MY150635A - Resin composition and resin coated copper foil obtained by using the resin composition - Google Patents

Resin composition and resin coated copper foil obtained by using the resin composition

Info

Publication number
MY150635A
MY150635A MYPI20095421A MY150635A MY 150635 A MY150635 A MY 150635A MY PI20095421 A MYPI20095421 A MY PI20095421A MY 150635 A MY150635 A MY 150635A
Authority
MY
Malaysia
Prior art keywords
component
resin
resin composition
copper foil
coated copper
Prior art date
Application number
Inventor
Sato Tetsuro
Matsushima Toshifumi
Matsunaga Tetsuhiro
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY150635A publication Critical patent/MY150635A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

DISCLOSED IS A RESIN COMPOSITION WHICH ENABLES TO FORM AN INSULATING RESIN LAYER HAVING ADEQUATE FLAME RETARDANCY, WHILE EXHIBITING GOOD ADHESION TO A COPPER FOIL FOR PRINTED WIRING BOARD PRODUCTION. ALSO DISCLOSED IS A RESIN COATED COPPER FOIL. SPECIFICALLY DISCLOSED IS A RESIN COMPOSITION FOR FORMING AN INSULATING LAYER FOR PRINTED WIRING BOARD, WHICH IS CHARACTERIZED BY HAVING A BASE COMPOSITION CONTAINING A BISPHENOL EPOXY RESIN HAVING AN EPOXY EQUIVALEN OF NOT MORE THAN 200 WHICH IS IN A LIQUID STATE AT 25 DEG C AS A COMPONENT A, A LINEAR POLYMER HAVING A CROSSLINKABLE FUNCTIONAL GROUP AS A COMPONENT B, A CROSSLINKING AGENT AS A COMPONENT C, 4,4?-DIAMINODIPHENYLSULFONE OR 2,2-BIS(4-(4-AMINOPHENOXY)PHENYL)PROPANE AS A COMPONENT D, A FLAME-RETARDANT EPOXY RESIN AS A COMPONENT E, AND A MULTI-FUNCTIONAL EPOXY RESIN AS A COMPONENT F.
MYPI20095421 2007-06-25 2008-06-25 Resin composition and resin coated copper foil obtained by using the resin composition MY150635A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007166869 2007-06-25

Publications (1)

Publication Number Publication Date
MY150635A true MY150635A (en) 2014-02-14

Family

ID=40185663

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20095421 MY150635A (en) 2007-06-25 2008-06-25 Resin composition and resin coated copper foil obtained by using the resin composition

Country Status (6)

Country Link
JP (1) JP5650908B2 (en)
KR (1) KR101249479B1 (en)
CN (1) CN101687981B (en)
MY (1) MY150635A (en)
TW (1) TW200916525A (en)
WO (1) WO2009001850A1 (en)

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KR101439496B1 (en) * 2009-12-22 2014-09-12 에스케이이노베이션 주식회사 Polyamic acid composition, method for preparing the same and polyimide metal clad laminate the same
JP5491295B2 (en) * 2010-06-25 2014-05-14 パナソニック株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP5580135B2 (en) * 2010-08-03 2014-08-27 三井金属鉱業株式会社 Printed wiring board manufacturing method and printed wiring board
CN102504197B (en) * 2011-10-10 2013-08-21 北京新福润达绝缘材料有限责任公司 Halogen-free epoxy resin composition with high proof tracking index and application thereof
CN102585440B (en) * 2012-01-16 2013-09-04 广州宏仁电子工业有限公司 High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate
CN102585663B (en) * 2012-02-06 2013-11-20 苏州太湖电工新材料股份有限公司 Halogen-free flame-retardant high-temperature-resistance insulation paint for motor
JP6375952B2 (en) * 2013-01-07 2018-08-22 株式会社ニコン Composition, laminate, method for producing laminate, transistor and method for producing transistor
KR101851882B1 (en) 2013-07-23 2018-04-24 제이엑스금속주식회사 Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
TWI645755B (en) 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method
KR102113190B1 (en) * 2013-12-20 2020-05-20 엘지이노텍 주식회사 Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same
KR102135414B1 (en) * 2013-12-20 2020-07-17 엘지이노텍 주식회사 Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same
KR102172298B1 (en) * 2014-03-17 2020-10-30 엘지이노텍 주식회사 Epoxy resin composite and printed curcuit board comprising insulating layer using the same
KR102172297B1 (en) * 2014-04-17 2020-10-30 엘지이노텍 주식회사 Epoxy resin composite and printed curcuit board comprising insulating layer using the same
JP6640567B2 (en) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board, method for manufacturing electronic equipment, and method for manufacturing printed wiring board
KR101852671B1 (en) 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
KR101942621B1 (en) 2015-02-06 2019-01-25 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board, electronic device and method of manufacturing printed circuit board
US11008458B2 (en) 2016-03-17 2021-05-18 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
JP2017193778A (en) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 Copper foil, copper foil for high frequency circuit, copper foil with carrier, copper foil with carrier for high frequency circuit, laminate, method for manufacturing printed wiring board and method for producing electronic apparatus
JP7312931B2 (en) * 2016-09-28 2023-07-24 東特塗料株式会社 electric insulated wire
CN106564240B (en) * 2016-11-07 2018-08-31 北京新福润达绝缘材料有限责任公司 A kind of preparation method of high anti creepage trace glass felt layers pressing plate
US10899871B2 (en) * 2019-04-23 2021-01-26 Chang Chun Plastics Co., Ltd. Phosphorous containing epoxy resins and process for synthesis

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08193188A (en) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd Adhesive for copper foil and copper foil backed therewith
JPH11186723A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JPH11186724A (en) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd Manufacturing multilayered printed wiring board
JP3533973B2 (en) * 1998-01-27 2004-06-07 東都化成株式会社 Phosphorus-containing epoxy resin composition
JP2001181593A (en) * 1999-12-28 2001-07-03 Kashima Oil Co Ltd Thermosetting adhesive and flexible printed wiring board material using this
JP3708423B2 (en) * 2000-10-20 2005-10-19 株式会社日鉱マテリアルズ Phenolic curing agent for epoxy resin and epoxy resin composition using the same
JP2005132925A (en) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd Epoxy resin composition and prepreg, metal-foil-clad laminate, and metal-foil-fitted resin sheet using the same
JP4553595B2 (en) 2004-01-29 2010-09-29 株式会社有沢製作所 Prepreg resin composition and prepreg using the same
JP2005314449A (en) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd Additive for resin
JP4732001B2 (en) * 2005-05-26 2011-07-27 株式会社タムラ製作所 Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate
JP2007099956A (en) * 2005-10-06 2007-04-19 Tamura Kaken Co Ltd Thermosetting resin composition, resin film and structure

Also Published As

Publication number Publication date
TWI374909B (en) 2012-10-21
CN101687981A (en) 2010-03-31
JP5650908B2 (en) 2015-01-07
KR101249479B1 (en) 2013-03-29
TW200916525A (en) 2009-04-16
JPWO2009001850A1 (en) 2010-08-26
WO2009001850A1 (en) 2008-12-31
CN101687981B (en) 2012-04-04
KR20100024949A (en) 2010-03-08

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