microcircuit inspection.
The anisotropic conductive film for microcircuit inspection of the present invention can be used for continuity inspection of separated LSI and electronic components. It can also be used for continuity inspection of silicon wafers before being singulated.

  Next, the present invention will be described with reference to examples and comparative examples.

(Manufacturing method of semiconductor element and inspection circuit board)
After forming an oxide film on the entire surface of a silicon piece (thickness 0.5 mm) of 1.6 mm × 15.1 mm in length and width, aluminum thin films (1000 mm) of 77 μm in width and 120 μm in length are placed at intervals of 23 μm, 40 μm inside. 140 pieces are formed on the long side and 14 pieces are formed on the short side. Further, a similar aluminum thin film is formed in the same pattern so that the gap and the position of the aluminum thin film are shifted from the pattern by 25 μm on the inner side of 30 μm. In order to form two gold bumps (thickness 15 μm) each having a width of 25 μm and a length of 100 μm on the aluminum thin film at intervals of 25 μm, a width of 10 μm inside 7.5 μm from the outer peripheral portion of each gold bump placement location. Then, a protective film of silicon oxide is formed on the entire surface other than the opening by a conventional method except for leaving the opening having a length of 60 μm. Thereafter, the gold bump is formed to form a semiconductor element.

  Connection pad of indium tin oxide film (1500 mm) so that gold bumps on the outer aluminum thin film are connected to a gold bump on the adjacent aluminum thin film on a non-alkali glass having a thickness of 0.7 mm so as to be paired with each other. (Width 77 μm, length 100 μm). Each time 20 gold bumps are connected, an indium tin oxide thin film lead wire is formed on the connection pad (this lead wire serves as a connection resistance measurement portion).

In addition, a connection pad (25 μm wide, 100 μm long) of an indium tin oxide film (1500 mm) is formed in such a positional relationship that the gold bumps on the outer aluminum thin film are connected to different sides. Lead wires (15 μm wide, indium tin oxide film) are formed from the connection pads through the corresponding bumps on the inner side, and indium tin oxide thin film connection wires are formed so that 10 bumps can be connected. Connect. Further, connection pads are formed in a similar manner so that the inner 10 bumps are paired with them, and connection wirings are formed between the outer bumps to form a comb pattern. A lead wire of an indium tin oxide thin film is formed on each connection wire (this lead wire becomes an insulation resistance measurement part).
An aluminum-titanium thin film (titanium 1%, 3000 mm) is formed on each lead-out wiring to form an inspection circuit board.

[Example 1]
25 g phenoxy resin (glass transition temperature 98 ° C., number average molecular weight 14000), modified phenoxy resin (glass transition temperature 45 ° C., 30% hydroxyl group modified with polyester polyol), rubber-modified epoxy resin (epoxy equivalent 290, bisphenol) 30 g of type A terminal carboxyl-butadiene-acrylonitrile copolymer (containing 10 parts by mass with respect to 100 parts by mass of epoxy resin) is dissolved in a mixed solvent of ethyl acetate-toluene (mixing ratio 1: 1), and the solid content is 50%. Make a solution. 30 g of a liquid epoxy resin containing a microcapsule-type latent imidazole curing agent (average particle diameter of microcapsules 5 μm, active temperature 125 ° C.) is mixed and dispersed in the 50% solid content solution. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film by which peeling treatment was carried out on the surface, and air-dried for 15 minutes at 60 degreeC, and the film-form support layer sheet | seat A with a film thickness of 14 micrometers was obtained.

  30 g of ethylene-vinyl acetate copolymer (vinyl acetate amount 50%, melt flow index 2 g / 10 min, 190 ° C.) is dissolved in methyl ethyl ketone to obtain a solution having a solid content of 10%. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film, and air-dried at 60 degreeC for 15 minute (s), and the film-like peeling layer sheet | seat B with a film thickness of 2.0 micrometer was obtained. After laminating support layer sheet A and release layer sheet B at 50 ° C., the polyethylene terephthalate film on the support layer sheet surface was peeled off.

  Gold-plated plastic particles with an average particle diameter of 17.0 μm (conductivity) applied to an unstretched polypropylene film with a thickness of 100 μm coated with a natural rubber-methyl methacrylate graft copolymer adhesive as an adhesive layer with a thickness of 8 μm. The particles, the elastic modulus at 40 ° C. of 3.8 GPa, and the compression recovery rate after compression at 25% at 25 ° C. of 8%) were applied in a single layer with almost no gap. That is, the conductive particles are prepared in a container having a thickness of several layers or more in a container larger than the film width, and the adhesive particles are pressed and adhered to the conductive particles with the application surface of the adhesive facing downward. Then, excess particles were scraped off with a scrubber made of soft rubber.

By repeating this operation twice, a conductive particle adhesion film coated with a single layer without a gap was obtained. This conductive particle adhesion film was heat-treated at 100 ° C. for 3 minutes in a dryer.
This film was fixed using 10 chucks vertically and horizontally using a biaxial stretching device (X6H-S manufactured by Toyo Seiki, pantograph type corner stretch type biaxial stretching device), preheated at 130 ° C. for 120 seconds, Thereafter, the film was stretched and fixed by 100% at a speed of 5% / second. Thereafter, the support layer surface of the laminated sheet was laminated at 50 ° C. on this stretched film, and then peeled and fixed, and heated at 150 ° C. for 2 hours to obtain an anisotropic conductive film for microcircuit inspection.

  An enlarged photograph was taken with an optical microscope, and when 100 arbitrary conductive particles were selected and the average particle size and maximum particle size of the conductive particles were measured, the average particle size was 3.0 μm and the maximum particle size was 3 .2 μm. As a result of laser microscope observation, 100% of 100 conductive particles were single particles. The average distance between the conductive particles was 21.2 μm. This is 1.25 times the average particle size of the conductive particles.

Also, select any 100 conductive particles, measure the height of the protruding portions of the conductive particles from the front and back surfaces of the anisotropic conductive film for microcircuit inspection, and obtain the average value thereof. It was. As a result, the average height of the protruding portions was 1.4 μm on the front surface and 1.6 μm on the back surface. This corresponds to 8.2% and 9.4%, respectively, with respect to the average particle diameter of the conductive particles.
When the support body which does not contain electroconductive particle was produced and the 40 degreeC elasticity modulus was measured, it was 0.9 GPa.

[Example 2]
40 g of phenoxy resin (glass transition temperature 98 ° C., number average molecular weight 14000), rubber-modified epoxy resin (epoxy equivalent 290, bisphenol A type, terminal carboxyl-butadiene-acrylonitrile copolymer 15 parts by mass with respect to 100 parts by mass of epoxy resin 25 g) is dissolved in a mixed solvent of ethyl acetate-toluene (mixing ratio 1: 1) to obtain a 50% solid content solution. A liquid epoxy resin containing a microcapsule-type latent imidazole curing agent (average particle diameter of microcapsule 5 μm, active temperature 125 ° C.) 35 g is mixed and dispersed in the 50% solid content solution. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film by which peeling treatment was carried out on the surface, and air-dried at 60 degreeC for 15 minute (s), and the film-form support layer sheet | seat C with a film thickness of 8 micrometers was obtained.

  30 g of ethylene-vinyl acetate copolymer (vinyl acetate amount 50%, melt flow index 2 g / 10 min, 190 ° C.) is dissolved in methyl ethyl ketone to obtain a solution having a solid content of 10%. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film, and air-dried for 15 minutes at 60 degreeC, and obtained the film-like peeling layer sheet | seat D with a film thickness of 1.0 micrometer. After laminating support layer sheet C and release layer sheet D at 50 ° C., the polyethylene terephthalate film on the support layer sheet surface was peeled off.

  Gold-plated plastic particles with an average particle size of 10.0 μm (conductive) coated on a non-stretched polypropylene film with a thickness of 100 μm and a 4 μm thick natural rubber-methyl methacrylate graft copolymer adhesive as an adhesive layer A single layer of particles, an elastic modulus of 3.7 GPa at 40 ° C., and a compression recovery rate of 8.5% after 25% compression at 25 ° C. was applied almost without any gap. That is, the conductive particles are prepared in a container having a thickness of several layers or more in a container larger than the film width, and the adhesive particles are pressed and adhered to the conductive particles with the application surface of the adhesive facing downward. Then, excess particles were scraped off with a scrubber made of soft rubber.

By repeating this operation twice, a conductive particle adhesion film coated with a single layer without a gap was obtained. This conductive particle adhesion film was heat-treated at 100 ° C. for 3 minutes in a dryer.
This film was fixed using 10 chucks vertically and horizontally using a biaxial stretching device (X6H-S manufactured by Toyo Seiki, pantograph type corner stretch type biaxial stretching device), preheated at 130 ° C. for 120 seconds, Thereafter, the film was stretched and fixed by 120% at a speed of 5% / second. Thereafter, the support layer surface of the laminated sheet was laminated at 50 ° C. on this stretched film, and then peeled and fixed, and heated at 150 ° C. for 2 hours to obtain an anisotropic conductive film for microcircuit inspection.

An enlarged photograph was taken with an optical microscope, and arbitrary 100 conductive particles were selected and the average particle size and maximum particle size of the conductive particles were measured. The average particle size was 10.0 μm, and the maximum diameter was 10 It was 5 μm.
As a result of laser microscope observation, 100% of 100 conductive particles were single particles. The average distance between the conductive particles was 14.3 μm. This is 1.43 times the average particle size of the conductive particles.
Also, select any 100 conductive particles, measure the height of the protruding portions of the conductive particles from the front and back surfaces of the anisotropic conductive film for microcircuit inspection, and obtain the average value thereof. It was. As a result, the average height of the protruding portions was 1.0 μm on the front surface and 0.9 μm on the back surface. This corresponds to 10.0% and 9.0% with respect to the average particle diameter of the conductive particles, respectively.
When the support body which does not contain electroconductive particle was produced and the 40 degreeC elastic modulus was measured, it was 1.0 GPa.

[Comparative Example 1]
25 g phenoxy resin (glass transition temperature 98 ° C., number average molecular weight 14000), modified phenoxy resin (glass transition temperature 45 ° C., 30% hydroxyl group modified with polyester polyol), rubber-modified epoxy resin (epoxy equivalent 290, bisphenol) 30 g of type A terminal carboxyl-butadiene-acrylonitrile copolymer (containing 10 parts by mass with respect to 100 parts by mass of epoxy resin) is dissolved in a mixed solvent of ethyl acetate-toluene (mixing ratio 1: 1), and the solid content is 50%. Make a solution. 30 g of a liquid epoxy resin containing a microcapsule-type latent imidazole curing agent (average particle diameter of microcapsules 5 μm, active temperature 125 ° C.) is mixed and dispersed in the 50% solid content solution. Gold-plated plastic particles having an average particle diameter of 17.0 μm (conductive particles, elastic modulus at 40 ° C., 3.8 GPa, after 25% compression at 25 ° C., so that the solid content is 13% by volume. The compression restoration rate of 8%) was mixed and dispersed. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film by which peeling treatment was carried out on the surface, and air-dried for 15 minutes at 60 degreeC, and the film-like support layer sheet | seat E with a film thickness of 16 micrometers was obtained.

The support layer sheet E was fixed and heat-cured at 150 ° C. for 2 hours to obtain an anisotropic conductive film for microcircuit inspection.
An enlarged photograph was taken with an optical microscope, and when arbitrary 100 conductive particles were selected and the average particle size and the maximum particle size of the conductive particles were measured, the average particle size was 17.1 μm and the maximum particle size was 17. 6 μm. As a result of laser microscope observation, 82% of 100 conductive particles were single particles. There were three places where three or more conductive particles were agglomerated, and the maximum particle diameter was 52 μm. The average distance between the conductive particles was 20.2 μm. This is 1.19 times the average particle size of the conductive particles.
Also, select any 100 conductive particles, measure the height of the protruding portions of the conductive particles from the front and back surfaces of the anisotropic conductive film for microcircuit inspection, and obtain the average value thereof. It was. As a result, the average height of the protruding portions was 0.1 μm on the front surface and 0 μm on the back surface. One side did not protrude.
When the support body which does not contain electroconductive particle was produced and the 40 degreeC elasticity modulus was measured, it was 0.9 GPa.

[Comparative Example 2]
40 g of phenoxy resin (glass transition temperature 98 ° C., number average molecular weight 14000), rubber-modified epoxy resin (epoxy equivalent 290, bisphenol A type, terminal carboxyl-butadiene-acrylonitrile copolymer 15 parts by mass with respect to 100 parts by mass of epoxy resin 25 g) is dissolved in a mixed solvent of ethyl acetate-toluene (mixing ratio 1: 1) to obtain a 50% solid content solution. A liquid epoxy resin containing a microcapsule-type latent imidazole curing agent (average particle diameter of microcapsule 5 μm, active temperature 125 ° C.) 35 g is mixed and dispersed in the 50% solid content solution. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film by which peeling treatment was carried out on the surface, and air-dried for 15 minutes at 60 degreeC, and the film-like support layer sheet | seat F with a film thickness of 12 micrometers was obtained.

  30 g of ethylene-vinyl acetate copolymer (vinyl acetate amount 50%, melt flow index 2 g / 10 min, 190 ° C.) is dissolved in methyl ethyl ketone to obtain a solution having a solid content of 10%. Then, it apply | coated on the 50-micrometer-thick polyethylene terephthalate film, and air-dried at 60 degreeC for 15 minute (s), and the film-like peeling layer sheet | seat G with a film thickness of 1.0 micrometer was obtained. After laminating the support layer sheet F and the release layer sheet G at 50 ° C., the polyethylene terephthalate film on the support layer sheet surface was peeled off.

  A polyethylene rubber terephthalate film with a thickness of 50 μm and a 1 μm thick natural rubber-methyl methacrylate graft copolymer adhesive applied as an adhesive layer are previously charged by shaking 20 times in a polyethylene bag. Further, gold-plated plastic particles having an average particle size of 14.0 μm (conductive particles, elastic modulus at 40 ° C. of 3.7 GPa, recovery rate after 25% compression at 25 ° C. of 8.3%) were dispersed and dispersed from above 5 cm. . Then, after laminating the support layer surface of the laminated sheet at 50 ° C. on this conductive particle adhesion film, peeling and fixing, heating at 150 ° C. for 2 hours to obtain an anisotropic conductive film for microcircuit inspection It was.

As a result of laser microscope observation, 87% of 100 conductive particles were single particles. There were two places where four or more conductive particles aggregated, and the maximum particle diameter was 55 μm. The average distance between the conductive particles was 18.3 μm. This is 1.31 times the average particle size of the conductive particles.
Also, select any 100 conductive particles, measure the height of the protruding portions of the conductive particles from the front and back surfaces of the anisotropic conductive film for microcircuit inspection, and obtain the average value thereof. It was. As a result, the average height of the protruding portions was 1.0 μm on the front surface and 0.9 μm on the back surface. This corresponds to 7.1% and 6.4%, respectively, with respect to the average particle diameter of the conductive particles.
When the support body which does not contain electroconductive particle was produced and the 40 degreeC elastic modulus was measured, it was 1.0 GPa.

Using the anisotropic conductive films for microcircuit inspection of Examples 1-2 and Comparative Examples 1-2 obtained in this manner, the connection resistance value and the insulation resistance value of the semiconductor element described above were measured.
An anisotropic conductive film for microcircuit inspection with a width of 4 mm and a length of 20 mm is arranged so that all the connection pads of the inspection circuit board are covered, the semiconductor element is aligned and mounted, and a load head with a width of 2.5 mm is mounted. Use and hold at 30 ° C under 0.3 MPa pressure, measure the resistance value between lead wires of test circuit board (daisy chain of 20 gold bumps) with a four-terminal ohmmeter, and connect resistance value And In addition, the resistance between the paired lead wires is measured to obtain an insulation resistance value. The insulation resistance value is x when the value is 100 MΩ or less, and ◯ when the value is more than 100 MΩ.
Evaluation of repeatability is: ○, ± 100% or more when the connection resistance value is measured repeatedly by applying and removing the load five times, and the fifth connection resistance value is within ± 20% of the initial connection resistance value. The case of was made as x.

  Table 1 shows the connection resistance values, insulation resistance values, and evaluation results of repeatability of the connection structures of Examples and Comparative Examples. As is apparent from Table 1, the anisotropic conductive film for microcircuit inspection of the present invention exhibits excellent characteristics.

  The anisotropic conductive film for microcircuit inspection of the present invention corresponds to fine wiring, can be used repeatedly, and is used as an anisotropic conductive film for control LSIs such as high-definition display devices that require microcircuit inspection. Is preferred.

The schematic diagram of the anisotropic conductive film for microcircuit inspection of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Conductive particle 2 Support base material 3 Anisotropic conductive film for microcircuit inspection

Claims (6)

A plurality of conductive particles are penetrated in the thickness direction in a state where a plurality of conductive particles are insulated from each other, and each conductive particle has a substantially spherical shape having protruding portions protruding from the front surface and the back surface of the support substrate. The conductive particles have an average particle size of 5 to 40 μm and a maximum particle size of 5 to 50 μm, and the average interval between the conductive particles is 0.5 to 5 times the average particle size of the conductive particles. An anisotropic conductive film for microcircuit inspection in which the average height of the protruding portion of the conductive particles from the surface of the support substrate is different from the average height of the protruding portion of the conductive particles from the back surface,
Method of inspecting semiconductor element or electronic component for inspecting electrical continuity between both connection electrode groups by applying load between connection electrode group of semiconductor element or electronic component and connection electrode group of inspection circuit board Because
Hold the surface with the higher average height of the protruding part of each conductive particle in the anisotropic conductive film for microcircuit inspection facing the connecting electrode group with the larger variation in electrode height. A method for inspecting a semiconductor element or an electronic component, wherein a load is applied. The method for inspecting a semiconductor element or an electronic component according to claim 1, wherein the support base material includes an insulating resin obtained by curing a curable insulating resin as an insulating resin . The method for inspecting a semiconductor element or electronic component according to claim 1 or 2, wherein the conductive particles have a compression recovery rate of 2% or more and 100% or less at 25 ° C. The method for inspecting a semiconductor element or an electronic component according to claim 1, wherein the conductive particles are metal-coated resin particles . The average height of the protruding portion of the conductive particles from the surface of the support base and the average height of the protruding portion of the conductive particles from the back surface are in the range of 2 to 30% of the average particle size of the conductive particles. The method for inspecting a semiconductor element or electronic component according to any one of claims 1 to 4 . The method for inspecting a semiconductor element or electronic component according to any one of claims 1 to 5, wherein the elastic modulus of the supporting substrate at 40 ° C is smaller than the elastic modulus of the conductive particles .

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