CN103009713A - Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof - Google Patents
Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof Download PDFInfo
- Publication number
- CN103009713A CN103009713A CN201210501115XA CN201210501115A CN103009713A CN 103009713 A CN103009713 A CN 103009713A CN 201210501115X A CN201210501115X A CN 201210501115XA CN 201210501115 A CN201210501115 A CN 201210501115A CN 103009713 A CN103009713 A CN 103009713A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- copper
- circuit board
- clad plate
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention relates to a manufacturing method of a copper-clad plate. The method comprises the following steps of: providing a base plate which is made of polymethyl methacrylate materials; providing copper foil which is provided with a roughening surface; fitting the roughening surface to the surface of the base plate; and carrying out thermal compression bonding on base plates fit with the copper foil, and combining the base plates and the copper foil tightly together. The invention also provides a manufacturing method of a printed circuit board based on the manufacturing method of the copper-clad plate. The invention further provides the copper-clad plate and the printed circuit board, and the printed circuit board has the advantages of favorable electrical and mechanical properties, wide application ranges and low cost.
Description
Technical field
The present invention relates to a kind of copper-clad plate, printed circuit board (PCB) and preparation method thereof, relate in particular to a kind of with the PMMA(polymethyl methacrylate) material is made for copper-clad plate, printed circuit board (PCB) of substrate and preparation method thereof.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) almost be the basis of any electronic product, develop rapidly along with electronic industry, printed circuit board applications as the electronic product basic building block is more and more extensive, although the function of electronic product not only strengthens, the expansion of application is wide, particularly the development in high speed information epoch drives lower, the requirement that is applied in the printed circuit board (PCB) in the electronic product is also more and more, and especially the requirement at aspects such as the transmission quality of signal, speed constantly promotes to printed circuit board (PCB).
In the prior art, epoxy resin is that main body (FR-4) is that printed circuit board (PCB) is the consumption maximum at present, purposes is a series products the most widely, yet the printed circuit board (PCB) cost that the FR-4 material is made is high, it is relatively poor that dielectric loss reaches greatly electrical property, and FR-4 has easy suction, be easy to wear out, a series of shortcomings such as the reactance voltage ability is relatively poor, cause the printed circuit board (PCB) of its making to be not suitable at special environment, wet environment particularly, space flight and aviation, high speed communication, space or radioactivity medicine equipment) etc. the field, require density of material light, the transmission dielectric loss is little, anticorrosive property is strong, environmental protection, the characteristics such as high-insulativity.
In view of this, be necessary the defective of above-mentioned existence is improved.
Summary of the invention
The invention provides a kind of electric, mechanicalness is good, applied widely, copper-clad plate that cost is low, printed circuit board (PCB) and preparation method thereof.
A kind of preparation method of copper-clad plate is provided, and the method may further comprise the steps: a substrate is provided, and described substrate is that polymethyl methacrylate materials is made;
One Copper Foil is provided, and described Copper Foil has a coarse surface; The coarse surface of described Copper Foil is fitted in the surface of described substrate; The substrate that is fitted with described Copper Foil is carried out hot pressing, described substrate and described Copper Foil are closely linked.
According to a preferred embodiment of the invention, sand-blast is adopted in the roughening treatment of described copper foil surface, and the sandblast that described sand-blast adopts is any one in copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA, the plastic grain.
According to a preferred embodiment of the invention, sand-blast is adopted in described roughening treatment, and described sandblast material spray adopts 120 purpose sandblasts, and forms 50 microns-150 microns roughness on the surface of described Copper Foil.
According to a preferred embodiment of the invention, the thickness of described Copper Foil is 10-70 micron 10-70 micron.
According to a preferred embodiment of the invention, the coarse surface of described Copper Foil adopts the liquid medicine etching method to make.
A kind of copper-clad plate is provided, and described copper-clad plate comprises: substrate, described substrate are that polymethyl methacrylate materials is made; Copper Foil, described Copper Foil has a coarse surface, and combines closely by described coarse surface and described substrate.
According to a preferred embodiment of the invention, the thickness of described Copper Foil is 10-70 micron 10-70 micron.
A kind of preparation method of printed circuit board (PCB) is provided, comprises step: a substrate is provided; One Copper Foil is provided, and described Copper Foil has a coarse surface; The coarse surface of described Copper Foil is fitted in the surface of described substrate; The described substrate that is fitted with described Copper Foil is carried out hot pressing, described substrate and described Copper Foil are closely linked; Copper Foil to described copper-clad plate carries out patterned process, forms printed circuit board (PCB).
A kind of printed circuit board (PCB) is provided, and described printed circuit board (PCB) comprises: substrate, described substrate are that polymethyl methacrylate materials is made; The patterning Copper Foil, described patterning Copper Foil has a coarse surface, and combines closely by described coarse surface and described substrate.
According to a preferred embodiment of the invention, described printed circuit board (PCB) makes by the preparation method of printed circuit board (PCB) as mentioned above.
Compared to prior art, copper-clad plate of the present invention, printed circuit board (PCB) and preparation method thereof have following advantage:
1) the PMMA resin is the material of asepsis environment-protecting, has good machining, optical characteristics, chemical stability and gasproof marquis variation characteristic.
2) good insulating properties and mechanical strength are arranged, can carry out the techniques such as bonding, saw, plane, brill, quarter, mill, serigraphy, spray, has preferably impact property, can hole, be easy to machining, vitrification point is 105 ℃ lower, be conducive to be made into multilayer circuit board, break through tradition and use FR4(epoxy resin) and the PTFE(polytetrafluoroethylene (PTFE)) make printed circuit board (PCB), product category is novel, and electrical property is good.And can recycle and reuse.
3) chemical property; PMMA has certain resistance to chemical attack ability, and acid, alkali, salt are had stronger decay resistance;
4) electrical property of good electrical property: PMMA is good, particularly under the low frequency condition of work, yet its some electrical property is unique: the dielectric loss angle tangent value reduces with the rising of frequency, only have common FR4(epoxy resin) material 10%, be conducive to the transmission of signal, and weather and humidity are little on the impact of electrical property.Use under high humidity environment for a long time, insulating properties are good, are not easy to produce the bad phenomenon such as micro-short circuit.
5) lightweight, high rigidity: half of the not enough FR4 of the density of polymethyl methacrylate materials, its printed circuit board (PCB) of making can be good is applied to space flight and aviation, satellite communication field.
6) high-quality environment protective: polymethyl methacrylate materials can not occur to decompose and go mouldy, and can not produce harmful substance can send out, stable chemical nature, and polymethyl methacrylate materials itself is pollution-free, and recyclable processing recycling is the high-quality environment protective product.
7) transparency: PMMA is amorphous high polymer, visible light transmissivity is up to 92%, the printed circuit board (PCB) of its making can transparence, convenient unusually effectively analyzing product, such as problems such as internal layer open circuit, short circuits, do not need section, directly visual examination can be made circuit board or electronic product with artistic beauty.
8) polymethyl methacrylate is amorphous polymer, and shrinkage factor and excursion thereof are all less, generally about 0.5%-0.8%, is conducive to mold the higher plastic of dimensional accuracy.
9) cost is low: the printed circuit board (PCB) take polymethyl methacrylate materials as substrate is that tradition is take the FR4 material as 1/4th of base printed circuit board cost of manufacture, and making apparatus can share with common PCB, difficulty of processing is little, is conducive to the control of print circuit plates making cost and the popularization of industrialization.
10) hot pressing temperature is low: because the vitrification point of TPUE is lower, generally directly press at 105-150 degree centigrade, this temperature belongs to the low temperature in the process for manufacturing circuit board, and the variation of form can not occur in place an order substrate in the layer printed circuit board of this temperature, performance that can the bonding layer printed circuit board stable.
11) in conjunction with tight: have stronger cohesive behind the TPUE hot melt, can securely many single-layer printed circuit plates be bonded together securely, guaranteed tight type and the reliability of the combination of multilayer circuit board.
Description of drawings
Fig. 1 is a kind of cross-sectional view of printed circuit board (PCB) related to the present invention.
Fig. 2 is the schematic flow sheet for the preparation method of printed circuit board (PCB) among Fig. 1.
Fig. 3 a-Fig. 3 e is the cross-sectional view of each step of print circuit plates making method shown in Figure 2.
The specific embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
See also Fig. 1, Fig. 1 is the cross-sectional view of printed circuit board (PCB) of the present invention (Printed Circuit Board, PCB).Described printed circuit board (PCB) 100 comprises substrate 1 and is arranged on patterning Copper Foil 2 on the substrate 1.
Described substrate 1 is tabular, and it is made by polymethyl methacrylate (Polymethyl Methacrylate, PMMA) material, can design according to actual needs the parameters such as its thickness, does not limit at this.
Described patterning Copper Foil 2 has a coarse surface 21, and fits tightly surface at described substrate 1 by described coarse surface 21.Usually, the roughness of the coarse surface 21 of described patterning Copper Foil 2 is 50 microns-150 microns.Accordingly, the coarse surface 21 of the surface of substrate 1 and described patterning Copper Foil 2 has the surface texture that mutually agrees with, and like this, described substrate 1 can closely combine with described patterning Copper Foil 2, prevents the phenomenons such as patterning Copper Foil 2 comes off, perk.
Described patterning Copper Foil 2 can be used as the wire of connecting electronic component, and its purposes can design according to actual needs, is not specifically limited at this.The thickness of the patterning Copper Foil 2 in the present embodiment is 10-70 micron 10-70 micron.
General, the rough surface 21 of described patterning Copper Foil 2 can make by sand-blast alligatoring on ganoid Copper Foil.Sand-blast can adopt dry abrasive blasting or vapour blasting technique, does not specifically limit.In the present embodiment, blasting craft is that employing compressed air is the dry abrasive blasting technique of power, form the high velocity jet bundle with the surface of material spray (copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA, plastic grain etc.) high velocity jet to Copper Foil, its appearance is changed, because material spray is to impact and the shear action of copper foil surface, so that the surface of Copper Foil obtains certain cleannes and roughness, thereby form coarse surface 21, increased like this surface of patterning Copper Foil 2 and the adhesive force between the substrate 1.Wherein, can according to the difference of roughness, adopt the material spray of different size, such as 60 orders, 80 orders, 100 orders, 120 orders, 150 orders etc., in the present embodiment, the sandblast material spray adopts 120 purpose sandblasts, gets 100 microns-150 microns roughness on the surface of poly-Copper Foil.
In addition, the rough surface 21 of patterning Copper Foil 2 can also form by the etched mode of liquid medicine 100 microns-150 microns roughness, and the concrete erosion carving method has been known to the insider, does not repeat them here.
Certainly, can also be according to actual needs, the common conductive materials such as the aluminium lamination that patterning Copper Foil 2 can be patterned, silver layer, gold layer substitute, and do not do concrete restriction at this.
Please consult simultaneously Fig. 2, Fig. 3 a-Fig. 3 e, Fig. 2 is the schematic flow sheet of the preparation method of printed circuit board (PCB) 100 shown in Figure 1, Fig. 3 a-Fig. 3 e is the cross-sectional view of each step of printed circuit board (PCB) 100 shown in Figure 2, and the preparation method of described printed circuit board (PCB) 100 specifically comprises:
Step S1 provides a substrate;
See also Fig. 3 a, described substrate 1 is laminated structure, and 1 is laminated structure, by polymethyl methacrylate (Polymethyl Methacrylate, PMMA) material is made, and can select as required tens microns to several millimeters thickness, and the surface of general substrate 1 is smooth surface.In the present embodiment, the surface of described substrate 1 can be smooth flat, also can be the surface with certain roughness, its on content of the present invention without impact.In the present embodiment, be elaborated as smooth flat as example take the surface of substrate 1.
Step S2 provides a Copper Foil, and described Copper Foil has a coarse surface;
See also Fig. 3 b, the thickness of described Copper Foil 20 is 10-70 micron 10-70 micron, and it has a coarse surface 21, and the roughness of described coarse surface 21 is 50 microns-150 microns.As indicated above, described coarse surface can make by sand-blast, can also make by techniques such as etching, cuttings, does not do concrete restriction herein.
Step S3 is fitted in the coarse surface of described Copper Foil on the surface of described substrate;
See also Fig. 3 c, the coarse surface 21 of described Copper Foil 20 is fitted in the surface of described substrate 1.At this moment, the coarse surface 21 of described Copper Foil 20 partly contacts with the smooth surface of described substrate 1, and forms the space of many places between the two.
Step S4 carries out hot pressing to the described substrate that is fitted with described Copper Foil, and described substrate and described Copper Foil are closely linked, and forms copper-clad plate;
See also Fig. 3 d, in vacuum environment, described Copper Foil 20 and described substrate 1 be placed on carry out hot pressing in the hot press, make at a certain temperature described substrate 1 reach vitrification point, change the elastomeric state of melting into, has certain viscosity, by strengthening the pressure between described Copper Foil 20 and the described substrate 1, make the smooth surface 11 of described substrate 1 produce the alligatoring structure corresponding with coarse surface 21 generations of described Copper Foil 20, get rid of the space between the two, and be bonded together closely with the coarse surface 21 of described Copper Foil 20, when treating that temperature is reduced to room temperature, can form copper-clad plate.
Wherein, the hot pressing temperature that is directed to polymethyl methacrylate materials is generally between 85 degree 150, can omit inching according to the characteristic of real material.
Step S5 carries out patterned process to the Copper Foil of copper-clad plate, forms printed circuit board (PCB).
See also Fig. 3 e, by process for manufacturing circuit board such as etchings, the Copper Foil 20 of copper-clad plate can be carried out patterned process, form patterning Copper Foil 2, described patterning Copper Foil 2 can be used as the wire of connecting electronic component, and its purposes can design according to actual needs, is not specifically limited at this.
Compared to prior art, printed circuit board (PCB) 100 of the present invention adopts polymethyl methacrylate materials as baseplate material, and makes by hot pressing technique, has following advantage:
1) the PMMA resin is the material of asepsis environment-protecting, has good machining, optical characteristics, chemical stability and gasproof marquis variation characteristic.
2) good insulating properties and mechanical strength are arranged, can carry out the techniques such as bonding, saw, plane, brill, quarter, mill, serigraphy, spray, has preferably impact property, can hole, be easy to machining, vitrification point is 105 ℃ lower, be conducive to be made into multilayer circuit board, break through tradition and use FR4(epoxy resin) and the PTFE(polytetrafluoroethylene (PTFE)) make printed circuit board (PCB), product category is novel, and electrical property is good.And can recycle and reuse.
3) chemical property; PMMA has certain resistance to chemical attack ability, and acid, alkali, salt are had stronger decay resistance;
4) electrical property of good electrical property: PMMA is good, particularly under the low frequency condition of work, yet its some electrical property is unique: the dielectric loss angle tangent value reduces with the rising of frequency, only have common FR4(epoxy resin) material 10%, be conducive to the transmission of signal, and weather and humidity are little on the impact of electrical property.Use under high humidity environment for a long time, insulating properties are good, are not easy to produce the bad phenomenon such as micro-short circuit.
5) lightweight, high rigidity: half of the not enough FR4 of the density of polymethyl methacrylate materials, its printed circuit board (PCB) of making can be good is applied to space flight and aviation, satellite communication field.
6) high-quality environment protective: polymethyl methacrylate materials can not occur to decompose and go mouldy, and can not produce harmful substance can send out, stable chemical nature, and polymethyl methacrylate materials itself is pollution-free, and recyclable processing recycling is the high-quality environment protective product.
7) transparency: PMMA is amorphous high polymer, visible light transmissivity is up to 92%, the printed circuit board (PCB) of its making can transparence, convenient unusually effectively analyzing product, such as problems such as internal layer open circuit, short circuits, do not need section, directly visual examination can be made circuit board or electronic product with artistic beauty.
8) polymethyl methacrylate is amorphous polymer, and shrinkage factor and excursion thereof are all less, generally about 0.5%-0.8%, is conducive to mold the higher plastic of dimensional accuracy.
9) cost is low: the printed circuit board (PCB) take polymethyl methacrylate materials as substrate is that tradition is take the FR4 material as 1/4th of base printed circuit board cost of manufacture, and making apparatus can share with common PCB, difficulty of processing is little, is conducive to the control of print circuit plates making cost and the popularization of industrialization.
10) hot pressing temperature is low: because the vitrification point of TPUE is lower, generally directly press at 105-150 degree centigrade, this temperature belongs to the low temperature in the process for manufacturing circuit board, and the variation of form can not occur in place an order substrate in the layer printed circuit board of this temperature, performance that can the bonding layer printed circuit board stable.
11) in conjunction with tight: have stronger cohesive behind the TPUE hot melt, can securely many single-layer printed circuit plates be bonded together securely, guaranteed tight type and the reliability of the combination of multilayer circuit board.
The above only is preferred embodiments of the present invention; protection scope of the present invention is not limited with above-mentioned embodiment; as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection domain of putting down in writing in claims.
Claims (9)
1. the preparation method of a copper-clad plate is characterized in that, the method may further comprise the steps:
One substrate is provided, and described substrate is that polymethyl methacrylate materials is made;
One Copper Foil is provided, and described Copper Foil has a coarse surface;
The coarse surface of described Copper Foil is fitted in the surface of described substrate;
The substrate that is fitted with described Copper Foil is carried out hot pressing, described substrate and described Copper Foil are closely linked.
2. the preparation method of copper-clad plate according to claim 1, it is characterized in that, the coarse surface of described Copper Foil adopts sand-blast to make, and the sandblast that described sand-blast adopts is any one in copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA, the plastic grain.
3. the preparation method of copper-clad plate according to claim 2 is characterized in that, described coarse surface forms 50 microns-150 microns roughness.
4. the preparation method of copper-clad plate according to claim 1 is characterized in that, the thickness of described Copper Foil is 10-70 micron 10-70 micron.
5. the preparation method of copper-clad plate according to claim 1 is characterized in that, the coarse surface of described Copper Foil adopts the liquid medicine etching method to make.
6. a copper-clad plate is characterized in that, described copper-clad plate comprises:
Substrate, described substrate are that polymethyl methacrylate materials is made;
Copper Foil, described Copper Foil has a coarse surface, and combines closely by described coarse surface and described substrate.
7. copper-clad plate according to claim 6 is characterized in that, the thickness of described Copper Foil is 10-70 micron 10-70 micron.
8. the preparation method of a printed circuit board (PCB) is characterized in that, on the basis of the preparation method of the described copper-clad plate of any one, further comprises step in such as claim 1-4:
Copper Foil to described copper-clad plate carries out patterned process, forms printed circuit board (PCB).
9. a printed circuit board (PCB) is characterized in that, described printed circuit board (PCB) comprises:
Substrate, described substrate are that polymethyl methacrylate materials is made;
The patterning Copper Foil, described patterning Copper Foil has a coarse surface, and combines closely by described coarse surface and described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210501115XA CN103009713A (en) | 2012-11-28 | 2012-11-28 | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210501115XA CN103009713A (en) | 2012-11-28 | 2012-11-28 | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103009713A true CN103009713A (en) | 2013-04-03 |
Family
ID=47959071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210501115XA Pending CN103009713A (en) | 2012-11-28 | 2012-11-28 | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103009713A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786979A (en) * | 2019-01-31 | 2019-05-21 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The method of the anti-heterogeneous material splicing seams oil paint cracking of PTFE base antenna array |
| CN112037967A (en) * | 2019-06-03 | 2020-12-04 | 苏州维业达触控科技有限公司 | Conducting film mold, manufacturing method thereof and conducting film |
| CN112739021A (en) * | 2020-12-21 | 2021-04-30 | 北京大华博科智能科技有限公司 | Wearable substrate material surface circuit and preparation method thereof |
| CN117222104A (en) * | 2023-09-28 | 2023-12-12 | 电子科技大学 | Composite medium substrate based on silicone rubber/fabric fiber and preparation method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2216318Y (en) * | 1994-11-24 | 1995-12-27 | 刘宝申 | Flexible polyester film coated copper foil plate and film-coated circuit board |
| US20020004123A1 (en) * | 2000-07-07 | 2002-01-10 | Takuya Yamamoto | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
| JP2003051673A (en) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | Printed wiring board copper foil and copper-plated laminated board using the same |
| CN101180178A (en) * | 2005-04-04 | 2008-05-14 | 宇部兴产株式会社 | Copper clad laminate |
| CN101365294A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Copper coated substrate material and flexible circuit board having the copper coated substrate material |
| CN101431866A (en) * | 2007-11-07 | 2009-05-13 | 优利科技股份有限公司 | Method for producing flexible circuit board by rinsing technique |
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN102673053A (en) * | 2012-06-05 | 2012-09-19 | 深圳市五株科技股份有限公司 | Copper-clad plate, printed circuit plate and manufacturing method thereof |
| WO2012132577A1 (en) * | 2011-03-30 | 2012-10-04 | Jx日鉱日石金属株式会社 | Copper foil for printed circuit |
| CN102752956A (en) * | 2005-10-25 | 2012-10-24 | 日立化成工业株式会社 | Flexible laminate board and flexible print wiring board |
| CN203032024U (en) * | 2012-11-28 | 2013-07-03 | 梅州市志浩电子科技有限公司 | Hot-pressed copper-clad board and printed circuit board adopting polymethyl methacrylate as medium |
-
2012
- 2012-11-28 CN CN201210501115XA patent/CN103009713A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2216318Y (en) * | 1994-11-24 | 1995-12-27 | 刘宝申 | Flexible polyester film coated copper foil plate and film-coated circuit board |
| US20020004123A1 (en) * | 2000-07-07 | 2002-01-10 | Takuya Yamamoto | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
| JP2003051673A (en) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | Printed wiring board copper foil and copper-plated laminated board using the same |
| CN101180178A (en) * | 2005-04-04 | 2008-05-14 | 宇部兴产株式会社 | Copper clad laminate |
| CN102752956A (en) * | 2005-10-25 | 2012-10-24 | 日立化成工业株式会社 | Flexible laminate board and flexible print wiring board |
| CN101365294A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Copper coated substrate material and flexible circuit board having the copper coated substrate material |
| CN101431866A (en) * | 2007-11-07 | 2009-05-13 | 优利科技股份有限公司 | Method for producing flexible circuit board by rinsing technique |
| WO2012132577A1 (en) * | 2011-03-30 | 2012-10-04 | Jx日鉱日石金属株式会社 | Copper foil for printed circuit |
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN102673053A (en) * | 2012-06-05 | 2012-09-19 | 深圳市五株科技股份有限公司 | Copper-clad plate, printed circuit plate and manufacturing method thereof |
| CN203032024U (en) * | 2012-11-28 | 2013-07-03 | 梅州市志浩电子科技有限公司 | Hot-pressed copper-clad board and printed circuit board adopting polymethyl methacrylate as medium |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786979A (en) * | 2019-01-31 | 2019-05-21 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The method of the anti-heterogeneous material splicing seams oil paint cracking of PTFE base antenna array |
| CN112037967A (en) * | 2019-06-03 | 2020-12-04 | 苏州维业达触控科技有限公司 | Conducting film mold, manufacturing method thereof and conducting film |
| CN112739021A (en) * | 2020-12-21 | 2021-04-30 | 北京大华博科智能科技有限公司 | Wearable substrate material surface circuit and preparation method thereof |
| CN117222104A (en) * | 2023-09-28 | 2023-12-12 | 电子科技大学 | Composite medium substrate based on silicone rubber/fabric fiber and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10512170B2 (en) | Highly conductive transparent glass-based circuit board | |
| CN102673053B (en) | Copper-clad plate, Printed circuit board and manufacturing methods | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| CN103009713A (en) | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof | |
| CN105905867B (en) | Preparation method of three-dimensional surface cis-formal or conformal pattern | |
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN102709702B (en) | Metamaterial preparation method and antenna housing made of metamaterial prepared by method | |
| CN102647861A (en) | Metal-core printed circuit board and manufacturing method thereof | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN102045948B (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN101661364A (en) | Resistance-type touch screen window and manufacturing method thereof | |
| CN203032024U (en) | Hot-pressed copper-clad board and printed circuit board adopting polymethyl methacrylate as medium | |
| CN102975429A (en) | Electrolytic copper-clad plate by taking polymethyl methacrylate as medium, printed circuit board and manufacturing method thereof | |
| CN202998653U (en) | Printed circuit board | |
| CN202998642U (en) | Multilayer printed circuit board | |
| CN203818668U (en) | Combined type two-sided copper foil base plate of transparent insulating layer | |
| CN103108502A (en) | Method for laminating cover film in soft board | |
| CN107046766A (en) | Flexible print thin film circuit and system | |
| CN202998655U (en) | Metal-base printed circuit board | |
| CN102922809A (en) | Liquid crystal polymer glass fiber bonding sheet copper-clad plate and preparation method thereof | |
| CN202805801U (en) | Copper-clad board and printed circuit board | |
| CN203110439U (en) | Copper clad plate and printed circuit board | |
| CN103002654A (en) | Multilayer printed circuit board and manufacturing method thereof | |
| CN102709703B (en) | Manufacturing method of metamaterials and antenna housing made of metamaterials | |
| CN204721704U (en) | Circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130403 |
|
| RJ01 | Rejection of invention patent application after publication |