JP3360772B2 - Connection structure of fine electrode and inspection method of electronic component having fine electrode - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an LCD, a TAB type IC,
The present invention relates to a novel fine electrode connection structure for an electronic component such as a bare chip IC having fine electrodes on substantially the same plane, and a continuity inspection method using the same.

[0002]

2. Description of the Related Art As electronic devices become smaller and thinner, LCDs
Flat panel displays such as (liquid crystal displays) have been applied to many products instead of conventional CRTs.
In this LCD, the pixel density is increased in order to improve the display image quality, and accordingly, the electrodes for inputting image signals are also increased in density and definition. Similarly, TAB type IC electrodes used to output image signals to LCDs have a high density,
High definition. The connection of fine electrodes when mounting these electronic components is difficult with conventional solder or rubber connectors, so recently connection members made of anisotropically conductive adhesives or films have been used frequently. It has become In addition, many products that directly mount a bare chip on a substrate using an LCD or other electronic components are increasing. These LCs
The connection of fine electrodes in a function test before mounting electronic components such as D, TAB type ICs, bare chip ICs, etc. is a jig that obtains electrical connection by pressing a needle-like electrode against an electrode of an electronic component conventionally. This is done with a pin probe.

[0003] In addition, there have been proposed other connection structures as shown in the prior art documents. 53-15
No. 6569, Japanese Unexamined Patent Publication No. Sho 54-67672 discloses a connection structure in which an anisotropic conductive rubber sheet is sandwiched between an electrode portion of an electronic component to be inspected and a substrate for inspection. Electrical connection. This anisotropic conductive rubber sheet is made of zebra rubber in which conductive rubber and insulating rubber are laminated or conductive rubber particles uniformly dispersed in an insulating rubber sheet, and conductive short fibers are oriented in the thickness direction of the insulating rubber sheet. It was made.

A connection structure disclosed in Japanese Patent Application Laid-Open No. Hei 3-183974 has a connection structure in which conductive particles are localized at positions corresponding to electrodes for the purpose of improving the definition of the anisotropic conductive rubber sheet. Structures have also been proposed. JP-A-59-1
The methods disclosed in Japanese Patent Application No. 55679 and Japanese Utility Model Application Laid-Open No. 59-163967 perform an electrical connection by directly contacting a conductive pattern formed on a flexible film with an electrode part of an electronic component to be inspected. And JP-A-61-2338.
JP, JP-A-1-128381, JP-B2-4
Japanese Patent Application Laid-Open No. 4747/1995, Japanese Patent Publication No. 3-22367, etc. provide a conductive projection on the conductive pattern and make an electrical connection by directly contacting the projection with an electrode portion of an electronic component. Is also known. In addition,
As disclosed in Japanese Patent Publication No. 18031, an anisotropic conductive film provided with a protruding electrode through an electrically insulating polymer film is sandwiched between an object to be inspected and a printed circuit board for characteristic inspection. A connection structure for obtaining an electrical connection has also been proposed.

[0005]

However, the connection structure according to the prior art described above cannot cope with high-definition electrodes, is expensive, cannot absorb variations in electrode height, and has poor electrical connectivity. There was a problem. In particular,
In a connection structure using a probe, the probe must be pressed into contact with each electrode. Therefore, a finer probe is required as the definition of the electrode is increased, and a high level of technology is required for the manufacture of the probe. Further, there is a problem that it is not easy to arrange a large number of probes in accordance with the positions of the electrodes, and the manufacturing cost becomes large. Even with the method of using a zebra rubber or an anisotropically conductive rubber sheet in which conductors are uniformly dispersed, it is difficult to cope with high-definition electrodes, the insulation between adjacent electrodes cannot be maintained, and the connection resistance is high. was there. The anisotropic conductive rubber sheet, in which conductive particles are poled at the position corresponding to the electrode, makes it difficult to remove the insulating layer on the surface of the electrode if the electrode surface is contaminated with organic matter or has an oxide layer, and the connection resistance increases. There was a problem.

A conductive structure formed on a flexible film and an electrode portion of an electronic component to be inspected are brought into direct contact with each other to make an electrical connection, and a protruding electrode penetrates through an electrically insulating polymer film. In the connection structure in which the provided anisotropic conductive film is sandwiched between the object to be inspected and the printed circuit board for characteristic inspection to obtain an electrical connection, the conductive pattern and the protruding electrodes are made of a metal such as copper or gold. Since the amount of elastic deformation is small, it is necessary to follow the variation in the height between the electrodes of the inspection object by the bending deformation due to the flexibility of the connecting substrate and the flexibility of the film base material. Has a problem that the connectivity is reduced. Further, in general printed wiring boards and ICs, since there is a solder resist or an insulating protective film between the electrodes, the electrodes are often lower than these surfaces, and a protruding electrode must be provided only in the electrode portion. There was a problem. The present invention has been made in view of such a situation, and an object of the present invention is to provide a novel connection structure capable of reliably obtaining a low-resistance electrical connection even with a fine electrode.

[0007]

According to the present invention, according to the present invention, elastic conductive particles exposed on the front and back surfaces are provided between an electrode part of an electronic component and an electronic component having an electrode facing the electrode. This is achieved by providing a fine electrode connection structure characterized by obtaining an electrical connection by sandwiching an anisotropic conductive resin film-shaped molded product having conductivity only in the thickness direction through the intermediary. In other words, by using the connection structure of the fine electrodes as a connection structure between an electronic component having a fine electrode which is a non-inspection object and an inspection substrate connected to an inspection device, an LCD display inspection which has been difficult by the conventional method. In addition, it has become possible to perform an operation inspection of an element constituting an LCD, an operation inspection of a bare chip IC, a TAB type IC, a conduction inspection of a printed wiring board, and the like.

[0008] The anisotropic conductive resin film-like molded product used in the present invention has a single layer of conductive particles having elasticity dispersed in the surface direction of the resin film, and a part of the surface of each conductive particle. Has a structure exposed or projected from both sides of the resin film. The type of the conductive particles is not particularly limited as long as it has elasticity, such as particles made of conductive rubber or conductive plastic, and particles formed by forming a metal plating layer on the surface of rubber or plastic particles. Can be used alone or in combination. Elasticity does not decrease the conductivity, and the wider the elastic deformation region, the more the variation in the electrode height and the variation in the particle size of the conductive particles are absorbed, and good electrical connection becomes possible. As the particles having a metal plating layer formed on the surface of the plastic particles, plastic particles having various elastic moduli are commercially available, and various metals can be selected for plating. Plating is used in a configuration in which various metals are used alone or in combination. For example, Ni-Au plating, a solder alloy, or the like can be used. In particular, a metal having large extensibility that easily follows elastic deformation of conductive particles is preferable.
Alloys with high extensibility such as u and Pt are preferable.

The conductive particles provided with conductivity by plating include:
It is preferable to use plastic particles having fine pores on the surface and to apply plating to the inner surfaces of the pores, since the plating layer on the surface does not easily peel off when the particles are deformed. further,
The holes are formed in a sponge shape communicating with each other on the surface and inside of the plastic particles, and the inside of the holes is plated to form conductive particles having a conductive path inside the particles. The conductive particles do not have a decrease in conductivity due to peeling of the conductive layer on the surface of the plating particles, and have a smaller resistance than the conductive rubber particles in which the conductive filler is dispersed, and thus are preferable.

Further, when an insulating thin film made of an organic substance, a metal oxide, or the like is present on the surface of the electrode to be connected, fine protrusions are provided on the surface of the conductive particles to push the insulating thin film at the time of connection to reduce resistance. A small and stable connection is obtained. Since these fine protrusions are made of a material that is hard and has small spreadability, a conductive material having excellent conductivity can be obtained by fixing a material different from the plating metal of the conductive particles on the particle surface. The production method is a method of depositing plating metal particles during the plating treatment of the conductive particles and fixing them to the surface of the conductive particles, and performing the plating treatment of the conductive particles in a plating bath in which inorganic fine particles such as silica or metal fine particles such as Ni are dispersed. And a method of fixing the conductive particles to the surface of the conductive particles.

Although the particle size of the conductive particles is selected depending on the fineness of the electrode to be connected, the particle size of each particle needs to be as uniform as possible. Since the present invention is useful for connecting fine electrodes, a particle size of 5 to 100 μm is particularly preferable. The particle size distribution preferably has a uniform particle size with a standard deviation of 10% or less of the particle size. The shape is preferably spherical in order to make the particle size uniform for connection of the fine electrode.

[0012] The arrangement of the conductive particles on the film surface is such that one or more conductive particles are arranged corresponding to the position of the electrode to be connected, or the conductive particles and the electrode are arranged in a lattice or staggered pattern at a constant pitch. Although it is possible to eliminate the need for alignment, the selection is made in accordance with the fineness of the electrode and the particle size and distribution density of the conductive particles. The film-forming resin acts as a binder for the conductive particles and can be formed into a film. Specifically, in addition to various synthetic resins and elastomers soluble in solvents, thermoplastic resins such as polyethylene, vinyl acetate, and polypropylene, and resins having high heat resistance, such as polyether sulfone, polyetherimide, and polyimide, and epoxy resins , A thermosetting resin such as a phenolic resin, or a photocurable resin such as an urethane acrylate or an epoxy acrylate having an acryloyl group. Among these film-forming resins, thermosetting resins and photo-curing resins are particularly excellent in heat resistance because they form a network structure and are cured, and high connection reliability is obtained. Is desirably used as part of Although the thickness of the resin film molded product is not particularly limited, as described above, as the thickness increases, the particle size of the conductive particles to be used increases, and the resolution is reduced, so that it is not suitable for connection of fine electrodes. Further, when the thickness is reduced, the handling is not easy, and the production becomes difficult due to generation of wrinkles and the like.
00 μm is appropriate.

When the connection structure of the present invention is used in an inspection device for an electronic component, the inspection substrate includes a fine electrode of the electronic component to be inspected, and outputs an input signal or an output signal of the inspection object. It is for electrically connecting the electrodes of the device. Generally, electrode substrates such as PCBs and FPCs can be used, but glass substrates and ceramic substrates with excellent flatness, small variations in electrode height, easy formation of fine electrodes, and excellent temperature and humidity dimensional stability. It is most preferable that a thin film electrode is formed thereon. Further, a transparent glass substrate has an advantage that alignment between electrodes can be easily performed. Height variation between adjacent electrodes is about 10 μm
Or less, more preferably 1 μm or less. The electrode may be manufactured by a method such as etching, plating, vapor deposition, or sputtering of a metal foil, or a combination of these methods. Plating, vapor deposition, and sputtering are suitable for fine electrode portions, but etching of a metal foil having a large electrode thickness and low resistance is preferable for a rough circuit or an electrode portion.

The electronic components to be connected can be applied to a liquid crystal display panel, a bare chip IC, a TAB type IC, a printed wiring board, etc. In particular, there are LCDs, bare chip ICs, It is useful for TAB type IC electronic components. The variation in the height of these adjacent electrodes is preferably 10 μm or less, more preferably 1 μm or less.

The connection structure of the present invention can be used for permanent mounting by holding the electrodes in a pressed state or bonding them with an adhesive. However, the connection is made conductive and the connection can be easily attached and detached. Therefore, it is suitable for temporary connection such as operation inspection of electronic components. At this time, it is also possible to improve the handleability by bonding the anisotropic conductive resin film-shaped molded product to the electrode portion only on the inspection substrate side.

The method for producing the anisotropic conductive resin film-shaped molded product is not particularly limited, but it can be produced by the following method as an example. After the conductive particles are dispersed on the pressure-sensitive adhesive surface and fixed in a state where the conductive particles are arranged in the plane direction, a film-forming resin is applied and filled between the conductive particles. Thereafter, the film-forming resin is dried or cured, and the film-forming resin on the particles is removed to obtain a resin film molded product having conductivity only in the thickness direction of the film. In the present invention, a mask having a through-hole is placed on the surface of the pressure-sensitive adhesive, and the conductive particles are sprayed, whereby the conductive particles can be attached only to the surface of the pressure-sensitive adhesive in the hole. This makes it possible to arrange the conductive particles in a lattice shape or a staggered lattice shape to control the insulating property in the plane direction of the film, or to arrange the conductive particles only at the electrode positions. For example, if the size of the through-hole is such that two or more conductive particles do not adhere to the surface of the pressure-sensitive adhesive, an anisotropic conductive resin film-like molded product in which insulation between individual particles is maintained can be obtained. Further, the connection structure of the present invention can be applied not only to the above-described electrode connection structure but also to a switch member, a multilayer circuit member, and the like.

[0017]

According to the fine electrode connection structure of the present invention, reliable electrical connection between the electrodes can be achieved with higher definition than before. Hereinafter, the operation of the present invention will be described in more detail. FIG. 1 is a sectional view showing an example of the fine electrode connection structure of the present invention. As shown in FIG. 1A, the electrodes are electrically connected by sandwiching the anisotropic conductive resin film-shaped molded product 3 between the electrodes 5-5. At this time, since the conductive particles 1 are elastic particles that are deformed by pressurization, the conductive particles can be reliably deformed to conduct even if there is a variation in height between the electrodes. Further, as shown in FIG. 1 (B), since there is an insulating layer 6 such as a solder resist between the electrodes and the conductive particles are deformed even if the electrodes are not convex, it is necessary to dispose the conductive particles only in the electrode portion. There is no. FIG. 2 shows a cross-sectional view of connection when using conventional metal particles. As shown in FIG. 2A, the metal particles 7 do not deform elastically enough to absorb variations in height between the electrodes and variations in the size of the metal particles. It must be absorbed by the deformation due to the flexibility of the film base material that is the binder between them, the pitch between the electrodes becomes small, and when the variation in the electrode height is large, the metal particles may not contact the electrodes . In addition, as shown in FIG. 2B, when there is an insulating layer 6 such as a solder resist between the electrodes and the electrodes are not convex, the contact between the electrodes and the conductive particles is caused by the presence of the conductive particles between the electrodes. Therefore, it is necessary to dispose conductive particles only in the electrode portion.

It is preferable that the particle size of the conductive particles be uniform because the deformation amount can be absorbed only by the deformation amount of the height difference between the electrodes. As the material of the conductive particles, a material in which a conductive filler is dispersed in a conductive polymer or a resin can be used, and a material in which a metal thin film is formed by plating the surface of plastic particles having a uniform particle size is easily commercially available. Is available at At this time, the conductivity can be adjusted by the metal thin film on the surface,
Since the deformability and elasticity can be adjusted by the material of the plastic particles, there is an advantage that an appropriate combination can be selected in a wide range. In addition, since the thin metal layer on the surface must also be deformed in accordance with the deformation of the conductive particles, a metal or alloy having a large spreadability such as Pt or Au is preferable because peeling or cracking of the conductive particles during deformation is less likely to occur. .

In order to prevent the thin metal layer on the surface of the conductive particles from peeling or cracking, it is effective to increase the adhesion by the anchor effect due to the unevenness of the surface of the conductive particles. Therefore, when plating is performed on plastic particles having fine holes on the surface, a thin metal layer is formed on the inner surface of the holes, and high adhesion is obtained. Furthermore, if these holes exist not only on the surface but also inside, if the holes are connected to each other, a conductive path is formed inside the plastic particles, and there is no concern about cracking or peeling of the thin metal layer on the surface. Deformable conductive particles are obtained. When such deformable conductive particles are used, the electrodes are not deformed by the conductive particles at the time of connection pressure welding, and are suitable for use in inspection of electronic components and the like.

It is common that the surface of an electrode is contaminated with an organic substance or covered with an insulating thin film of a metal oxide in the usual handling of electronic parts. If the electrodes are not penetrated and clean electrode portions are not connected to each other, the resistance may increase and good connection may not be obtained. The connection penetrating the insulating layer can be made by adjusting the hardness of the conductive particles, but as described above, an appropriate hardness must be selected within a range where the electrode is not damaged. However, by providing fine protrusions with hardness that penetrates the insulating layer on the thin metal layer on the surface of the conductive particles, a large pressure is applied to the protrusions at the time of connection, and good connection can be achieved without depending on the hardness of the conductive particles. can get. If the surface of the fine projections is electrically conductive, this object can be achieved if the surface is electrically conductive, so the interior of the projections may be non-conductive.For example, silica fine particles or glass fine particles having high hardness are attached to the surface of the conductive particles. This can be achieved by covering the surface of the insulating fine particles with plating. When providing projections with conductive fine particles,
For example, when hard Ni fine particles having barbed protrusions on the surface are used, it is easy to penetrate into the insulating layer on the electrode surface, and good connection can be obtained. In addition to the method of attaching fine particles to the projections, a method of forming irregularities on the plating surface depending on plating conditions, a method of once oxidizing to form a projection-like oxide, and then reducing the same can be used.

In the connection structure of the present invention, an adhesive layer can be provided on the surface of the anisotropic conductive resin film-like molded product to form a connection structure in which the substrates are bonded and fixed. The connection structure may be detachable without using and bonding. When this detachable connection structure is used, for example, for inspection of electronic components, the conductive particles are deformable because of the deformability of the conductive particles. Small rigid test substrates can be used. These rigid substrates can have high flatness by polishing the surface or the like. The electrode of this substrate can be an electrode produced by etching a general metal foil.However, by using a thin-film electrode formed by plating, vapor deposition, sputtering or the like of a conductor, variations in the electrode height of the inspection substrate can be reduced. It is possible to reduce the size, which is more preferable. In addition, by using an anisotropic conductive resin film-shaped molded product bonded to this inspection substrate, even a thin film corresponding to a fine electrode is less likely to be damaged by repeated connection operations, and it is possible to further improve the handleability. it can. L
CDs, bare chip ICs, TAB type ICs, printed wiring boards, and the like have a small variation in electrode height, and thus are particularly suitable as a connection structure at the time of inspection.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments, but the present invention is not limited thereto. Table 1 shows the evaluation results of the examples and comparative examples shown below.

Example 1 As conductive particles, plastic conductive particles having a polystyrene spherical particle having an average particle diameter of 40 μm and an Au layer of 0.2 μm provided on the surface were used. The standard deviation of the particle size distribution of the conductive particles was 2 μm or less. Preparation of the anisotropic conductive resin film-shaped molded product was performed by the following method. The conductive particles were sprayed on the surface of the PET film coated with the silicone adhesive, using a dry particle spraying device that sprays the powder through a sieve having openings of 80 μm. A mesh having openings of 50 μm and a pitch of 85 μm was brought into close contact with the surface of the silicone pressure-sensitive adhesive in advance as a mask so that the conductive particles were arranged in a lattice. A urethane acrylate oligomer solution to which a photo-curing agent was added was applied to the particle-dispersed surface, dried, and irradiated with ultraviolet rays to cure the film-forming resin. This was immersed in isopropanol to dissolve and remove uncured urethane acrylate oligomer, dried, and peeled from the interface between the film-forming resin and the silicone adhesive. The connecting substrate has a line width of 50 μm, a pitch of 100 μm, a height of about 0.8 μm, and a maximum variation in height between adjacent electrodes of about 2 μm. Using a glass substrate having a width of 50 mm, the electrodes of the substrates are opposed to each other and aligned. Then, an anisotropic conductive resin film-like molded product produced between the electrodes is inserted, and a 10 kg / cm ² application is performed. The connection resistance was measured with the electrodes pressed against the pressure. The measurement conditions were such that a connection resistance between a pair of glass substrates was measured at a measurement current of 1 mA.

Example 2 One of the glass substrates of Example 1 was a printed circuit board having a solder resist layer on average about 2 μm higher than the electrode surface. This electrode was a Cu electrode having a height of 18 μm.

Example 3 The conductive particles of Example 1 were formed by sponging polystyrene particles having pores of about 0.01 μm with Au plating applied to the surface thereof.

Example 4 The conductive particles of Example 1 were Au-plated on the surface of plastic particles in a plating solution in which silica fine particles having a primary particle size of 0.04 μm were dispersed, and the silica fine particles and the conductive particles adhered to the surface were plated. Were made into conductive particles coated with Au plating. Further, the electrode of the glass substrate of Example 1 was set to a height of about 0.7.
A μm Al electrode was used.

Example 5 The conductive particles of Example 1 were plated with Au on the surface of plastic particles in a plating solution in which Ni fine particles having a primary particle size of about 3 μm were dispersed.
Plating was performed to obtain conductive particles in which the surfaces of the Ni fine particles and the conductive particles adhered to the surface were covered with Au plating. Further, one of the glass substrates of Example 1 was a printed circuit board having a solder resist layer that was higher than the electrode surface by about 2 μm on average. This electrode was a Cu electrode having a height of 18 μm.

Example 6 The anisotropic conductive resin film-shaped molded article of Example 1 was cured and adhered to one glass substrate while being pressed with an epoxy adhesive, and then held in contact with the other glass substrate in a pressed state. did.

Example 7 An epoxy-based adhesive was applied to both surfaces of an anisotropically conductive resin film-shaped molded product, and cured by pressing between glass substrates to bond and fix both glass substrates.

Comparative Example 1 The conductive particles of Example 1 were Ni particles.

Comparative Example 2 The conductive particles of Example 1 were Ni particles, and one glass substrate was a printed circuit board having a solder resist layer on average about 2 μm higher than the electrode surface. This electrode is 18μ high
m Cu electrode.

[0032]

[Table 1]

[0033]

Effect of the Invention] As described above in detail, according to the present invention, reliable electrical connection between the high-resolution fine electrode compared to traditional becomes available.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a fine electrode connection structure according to the present invention.

FIG. 2 is a cross-sectional view illustrating an example of a fine electrode connection structure according to the related art.

[Explanation of symbols]

1. 1. conductive particles 2. film-forming resin 3. Anisotropic conductive resin film-shaped molded product Substrate 5. Electrode 6. Insulating layer 7. Metal particles 8. Conduction failure due to gap

Continuation of front page (56) References JP-A-6-51337 (JP, A) JP-A-5-347464 (JP, A) JP-A-2-306558 (JP, A) JP-A-5-334912 (JP) , A) JP-A-62-76215 (JP, A) JP-A-61-173471 (JP, A) JP-A-61-77278 (JP, A) Japanese Utility Model No. 5-79875 (JP, U) Japanese Utility Model Application 61-201207 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 11/01

Claims (11)

(57) [Claims] 1. A variation in height of adjacent electrodes is 10 μm.
In the following, the electrode portions of a plurality of electronic components having fine electrodes arranged on substantially the same plane are opposed to each other, and a resin foil is provided between the opposed electrodes.
Conductive particles that have elasticity in the plane of the film
And a part of the surface of the conductive particles is filled with resin.
Has a structure that is exposed or protrudes from both sides of the
When the standard deviation of the particle size distribution of the conductive particles is 10% or less of the average particle size
A microelectrode connection structure characterized in that an anisotropic conductive resin film-shaped molded product having conductivity only in the thickness direction is sandwiched via certain conductive particles to obtain electrical connection. 2. The method according to claim 1, wherein the conductive particles have fine pores on the surface,
A part or all of the inner surface of the hole is coated with metal, or a part or all of the hole is conductive particles filled with metal, using plastic particles having fine holes communicating with each other on the surface and inside. 2. The fine electrode connection structure according to 1. 3. The fine electrode connection structure according to claim 1, wherein the conductive particles are conductive particles having fine projections on the surface. 4. The method according to claim 1, wherein the fine projections have a diameter of 1/100 of a particle diameter of the conductive particles.
4. The fine electrode connection structure according to claim 3 , wherein fine particles of silica, glass, Ni or the like having a particle size of 10 or less are adhered to the surface of the conductive particles, and the surface is covered with a conductive thin film. 5. A micro-electrode connecting structure according to any one of claims 1 to 4 in which the anisotropic conductive resin film-like molded product is an array of conductive particles corresponding to the arrangement of the electrodes to be connected. 6. At least one of the electronic component is a substrate having a glass, a high elasticity, such as ceramic claims 1 to 5
The microelectrode connection structure according to any one of the above. 7. One or both of the substrates facing each other.
Characterized in that the electrode of the other substrate is recessed from the substrate surface.
The microelectrode connection structure according to claim 1.
Build. Either or both the plating of 8. Phase confronting electrodes, deposition, fine electrode connection structure according to any one of claims 1 to 7 is a thin film electrode prepared by sputtering or the like. 9. At least one of the substrates facing each other.
Hands substrate and anisotropic conductive fill arm-like molding clamping, adhesive, etc.
9. The method according to claim 1, wherein the step is fixed by a step.
The fine electrode connection structure according to any one of the above. 10. The electronic component is an LCD, a bare chip IC,
The microelectrode connection structure according to any one of claims 1 to 9 , wherein the microelectrode connection structure is one of a TAB type IC and a printed wiring board. 11. The display inspection of the LCD using the electrode connecting structure according to any one of claims 1 to 10, the operation inspection of elements constituting the LCD, bare chip IC, TAB type I
An inspection method characterized by performing an operation inspection of C or a continuity inspection of a printed wiring board.