CN104125727A - Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards - Google Patents
Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards Download PDFInfo
- Publication number
- CN104125727A CN104125727A CN201410375302.7A CN201410375302A CN104125727A CN 104125727 A CN104125727 A CN 104125727A CN 201410375302 A CN201410375302 A CN 201410375302A CN 104125727 A CN104125727 A CN 104125727A
- Authority
- CN
- China
- Prior art keywords
- soft
- substrate
- prepreg
- soft board
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000002365 multiple layer Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000011889 copper foil Substances 0.000 claims abstract description 34
- 230000000875 corresponding Effects 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 239000000047 product Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 23
- 239000012043 crude product Substances 0.000 claims description 10
- 210000003491 Skin Anatomy 0.000 claims description 5
- 235000015895 biscuits Nutrition 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 229920001721 Polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229940116821 SSD Drugs 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Abstract
The invention relates to a method for manufacturing a rigid-flexible printed circuit board with multiple layers of soft boards. The method comprises the steps of forming circuit patterns on first flexible substrates, sticking a first prepreg to each first flexible substrate, putting second flexible substrates on the outer layers of the first prepreg, forming circuit patterns on the second flexible substrates, forming circuit patterns on first rigid substrates, laminating a copper foil, a third prepreg, the first rigid substrate, a second prepreg, soft board blanks, the second prepreg, the first rigid substrate, the third prepreg and the copper foil together, forming circuit patterns on the copper foils in the coarse rigid-flexible printed circuit board and forming a welding isolating ink layer by printing, performing laser controlled deep cutting processing on the regions, corresponding to the first rigid substrates and the third prepregs, of the semi-finished rigid-flexible printed circuit board and removing the cover so that the regions of the flexible board blanks are exposed. The method is simple and easy in process steps.
Description
Technical field
The present invention relates to a kind of manufacture method of printed substrate, the present invention especially relates to a kind of soft or hard of multilayer soft board in conjunction with the manufacture method of printed substrate.
Background technology
Along with consumer electronics product multifunction, lightening, integrated development trend, its manufacture craft to printed circuit board (PCB) becomes increasingly complex, and difficulty is more and more higher.For tackling this development trend, hardboard district has the soft or hard of different-thickness in conjunction with printed substrate, will become gradually the pith of all kinds of consumer electronics printed circuit board (PCB)s.
Having the soft or hard of multilayer soft board in conjunction with printed circuit board (PCB), is exactly superimposed coverlay on soft board layer, the prepreg of windowing, Copper Foil, forms hardboard semi-finished product after pressing, in production, important flow process is the pressing of multilayer soft board, rigid-flex contraposition management and control, after pressing, form Rigid Flex finished product, now, increase the flow process of uncapping, hardboard semi-finished product are wanted to naked leakage position, corresponding finished product hardboard district, uncaps and removes, and so just forms the soft or hard of multilayer soft board in conjunction with printed substrate.
The Rigid Flex of this type of multilayer soft board can meet the requirements such as current transfer of data required amount is many, fast, accurate, is applicable to storage class electronic product, as product demands such as SSD solid state hard discs.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide the soft or hard of the simple multilayer soft board of a kind of processing step in conjunction with the manufacture method of printed substrate.
According to technical scheme provided by the invention, the soft or hard of described a kind of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate of step a and lower copper layer, stick respectively one deck the first prepreg;
C, place a second soft board substrate the skin of the first prepreg of step b is each, and they are pressed together;
D, on the second soft board substrate of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay and cut into required shape, by covering film spot and be attached on the second soft board substrate of steps d and carrying out pressing and baking-curing, obtaining soft board blank;
F, get two the second prepregs and pull soft board regional window out at correspondence position, ensure nothing the second prepreg in the coverlay region in step e, and it being for subsequent use to get two the 3rd prepregs;
G, get the first hardboard substrate, and produce line pattern on the first hardboard substrate;
H, get Copper Foil, and by superimposed to the first hardboard substrate of the second prepreg of the soft board blank of the second prepreg of the first hardboard substrate of Copper Foil, the 3rd prepreg, step g, step f, step e, step f, step g, the 3rd prepreg and Copper Foil and press together, obtain soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil in printed substrate crude product, and printing, every weldering ink layer, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control in conjunction with corresponding the first hardboard substrate and the 3rd prepreg region on printed wire boards half-finished product and are taken off lid and remove, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
The thickness of described the first soft board substrate is 0.037 ~ 0.22mm.
The thickness of described the first prepreg is 0.03 ~ 0.05mm.
The thickness of described the second soft board substrate is 0.027 ~ 0.168mm.
The thickness of described coverlay is 0.028 ~ 0.075mm.
The thickness of described the second prepreg is 0.05 ~ 0.075mm.
The thickness of described the first hardboard substrate is 0.05 ~ 2mm.
The thickness of described Copper Foil is 0.011 ~ 0.068mm.
The thickness of described the 3rd prepreg is 0.05 ~ 0.075mm.
The pressing pressure of described step c is controlled at 1 ~ 3Mpa, and the pressing pressure of step e is controlled at 1 ~ 3Mpa, and the baking temperature of step e is controlled at 120 ~ 170 DEG C DEG C, and the pressing pressure of step h is controlled at 1 ~ 3Mpa.
Method of the present invention has the features such as processing step is simple and easy to, and the soft or hard of the multilayer soft board obtaining by manufacture method of the present invention can ensure to have both the function of common Rigid Flex in conjunction with printed wire board finished product, possesses again the particular design of multilayer soft board.The soft or hard of the multilayer soft board obtaining by manufacture method of the present invention is specially adapted to the requirements such as volume of transmitted data is many, fast, accurate in conjunction with printed wire board finished product, is applicable to storage class electronic product, as product demands such as SSD solid state hard discs.
Brief description of the drawings
Fig. 1 is the structural representation that step a of the present invention obtains plate body.
Fig. 2 is the structural representation that step b of the present invention obtains plate body.
Fig. 3 is the structural representation that step c of the present invention obtains plate body.
Fig. 4 is the structural representation that step e of the present invention obtains plate body.
Fig. 5 is the structural representation that step h of the present invention obtains plate body.
Fig. 6 is the structural representation that step I of the present invention obtains plate body.
Fig. 7 is the structural representation that step j of the present invention obtains plate body.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
The first soft board substrate 1 is provided by Co., Ltd of Matsushita Electric Industries (China), and it is the FCCL material of polyimides (Polyimide) double-sided copper-clad, model: R-F775.
The first prepreg 2 is provided by Co., Ltd of Matsushita Electric Industries (China), it is semi-solid preparation (Prepre) material of epoxy resin (Epoxy) & glass fabric (glass fibra) composition, model: R1551.
The second soft board substrate 3 is provided by Co., Ltd of Matsushita Electric Industries (China), and it is the FCCL material that polyimides (Polyimide) one side covers copper, model: R-F770.
Coverlay 4 is provided by platform rainbow science and technology (Kunshan) Co., Ltd, and it is the Cover-lay material of one deck polyimides (Polyimide) and one deck epoxy resin (Epoxy) composition, model: FHK/FGA series.
The second prepreg 5 and the 3rd prepreg 8 provide by platform photoelectron material (Kunshan) Co., Ltd, it is semi-solid preparation (Prepre) material of epoxy resin (Epoxy) & glass fabric (glass fibra) composition, model: EM-285.
The first hardboard substrate 6 is provided by platform photoelectron material (Kunshan) Co., Ltd, its structure is by dielectric layer (resin Resin, glass fibre Glass fiber), and the two copper-clad base plate material forming of highly purified conductor (Copper Foil Copper foil), model: EM-285.
Copper Foil 7 is provided by Taiwan Li Chang Rong Science & Technology Co., Ltd.
Embodiment 1
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 1 ~ 2Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 1 ~ 2Mpa, and baking temperature is controlled at 120 ~ 140 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 1 ~ 2Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
Embodiment 2
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 2 ~ 3Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 2 ~ 3Mpa, and baking temperature is controlled at 140 ~ 155 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 2 ~ 3Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
Embodiment 3
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 1.5 ~ 2.5Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 1.5 ~ 2.5Mpa, and baking temperature is controlled at 155 ~ 170 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 1.5 ~ 2.5Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
Claims (10)
1. the soft or hard of multilayer soft board, in conjunction with a manufacture method for printed substrate, is characterized in that this manufacture method comprises the following steps:
A, on the upper copper layer of the first soft board substrate (1) and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate (1) of step a and lower copper layer, stick respectively one deck the first prepreg (2);
C, place a second soft board substrate (3) the skin of the first prepreg (2) of step b is each, and they are pressed together;
D, on the second soft board substrate (3) of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay (4) and cut into required shape, the second soft board substrate (3) that coverlay (4) point is attached to steps d is gone up and carries out pressing and baking-curing, obtains soft board blank;
F, get two the second prepregs (5) and pull soft board regional window out at correspondence position, ensure nothing the second prepreg (5) in coverlay (4) region in step e, and it being for subsequent use to get two the 3rd prepregs (8);
G, get the first hardboard substrate (6), and produce line pattern on the first hardboard substrate (6);
H, get Copper Foil (7), and by superimposed to the first hardboard substrate (6) of the second prepreg (5) of the soft board blank of the second prepreg (5) of the first hardboard substrate (6) of Copper Foil (7), the 3rd prepreg (8), step g, step f, step e, step f, step g, the 3rd prepreg (8) and Copper Foil (7) and press together, obtain soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil in printed substrate crude product (7), and printing, every weldering ink layer (9), obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil (7) of having produced line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate (6) on printed wire boards half-finished product and the 3rd prepreg (8) region, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
2. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first soft board substrate (1) is 0.037 ~ 0.22mm.
3. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first prepreg (2) is 0.03 ~ 0.05mm.
4. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the second soft board substrate (3) is 0.027 ~ 0.168mm.
5. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described coverlay (4) is 0.028 ~ 0.075mm.
6. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the second prepreg (5) is 0.05 ~ 0.075mm.
7. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first hardboard substrate (6) is 0.05 ~ 2mm.
8. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described Copper Foil (7) is 0.011 ~ 0.068mm.
9. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the 3rd prepreg (8) is 0.05 ~ 0.075mm.
10. the soft or hard of a kind of multilayer soft board as claimed in claim 1 is in conjunction with the manufacture method of printed substrate, it is characterized in that: the pressing pressure of described step c is controlled at 1 ~ 3Mpa, the pressing pressure of step e is controlled at 1 ~ 3Mpa, the baking temperature of step e is controlled at 120 ~ 170 DEG C, and the pressing pressure of step h is controlled at 1 ~ 3Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410375302.7A CN104125727A (en) | 2014-07-31 | 2014-07-31 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410375302.7A CN104125727A (en) | 2014-07-31 | 2014-07-31 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104125727A true CN104125727A (en) | 2014-10-29 |
Family
ID=51770946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410375302.7A Pending CN104125727A (en) | 2014-07-31 | 2014-07-31 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104125727A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102319A (en) * | 2016-08-18 | 2016-11-09 | 高德（无锡）电子有限公司 | Uncap after a kind of Rigid Flex and directly take off the processing technique of lid |
| CN106231814A (en) * | 2016-08-18 | 2016-12-14 | 高德（无锡）电子有限公司 | The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens |
| CN106332446A (en) * | 2016-11-02 | 2017-01-11 | 江苏弘信华印电路科技有限公司 | High rupture resistant rigid-flex printed circuit board (PCB) |
| CN106604574A (en) * | 2016-12-20 | 2017-04-26 | 高德（江苏）电子科技有限公司 | Flex-rigid printed circuit board and preparation process thereof |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid Flex structure |
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN109714893A (en) * | 2019-02-26 | 2019-05-03 | 深圳市吉泰电子有限公司 | A kind of high-frequency ceramic Rigid Flex and preparation method thereof |
| CN110012622A (en) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | A kind of Rigid Flex production method of flexible board area pad laser windowing |
| CN111356306A (en) * | 2020-03-24 | 2020-06-30 | 苏州福莱盈电子有限公司 | Method for processing sinking type camera module board |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| CN201805616U (en) * | 2010-08-03 | 2011-04-20 | 广东达进电子科技有限公司 | Ceramic-based rigid-flexible multilayer circuit board |
| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
| CN102510670A (en) * | 2011-12-21 | 2012-06-20 | 博罗县精汇电子科技有限公司 | Method and tool for manufacturing flexible PCB (printed circuit board) |
| CN202353922U (en) * | 2011-10-17 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Soft and hard combined circuit board structure |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN203523147U (en) * | 2013-09-03 | 2014-04-02 | 统赢软性电路(珠海)有限公司 | Rigid-flexible PCB |
-
2014
- 2014-07-31 CN CN201410375302.7A patent/CN104125727A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191050A (en) * | 1992-01-13 | 1993-07-30 | Hitachi Chem Co Ltd | Manufacture of rigid flex wiring board |
| CN201805616U (en) * | 2010-08-03 | 2011-04-20 | 广东达进电子科技有限公司 | Ceramic-based rigid-flexible multilayer circuit board |
| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
| CN202353922U (en) * | 2011-10-17 | 2012-07-25 | 深圳崇达多层线路板有限公司 | Soft and hard combined circuit board structure |
| CN102510670A (en) * | 2011-12-21 | 2012-06-20 | 博罗县精汇电子科技有限公司 | Method and tool for manufacturing flexible PCB (printed circuit board) |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN203523147U (en) * | 2013-09-03 | 2014-04-02 | 统赢软性电路(珠海)有限公司 | Rigid-flexible PCB |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231814B (en) * | 2016-08-18 | 2019-01-15 | 高德（无锡）电子有限公司 | A kind of process for pressing for the multilayer Rigid Flex that light-sensitive surface thickens |
| CN106231814A (en) * | 2016-08-18 | 2016-12-14 | 高德（无锡）电子有限公司 | The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens |
| CN106102319A (en) * | 2016-08-18 | 2016-11-09 | 高德（无锡）电子有限公司 | Uncap after a kind of Rigid Flex and directly take off the processing technique of lid |
| CN106102319B (en) * | 2016-08-18 | 2018-10-12 | 高德（无锡）电子有限公司 | It uncaps after a kind of Rigid Flex and directly takes off the processing technology of lid |
| CN106332446A (en) * | 2016-11-02 | 2017-01-11 | 江苏弘信华印电路科技有限公司 | High rupture resistant rigid-flex printed circuit board (PCB) |
| CN106332446B (en) * | 2016-11-02 | 2019-02-15 | 江苏弘信华印电路科技有限公司 | The rigid-flex combined board that resistance to height is destroyed or force to yield |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid Flex structure |
| CN106604574A (en) * | 2016-12-20 | 2017-04-26 | 高德（江苏）电子科技有限公司 | Flex-rigid printed circuit board and preparation process thereof |
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN109714893A (en) * | 2019-02-26 | 2019-05-03 | 深圳市吉泰电子有限公司 | A kind of high-frequency ceramic Rigid Flex and preparation method thereof |
| CN109714893B (en) * | 2019-02-26 | 2020-05-05 | 深圳市吉泰电子有限公司 | High-frequency ceramic soft and hard combined board and preparation method thereof |
| CN110012622A (en) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | A kind of Rigid Flex production method of flexible board area pad laser windowing |
| CN111356306A (en) * | 2020-03-24 | 2020-06-30 | 苏州福莱盈电子有限公司 | Method for processing sinking type camera module board |
| CN111356306B (en) * | 2020-03-24 | 2021-04-06 | 福莱盈电子股份有限公司 | Method for processing sinking type camera module board |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| US9743533B2 (en) | Method for manufacturing rigid-flexible printed circuit board | |
| US20140216795A1 (en) | Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method | |
| CN104202922B (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| US20110297644A1 (en) | Method for manufacturing printed circuit board with cavity | |
| CN104582309A (en) | Rigid-flex circuit board and production method thereof | |
| CN103068185A (en) | Manufacturing method of printed circuit board soft-hard combination substrate flexible area | |
| CN103648240A (en) | Method for manufacturing symmetrical rigid-flexible printed circuit board | |
| CN104202928A (en) | Production method for rigid-flex board | |
| CN102340933B (en) | Manufacturing method of circuit board | |
| CN105830542B (en) | The production method of ladder copper post in a kind of PCB | |
| CN106879195A (en) | A kind of Rigid Flex preparation method and device | |
| CN102045948A (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| JP2015026654A5 (en) | Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board | |
| CN103108491A (en) | Circuit board and manufacture method thereof | |
| KR20110081856A (en) | Wiring board and method for manufacturing same | |
| CN103144378B (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN103578804B (en) | A kind of preparation method of rigid/flexible combined printed circuit board | |
| CN202353923U (en) | Composite covering film | |
| CN103635005A (en) | Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing methods | |
| US20130220683A1 (en) | Printed circuit board and method for manufacturing printed circuit board | |
| CN204272492U (en) | A kind of single-sided flexible circuit board | |
| CN201374874Y (en) | Printed circuit board | |
| CN109688734B (en) | Processing technology for preventing soft and hard combined plate from being bent and torn | |
| CN202979466U (en) | Composite flexible printed circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141029 |
|
| RJ01 | Rejection of invention patent application after publication |