CN107046766A - Flexible print thin film circuit and system - Google Patents
Flexible print thin film circuit and system Download PDFInfo
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- CN107046766A CN107046766A CN201710129606.9A CN201710129606A CN107046766A CN 107046766 A CN107046766 A CN 107046766A CN 201710129606 A CN201710129606 A CN 201710129606A CN 107046766 A CN107046766 A CN 107046766A
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- thin film
- flexible print
- film circuit
- print thin
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- 239000010409 thin film Substances 0.000 title claims abstract description 48
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims description 38
- 239000010408 film Substances 0.000 claims description 17
- 238000003854 Surface Print Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000010147 laser engraving Methods 0.000 claims description 4
- 229910052705 radium Inorganic materials 0.000 claims description 3
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 claims description 3
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims 1
- 230000002146 bilateral effect Effects 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920009441 perflouroethylene propylene Polymers 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004635 Polyester fiberglass Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011101 paper laminate Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WJZHMLNIAZSFDO-UHFFFAOYSA-N manganese zinc Chemical compound [Mn].[Zn] WJZHMLNIAZSFDO-UHFFFAOYSA-N 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
This application provides flexible print thin film circuit and system, it is related to circuit board making technical field, wherein, the flexible print thin film circuit includes：Basal layer and the conductive layer at least set in basal layer side, wherein, basal layer is thermoplastic elastomer (TPE), and, conductive layer forms conductive path on basal layer, i.e. in this programme, one side or bilateral on thermoplastic elastomer (TPE) set conductive layer, conductive layer is attached in thermoplastic elastomer (TPE) and then form conductive path, the circuit board formed through the above way is thin film, lightweight, soft texture, pliability is good, is widely used on the electronic tag of product, meets the demand of industrial production and life.
Description
Technical field
The present invention relates to circuit board making technical field, more particularly to flexible print thin film circuit and system.
Background technology
At present, commercially most widely used circuit board is mainly PCB, generally, and PCB is come by the number of plies
It is divided into single sided board, dual platen and the class of multilayer circuit board three if point.In single sided board the part such as electronic device layer only concentrate on PCB its
In one side on, wire is then concentrated and is laid on another side.The manufacture craft of this single sided board is simple, cheap, still, nothing
Method is applied on too complicated product.When individual layer wiring can not meet the demand of electronic product, dual platen, dual platen can be used
That is the tow sides of circuit board, which have, covers copper and cabling, and it is possible between turning on positive and negative by the via on plank
Circuit, is allowed to form required network connection.Multilayer circuit board refer to conductive pattern layer with three layers or the above with therebetween
Insulating materials formed with being separated by lamination.Multilayer circuit board capacity is big, small volume, function are more, and still, cost is higher.
In addition, circuit board is divided into soft board, hardboard and Rigid Flex if dividing by pliability.Soft board is also known as flexible circuit
Plate, common flexible PCB composition material is polyester film, Kapton, fluorinated ethylene propylene (FEP) film or paper, tool
The characteristics of having high, lightweight Distribution density, thickness of thin.Common hardboard composition material is phenolic paper laminate, epoxy papery
Laminate, polyester fiberglass carpet veneer pressing plate and epoxy glass cloth laminated board.Rigid Flex is flexible PCB and hard circuit board,
By processes, the circuit board being grouped together into by related process requirement such as pressings.
But, in the process of circuit board, the method for relying primarily on etching eats away circuit board with chemical reagent
The otiose copper in surface or aluminium, pollute environment.In addition, the circuit board that existing method makes, even soft board, feel also compares
Firmly, suppleness is poor, especially applies in the electronic tag field of product, due to when electronic tag is identified, needing
The circuit where electronic tag is used for multiple times, therefore harder circuit board is easily bent, or even damage.
The content of the invention
In view of this, the purpose of the embodiment of the present invention is the provision of flexible print thin film circuit and system, by by heat
Thermoplastic elastic is set to basal layer etc., enhances the pliability and availability of circuit board.
In a first aspect, the embodiments of the invention provide flexible print thin film circuit, including：
Basal layer and the conductive layer at least set in basal layer side, wherein, basal layer is thermoplastic elastomer (TPE)；
Conductive layer, for forming conductive path on basal layer.
With reference in a first aspect, the embodiments of the invention provide the possible embodiment of the first of first aspect, wherein, lead
Electric layer is attached on basal layer by way of printing, solidification, adhesion, laser engraving or radium quarter.
With reference in a first aspect, the embodiments of the invention provide the possible embodiment of second of first aspect, wherein, it is soft
Property printed film circuit also include electronic device layer, electronic device layer is connected with conductive layer, and, electronic device layer passes through conducting resinl
Or scolding tin is connected with conductive layer；
Electronic device layer, for forming circuit with conductive path.
With reference in a first aspect, the embodiments of the invention provide the possible embodiment of the third of first aspect, wherein, it is soft
Property printed film circuit also include the first insulating barrier, the first insulating barrier is arranged on side of the conductive layer away from basal layer, and, first
Insulating barrier is polytetrafluoroethylene film.
With reference to the third possible embodiment of first aspect, the embodiments of the invention provide the 4th of first aspect kind
Possible embodiment, wherein, flexible print thin film circuit also includes anti-tensile layer, and it is remote that anti-tensile layer is arranged on the first insulating barrier
From the side of conductive layer, and, anti-tensile layer is fibre.
With reference to the 4th kind of possible embodiment of first aspect, the embodiments of the invention provide the 5th of first aspect kind
Possible embodiment, wherein, flexible print thin film circuit also includes the second insulating barrier, and the second insulating barrier is arranged on anti-tensile layer
Away from the first insulating barrier side, and, the second insulating barrier be polytetrafluoroethylene film.
With reference to the 5th kind of possible embodiment of first aspect, the embodiments of the invention provide the 6th of first aspect kind
Possible embodiment, wherein, flexible print thin film circuit also includes surface printing layer, and surface printing layer is covered in the second insulation
Side of the layer away from anti-tensile layer.
With reference to the 6th kind of possible embodiment of first aspect, the embodiments of the invention provide the 7th of first aspect kind
Possible embodiment, wherein, flexible print thin film circuit also includes the first diaphragm, and the first diaphragm is pasted onto surface printing
On layer.
With reference in a first aspect, the embodiments of the invention provide the possible embodiment of the 8th of first aspect kind, wherein, lead
Electric layer is conductive material.
Second aspect, the embodiments of the invention provide flexible printed circuit system, including：External circuitses plate and above-mentioned flexibility
Printed film circuit；
External circuitses plate is electrically connected with flexible print thin film circuit.
Flexible print thin film circuit provided in an embodiment of the present invention and system, wherein, the flexible print thin film circuit includes：
Basal layer and the conductive layer at least set in basal layer side, in this programme, basal layer is thermoplastic elastomer (TPE), and conductive layer exists
Conductive path is formed on basal layer, the circuit board elastic made by this material and method is high, intensity is big, safety non-toxic ring
Guarantor, soft texture, good insulating, heat resistance are strong, in actual use, soft stretchable, and can recover after the stretch, from
And preferably client can be facilitated to use.
Further, flexible print thin film circuit provided in an embodiment of the present invention, wherein, the flexible print thin film circuit is also
Including：Conductive layer is attached on basal layer by way of printing, solidification, adhesion, laser engraving or radium quarter, rather than is used
Traditional etching, so, it is to avoid excessive chemical reagent is used in circuit board fabrication process, so that whole process
It is more environment-friendly and safer.In addition, electronic device layer is connected with conductive layer in this programme, i.e., by electronic device layer by conducting resinl or
Person's scolding tin is connected with conductive layer, it is necessary to first be heated at high temperature conducting resinl or scolding tin in specific operation process, treat conducting resinl or
Electronic device layer after person's scolding tin melts, is connected on conductive layer to, so, electronic device layer and conductive path formation circuit, with
For subsequently using.Circuit board is formed through the above way, is effectively reduced circuit board and is used chemical reagent institute in process
Pollution brought etc., also, electronic device layer by conducting resinl or scolding tin bonding on the electrically conductive, so as to form complete electricity
Road so that electronic device layer can be adhered on the electrically conductive, and be converted with the stretching of basal layer, while effectively saving electronics
Space shared by device layer.
To enable the above objects, features and advantages of the present invention to become apparent, preferred embodiment cited below particularly, and coordinate
Appended accompanying drawing, is described in detail below.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 shows the structure chart for the flexible print thin film circuit that the embodiment of the present invention is provided；
Fig. 2 shows that the basal layer for the flexible print thin film circuit that the embodiment of the present invention is provided and the structure of conductive layer connect
Map interlinking；
Fig. 3 shows the basal layer and the structural frames of conductive layer for the flexible print thin film circuit that the embodiment of the present invention is provided
Frame figure；
Fig. 4 shows the structure connection figure for the flexible print thin film circuit that the embodiment of the present invention is provided.
Icon：1- basal layers；2- conductive layers；3- electronic device layers；The insulating barriers of 4- first；The anti-tensile layers of 5-；6- second is exhausted
Edge layer；7- surface printing layers.
Embodiment
Below in conjunction with accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Generally exist
The component of the embodiment of the present invention described and illustrated in accompanying drawing can be arranged and designed with a variety of configurations herein.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
At present, common circuit board has PCB (Printed Circuit Board), Kapton (polyimide
film；PI film) flexible circuit etc..PCB is also known as printed substrate, is widely used in electronic electric equipment, but hardness compared with
Greatly.Kapton flexible circuit is also known as PI film flexible circuits, is the printed circuit being made of flexible insulating substrate, soft
Degree is preferable, but tensility is not good.
In addition, circuit board is divided into soft board, hardboard and Rigid Flex if classifying by pliability.Soft board is also known as flexible electrical
Road plate, common flexible PCB composition material is polyester film, Kapton, fluorinated ethylene propylene (FEP) film or paper,
With Distribution density is high, lightweight, thickness of thin the characteristics of.Common hardboard composition material is phenolic paper laminate, Epoxide cellulose paper
Matter laminate, polyester fiberglass carpet veneer pressing plate and epoxy glass cloth laminated board.Rigid Flex is flexible PCB and rigid circuit
Plate, by processes, the circuit board being grouped together into by related process requirement such as pressings.But, the electricity that existing method makes
Road plate, even soft board, feel is also harder, suppleness is poor.In addition, in the process of circuit board, relying primarily on erosion
The method at quarter, i.e., eat away the otiose copper of circuit board surface or aluminium with chemical reagent, pollutes environment.
Based on this, the embodiments of the invention provide flexible print thin film circuit and system, retouched below by embodiment
State.
Embodiment 1
Referring to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, the flexible print thin film circuit that the present embodiment is proposed includes：Basal layer 1 and at least
The conductive layer 2 set in the side of basal layer 1, it is common, in process of production by using screen printing between basal layer 1 and conductive layer 2
After brush, then by high/low temperature solidify the step of formed.Conductive layer 2 is printed onto on basal layer 1, then by high/low temperature solidification one
The section time, after then cooling down, conductive layer 2 is attached on basal layer 1, wherein, basal layer 1 is thermoplastic elastomer (TPE), thermoplastic
Property elastomer abbreviation TPE (Thermoplastic Elastomer), be also thermoplastic elastomer (TPE), be it is a kind of have can be molded plus
The material of work feature, with environment-protecting and non-poisonous, soft-touch, fatigue resistance and temperature tolerance, processing characteristics is superior, can with PP, PE,
The matrix material coating and bonding such as PC, PS, can also be separately formed.With PVC (Polyvinyl chloride) (Chinese abbreviation polychlorostyrene
Ethene) to compare, material soft-touch, good weatherability, not plasticizer-containing, elasticity is good, the attention protected with Environmental,
TPE is more and more applied in all trades and professions.In this programme, from layer based on TPE 1, make the layer 1 based on TPE
Circuit board softness is stretchable, also, can also recover after being stretched as former state.
Because TPE is hot formable material, multilayer TPE circuits can be fabricated to multilayer circuit by hot pressing.Obtaining
After above-mentioned basal layer 1, conductive layer 2 is set in the one or both sides of basal layer 1.I.e. when needing to make lamina, in basal layer 1
Side set conductive layer 2；When needing to make doubling plate, conductive layer 2 is respectively provided with the both sides of basal layer 1.In this programme,
From conductive material as conductive layer 2, conductive material is that the electrocondution slurry of silver-colored electric conductivity and electric conductivity is realized with silver powder, with solid
The features such as changing low temperature, electric performance stablity, be easy to silk-screen printing, in this application, conductive layer 2 forms conduction on basal layer 1
That conductive material is printed onto on basal layer 1 in path, specific implementation process, or, by laser engraving, solidification, adhesion,
Laser carving technology etc. lays conductive material on basal layer 1, and conventional conductive material includes silver paste, ink, graphene, carbon nanometer
The metals such as pipe, copper foil, aluminium foil and non-metallic conducting material.(eaten away and do not used with chemical reagent with traditional engraving method
Copper or aluminium film) compare, operating process is more environmentally-friendly, the antenna as RFID.
Flexible print thin film circuit also includes electronic device layer 3, and electronic device layer 3 is connected with conductive layer 2, i.e., in conductive layer
2 surface sets the electronic component needed for user according to circuit design, also, electronic device layer 3 passes through conducting resinl or weldering
Tin is connected with conductive layer 2, i.e., will conducting resinl or scolding tin hot melt processing after be connected with conductive layer 2, so, electronic device layer 3 with
Conductive path formation circuit, the length of 2 times of stretching, circuit will not be damaged.
In order to be protected to foregoing circuit, flexible print thin film circuit also includes the first insulating barrier 4, the first insulating barrier 4
Side of the conductive layer 2 away from basal layer 1 is arranged on, the first insulating barrier 4 is by the way that glue is heated, the mode of reflow process processing
It is attached with conductive layer 2, is typically that first insulating barrier 4 is set in the outside of conductive layer 2, also, the first insulating barrier 4 is poly-
Tetrafluoroethene film, polytetrafluoroethylene film abbreviation PTFE, with good chemical stability, corrosion resistance, sealing and electricity
Insulating properties, in the circuit board application can be protected to conductive layer 2, while good insulating effect can also be played.
Also include anti-tensile layer 5 in flexible print thin film circuit, anti-tensile layer 5 is arranged on the first insulating barrier 4 away from conductive
The side of layer 2, anti-tensile layer 5 is connected by way of film or hot setting with the first insulating barrier 4, for example, making individual layer
During plate, anti-tensile layer 5 is arranged on the surface of the first insulating barrier 4；When making doubling plate, it is respectively provided with the surface of the first insulating barrier 4
Anti- tensile layer 5.Also, anti-tensile layer 5 selects fibre.Fibre specifically has glass fibre, polyester fiber and nylon fine
Dimension, glass fibre is the most commonly used, and glass fibre is a kind of inorganic non-metallic material of excellent performance, its good insulating, heat resistance
By force, corrosion resistance is good, high mechanical strength, its by raw material of glass marble or discarded glass through high temperature melting, wire drawing, doff, weave cotton cloth
It is manufactured into etc. technique, for that in circuit board, can strengthen mechanical strength and electrical insulating property, heat-proof quality is high.
In order to further function as protective effect to circuit board, flexible print thin film circuit also includes the second insulating barrier 6, second
Insulating barrier 6 is arranged on the side away from the first insulating barrier 4 of anti-tensile layer 5, equally, between the second insulating barrier 6 and anti-tensile layer 5
It is also to be bonded by way of film, needs to carry out the processing of high temperature (for example, 100-200 degrees Celsius) solidification afterwards, with
First insulating barrier 4 is similar, and the second insulating barrier 6 also selects polytetrafluoroethylene film, so, in the circuit board using can be to conduction
The further protection of layer 2, while good insulating effect can also be played.
Because in R＆D process, specification, date of circuit board etc. are different, particularly when user is also needed to electricity
, it is necessary to during circuit board making, be labeled to it when road plate is upgraded, so, facilitate the later stage use and
Management.Therefore, flexible print thin film circuit also includes surface printing layer 7, and it is remote that surface printing layer 7 is covered in the second insulating barrier 6
The side of anti-tensile layer 5, surface printing layer 7 is connected by gluing mode with the second insulating barrier 6, i.e., be applied to after glue is heated
On second insulating barrier 6, shape after cooling.The material that the selection of surface printing layer 7 can print, can be pressed on surface printing layer 7
According to the demand of user, model, species, date of manufacture and other explanations of printed circuit board etc. are conveniently produced and used.
In addition, in order to avoid circuit board collides with and rubbed with other articles during transport or use, it is flexible
Printed film circuit also includes the first diaphragm, and the first diaphragm generally chooses the larger plastic foil of hardness, and the first diaphragm glues
It is attached on surface printing layer 7, whole circuit board is protected, effectively prevent in collision process, circuit board is because of external force collision
Or the phenomenon that is damaged such as friction.
In summary, the flexible print thin film circuit that the present embodiment is provided includes：Basal layer 1 and at least in basal layer 1 one
The conductive layer 2 that side is set, wherein, basal layer 1 is thermoplastic elastomer (TPE), and conductive layer 2 forms conductive path on basal layer 1, is led to
The circuit board for crossing aforesaid way formation is good in film-form, soft texture, pliability, is widely used in electronic tag field.In addition,
Electronic device layer 3, can also also be set gradually in the outside of conductive layer 2 according to the difference of customer demand and use environment etc.
One insulating barrier 4, anti-tensile layer 5, the second insulating barrier 6, the diaphragm of surface printing layer 7 and first etc., so that the insulation of circuit board
More preferably, tensility is stronger for performance, preferably can be applied in production, carrying and research and development.
Embodiment 2
Present embodiments providing flexible printed circuit system includes：External circuitses plate and above-mentioned flexible print thin film circuit,
External circuitses plate is electrically connected with flexible print thin film circuit, in specific operation process, and a kind of battery material (is mainly polymerize
Thing and zinc-manganese material) directly it is bonded on basal layer 1 by way of printing, hot setting, realize external circuitses plate and above-mentioned
The circuit connection of flexible print thin film circuit.
In summary, the flexible printed circuit system that the present embodiment is provided includes：External circuitses plate and above-mentioned flexible print
Thin film circuit, external circuitses plate is electrically connected with flexible print thin film circuit, and flexible print thin film circuit is realized by this way
Functions expanding, the flexible print thin film circuit and a variety of external circuitses plates for enabling the application be attached, and improves flexible print
The compatibility of made membrane circuit.
In addition, in the description of the embodiment of the present invention, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, to those skilled in the art, with concrete condition above-mentioned term can be understood in this hair
Concrete meaning in bright.In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right",
The orientation or position relationship of the instruction such as " vertical ", " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship,
It is for only for ease of the description present invention and simplifies description, rather than to indicate or imply that signified device or element must have specific
Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ",
" second ", " the 3rd " are only used for describing purpose, and it is not intended that indicating or implying relative importance.
Finally it should be noted that：Embodiment described above, is only the embodiment of the present invention, to illustrate the present invention
Technical scheme, rather than its limitations, protection scope of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, it will be understood by those within the art that：Any one skilled in the art
The invention discloses technical scope in, it can still modify to the technical scheme described in previous embodiment or can be light
Change is readily conceivable that, or equivalent substitution is carried out to which part technical characteristic；And these modifications, change or replacement, do not make
The essence of appropriate technical solution departs from the spirit and scope of technical scheme of the embodiment of the present invention, should all cover the protection in the present invention
Within the scope of.Therefore, protection scope of the present invention described should be defined by scope of the claims.
Claims (10)
1. flexible print thin film circuit, it is characterised in that including：Basal layer and the conduction at least set in the basal layer side
Layer, wherein, the basal layer is thermoplastic elastomer (TPE)；
The conductive layer, for forming conductive path on the basal layer.
2. flexible print thin film circuit according to claim 1, it is characterised in that the conductive layer by printing, solidification,
The mode that adhesion, laser engraving or radium are carved is attached on the basal layer.
3. flexible print thin film circuit according to claim 1, it is characterised in that also including electronic device layer, the electricity
Sub- device layer is connected with the conductive layer, and, the electronic device layer is connected by conducting resinl or scolding tin with the basal layer；
The electronic device layer, for forming circuit with the conductive path.
4. flexible print thin film circuit according to claim 1, it is characterised in that also including the first insulating barrier, described
One insulating barrier is arranged on side of the conductive layer away from the basal layer, and, first insulating barrier is that polytetrafluoroethylene (PTFE) is thin
Film.
5. flexible print thin film circuit according to claim 4, it is characterised in that also including anti-tensile layer, the anti-drawing
Stretch layer and be arranged on the side of first insulating barrier away from the conductive layer, and, the anti-tensile layer is fibre.
6. flexible print thin film circuit according to claim 5, it is characterised in that also including the second insulating barrier, described
Two insulating barriers are arranged on the side of remote first insulating barrier of the anti-tensile layer, and, second insulating barrier is poly- four
Fluoroethylene film.
7. flexible print thin film circuit according to claim 6, it is characterised in that also including surface printing layer, the table
Face printing layer is covered in side of second insulating barrier away from the anti-tensile layer.
8. flexible print thin film circuit according to claim 7, it is characterised in that also including the first diaphragm, described
One diaphragm is pasted onto on the surface printing layer.
9. flexible print thin film circuit according to claim 1, it is characterised in that the conductive layer is conductive material.
10. flexible printed circuit system, it is characterised in that including：External circuitses plate and as described in claim any one of 1-9
Flexible print thin film circuit；
The external circuitses plate is electrically connected with the flexible print thin film circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710129606.9A CN107046766A (en) | 2017-03-06 | 2017-03-06 | Flexible print thin film circuit and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710129606.9A CN107046766A (en) | 2017-03-06 | 2017-03-06 | Flexible print thin film circuit and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107046766A true CN107046766A (en) | 2017-08-15 |
Family
ID=59544064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710129606.9A Pending CN107046766A (en) | 2017-03-06 | 2017-03-06 | Flexible print thin film circuit and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107046766A (en) |
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| CN109951982A (en) * | 2019-04-23 | 2019-06-28 | 台州思碳科技有限公司 | A kind of the power supply connecting structure and air cleaning unit of thin film circuit |
| CN110225648A (en) * | 2019-04-23 | 2019-09-10 | 台州思碳科技有限公司 | A kind of the film folding electric circuit and air cleaning unit of band simplicity power connection equipment |
| CN112020239A (en) * | 2019-05-29 | 2020-12-01 | 北京梦之墨科技有限公司 | Printed electronics and printed electronics manufacturing method |
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Application publication date: 20170815 |
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