CN103057208B - Composite cover film - Google Patents
Composite cover film Download PDFInfo
- Publication number
- CN103057208B CN103057208B CN201110323649.3A CN201110323649A CN103057208B CN 103057208 B CN103057208 B CN 103057208B CN 201110323649 A CN201110323649 A CN 201110323649A CN 103057208 B CN103057208 B CN 103057208B
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- cover film
- adhering agent
- composite cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a composite cover film which comprises a polymer layer, a first adhesive layer, a second adhesive layer and a copper foil layer. As the copper foil layer is arranged, the line can be directly etched, so that the client production step is simplified, the production time is shortened, and the production efficiency is improved. According to the composite cover film, the copper foil layer is integrally formed in each material layer, so that the production yield is greatly improved compared with that of the preparation process for adhering and curing a plastic film with the copper foil layer in the prior art. The material layers are integrally formed to enhance the bonding strength of materials, so that the characteristics of the integrated material are enhanced. According to the composite cover film, a through hole is drilled in a part for preparing a semi-buried hole, and the semi-buried hole is formed by attaching the copper foil in the subsequent preparation process, so that the production yield is greatly improved.
Description
Technical field
The present invention relates to a kind of cover layer of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and along with the growth of consumption electronic products demand, the demand for printed circuit board (PCB) also grows with each passing day.Because flexible printed wiring board has flexibility and can the characteristic such as three-dimensional space distribution, under technicalization electronic product emphasizes that gesture is driven in development that is compact, flexibility, be widely used in computer and ancillary equipment thereof, communication product and consumption electronic products etc. at present.
Generally speaking, flexible print wiring board is mainly made up of copper clad laminate (FCCL) and cover layer (CL).In this board structure of circuit, be generally use plastic film as cover layer, or utilize screen printing technology to form one deck thin insulating ink.Due to precision and operative relationship in boring procedure, generally all cannot hold the degree of depth of boring, cause the circuit of very difficult formation half buried via hole mode, namely allow to the circuit of holing into buried via hole design, yield is also extremely low.
Therefore, circuit to be formed on such cover layer, must need first on polyimides (PI) layer of cover layer, first to form copper foil layer, then just can on copper foil layer printed wire.
The technology generally adopted in electric PC board industry is at present, protected by the mode of the pure glue of laminating hot pressing on cover layer surface and paste one deck copper foil base material, then on Copper Foil, printing forms circuit.The method operation needs through protecting the manufacturing process such as subsides, hot pressing, slaking, and in processing procedure, easily form the technique such as plate bursting, bubble bad.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of composite cover film, this composite cover film has circuit etching function and buried via hole design function, can simplify client production process and man-hour, and improves production efficiency and produce yield.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of composite cover film, comprise polymeric layer, described polymeric layer has two relative surfaces, two relative surfaces of described polymeric layer are stained with the first adhering agent layer and the second adhering agent layer respectively, described first adhering agent layer is stained with copper foil layer, and described first adhesion coating is folded between described copper foil layer and described polymeric layer.Prior art needs to be protected by the mode of the pure glue of laminating hot pressing on the surface of plastics cover layer to paste one deck copper foil base material, and then on Copper Foil, printing forms circuit.Cover layer of the present invention has copper foil layer, directly can form circuit, can simplify client production process, shortens production hour, enhances productivity; Because composite cover film of the present invention is by one-body molded for each material layer comprising one deck copper foil layer, relative to prior art, plastic foil and copper foil layer are fitted and the processing procedure of slaking, substantially increase production yield, and the one-body molded conjugation adding material of each material layer, improve the characteristic of integral material.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
Described polymeric layer is polyimide layer, PET (polyethylene terephthalate, PET) layer, polyaniline (polyaniline, PAn) layer, PEN (Polyethylene Naphthalate, PEN) layer, triacetyl glycerine (Triacetine, TAc) layer and polycarbonate resin (Polycarbonate, PC) one in layer, preferably polyimide layer or PET (polyethylene terephthalate, PET) layer.The thickness of described polymeric layer is 12.5 ~ 50um.
Described first adhering agent layer is the epoxide-resin glue after baking-curing, and the thickness of described first adhering agent layer is 8 ~ 50um.
Described second adhering agent layer is the epoxide-resin glue being in half flowing semi-cured state (B-stage) and the one be in the acrylic size of half flowing semi-cured state, and the thickness of described second adhering agent layer is 8 ~ 50um.
Described copper foil layer is the one in electrolysis (ED) Copper Foil and calendering (RA) Copper Foil, wherein rolls (RA) Copper Foil and also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8 ~ 70um.
In order to keep the viscosity of the second adhering agent layer, described second adhering agent layer can be stained with release layer, described second adhering agent layer is folded between described polymeric layer and described release layer.When needing in successive process cover layer to be fitted again Copper Foil, first described parting agent layer is torn off.Described release layer is the one in release liners and mould release membrance, the thickness 38 ~ 170um of described release layer.
Described composite cover film is drilled with the through hole of copper foil layer described in break-through, described first adhering agent layer, described polymeric layer and described second adhering agent layer.The composite cover film this being drilled with through hole when successive process is fitted after one deck Copper Foil makes double-side copper foil construction again, and the through hole in original composite cover film has just become half buried via hole in double-side copper foil construction.When prior art makes half buried via hole on double-side copper foil construction, be directly hole on double-side copper foil construction, the degree of depth that very difficult assurance drills through, the yield of production is very low.Composite cover film of the present invention is drilled with through hole needing the position of making half buried via hole, then by forming half buried via hole after successive process laminating Copper Foil, greatly improves production yield.
The invention has the beneficial effects as follows: composite cover film of the present invention has copper foil layer, can direct circuit etching, client production process can be simplified, shorten production hour, enhance productivity; Because composite cover film of the present invention is by one-body molded for each material layer comprising one deck copper foil layer, relative to prior art, plastic foil and copper foil layer are fitted and the processing procedure of slaking, substantially increase production yield, and the one-body molded conjugation adding material of each material layer, improve the characteristic of integral material; Composite cover film of the present invention is drilled with through hole needing the position of making half buried via hole, then by forming half buried via hole after successive process laminating Copper Foil, greatly improves production yield.
Accompanying drawing explanation
Fig. 1 is composite cover film generalized section of the present invention;
Fig. 2 is that composite cover film of the present invention has release layer schematic diagram;
Fig. 3 is that the composite cover film being drilled with through hole of the present invention is fitted the generalized section of Copper Foil again.
Detailed description of the invention
Embodiment: be described in detail preferred embodiment of the present invention below in conjunction with accompanying drawing, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus make more explicit defining to protection scope of the present invention.
A kind of composite cover film 100, comprise polymeric layer 110, described polymeric layer has two relative surfaces, two relative surfaces of described polymeric layer are stained with respectively the first adhering agent layer 120 and the second adhering agent layer 130, described first adhering agent layer is stained with copper foil layer 140, and described first adhesion coating is folded between described copper foil layer and described polymeric layer.Prior art needs to be protected by the mode of the pure glue of laminating hot pressing on the surface of plastics cover layer to paste one deck copper foil base material, and then on Copper Foil, printing forms circuit.Cover layer of the present invention has copper foil layer, directly can form circuit, can simplify client production process, shortens production hour, enhances productivity; Because composite cover film of the present invention is by one-body molded for each material layer comprising one deck copper foil layer, relative to prior art, plastic foil and copper foil layer are fitted and the processing procedure of slaking, substantially increase production yield, and the one-body molded conjugation adding material of each material layer, improve the characteristic of integral material.
Wherein, described polymeric layer is polyimide layer, PET (polyethylene terephthalate, PET) layer, polyaniline (polyaniline, PAn) layer, PEN (Polyethylene Naphthalate, PEN) layer, triacetyl glycerine (Triacetine, TAc) layer and polycarbonate resin (Polycarbonate, PC) one in layer, preferably polyimide layer or PET (polyethylene terephthalate, PET) layer.The thickness of described polymeric layer is 12.5 ~ 50um.
Wherein, described first adhering agent layer is the epoxide-resin glue after baking-curing, and the thickness of described first adhering agent layer is 8 ~ 50um.
Wherein, described second adhering agent layer is the epoxide-resin glue being in half flowing semi-cured state (B-stage) and the one be in the acrylic size of half flowing semi-cured state, and the thickness of described second adhering agent layer is 8 ~ 50um.
Wherein, described copper foil layer is the one in electrolysis (ED) Copper Foil and calendering (RA) Copper Foil, wherein rolls (RA) Copper Foil and also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8 ~ 70um.
Above-mentioned composite cover film obtains by following production technology: be coated with the first viscose glue oxidant layer prior to the matsurface of copper foil layer, after high temperature toasts online, make the first viscose glue oxidant layer reach semi-solid preparation half flow regime, then polymeric layer is pasted, by these semi-finished product by baking Post RDBMS, the another side of the half-finished polymeric layer after solidification is coated with the second adhering agent layer, after toasting online, make the second viscose glue oxidant layer reach semi-solid preparation half flow regime, become finished product.
In order to keep the viscosity of the second adhering agent layer, described second adhering agent layer can be stained with release layer 150, described second adhering agent layer is folded between described polymeric layer and described release layer.When needing in successive process cover layer to be fitted again Copper Foil, first described parting agent layer is torn off.Described release layer is the one in release liners and mould release membrance, the thickness 38 ~ 170um of described release layer.
When prior art makes half buried via hole on double-side copper foil construction, be directly hole on double-side copper foil construction, the degree of depth that very difficult assurance drills through, the yield of production is very low.Described composite cover film of the present invention is drilled with the through hole 160 of copper foil layer described in break-through, described first adhering agent layer, described polymeric layer and described second adhering agent layer.The composite cover film this being drilled with through hole when successive process is fitted after one deck Copper Foil 200 makes double-side copper foil construction again, and the through hole in original composite cover film has just become half buried via hole in double-side copper foil construction.Composite cover film of the present invention is drilled with through hole needing the position of making half buried via hole, then by forming half buried via hole after successive process laminating Copper Foil, greatly improves production yield.
The production efficiency of cover layer in printed circuit board (PCB) processing procedure of composite cover film of the present invention and prior art contrasts in table one.
Table one: production efficiency comparison
The cover layer of prior art pastes the bending test of copper foil layer and composite cover film of the present invention and slide unit test result in table two.
Table two: resistance to bending and slide unit test
Claims (6)
1. a composite cover film, it is characterized in that: comprise polymeric layer (110), described polymeric layer has two relative surfaces, two relative surfaces of described polymeric layer are stained with the first adhering agent layer (120) and the second adhering agent layer (130) respectively, described first adhering agent layer is stained with copper foil layer (140), described first adhesion coating is folded between described copper foil layer and described polymeric layer, described second adhering agent layer is the epoxide-resin glue being in half flowing semi-cured state and the one be in the acrylic size of half flowing semi-cured state, the thickness of described second adhering agent layer is 8 ~ 50 μm, described second adhering agent layer is stained with release layer (150), described second adhering agent layer is folded between described polymeric layer and described release layer.
2. composite cover film according to claim 1, is characterized in that: the through hole (160) described composite cover film being drilled with copper foil layer described in break-through, described first adhering agent layer, described polymeric layer and described second adhering agent layer.
3. composite cover film according to claim 1, it is characterized in that: described polymeric layer is the one in polyimide layer, layer of polyethylene terephthalate, polyaniline, PEN layer and polycarbonate resin, the thickness of described polymeric layer is 12.5 ~ 50 μm.
4. composite cover film according to claim 1, is characterized in that: described first adhering agent layer is the epoxide-resin glue after baking-curing, and the thickness of described first adhering agent layer is 8 ~ 50 μm.
5. composite cover film according to claim 1, is characterized in that: described copper foil layer is the one in electrolytic copper foil and rolled copper foil, and the thickness of described copper foil layer is 8 ~ 70 μm.
6. composite cover film according to claim 1, is characterized in that: described release layer is the one in release liners and mould release membrance, the thickness of described release layer 38 ~ 170 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323649.3A CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323649.3A CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103057208A CN103057208A (en) | 2013-04-24 |
| CN103057208B true CN103057208B (en) | 2015-05-13 |
Family
ID=48100231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110323649.3A Active CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103057208B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106584988B (en) * | 2016-12-16 | 2019-04-16 | 湖北奥马电子科技有限公司 | The compound production method for covering metal plate or compound cover film used for flexible printed circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6352781B1 (en) * | 1999-02-17 | 2002-03-05 | Alusuisse Technology & Management Ltd. | Composite film and process for its manufacture |
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN201422195Y (en) * | 2009-06-03 | 2010-03-10 | 昆山雅森电子材料科技有限公司 | Protective film for rigid-flexible printed circuit boards |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| CN201541389U (en) * | 2009-06-30 | 2010-08-04 | 昆山雅森电子材料科技有限公司 | Coating film for printing circuit board |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143645B (en) * | 2010-01-28 | 2013-05-15 | 昆山雅森电子材料科技有限公司 | Cover layer and printed circuit board with same |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
-
2011
- 2011-10-21 CN CN201110323649.3A patent/CN103057208B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6352781B1 (en) * | 1999-02-17 | 2002-03-05 | Alusuisse Technology & Management Ltd. | Composite film and process for its manufacture |
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| CN201422195Y (en) * | 2009-06-03 | 2010-03-10 | 昆山雅森电子材料科技有限公司 | Protective film for rigid-flexible printed circuit boards |
| CN201541389U (en) * | 2009-06-30 | 2010-08-04 | 昆山雅森电子材料科技有限公司 | Coating film for printing circuit board |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103057208A (en) | 2013-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007129124A5 (en) | ||
| CN104582325A (en) | Rigid-flex printed circuit board and manufacturing method thereof as well as circuit board module | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN101296562A (en) | Copper foil substrates and method for making flexible printed circuit board of the same | |
| US20190281707A1 (en) | Method for manufacturing an embedded flexible circuit board | |
| CN101304639A (en) | Method for producing printed circuit board | |
| CN102794962A (en) | Composite double-sided copper foil substrate and manufacturing method thereof | |
| WO2015014048A1 (en) | Rigid-flex printed circuit board and manufacturing method therefor | |
| CN105722317B (en) | Rigid-flexible combination printed circuit board and preparation method thereof | |
| CN102387662A (en) | Rigid-flexibility circuit board and manufacturing method thereof | |
| CN205961580U (en) | A compound glued membrane component that hinders for production of printed circuit board | |
| CN202353923U (en) | Composite covering film | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN103057208B (en) | Composite cover film | |
| Stoukatch et al. | Additive low temperature 3D printed electronic as enabling technology for IoT application | |
| CN106585046A (en) | Manufacturing process of ultra-micro-thin copper-coated copper plate and five-axis pressing machine used for manufacturing process | |
| CN107046766A (en) | Flexible print thin film circuit and system | |
| CN204362415U (en) | Automobile audio half flex circuit application | |
| CN102922809A (en) | Liquid crystal polymer glass fiber bonding sheet copper-clad plate and preparation method thereof | |
| CN202979466U (en) | Composite flexible printed circuit board structure | |
| CN202435714U (en) | Glue-free single-sided copper foil coated substrate with bonding function | |
| CN102427679B (en) | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board | |
| CN205667014U (en) | High heat -resisting high roughness integrated circuit laminated structure has | |
| CN204674123U (en) | The copper-clad plate of a kind of two-layered medium non-gel flexible | |
| CN202998642U (en) | Multilayer printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |