CN104125727A - Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards - Google Patents

Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards Download PDF

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Publication number
CN104125727A
CN104125727A CN201410375302.7A CN201410375302A CN104125727A CN 104125727 A CN104125727 A CN 104125727A CN 201410375302 A CN201410375302 A CN 201410375302A CN 104125727 A CN104125727 A CN 104125727A
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China
Prior art keywords
soft
substrate
prepreg
soft board
hard
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Pending
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CN201410375302.7A
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Chinese (zh)
Inventor
卞华昊
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Gul Wuxi Technologies Co Ltd
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Gul Wuxi Technologies Co Ltd
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Application filed by Gul Wuxi Technologies Co Ltd filed Critical Gul Wuxi Technologies Co Ltd
Priority to CN201410375302.7A priority Critical patent/CN104125727A/en
Publication of CN104125727A publication Critical patent/CN104125727A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a method for manufacturing a rigid-flexible printed circuit board with multiple layers of soft boards. The method comprises the steps of forming circuit patterns on first flexible substrates, sticking a first prepreg to each first flexible substrate, putting second flexible substrates on the outer layers of the first prepreg, forming circuit patterns on the second flexible substrates, forming circuit patterns on first rigid substrates, laminating a copper foil, a third prepreg, the first rigid substrate, a second prepreg, soft board blanks, the second prepreg, the first rigid substrate, the third prepreg and the copper foil together, forming circuit patterns on the copper foils in the coarse rigid-flexible printed circuit board and forming a welding isolating ink layer by printing, performing laser controlled deep cutting processing on the regions, corresponding to the first rigid substrates and the third prepregs, of the semi-finished rigid-flexible printed circuit board and removing the cover so that the regions of the flexible board blanks are exposed. The method is simple and easy in process steps.

Description

A kind of soft or hard of multilayer soft board is in conjunction with the manufacture method of printed substrate
Technical field
The present invention relates to a kind of manufacture method of printed substrate, the present invention especially relates to a kind of soft or hard of multilayer soft board in conjunction with the manufacture method of printed substrate.
Background technology
Along with consumer electronics product multifunction, lightening, integrated development trend, its manufacture craft to printed circuit board (PCB) becomes increasingly complex, and difficulty is more and more higher.For tackling this development trend, hardboard district has the soft or hard of different-thickness in conjunction with printed substrate, will become gradually the pith of all kinds of consumer electronics printed circuit board (PCB)s.
Having the soft or hard of multilayer soft board in conjunction with printed circuit board (PCB), is exactly superimposed coverlay on soft board layer, the prepreg of windowing, Copper Foil, forms hardboard semi-finished product after pressing, in production, important flow process is the pressing of multilayer soft board, rigid-flex contraposition management and control, after pressing, form Rigid Flex finished product, now, increase the flow process of uncapping, hardboard semi-finished product are wanted to naked leakage position, corresponding finished product hardboard district, uncaps and removes, and so just forms the soft or hard of multilayer soft board in conjunction with printed substrate.
The Rigid Flex of this type of multilayer soft board can meet the requirements such as current transfer of data required amount is many, fast, accurate, is applicable to storage class electronic product, as product demands such as SSD solid state hard discs.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide the soft or hard of the simple multilayer soft board of a kind of processing step in conjunction with the manufacture method of printed substrate.
According to technical scheme provided by the invention, the soft or hard of described a kind of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate of step a and lower copper layer, stick respectively one deck the first prepreg;
C, place a second soft board substrate the skin of the first prepreg of step b is each, and they are pressed together;
D, on the second soft board substrate of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay and cut into required shape, by covering film spot and be attached on the second soft board substrate of steps d and carrying out pressing and baking-curing, obtaining soft board blank;
F, get two the second prepregs and pull soft board regional window out at correspondence position, ensure nothing the second prepreg in the coverlay region in step e, and it being for subsequent use to get two the 3rd prepregs;
G, get the first hardboard substrate, and produce line pattern on the first hardboard substrate;
H, get Copper Foil, and by superimposed to the first hardboard substrate of the second prepreg of the soft board blank of the second prepreg of the first hardboard substrate of Copper Foil, the 3rd prepreg, step g, step f, step e, step f, step g, the 3rd prepreg and Copper Foil and press together, obtain soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil in printed substrate crude product, and printing, every weldering ink layer, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control in conjunction with corresponding the first hardboard substrate and the 3rd prepreg region on printed wire boards half-finished product and are taken off lid and remove, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
The thickness of described the first soft board substrate is 0.037 ~ 0.22mm.
The thickness of described the first prepreg is 0.03 ~ 0.05mm.
The thickness of described the second soft board substrate is 0.027 ~ 0.168mm.
The thickness of described coverlay is 0.028 ~ 0.075mm.
The thickness of described the second prepreg is 0.05 ~ 0.075mm.
The thickness of described the first hardboard substrate is 0.05 ~ 2mm.
The thickness of described Copper Foil is 0.011 ~ 0.068mm.
The thickness of described the 3rd prepreg is 0.05 ~ 0.075mm.
The pressing pressure of described step c is controlled at 1 ~ 3Mpa, and the pressing pressure of step e is controlled at 1 ~ 3Mpa, and the baking temperature of step e is controlled at 120 ~ 170 DEG C DEG C, and the pressing pressure of step h is controlled at 1 ~ 3Mpa.
Method of the present invention has the features such as processing step is simple and easy to, and the soft or hard of the multilayer soft board obtaining by manufacture method of the present invention can ensure to have both the function of common Rigid Flex in conjunction with printed wire board finished product, possesses again the particular design of multilayer soft board.The soft or hard of the multilayer soft board obtaining by manufacture method of the present invention is specially adapted to the requirements such as volume of transmitted data is many, fast, accurate in conjunction with printed wire board finished product, is applicable to storage class electronic product, as product demands such as SSD solid state hard discs.
Brief description of the drawings
Fig. 1 is the structural representation that step a of the present invention obtains plate body.
Fig. 2 is the structural representation that step b of the present invention obtains plate body.
Fig. 3 is the structural representation that step c of the present invention obtains plate body.
Fig. 4 is the structural representation that step e of the present invention obtains plate body.
Fig. 5 is the structural representation that step h of the present invention obtains plate body.
Fig. 6 is the structural representation that step I of the present invention obtains plate body.
Fig. 7 is the structural representation that step j of the present invention obtains plate body.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
The first soft board substrate 1 is provided by Co., Ltd of Matsushita Electric Industries (China), and it is the FCCL material of polyimides (Polyimide) double-sided copper-clad, model: R-F775.
The first prepreg 2 is provided by Co., Ltd of Matsushita Electric Industries (China), it is semi-solid preparation (Prepre) material of epoxy resin (Epoxy) & glass fabric (glass fibra) composition, model: R1551.
The second soft board substrate 3 is provided by Co., Ltd of Matsushita Electric Industries (China), and it is the FCCL material that polyimides (Polyimide) one side covers copper, model: R-F770.
Coverlay 4 is provided by platform rainbow science and technology (Kunshan) Co., Ltd, and it is the Cover-lay material of one deck polyimides (Polyimide) and one deck epoxy resin (Epoxy) composition, model: FHK/FGA series.
The second prepreg 5 and the 3rd prepreg 8 provide by platform photoelectron material (Kunshan) Co., Ltd, it is semi-solid preparation (Prepre) material of epoxy resin (Epoxy) & glass fabric (glass fibra) composition, model: EM-285.
The first hardboard substrate 6 is provided by platform photoelectron material (Kunshan) Co., Ltd, its structure is by dielectric layer (resin Resin, glass fibre Glass fiber), and the two copper-clad base plate material forming of highly purified conductor (Copper Foil Copper foil), model: EM-285.
Copper Foil 7 is provided by Taiwan Li Chang Rong Science & Technology Co., Ltd.
Embodiment 1
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 1 ~ 2Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 1 ~ 2Mpa, and baking temperature is controlled at 120 ~ 140 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 1 ~ 2Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
Embodiment 2
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 2 ~ 3Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 2 ~ 3Mpa, and baking temperature is controlled at 140 ~ 155 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 2 ~ 3Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
Embodiment 3
A kind of soft or hard of multilayer soft board comprises the following steps in conjunction with the manufacture method of printed substrate:
A, on the upper copper layer of the first soft board substrate 1 and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate 1 of step a and lower copper layer, stick respectively one deck the first prepreg 2;
C, place a second soft board substrate 3 the skin of the first prepreg 2 of step b is each, and they are pressed together, pressing pressure is controlled at 1.5 ~ 2.5Mpa;
D, on the second soft board substrate 3 of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay 4 and cut into required shape, 4 of coverlays be attached on the second soft board substrate 3 of steps d and carry out pressing and baking-curing, pressing pressure is controlled at 1.5 ~ 2.5Mpa, and baking temperature is controlled at 155 ~ 170 DEG C, obtains soft board blank;
F, get two the second prepregs 5 and pull soft board regional window out at correspondence position, ensure nothing the second prepreg 5 in coverlay 4 regions in step e, and it being for subsequent use to get two the 3rd prepregs 8;
G, get the first hardboard substrate 6, and produce line pattern on the first hardboard substrate 6;
H, get Copper Foil 7, and the first hardboard substrate 6 of the second prepreg 5 of the soft board blank of the second prepreg 5 of the first hardboard substrate 6 of Copper Foil 7, the 3rd prepreg 8, step g, step f, step e, step f, step g, the 3rd prepreg 8 is superimposed and press together with Copper Foil 7, pressing pressure is controlled at 1.5 ~ 2.5Mpa, obtains soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil 7 in printed substrate crude product, and printing, every weldering ink layer 9, obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil 7 of producing line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate 6 on printed wire boards half-finished product and the 3rd prepreg 8 regions, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.

Claims (10)

1. the soft or hard of multilayer soft board, in conjunction with a manufacture method for printed substrate, is characterized in that this manufacture method comprises the following steps:
A, on the upper copper layer of the first soft board substrate (1) and lower copper layer, produce line pattern;
B, on the upper copper layer of the first soft board substrate (1) of step a and lower copper layer, stick respectively one deck the first prepreg (2);
C, place a second soft board substrate (3) the skin of the first prepreg (2) of step b is each, and they are pressed together;
D, on the second soft board substrate (3) of step c, be positioned on outer field copper layer and produce line pattern;
E, get a coverlay (4) and cut into required shape, the second soft board substrate (3) that coverlay (4) point is attached to steps d is gone up and carries out pressing and baking-curing, obtains soft board blank;
F, get two the second prepregs (5) and pull soft board regional window out at correspondence position, ensure nothing the second prepreg (5) in coverlay (4) region in step e, and it being for subsequent use to get two the 3rd prepregs (8);
G, get the first hardboard substrate (6), and produce line pattern on the first hardboard substrate (6);
H, get Copper Foil (7), and by superimposed to the first hardboard substrate (6) of the second prepreg (5) of the soft board blank of the second prepreg (5) of the first hardboard substrate (6) of Copper Foil (7), the 3rd prepreg (8), step g, step f, step e, step f, step g, the 3rd prepreg (8) and Copper Foil (7) and press together, obtain soft or hard in conjunction with printed substrate crude product;
I, the soft or hard obtaining at step h are produced line pattern in conjunction with the Copper Foil in printed substrate crude product (7), and printing, every weldering ink layer (9), obtains soft or hard in conjunction with printed wire boards half-finished product on the Copper Foil (7) of having produced line pattern;
J, the soft or hard obtaining in step I are carried out the dark cutting processing of radium-shine control and take off lid and remove in conjunction with corresponding the first hardboard substrate (6) on printed wire boards half-finished product and the 3rd prepreg (8) region, the soft board biscuit area that step e is corresponding is exposed, obtained soft or hard in conjunction with printed wire board finished product.
2. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first soft board substrate (1) is 0.037 ~ 0.22mm.
3. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first prepreg (2) is 0.03 ~ 0.05mm.
4. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the second soft board substrate (3) is 0.027 ~ 0.168mm.
5. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described coverlay (4) is 0.028 ~ 0.075mm.
6. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the second prepreg (5) is 0.05 ~ 0.075mm.
7. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the first hardboard substrate (6) is 0.05 ~ 2mm.
8. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described Copper Foil (7) is 0.011 ~ 0.068mm.
9. the soft or hard of a kind of multilayer soft board as claimed in claim 1, in conjunction with the manufacture method of printed substrate, is characterized in that: the thickness of described the 3rd prepreg (8) is 0.05 ~ 0.075mm.
10. the soft or hard of a kind of multilayer soft board as claimed in claim 1 is in conjunction with the manufacture method of printed substrate, it is characterized in that: the pressing pressure of described step c is controlled at 1 ~ 3Mpa, the pressing pressure of step e is controlled at 1 ~ 3Mpa, the baking temperature of step e is controlled at 120 ~ 170 DEG C, and the pressing pressure of step h is controlled at 1 ~ 3Mpa.
CN201410375302.7A 2014-07-31 2014-07-31 Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards Pending CN104125727A (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102319A (en) * 2016-08-18 2016-11-09 高德(无锡)电子有限公司 Uncap after a kind of Rigid Flex and directly take off the processing technique of lid
CN106231814A (en) * 2016-08-18 2016-12-14 高德(无锡)电子有限公司 The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens
CN106332446A (en) * 2016-11-02 2017-01-11 江苏弘信华印电路科技有限公司 High rupture resistant rigid-flex printed circuit board (PCB)
CN106604574A (en) * 2016-12-20 2017-04-26 高德(江苏)电子科技有限公司 Flex-rigid printed circuit board and preparation process thereof
CN108076589A (en) * 2016-11-18 2018-05-25 同泰电子科技股份有限公司 Rigid Flex structure
CN108323039A (en) * 2018-01-26 2018-07-24 景旺电子科技(龙川)有限公司 A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed
CN109714893A (en) * 2019-02-26 2019-05-03 深圳市吉泰电子有限公司 A kind of high-frequency ceramic Rigid Flex and preparation method thereof
CN110012622A (en) * 2019-04-11 2019-07-12 信丰迅捷兴电路科技有限公司 A kind of Rigid Flex production method of flexible board area pad laser windowing
CN111356306A (en) * 2020-03-24 2020-06-30 苏州福莱盈电子有限公司 Method for processing sinking type camera module board
CN113645767A (en) * 2021-07-30 2021-11-12 高德(江苏)电子科技有限公司 Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC)

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CN106231814B (en) * 2016-08-18 2019-01-15 高德(无锡)电子有限公司 A kind of process for pressing for the multilayer Rigid Flex that light-sensitive surface thickens
CN106231814A (en) * 2016-08-18 2016-12-14 高德(无锡)电子有限公司 The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens
CN106102319A (en) * 2016-08-18 2016-11-09 高德(无锡)电子有限公司 Uncap after a kind of Rigid Flex and directly take off the processing technique of lid
CN106102319B (en) * 2016-08-18 2018-10-12 高德(无锡)电子有限公司 It uncaps after a kind of Rigid Flex and directly takes off the processing technology of lid
CN106332446A (en) * 2016-11-02 2017-01-11 江苏弘信华印电路科技有限公司 High rupture resistant rigid-flex printed circuit board (PCB)
CN106332446B (en) * 2016-11-02 2019-02-15 江苏弘信华印电路科技有限公司 The rigid-flex combined board that resistance to height is destroyed or force to yield
CN108076589A (en) * 2016-11-18 2018-05-25 同泰电子科技股份有限公司 Rigid Flex structure
CN106604574A (en) * 2016-12-20 2017-04-26 高德(江苏)电子科技有限公司 Flex-rigid printed circuit board and preparation process thereof
CN108323039A (en) * 2018-01-26 2018-07-24 景旺电子科技(龙川)有限公司 A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed
CN109714893A (en) * 2019-02-26 2019-05-03 深圳市吉泰电子有限公司 A kind of high-frequency ceramic Rigid Flex and preparation method thereof
CN109714893B (en) * 2019-02-26 2020-05-05 深圳市吉泰电子有限公司 High-frequency ceramic soft and hard combined board and preparation method thereof
CN110012622A (en) * 2019-04-11 2019-07-12 信丰迅捷兴电路科技有限公司 A kind of Rigid Flex production method of flexible board area pad laser windowing
CN111356306A (en) * 2020-03-24 2020-06-30 苏州福莱盈电子有限公司 Method for processing sinking type camera module board
CN111356306B (en) * 2020-03-24 2021-04-06 福莱盈电子股份有限公司 Method for processing sinking type camera module board
CN113645767A (en) * 2021-07-30 2021-11-12 高德(江苏)电子科技有限公司 Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC)

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