CN105491788A - Graphene heat radiation type shielding film and preparation method thereof - Google Patents
Graphene heat radiation type shielding film and preparation method thereof Download PDFInfo
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- CN105491788A CN105491788A CN201610023107.7A CN201610023107A CN105491788A CN 105491788 A CN105491788 A CN 105491788A CN 201610023107 A CN201610023107 A CN 201610023107A CN 105491788 A CN105491788 A CN 105491788A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The invention relates to the technical field of a shielding film, and particularly to a graphene heat radiation type shielding film and a preparation method thereof. The graphene heat radiation type shielding film comprises the components of a carrier film layer, an ink layer which is applied on the upper surface of the carrier film layer, a graphene heat radiation layer which is applied on the upper surface of the ink layer, and a conductive adhesive layer which is applied on the upper surface of the graphene heat radiation layer. The graphene heat radiation type shielding film has advantages of high flexibility and ultra-small thickness. The heat resistance of the graphene heat radiation type shielding film satisfies a requirement of no layering or bubbling after the graphene heat radiation type shielding film is soaked in melted scolding tin for 30 seconds at the temperature of 340 DEG C. Furthermore the graphene heat radiation type shielding film has advantages of high conductivity of which the on-resistance is lower than 300 millimho, high heat radiation performance so that thermal conductivity is above 2.0W/m*K, and high electromagnetic shielding effect which is above 50db. The graphene heat radiation type shielding film well satisfies a requirement in an electronic product industry.
Description
Technical field
The present invention relates to screened film technical field, be specifically related to a kind of Graphene heat radiating type screened film and preparation method thereof.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and ancillary equipment, communication product and consumption electronic products at present, along with the sustainable growth of consumption electronic products demand, the requirement for printed circuit board (PCB) also grows with each passing day.
In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, also more and more higher to the requirement of electromagnetic shielding.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
Now along with the raising of the whole integrated level of wiring board, while the excellent shielding of consideration, the heat dissipation problem also can considered.For better head it off, in the urgent need to a kind of Novel shielding film product.
Summary of the invention
In order to overcome the shortcoming and defect existed in prior art, the object of the present invention is to provide a kind of good heat dissipation effect and the thin Graphene heat radiating type screened film of thickness.
Another object of the present invention is to the preparation method providing a kind of Graphene heat radiating type screened film, this preparation method's technique is simple, convenient operation and control, steady quality, and production efficiency is high, and production cost is low, is applicable to large-scale industrial production.
Object of the present invention is achieved through the following technical solutions: a kind of Graphene heat radiating type screened film, the conduction adhesive layer of the Graphene heat dissipating layer upper surface that comprises carrier film layer, coats the ink layer of carrier film layer upper surface, coats the Graphene heat dissipating layer of ink layer upper surface, coats.
Graphene heat radiating type screened film of the present invention has good pliability, thickness ultrathin, heat resistance meet tin soldering liquid soak reach 340 DEG C * 30 seconds, not stratified foaming, and there is good conduction property, conducting resistance is below 300 milliohms, good thermal diffusivity, thermal conductivity is more than 2.0W/m*K, and effectiveness is good, can more than 50db be reached, meet the demand of electronic product industry well.
Preferably, described carrier film layer is high molecular polymer film, and high molecular polymer film is at least one of PET film, PEN film, PI film, PBT film and PPS film.The present invention, by adopting above-mentioned film as carrier film layer, has good light transmission and light diffusing.
Preferably, the raw material of described ink layer is at least one in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar and polyurethane resin.The present invention, by adopting above-mentioned raw materials as ink layer, makes Graphene heat radiating type screened film have good insulating properties.More preferred, the mixture that the raw material of described ink layer is made up of with weight ratio 1:0.8-1.2:1.4-2.2 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer is made up of with weight ratio 0.5-1.5:1.5-2.5:1 modified rubber, mylar and polyurethane resin.
Preferably, the raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 10-100nm.The present invention passes through the nano-graphene of employing particle diameter at 10-100nm as the raw material of Graphene heat dissipating layer, makes Graphene heat radiating type screened film have excellent heat conduction, thermal diffusivity, advantages of good shielding performance.
Preferably, the raw material of described conduction adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body.The present invention adds conducting powder by adopting in adhesive main body, makes Graphene heat radiating type screened film have excellent conduction property.More preferred, the weight ratio of described conducting powder and described adhesive main body is 1-5:100.
The raw material of described adhesive main body is at least one in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar and polyurethane resin.The present invention is by adopting above-mentioned raw materials as mucigel, and it coheres effective.More preferred, the mixture that the raw material of described adhesive main body is made up of with weight ratio 0.8-1.2:1.4-2.2:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 2-4:0.5-1.5:1 phenolic resins, mylar and polyurethane resin.
Described conducting powder is at least one in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conducting powder is 1-15 μm.The present invention is by adopting above-mentioned conducting powder, and to control its particle diameter be 1-15 μm, makes Graphene heat radiating type screened film have excellent conduction property.More preferred, the mixture that described conducting powder is made up of with weight ratio 2-4:1.4-2.2:1 silver powder, silver-coated copper powder and nickel powder.
The thickness of described carrier film layer is 25-200 μm; The thickness of described ink layer is 5-50 μm; The thickness of described Graphene heat dissipating layer is 2-50 μm; The thickness of described conduction adhesive layer is 3-15 μm.
Preferably, the upper surface of described conduction adhesive layer is provided with the release protective film of one deck; The thickness of described release protective film is 12-200 μm.The present invention is by arranging the release protective film of one deck at the upper surface of conduction adhesive layer, and its protected effect is good.
Preferably, described release protective film is any one in PET release film, PP release film, PBT release film and release liners.The present invention is by adopting above-mentioned release film as release protective layer, and its protected effect is good.
Preferably, silicone oil mould release or non-silicone oil mould release between the lower surface of described release protective film and the upper surface of described conduction adhesive layer.The present invention is coated with silicone oil mould release or non-silicone oil mould release by adopting at the lower surface of release protective film, and release protective film can easily be peeled off in use.
Another object of the present invention is achieved through the following technical solutions: a kind of preparation method of Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer thereon, through oven drying, ink layer is solidified;
A2, on ink layer, be coated with a layer graphene, form Graphene heat dissipating layer;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
Preparation method of the present invention can be realized by conventional FPC processing technology (as coating, sputtering, laminating etc.), and facilitate commercial introduction to apply, technique is simple, convenient operation and control, steady quality, production efficiency is high, production cost is low, is applicable to large-scale industrial production.
Or another object of the present invention is achieved through the following technical solutions: a kind of preparation method of Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer thereon, through oven drying, ink layer is solidified;
B2, on ink layer, be coated with a layer graphene, form Graphene heat dissipating layer;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film of thermal-adhering one deck;
B5, rolling.
Preparation method of the present invention can be realized by conventional FPC processing technology (as coating, sputtering, laminating etc.), and facilitate commercial introduction to apply, technique is simple, convenient operation and control, steady quality, production efficiency is high, production cost is low, is applicable to large-scale industrial production.
Beneficial effect of the present invention is: Graphene heat radiating type screened film of the present invention, by adopting ink layer, has good insulating properties; Graphene heat radiating type screened film of the present invention, by adopting Graphene heat dissipating layer, has excellent heat conduction, thermal diffusivity, advantages of good shielding performance; Graphene heat radiating type screened film of the present invention, by adopting conductive adhesive layer, has excellent conduction property; The present invention, by adopting ink layer and conductive adhesive layer, has fabulous pliability, can meet the softness requirements of flexible circuitry board industry.Graphene heat radiating type screened film thickness ultrathin of the present invention, ink layer, Graphene heat dissipating layer and conductive adhesive layer gross thickness are minimum is 8-16um.
Graphene heat radiating type screened film of the present invention has good pliability, thickness ultrathin, heat resistance meet tin soldering liquid soak reach 340 DEG C * 30 seconds, not stratified foaming, and there is good conduction property, conducting resistance is below 300 milliohms, good thermal diffusivity, thermal conductivity is more than 2.0W/m*K, and effectiveness is good, can more than 50db be reached, meet the demand of electronic product industry well.
Preparation method of the present invention can be realized by conventional FPC processing technology (as coating, sputtering, laminating etc.), and facilitate commercial introduction to apply, technique is simple, convenient operation and control, steady quality, production efficiency is high, production cost is low, is applicable to large-scale industrial production.
Accompanying drawing explanation
Fig. 1 is the partial sectional view of the embodiment of the present invention 1.
Fig. 2 is the partial sectional view of the embodiment of the present invention 6.
Reference numeral is: 1-carrier film layer, 2-ink layer, 3-Graphene heat dissipating layer, 4-conduction adhesive layer, 5-release protective film.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment and accompanying drawing 1-2, the present invention is further illustrated, and the content that execution mode is mentioned not is limitation of the invention.
Embodiment 1
See Fig. 1, a kind of Graphene heat radiating type screened film, the conduction adhesive layer 4 comprising carrier film layer 1, coat the ink layer 2 of carrier film layer 1 upper surface, coat the Graphene heat dissipating layer 3 of ink layer 2 upper surface, coat Graphene heat dissipating layer 3 upper surface.
Described carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PET film.
The raw material of described ink layer 2 is epoxy resin.
The raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 10nm.
The raw material of described conduction adhesive layer 4 is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of adhesive main body is modified epoxy; Described conducting powder is silver powder, and the particle diameter of conducting powder is 1 μm.
The thickness of described carrier film layer 1 is 25 μm; The thickness of described ink layer 2 is 5 μm; The thickness of described Graphene heat dissipating layer 3 is 2um; The thickness of described conduction adhesive layer 4 is 3 μm.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 60 DEG C, and linear velocity is 30m/min;
A4, rolling.
Embodiment 2
The difference of the present embodiment and above-described embodiment 1 is:
Described carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PEN film.
The raw material of described ink layer 2 is polyacrylic resin.
The raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 30nm.
The raw material of described conduction adhesive layer 4 is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of adhesive main body is polyacrylic resin; Described conducting powder is silver-coated copper powder, and the particle diameter of conducting powder is 5 μm.
The thickness of described carrier film layer 1 is 50 μm; The thickness of described ink layer 2 is 20 μm; The thickness of described Graphene heat dissipating layer 3 is 20um; The thickness of described conduction adhesive layer is 6 μm.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 80 DEG C, and linear velocity is 20m/min;
A4, rolling.
Embodiment 3
The difference of the present embodiment and above-described embodiment 1 is:
Described carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PI film.
The raw material of described ink layer 2 is modified rubber.
The raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 50nm.
The raw material of described conduction adhesive layer 4 is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of adhesive main body is polyimide resin; Described conducting powder is copper powder, and the particle diameter of conducting powder is 8 μm.
The thickness of described carrier film layer 1 is 100 μm; The thickness of described ink layer 2 is 30 μm; The thickness of described Graphene heat dissipating layer 3 is 30um; The thickness of described conduction adhesive layer is 9 μm.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 90 DEG C, and linear velocity is 15m/min;
A4, rolling.
Embodiment 4
The difference of the present embodiment and above-described embodiment 1 is:
Described carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PBT film.
The raw material of described ink layer 2 is phenolic resins.
The raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 80nm.
The raw material of described conduction adhesive layer 4 is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of adhesive main body is modified rubber; Described conducting powder is nickel powder, and the particle diameter of conducting powder is 12 μm.
The thickness of described carrier film layer 1 is 150 μm; The thickness of described ink layer 2 is 40 μm; The thickness of described Graphene heat dissipating layer 3 is 40um; The thickness of described conduction adhesive layer is 12 μm.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 100 DEG C, and linear velocity is 10m/min;
A4, rolling.
Embodiment 5
The difference of the present embodiment and above-described embodiment 1 is:
Described carrier film layer 1 is high molecular polymer film, and high molecular polymer film is PPS film.
The raw material of described ink layer 2 is mylar or polyurethane resin.
The raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 100nm.
The raw material of described conduction adhesive layer 4 is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of adhesive main body is phenolic resins, mylar or polyurethane resin; Described conducting powder is silver powder, and the particle diameter of conducting powder is 15 μm.
The thickness of described carrier film layer 1 is 200 μm; The thickness of described ink layer 2 is 50 μm; The thickness of described Graphene heat dissipating layer 3 is 50um; The thickness of described conduction adhesive layer is 15 μm.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 120 DEG C, and linear velocity is 5m/min;
A4, rolling.
Embodiment 6
See Fig. 2, the difference of the present embodiment and above-described embodiment 1 is:
The upper surface of described conduction adhesive layer 4 is provided with the release protective film 5 of one deck; The thickness of described release protective film 5 is 12 μm.
Described release protective film 5 is PET release film.
Silicone oil mould release is coated with between the lower surface of described release protective film 5 and the upper surface of described conduction adhesive layer 4.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 60 DEG C, and linear velocity is 30m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
Embodiment 7
The difference of the present embodiment and above-described embodiment 6 is:
The upper surface of described conduction adhesive layer 4 is provided with the release protective film 5 of one deck; The thickness of described release protective film 5 is 50 μm.
Described release protective film 5 is PP release film.
Non-silicone oil mould release is coated with between the lower surface of described release protective film 5 and the upper surface of described conduction adhesive layer 4.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 80 DEG C, and linear velocity is 20m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
Embodiment 8
The difference of the present embodiment and above-described embodiment 6 is:
The upper surface of described conduction adhesive layer 4 is provided with the release protective film 5 of one deck; The thickness of described release protective film 5 is 100 μm.
Described release protective film 5 is PBT release film.
Silicone oil mould release is coated with between the lower surface of described release protective film 5 and the upper surface of described conduction adhesive layer 4.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 90 DEG C, and linear velocity is 15m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
Embodiment 9
The difference of the present embodiment and above-described embodiment 6 is:
The upper surface of described conduction adhesive layer 4 is provided with the release protective film 5 of one deck; The thickness of described release protective film 5 is 150 μm.
Described release protective film 5 is release liners.
Non-silicone oil mould release is coated with between the lower surface of described release protective film 5 and the upper surface of described conduction adhesive layer 4.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 100 DEG C, and linear velocity is 10m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
Embodiment 10
The difference of the present embodiment and above-described embodiment 6 is:
The upper surface of described conduction adhesive layer 4 is provided with the release protective film 5 of one deck; The thickness of described release protective film 5 is 200 μm.
Described release protective film 5 is PET release film.
Silicone oil mould release is coated with between the lower surface of described release protective film 5 and the upper surface of described conduction adhesive layer 4.
A preparation method for Graphene heat radiating type screened film, comprises the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2, be coated with a layer graphene, form Graphene heat dissipating layer 3;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 120 DEG C, and linear velocity is 5m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
Embodiment 11
The difference of the present embodiment and above-described embodiment 1 or embodiment 6 is:
The mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:0.8:1.4 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer 2 is made up of with weight ratio 0.5:1.5:1 modified rubber, mylar and polyurethane resin.
The weight ratio of described conducting powder and described adhesive main body is 1:100.
The mixture that the raw material of described adhesive main body is made up of with weight ratio 0.8:1.4:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 2:0.5:1 phenolic resins, mylar and polyurethane resin.
The mixture that described conducting powder is made up of with weight ratio 2:1.4:1 silver powder, silver-coated copper powder and nickel powder.
Embodiment 12
The difference of the present embodiment and above-described embodiment 11 is:
The mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:0.9:1.6 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer 2 is made up of with weight ratio 0.8:1.8:1 modified rubber, mylar and polyurethane resin.
The weight ratio of described conducting powder and described adhesive main body is 2:100.
The mixture that the raw material of described adhesive main body is made up of with weight ratio 0.9:1.6:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 2.5:0.8:1 phenolic resins, mylar and polyurethane resin.
The mixture that described conducting powder is made up of with weight ratio 2.5:1.6:1 silver powder, silver-coated copper powder and nickel powder.
Embodiment 13
The difference of the present embodiment and above-described embodiment 11 is:
The mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:1:1.8 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:2:1 modified rubber, mylar and polyurethane resin.
The weight ratio of described conducting powder and described adhesive main body is 3:100.
The mixture that the raw material of described adhesive main body is made up of with weight ratio 1:1.8:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 3:1:1 phenolic resins, mylar and polyurethane resin.
The mixture that described conducting powder is made up of with weight ratio 3:1.8:1 silver powder, silver-coated copper powder and nickel powder.
Embodiment 14
The difference of the present embodiment and above-described embodiment 11 is:
The mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:1.1:2 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer 2 is made up of with weight ratio 1.2:2.2:1 modified rubber, mylar and polyurethane resin.
The weight ratio of described conducting powder and described adhesive main body is 4:100.
The mixture that the raw material of described adhesive main body is made up of with weight ratio 1.1:2:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 3.5:1.2:1 phenolic resins, mylar and polyurethane resin.
The mixture that described conducting powder is made up of with weight ratio 3.5:2:1 silver powder, silver-coated copper powder and nickel powder.
Embodiment 15
The difference of the present embodiment and above-described embodiment 11 is:
The mixture that the raw material of described ink layer 2 is made up of with weight ratio 1:1.2:2.2 epoxy resin, polyacrylic resin and phenolic resins.Or, the mixture that the raw material of described ink layer 2 is made up of with weight ratio 1.5:2.5:1 modified rubber, mylar and polyurethane resin.
The weight ratio of described conducting powder and described adhesive main body is 5:100.
The mixture that the raw material of described adhesive main body is made up of with weight ratio 1.2:2.2:1 modified epoxy, polyacrylic resin and polyimide resin.Or, the mixture that the raw material of described adhesive main body is made up of with weight ratio 4:1.5:1 phenolic resins, mylar and polyurethane resin.
The mixture that described conducting powder is made up of with weight ratio 4:2.2:1 silver powder, silver-coated copper powder and nickel powder.
Above-described embodiment is the present invention's preferably implementation, and in addition, the present invention can also realize by alternate manner, and any apparent replacement is all within protection scope of the present invention without departing from the inventive concept of the premise.
Claims (10)
1. a Graphene heat radiating type screened film, is characterized in that: the conduction adhesive layer of the Graphene heat dissipating layer upper surface that comprises carrier film layer, coats the ink layer of carrier film layer upper surface, coats the Graphene heat dissipating layer of ink layer upper surface, coats.
2. a kind of Graphene heat radiating type screened film according to claim 1, it is characterized in that: described carrier film layer is high molecular polymer film, high molecular polymer film is at least one of PET film, PEN film, PI film, PBT film and PPS film.
3. a kind of Graphene heat radiating type screened film according to claim 1, is characterized in that: the raw material of described ink layer is at least one in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar and polyurethane resin.
4. a kind of Graphene heat radiating type screened film according to claim 1, is characterized in that: the raw material of described Graphene heat dissipating layer is the nano-graphene of particle diameter at 10-100nm.
5. a kind of Graphene heat radiating type screened film according to claim 1, is characterized in that: the raw material of described conduction adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body; The raw material of described adhesive main body is at least one in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar and polyurethane resin; Described conducting powder is at least one in silver powder, silver-coated copper powder, copper powder and nickel powder, and the particle diameter of conducting powder is 1-15 μm.
6. a kind of Graphene heat radiating type screened film according to claim 1, is characterized in that: the upper surface of described conduction adhesive layer is provided with the release protective film of one deck.
7. a kind of Graphene heat radiating type screened film according to claim 6, is characterized in that: described release protective film is any one in PET release film, PP release film, PBT release film and release liners.
8. a kind of Graphene heat radiating type screened film according to claim 6, is characterized in that: silicone oil mould release or non-silicone oil mould release between the lower surface of described release protective film and the upper surface of described conduction adhesive layer.
9. the preparation method of a kind of Graphene heat radiating type screened film as claimed in claim 1, is characterized in that: comprise the steps:
A1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer thereon, through oven drying, ink layer is solidified;
A2, on ink layer, be coated with a layer graphene, form Graphene heat dissipating layer;
A3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, send into oven drying, oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
10. the preparation method of a kind of Graphene heat radiating type screened film as claimed in claim 6, is characterized in that: comprise the steps:
B1, get a carrier thin film, remove the greasy dirt on carrier thin film volume inner face and foreign matter, and be coated with one deck ink layer thereon, through oven drying, ink layer is solidified;
B2, on ink layer, be coated with a layer graphene, thickness is 2-50um;
B3, on Graphene heat dissipating layer, be coated with one deck conductive adhesive, thickness is 3-15 μm, and send into oven drying, oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film of thermal-adhering one deck;
B5, rolling.
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