CN102143645A - Cover layer and printed circuit board with same - Google Patents
Cover layer and printed circuit board with same Download PDFInfo
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- CN102143645A CN102143645A CN2010101030576A CN201010103057A CN102143645A CN 102143645 A CN102143645 A CN 102143645A CN 2010101030576 A CN2010101030576 A CN 2010101030576A CN 201010103057 A CN201010103057 A CN 201010103057A CN 102143645 A CN102143645 A CN 102143645A
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- coverlay
- adhesion coating
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Abstract
The invention discloses a cover layer and a printed circuit board with the same. The cover layer comprises a substrate with a protection effect and an electrical insulation effect and an adhesive layer for adhering the cover layer to a flexible copper clad laminate, wherein the substrate is provided with opposite first and second surfaces; and the adhesive layer comprises a silicon-containing additive and fixedly covers the first surface of the substrate. Since the silicon-containing additive is added into the adhesive layer, the cover layer has high hardness; the cover layer can be attached to the surface of the flexible copper clad laminate to prepare the printed circuit board and is particularly suitable for preparing the flexible printed circuit board with flexural property; and when used for the flexible printed circuit board, the cover layer has mechanical protection and electrical insulation performance, and furthermore, a phenomenon of forming a large amount of adhesive smear in a drilling process is effectively improved on the premise of not influencing the flexural property of the flexible printed circuit board, and the adverse effect of drilled adhesive smear on a subsequent machining process is effectively reduced.
Description
Technical field
The present invention relates to a kind of coverlay and use the printed circuit board (PCB) of this coverlay, especially a kind of coverlay that the glue slag produces and printed circuit board (PCB) of when boring, can reducing with this coverlay.
Background technology
Printed circuit board (PCB) is a material indispensable in the electronic product, and along with the consumption electronic products growth of requirement, also grows with each passing day for the demand of printed circuit board (PCB) thereupon.Because flexible printed wiring board (FPC, FLEXIBLE PRINTED CIRCUIT) but have characteristics such as flexibility and three-dimensional space distribution, emphasize at the technicalization electronic product to be widely used in computer and ancillary equipment thereof, communication product and consumption electronic products or the like at present under the development trend of compact, flexibility.
Generally speaking, flexible printed wiring board is made of copper clad laminate (FCCL) and coverlay (CL).In this flexible printed circuit board structure, generally use plastic film as coverlay, perhaps utilize screen printing technology to form one deck thin insulating ink lay as coverlay.Yet, in the flexible printed wiring board processing procedure, in order to make the inside and outside layer circuit of this flexible printed wiring board communicate, the processing of must on this flexible printed wiring board, holing, thereby follow-up in the hole inside and outside layer of circuit of copper facing conducting, add man-hour in boring, because drill bit and sheet material in the process of friction fast, can produce the high heat of high temperature, cause the softening even liquefaction of resinous principle in the coverlay, and be covered with hole wall, promptly become the glue slag after the cooling.Hole wall residual glue slag can influence the roughness of hole wall, be unfavorable for combining of internal layer copper and hole wall copper, therefore, the formed glue slag of boring processing often produces suitable puzzlement to successive process.
Go at present the mode of de-smear, mostly adopt the slag machine (PlasmaDesmear Machine) or circuit board is soaked in makes the stripping of glue slag in the medicament of removing photoresist.Yet,, therefore, still need a kind of coverlay that the glue slag produces that reduces no matter adopt above-mentioned which kind of mode all can increase the step of processing procedure.
Summary of the invention
In order to overcome above-mentioned defective; the invention provides a kind of coverlay and have the printed circuit board (PCB) of this coverlay; this coverlay hardness is higher; when being applied to printed circuit board (PCB), not only plays this coverlay the effect of mechanical protection and electric insulation; and can effectively reduce the glue slag that in boring procedure, produces; be beneficial to the following process processing procedure, this coverlay is particularly useful for having the flexible printed wiring board of flexural property.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of coverlay; comprise base material with protective effect and electric insulation effect and the adhesion coating that is used for coverlay is adhered to copper clad laminate; described base material has first and second relative surface; contain silicon-containing additive in the described adhesion coating, described adhesion coating fixedly is covered in the first surface of described base material.
Described base material adopts polymeric film substrate, wherein said polymer can be but be not limited to polyimides (PI), polyethylene terephthalate (PET), polyaniline (PANI), Polyethylene Naphthalate (PEN), triacetyl glycerine or Merlon (PC), preferably polyimides (PI) or polyethylene terephthalate (PET).The thickness of described base material is 7.5～50 microns, preferably 7.5～45 microns, and more preferably 7.5～25 microns, the required mechanical protection of printed circuit board (PCB) to be provided and to take into account the required flexibility of flexible printed wiring board.
Described adhesion coating is coated by the epoxy resin that is added with silicon-containing additive on the first surface of base material and through crosslinking curing and is formed, wherein, described silicon-containing additive, as silicon dioxide, can increase the integral hardness of coverlay, aluminium hydroxide not in the coverlay of the present invention, help to improve the integrally-built stability of coverlay, by weight percentage, described silicon-containing additive accounts for 15～40% of described adhesion coating solid content, preferably 15～35%, more preferably 15～30%, so that coverlay has suitable hardness, and then in follow-up printed circuit board drilling processing procedure, can effectively reduce the shortcoming of adhesion coating, keep the required flexural property of flexible printed wiring board simultaneously because of high temperature or high heat residual a large amount of glue slags in the hole of friction generation fast.The thickness of described adhesion coating is 10～40 microns, preferably 10～35 microns, and more preferably 10～30 microns.
Described coverlay also comprises the release film that is covered on the described adhesion coating outer surface and is used to keep adhesion coating viscosity.The thickness of described release film is 60～150 microns, preferably 65～140 microns, and more preferably 70～120 microns.
Coverlay of the present invention owing to added silicon-containing additive in adhesion coating, makes coverlay of the present invention have the characteristic of high rigidity, and aluminium hydroxide not, can be used for printed circuit board (PCB), is specially adapted to flexible printed wiring board.The release film that will have during use on the coverlay of above-mentioned characteristic removes, and by the adhesion coating on the coverlay coverlay is adhered on the described copper clad laminate surface then, forms the printed circuit board (PCB) with coverlay of the present invention.When coverlay of the present invention was applied to printed circuit board (PCB), in the process of processing of holing, no matter use radium-shine or machine drilling, adhesion coating all reduced significantly because of high temperature or high heat residual glue slag in the hole of friction fast.On the other hand, use the printed circuit board (PCB) of coverlay made of the present invention,, be applicable to the making flexible printed wiring board with flexural property.
The invention has the beneficial effects as follows: coverlay of the present invention; owing in adhesion coating, added silicon-containing additive; make coverlay of the present invention have the characteristic of high rigidity; coverlay of the present invention can fit in the copper clad laminate surface and make printed circuit board (PCB); be specially adapted to make flexible printed wiring board with flexural property; when coverlay of the present invention is used for flexible printed wiring board; not only have mechanical protection and electrical insulation properties concurrently; more can be under the prerequisite that does not influence the flexible printed wiring board flexural property; effectively improve the phenomenon that forms a large amount of glue slags in the boring course of processing, effectively reduce the adverse effect of boring glue slag for the following process processing procedure.
Description of drawings
Fig. 1 is a coverlay profile of the present invention;
Fig. 2 is covered with the profile of the coverlay of release film for the present invention;
Fig. 3 is the printed circuit board (PCB) profile with coverlay of the present invention.
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those of ordinary skills can understand advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented by other different mode,, under not departing from disclosed category, can carry out different modifications and change that is.
Embodiment 1: a kind of coverlay 1, used thickness is that 12.5 microns polyimide film is as the base material 11 of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, formation thickness is 25 microns adhesion coating 12 after solidifying, wherein the 23.5wt% of silica comprises adhesion coating solid content forms coverlay as shown in Figure 1.Then, be that 75 microns release film 13 conforms to adhesion coating 12 with thickness, get final product coverlay of the present invention, as shown in Figure 2.When above-mentioned coverlay is used for printed circuit board (PCB), the release film on the coverlay 1 13 is removed, by the adhesion coating on the coverlay 12 coverlay is adhered on described copper clad laminate 2 surfaces then, form printed circuit board (PCB), as shown in Figure 3 with coverlay of the present invention.
Embodiment 2: a kind of coverlay 1, used thickness is that 12.5 microns polyimide film is as the base material 11 of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, formation thickness is 25 microns adhesion coating 12 after solidifying, wherein the 28.1wt% of silica comprises adhesion coating solid content forms coverlay as shown in Figure 1.Then, be that 75 microns release film 13 conforms to adhesion coating 12 with thickness, get final product coverlay of the present invention, as shown in Figure 2.When above-mentioned coverlay is used for printed circuit board (PCB), the release film on the coverlay 1 13 is removed, by the adhesion coating on the coverlay 12 coverlay is adhered on described copper clad laminate 2 surfaces then, form printed circuit board (PCB), as shown in Figure 3 with coverlay of the present invention.
Comparative example 1: used thickness is that 12.5 microns polyimide film is as the base material of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, formation thickness is 25 microns adhesion coating, the wherein 12.0wt% of silica comprises adhesion coating solid content after solidifying.Then, be that 75 microns release film conforms to adhesion coating with thickness, obtain coverlay.
Comparative example 2: used thickness is that 12.5 microns polyimide film is as the base material of coverlay, the epoxy resin that will contain silicon dioxide is coated the polyimide film surface, formation thickness is 25 microns adhesion coating, the wherein 45.5wt% of silica comprises adhesion coating solid content after solidifying.Then, be that 75 microns release film conforms to adhesion coating with thickness, obtain coverlay.
Reference examples: the coverlay FHK0525 that contains aluminium hydroxide of commercially available platform rainbow science and technology.
Test: embodiment 1, embodiment 2, comparative example 1, comparative example 2 and the described coverlay of reference examples are conformed to copper clad laminate respectively, utilize the processing of holing of radium-shine drilling machine, the interior glue slag of inspection hole, and with outcome record in following table 1.
Table 1
| | Embodiment | 1 | Embodiment 2 | Comparative example 1 | Comparative example 2 | Reference examples |
| Coverlay hardness | 2H | 3H | HB | 6H | 3B | |
| Glue slag observed result in the hole | ○ | ○ | △ | △ | × |
Coverlay hardness is in pencil hardness in the table;
Glue slag observed result mark implication in the table mesopore:
Zero---almost there is not or has only a small amount of glue slag;
△---obviously observe many glue slags;
*---a large amount of glue slags are coated with full hole wall.
By table 1 result as can be known, when coverlay of the present invention is used to make printed circuit board (PCB), in the boring course of processing, can reduce the formation of glue slag really, avoid follow-up puzzlement of removing de-smear.
Above-mentioned specification and embodiment only are exemplary illustration principle of the present invention and effect thereof, are not to be limitation of the present invention.The scope that any creation that falls in the claim scope of the present invention all belongs to the present invention to be protected.
Claims (20)
1. coverlay; it is characterized in that: comprise base material with protective effect and electric insulation effect and the adhesion coating that is used for coverlay is adhered to copper clad laminate; described base material has first and second relative surface; contain silicon-containing additive in the described adhesion coating, described adhesion coating fixedly is covered in the first surface of described base material.
2. coverlay as claimed in claim 1 is characterized in that: the thickness of described adhesion coating is 10～40 microns.
3. coverlay as claimed in claim 2 is characterized in that: the thickness of described adhesion coating is 10～35 microns.
4. coverlay as claimed in claim 3 is characterized in that: the thickness of described adhesion coating is 10～30 microns.
5. coverlay as claimed in claim 1 is characterized in that: by weight percentage, described silicon-containing additive accounts for 15～40% of described adhesion coating solid content.
6. coverlay as claimed in claim 5 is characterized in that: by weight percentage, described silicon-containing additive accounts for 15～35% of described adhesion coating solid content.
7. coverlay as claimed in claim 6 is characterized in that: by weight percentage, described silicon-containing additive accounts for 15～30% of described adhesion coating solid content.
8. coverlay as claimed in claim 1 is characterized in that: described adhesion coating is formed by the epoxy resin cure that is added with silicon-containing additive.
9. coverlay as claimed in claim 1 is characterized in that: described silicon-containing additive is a silicon dioxide.
10. coverlay as claimed in claim 1 is characterized in that: the thickness of described base material is 7.5～50 microns.
11. coverlay as claimed in claim 10 is characterized in that: the thickness of described base material is 7.5～45 microns.
12. coverlay as claimed in claim 11 is characterized in that: the thickness of described base material is 7.5～25 microns.
13. coverlay as claimed in claim 1 is characterized in that: the material of described base material adopts polymer.
14. coverlay as claimed in claim 13 is characterized in that: described polymer is a kind of in polyimides, polyethylene terephthalate, polyaniline, Polyethylene Naphthalate, triacetyl glycerine and the Merlon.
15. coverlay as claimed in claim 14 is characterized in that: described polymer is a kind of in polyimides and the polyethylene terephthalate.
16. as the described coverlay of one of claim 1 to 15, it is characterized in that: described coverlay also comprises the release film that is covered on the described adhesion coating outer surface and is used to keep adhesion coating viscosity.
17. coverlay as claimed in claim 16 is characterized in that: the thickness of described release film is 60～150 microns.
18. coverlay as claimed in claim 17 is characterized in that: the thickness of described release film is 65～140 microns.
19. coverlay as claimed in claim 18 is characterized in that: the thickness of described release film is 70～120 microns.
20. a printed circuit board (PCB) that has as the described coverlay of one of claim 1 to 15 comprises copper clad laminate, it is characterized in that: described coverlay adheres to described copper clad laminate surface by its adhesion coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103057 CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010103057 CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143645A true CN102143645A (en) | 2011-08-03 |
| CN102143645B CN102143645B (en) | 2013-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010103057 Active CN102143645B (en) | 2010-01-28 | 2010-01-28 | Cover layer and printed circuit board with same |
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| CN (1) | CN102143645B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970820A (en) * | 2012-11-24 | 2013-03-13 | 中山市东溢新材料有限公司 | Covering film for flexible printed circuit board and manufacturing process thereof |
| CN103057208A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Composite cover film |
| CN104451611A (en) * | 2014-12-12 | 2015-03-25 | 广东生益科技股份有限公司 | Release film with silicon dioxide film layer and preparation method of release film |
| CN105722320A (en) * | 2016-03-18 | 2016-06-29 | 捷讯精密橡胶（苏州）有限公司 | Flexible circuit board |
| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
| CN108184313A (en) * | 2017-12-29 | 2018-06-19 | 东莞市天晖电子材料科技有限公司 | True blind hole circuit board manufacturing process |
| CN108611011A (en) * | 2017-01-10 | 2018-10-02 | 台虹科技股份有限公司 | Covering film structure |
| CN110268800A (en) * | 2017-02-07 | 2019-09-20 | 捷温有限责任公司 | Film capable of conducting electricity |
| CN112778937A (en) * | 2020-12-30 | 2021-05-11 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, cover film and printing screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207650A (en) * | 2002-12-26 | 2004-07-22 | Sumitomo Electric Printed Circuit Inc | Substrate for flexible printed wiring |
| CN100551201C (en) * | 2007-04-23 | 2009-10-14 | 昆山雅森电子材料科技有限公司 | Flexible printed wiring board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
-
2010
- 2010-01-28 CN CN 201010103057 patent/CN102143645B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207650A (en) * | 2002-12-26 | 2004-07-22 | Sumitomo Electric Printed Circuit Inc | Substrate for flexible printed wiring |
| CN100551201C (en) * | 2007-04-23 | 2009-10-14 | 昆山雅森电子材料科技有限公司 | Flexible printed wiring board |
| CN201601890U (en) * | 2010-01-28 | 2010-10-06 | 昆山雅森电子材料科技有限公司 | Cover film |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057208A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Composite cover film |
| CN102970820A (en) * | 2012-11-24 | 2013-03-13 | 中山市东溢新材料有限公司 | Covering film for flexible printed circuit board and manufacturing process thereof |
| CN104451611A (en) * | 2014-12-12 | 2015-03-25 | 广东生益科技股份有限公司 | Release film with silicon dioxide film layer and preparation method of release film |
| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
| CN105722320A (en) * | 2016-03-18 | 2016-06-29 | 捷讯精密橡胶（苏州）有限公司 | Flexible circuit board |
| CN108611011A (en) * | 2017-01-10 | 2018-10-02 | 台虹科技股份有限公司 | Covering film structure |
| CN110268800A (en) * | 2017-02-07 | 2019-09-20 | 捷温有限责任公司 | Film capable of conducting electricity |
| CN110268800B (en) * | 2017-02-07 | 2021-11-26 | 捷温有限责任公司 | Film capable of conducting electricity |
| CN114069161A (en) * | 2017-02-07 | 2022-02-18 | 捷温有限责任公司 | Film capable of conducting electricity |
| CN108184313A (en) * | 2017-12-29 | 2018-06-19 | 东莞市天晖电子材料科技有限公司 | True blind hole circuit board manufacturing process |
| CN108184313B (en) * | 2017-12-29 | 2020-06-23 | 东莞市天晖电子材料科技有限公司 | Manufacturing process of circuit board with true blind holes |
| CN112778937A (en) * | 2020-12-30 | 2021-05-11 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, cover film and printing screen |
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|---|---|
| CN102143645B (en) | 2013-05-15 |
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