CN103057208A - Composite cover film - Google Patents
Composite cover film Download PDFInfo
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- CN103057208A CN103057208A CN2011103236493A CN201110323649A CN103057208A CN 103057208 A CN103057208 A CN 103057208A CN 2011103236493 A CN2011103236493 A CN 2011103236493A CN 201110323649 A CN201110323649 A CN 201110323649A CN 103057208 A CN103057208 A CN 103057208A
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- copper foil
- adhering agent
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Abstract
The invention discloses a composite cover film which comprises a polymer layer, a first adhesive layer, a second adhesive layer and a copper foil layer. As the copper foil layer is arranged, the line can be directly etched, so that the client production step is simplified, the production time is shortened, and the production efficiency is improved. According to the composite cover film, the copper foil layer is integrally formed in each material layer, so that the production yield is greatly improved compared with that of the preparation process for adhering and curing a plastic film with the copper foil layer in the prior art. The material layers are integrally formed to enhance the bonding strength of materials, so that the characteristics of the integrated material are enhanced. According to the composite cover film, a through hole is drilled in a part for preparing a semi-buried hole, and the semi-buried hole is formed by attaching the copper foil in the subsequent preparation process, so that the production yield is greatly improved.
Description
Technical field
The present invention relates to a kind of coverlay of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is material indispensable in the electronic product, and along with the consumption electronic products demand is grown up, and also grows with each passing day for the demand of printed circuit board (PCB).Because but flexible printed wiring board has the characteristics such as flexibility and three-dimensional space distribution, emphasize that at the technicalization electronic product development compact, flexibility drives under the gesture, be widely used at present computer and ancillary equipment thereof, communication product and consumption electronic products etc.
Generally speaking, flexible print wiring board is made of copper clad laminate (FCCL) and coverlay (CL).In this board structure of circuit, generally be to use plastic film as coverlay, perhaps utilize screen printing technology to form one deck thin insulating printing ink.Because precision and operative relationship generally all can't be held the degree of depth of boring, cause being difficult to form the circuit of half buried via hole mode in boring procedure, namely allow to hole into the circuit of buried via hole design, yield is also extremely low.
Therefore, form circuit at such coverlay, must need first on polyimides (PI) layer of coverlay, to form first copper foil layer, then just can be on copper foil layer printed wire.
The technology that generally adopts in the electric PC board industry at present is to protect subsides one deck copper foil base material on the coverlay surface by the mode of the pure glue of applying hot pressing, then printing formation circuit on Copper Foil.The method operation need to be passed through and protect the manufacturing process such as subsides, hot pressing, slaking, and it is bad to form easily the techniques such as plate bursting, bubble in processing procedure.
Summary of the invention
In order to overcome defects, the invention provides a kind of combined type coverlay, this combined type coverlay has circuit etching function and buried via hole design function, can simplify client production process and man-hour, and has promoted production efficiency and produced yield.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of combined type coverlay, comprise polymeric layer, described polymeric layer has two relative surfaces, be stained with respectively the first adhering agent layer and the second adhering agent layer on two relative surfaces of described polymeric layer, be stained with copper foil layer on described the first adhering agent layer, described the first adhesion coating is folded between described copper foil layer and the described polymeric layer.Prior art need to be protected by the mode of the pure glue of applying hot pressing on the surface of plastics coverlay and be pasted one deck copper foil base material, and then printing forms circuit on Copper Foil.Coverlay of the present invention has had copper foil layer, can directly form circuit, can simplify the client production process, shortens production hour, enhances productivity; Because combined type coverlay of the present invention will comprise that each material layer of one deck copper foil layer is one-body molded, with respect to the processing procedure of prior art with plastic foil and copper foil layer applying and slaking, greatly improved the production yield, and the one-body molded conjugation that increases material of each material layer, promoted the characteristic of integral material.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Described polymeric layer is polyimide layer, PET (polyethylene terephthalate, PET) layer, polyaniline (polyaniline, PAn) layer, PEN (Polyethylene Naphthalate, PEN) layer, triacetyl glycerine (Triacetine, TAc) layer and polycarbonate resin (Polycarbonate, PC) layer in a kind of, preferably polyimide layer or PET (polyethylene terephthalate, PET) layer.The thickness of described polymeric layer is 12.5～50um.
Described the first adhering agent layer is the epoxide-resin glue behind the baking-curing, and the thickness of described the first adhering agent layer is 8～50um.
Described the second adhering agent layer be in half flow semi-cured state (B-stage) epoxide-resin glue and be in half flow a kind of in the acrylic size of semi-cured state, the thickness of described the second adhering agent layer is 8～50um.
Described copper foil layer is a kind of in electrolysis (ED) Copper Foil and calendering (RA) Copper Foil, and wherein calendering (RA) Copper Foil also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8～70um.
In order to keep the viscosity of the second adhering agent layer, can be stained with release layer on described the second adhering agent layer, described the second adhering agent layer is folded between described polymeric layer and the described release layer.When needing in the successive process that coverlay fitted Copper Foil again, first described parting agent layer is torn off.Described release layer is a kind of in release liners and the mould release membrance, the thickness 38～170um of described release layer.
Be drilled with the through hole of the described copper foil layer of break-through, described the first adhering agent layer, described polymeric layer and described the second adhering agent layer on the described combined type coverlay.Fit after one deck Copper Foil makes the double-side copper foil construction when the combined type coverlay that successive process is drilled with this through hole, the through hole on original combined type coverlay had just become half buried via hole in the double-side copper foil construction again.When prior art is made half buried via hole at the double-side copper foil construction, be directly to hole at the double-side copper foil construction, the degree of depth that very difficult assurance drills through, the yield of production is very low.Combined type coverlay of the present invention is drilled with through hole at the position that needs are made half buried via hole, by forming half buried via hole behind the successive process applying Copper Foil, has greatly promoted the production yield again.
The invention has the beneficial effects as follows: combined type coverlay of the present invention has copper foil layer, and directly circuit etching can be simplified the client production process, shortens production hour, enhances productivity; Because combined type coverlay of the present invention will comprise that each material layer of one deck copper foil layer is one-body molded, with respect to the processing procedure of prior art with plastic foil and copper foil layer applying and slaking, greatly improved the production yield, and the one-body molded conjugation that increases material of each material layer, promoted the characteristic of integral material; Combined type coverlay of the present invention is drilled with through hole at the position that needs are made half buried via hole, by forming half buried via hole behind the successive process applying Copper Foil, has greatly promoted the production yield again.
Description of drawings
Fig. 1 is combined type coverlay generalized section of the present invention;
Fig. 2 is that combined type coverlay of the present invention has the release layer schematic diagram;
Fig. 3 is fit the again generalized section of Copper Foil of the combined type coverlay that is drilled with through hole of the present invention.
The specific embodiment
Embodiment: below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
A kind of combined type coverlay 100, comprise polymeric layer 110, described polymeric layer has two relative surfaces, be stained with respectively the first adhering agent layer 120 and the second adhering agent layer 130 on two relative surfaces of described polymeric layer, be stained with copper foil layer 140 on described the first adhering agent layer, described the first adhesion coating is folded between described copper foil layer and the described polymeric layer.Prior art need to be protected by the mode of the pure glue of applying hot pressing on the surface of plastics coverlay and be pasted one deck copper foil base material, and then printing forms circuit on Copper Foil.Coverlay of the present invention has had copper foil layer, can directly form circuit, can simplify the client production process, shortens production hour, enhances productivity; Because combined type coverlay of the present invention will comprise that each material layer of one deck copper foil layer is one-body molded, with respect to the processing procedure of prior art with plastic foil and copper foil layer applying and slaking, greatly improved the production yield, and the one-body molded conjugation that increases material of each material layer, promoted the characteristic of integral material.
Wherein, described polymeric layer is polyimide layer, PET (polyethylene terephthalate, PET) layer, polyaniline (polyaniline, PAn) layer, PEN (Polyethylene Naphthalate, PEN) layer, triacetyl glycerine (Triacetine, TAc) layer and polycarbonate resin (Polycarbonate, PC) layer in a kind of, preferably polyimide layer or PET (polyethylene terephthalate, PET) layer.The thickness of described polymeric layer is 12.5～50um.
Wherein, described the first adhering agent layer is the epoxide-resin glue behind the baking-curing, and the thickness of described the first adhering agent layer is 8～50um.
Wherein, described the second adhering agent layer be in half flow semi-cured state (B-stage) epoxide-resin glue and be in half flow a kind of in the acrylic size of semi-cured state, the thickness of described the second adhering agent layer is 8～50um.
Wherein, described copper foil layer is a kind of in electrolysis (ED) Copper Foil and calendering (RA) Copper Foil, and wherein calendering (RA) Copper Foil also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8～70um.
Above-mentioned combined type coverlay can make by following production technology: the matsurface prior to copper foil layer is coated with the first adhesive layer, through making the first adhesive layer reach semi-solid preparation half mobile state after the online baking of high temperature, then paste polymeric layer, these semi-finished product are solidified by baking is rear, the another side of the half-finished polymeric layer after solidifying is coated with the second adhering agent layer, through making the second adhesive layer reach semi-solid preparation half mobile state after the online baking, become finished product.
In order to keep the viscosity of the second adhering agent layer, can be stained with release layer 150 on described the second adhering agent layer, described the second adhering agent layer is folded between described polymeric layer and the described release layer.When needing in the successive process that coverlay fitted Copper Foil again, first described parting agent layer is torn off.Described release layer is a kind of in release liners and the mould release membrance, the thickness 38～170um of described release layer.
When prior art is made half buried via hole at the double-side copper foil construction, be directly to hole at the double-side copper foil construction, the degree of depth that very difficult assurance drills through, the yield of production is very low.Be drilled with the through hole 160 of the described copper foil layer of break-through, described the first adhering agent layer, described polymeric layer and described the second adhering agent layer on the described combined type coverlay of the present invention.Fit after one deck Copper Foil 200 makes the double-side copper foil construction when the combined type coverlay that successive process is drilled with this through hole, the through hole on original combined type coverlay had just become half buried via hole in the double-side copper foil construction again.Combined type coverlay of the present invention is drilled with through hole at the position that needs are made half buried via hole, by forming half buried via hole behind the successive process applying Copper Foil, has greatly promoted the production yield again.
The production efficiency contrast of the coverlay of combined type coverlay of the present invention and prior art in the printed circuit board (PCB) processing procedure sees Table one.
Table one: production efficiency comparison
Bending test and slide unit test result that the coverlay of prior art pastes copper foil layer and combined type coverlay of the present invention see Table two.
Table two: anti-bending and slide unit test
Claims (8)
1. combined type coverlay, it is characterized in that: comprise polymeric layer (110), described polymeric layer has two relative surfaces, be stained with respectively the first adhering agent layer (120) and the second adhering agent layer (130) on two relative surfaces of described polymeric layer, be stained with copper foil layer (140) on described the first adhering agent layer, described the first adhesion coating is folded between described copper foil layer and the described polymeric layer.
2. combined type coverlay according to claim 1, it is characterized in that: be stained with release layer (150) on described the second adhering agent layer, described the second adhering agent layer is folded between described polymeric layer and the described release layer.
3. combined type coverlay according to claim 1 is characterized in that: the through hole (160) that is drilled with the described copper foil layer of break-through, described the first adhering agent layer, described polymeric layer and described the second adhering agent layer on the described combined type coverlay.
4. combined type coverlay according to claim 1, it is characterized in that: described polymeric layer is a kind of in polyimide layer, layer of polyethylene terephthalate, polyaniline layer, PEN layer, triacetyl glycerine layer and the polycarbonate resin, and the thickness of described polymeric layer is 12.5～50um.
5. combined type coverlay according to claim 1, it is characterized in that: described the first adhering agent layer is the epoxide-resin glue behind the baking-curing, and the thickness of described the first adhering agent layer is 8～50um.
6. combined type coverlay according to claim 1, it is characterized in that: described the second adhering agent layer be in half flow semi-cured state epoxide-resin glue and be in half flow a kind of in the acrylic size of semi-cured state, the thickness of described the second adhering agent layer is 8～50um.
7. combined type coverlay according to claim 1 is characterized in that: described copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil, and the thickness of described copper foil layer is 8～70um.
8. combined type coverlay according to claim 2 is characterized in that: described release layer is a kind of in release liners and the mould release membrance, the thickness 38～170um of described release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323649.3A CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323649.3A CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
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| CN103057208A true CN103057208A (en) | 2013-04-24 |
| CN103057208B CN103057208B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110323649.3A Active CN103057208B (en) | 2011-10-21 | 2011-10-21 | Composite cover film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
Citations (8)
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| US6352781B1 (en) * | 1999-02-17 | 2002-03-05 | Alusuisse Technology & Management Ltd. | Composite film and process for its manufacture |
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN201422195Y (en) * | 2009-06-03 | 2010-03-10 | 昆山雅森电子材料科技有限公司 | Protective film for rigid-flexible printed circuit boards |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| CN201541389U (en) * | 2009-06-30 | 2010-08-04 | 昆山雅森电子材料科技有限公司 | Coating film for printing circuit board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
| CN102143645A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Cover layer and printed circuit board with same |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
-
2011
- 2011-10-21 CN CN201110323649.3A patent/CN103057208B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6352781B1 (en) * | 1999-02-17 | 2002-03-05 | Alusuisse Technology & Management Ltd. | Composite film and process for its manufacture |
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| CN201422195Y (en) * | 2009-06-03 | 2010-03-10 | 昆山雅森电子材料科技有限公司 | Protective film for rigid-flexible printed circuit boards |
| CN201541389U (en) * | 2009-06-30 | 2010-08-04 | 昆山雅森电子材料科技有限公司 | Coating film for printing circuit board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
| CN102143645A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Cover layer and printed circuit board with same |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
| CN106584988B (en) * | 2016-12-16 | 2019-04-16 | 湖北奥马电子科技有限公司 | The compound production method for covering metal plate or compound cover film used for flexible printed circuit board |
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| CN103057208B (en) | 2015-05-13 |
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