WO2009001850A1 - Resin composition and copper foil with resin obtained by using the resin composition - Google Patents
Resin composition and copper foil with resin obtained by using the resin composition Download PDFInfo
- Publication number
- WO2009001850A1 WO2009001850A1 PCT/JP2008/061529 JP2008061529W WO2009001850A1 WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1 JP 2008061529 W JP2008061529 W JP 2008061529W WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- resin
- resin composition
- copper foil
- disclosed
- Prior art date
Links
- 0 C*1(C)C=CC(**([U](*[U](O)=IC)(O)=C)=C)=CC1 Chemical compound C*1(C)C=CC(**([U](*[U](O)=IC)(O)=C)=C)=CC1 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800220983A CN101687981B (en) | 2007-06-25 | 2008-06-25 | Resin composition and copper foil with resin obtained by using the resin composition |
KR1020097026807A KR101249479B1 (en) | 2007-06-25 | 2008-06-25 | Resin composition and copper foil with resin obtained by using the resin composition |
JP2009520611A JP5650908B2 (en) | 2007-06-25 | 2008-06-25 | Resin composition and copper foil with resin obtained using the resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-166869 | 2007-06-25 | ||
JP2007166869 | 2007-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009001850A1 true WO2009001850A1 (en) | 2008-12-31 |
Family
ID=40185663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061529 WO2009001850A1 (en) | 2007-06-25 | 2008-06-25 | Resin composition and copper foil with resin obtained by using the resin composition |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5650908B2 (en) |
KR (1) | KR101249479B1 (en) |
CN (1) | CN101687981B (en) |
MY (1) | MY150635A (en) |
TW (1) | TW200916525A (en) |
WO (1) | WO2009001850A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012007091A (en) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
WO2012017909A1 (en) * | 2010-08-03 | 2012-02-09 | 三井金属鉱業株式会社 | Method for producing printed wiring board, and printed wiring board |
CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
WO2015012376A1 (en) | 2013-07-24 | 2015-01-29 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board |
WO2015012327A1 (en) | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method |
EP3046400A2 (en) | 2015-01-16 | 2016-07-20 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board |
EP3048864A2 (en) | 2015-01-21 | 2016-07-27 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board |
EP3054751A2 (en) | 2015-02-06 | 2016-08-10 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board |
JPWO2014106955A1 (en) * | 2013-01-07 | 2017-01-19 | 株式会社ニコン | Composition, laminate, method for producing laminate, transistor and method for producing transistor |
WO2017161120A1 (en) * | 2016-03-17 | 2017-09-21 | Qed Labs Inc. | Articles with improved flame retardancy and/or melt dripping properties |
EP3232747A1 (en) | 2016-04-15 | 2017-10-18 | JX Nippon Mining & Metals Corp. | Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101439496B1 (en) * | 2009-12-22 | 2014-09-12 | 에스케이이노베이션 주식회사 | Polyamic acid composition, method for preparing the same and polyimide metal clad laminate the same |
CN102504197B (en) * | 2011-10-10 | 2013-08-21 | 北京新福润达绝缘材料有限责任公司 | Halogen-free epoxy resin composition with high proof tracking index and application thereof |
CN102585663B (en) * | 2012-02-06 | 2013-11-20 | 苏州太湖电工新材料股份有限公司 | Halogen-free flame-retardant high-temperature-resistance insulation paint for motor |
KR102113190B1 (en) * | 2013-12-20 | 2020-05-20 | 엘지이노텍 주식회사 | Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same |
KR102135414B1 (en) * | 2013-12-20 | 2020-07-17 | 엘지이노텍 주식회사 | Liquid crystal polymer resin composite and printed circuit board comprising isolation using the same |
KR102172298B1 (en) * | 2014-03-17 | 2020-10-30 | 엘지이노텍 주식회사 | Epoxy resin composite and printed curcuit board comprising insulating layer using the same |
KR102172297B1 (en) * | 2014-04-17 | 2020-10-30 | 엘지이노텍 주식회사 | Epoxy resin composite and printed curcuit board comprising insulating layer using the same |
JP7312931B2 (en) * | 2016-09-28 | 2023-07-24 | 東特塗料株式会社 | electric insulated wire |
CN106564240B (en) * | 2016-11-07 | 2018-08-31 | 北京新福润达绝缘材料有限责任公司 | A kind of preparation method of high anti creepage trace glass felt layers pressing plate |
US10899871B2 (en) * | 2019-04-23 | 2021-01-26 | Chang Chun Plastics Co., Ltd. | Phosphorous containing epoxy resins and process for synthesis |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08193188A (en) * | 1995-01-18 | 1996-07-30 | Mitsui Mining & Smelting Co Ltd | Adhesive for copper foil and copper foil backed therewith |
JPH11186724A (en) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | Manufacturing multilayered printed wiring board |
JPH11186723A (en) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | Manufacturing multilayered printed wiring board |
JPH11279258A (en) * | 1998-01-27 | 1999-10-12 | Toto Kasei Co Ltd | Phosphorus-containing epoxy resin composition |
JP2001181593A (en) * | 1999-12-28 | 2001-07-03 | Kashima Oil Co Ltd | Thermosetting adhesive and flexible printed wiring board material using this |
JP2002128867A (en) * | 2000-10-20 | 2002-05-09 | Nikko Materials Co Ltd | Phenol hardener for epoxy resin and epoxy resin composition using the same |
JP2005132925A (en) * | 2003-10-29 | 2005-05-26 | Matsushita Electric Works Ltd | Epoxy resin composition and prepreg, metal-foil-clad laminate, and metal-foil-fitted resin sheet using the same |
JP2005213352A (en) * | 2004-01-29 | 2005-08-11 | Arisawa Mfg Co Ltd | Resin composition for prepreg and prepreg using the same |
JP2005314449A (en) * | 2004-04-27 | 2005-11-10 | Nikko Materials Co Ltd | Additive for resin |
JP2006328214A (en) * | 2005-05-26 | 2006-12-07 | Tamura Kaken Co Ltd | Thermosetting resin composition, resin film, and film-attached product |
JP2007099956A (en) * | 2005-10-06 | 2007-04-19 | Tamura Kaken Co Ltd | Thermosetting resin composition, resin film and structure |
-
2008
- 2008-06-25 KR KR1020097026807A patent/KR101249479B1/en active IP Right Grant
- 2008-06-25 TW TW097123681A patent/TW200916525A/en not_active IP Right Cessation
- 2008-06-25 WO PCT/JP2008/061529 patent/WO2009001850A1/en active Application Filing
- 2008-06-25 CN CN2008800220983A patent/CN101687981B/en not_active Expired - Fee Related
- 2008-06-25 MY MYPI20095421 patent/MY150635A/en unknown
- 2008-06-25 JP JP2009520611A patent/JP5650908B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08193188A (en) * | 1995-01-18 | 1996-07-30 | Mitsui Mining & Smelting Co Ltd | Adhesive for copper foil and copper foil backed therewith |
JPH11186724A (en) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | Manufacturing multilayered printed wiring board |
JPH11186723A (en) * | 1997-12-25 | 1999-07-09 | Sumitomo Bakelite Co Ltd | Manufacturing multilayered printed wiring board |
JPH11279258A (en) * | 1998-01-27 | 1999-10-12 | Toto Kasei Co Ltd | Phosphorus-containing epoxy resin composition |
JP2001181593A (en) * | 1999-12-28 | 2001-07-03 | Kashima Oil Co Ltd | Thermosetting adhesive and flexible printed wiring board material using this |
JP2002128867A (en) * | 2000-10-20 | 2002-05-09 | Nikko Materials Co Ltd | Phenol hardener for epoxy resin and epoxy resin composition using the same |
JP2005132925A (en) * | 2003-10-29 | 2005-05-26 | Matsushita Electric Works Ltd | Epoxy resin composition and prepreg, metal-foil-clad laminate, and metal-foil-fitted resin sheet using the same |
JP2005213352A (en) * | 2004-01-29 | 2005-08-11 | Arisawa Mfg Co Ltd | Resin composition for prepreg and prepreg using the same |
JP2005314449A (en) * | 2004-04-27 | 2005-11-10 | Nikko Materials Co Ltd | Additive for resin |
JP2006328214A (en) * | 2005-05-26 | 2006-12-07 | Tamura Kaken Co Ltd | Thermosetting resin composition, resin film, and film-attached product |
JP2007099956A (en) * | 2005-10-06 | 2007-04-19 | Tamura Kaken Co Ltd | Thermosetting resin composition, resin film and structure |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012007091A (en) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
WO2012017909A1 (en) * | 2010-08-03 | 2012-02-09 | 三井金属鉱業株式会社 | Method for producing printed wiring board, and printed wiring board |
JP2012038772A (en) * | 2010-08-03 | 2012-02-23 | Mitsui Mining & Smelting Co Ltd | Printed wiring board manufacturing method and printed wiring board |
US9144157B2 (en) | 2010-08-03 | 2015-09-22 | Mitsui Mining & Smelting Co., Ltd. | Manufacturing method of printed wiring board and printed wiring board |
CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
CN102585440B (en) * | 2012-01-16 | 2013-09-04 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
JPWO2014106955A1 (en) * | 2013-01-07 | 2017-01-19 | 株式会社ニコン | Composition, laminate, method for producing laminate, transistor and method for producing transistor |
US10510460B2 (en) | 2013-01-07 | 2019-12-17 | Nikon Corporation | Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor |
WO2015012327A1 (en) | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method |
WO2015012376A1 (en) | 2013-07-24 | 2015-01-29 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board |
EP3046400A2 (en) | 2015-01-16 | 2016-07-20 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board |
EP3048864A2 (en) | 2015-01-21 | 2016-07-27 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board |
EP3054751A2 (en) | 2015-02-06 | 2016-08-10 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board |
US9839124B2 (en) | 2015-02-06 | 2017-12-05 | Jx Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board |
WO2017161120A1 (en) * | 2016-03-17 | 2017-09-21 | Qed Labs Inc. | Articles with improved flame retardancy and/or melt dripping properties |
US11008458B2 (en) | 2016-03-17 | 2021-05-18 | Qed Labs Inc. | Articles with improved flame retardancy and/or melt dripping properties |
EP3232747A1 (en) | 2016-04-15 | 2017-10-18 | JX Nippon Mining & Metals Corp. | Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN101687981A (en) | 2010-03-31 |
CN101687981B (en) | 2012-04-04 |
JP5650908B2 (en) | 2015-01-07 |
KR101249479B1 (en) | 2013-03-29 |
TWI374909B (en) | 2012-10-21 |
JPWO2009001850A1 (en) | 2010-08-26 |
TW200916525A (en) | 2009-04-16 |
KR20100024949A (en) | 2010-03-08 |
MY150635A (en) | 2014-02-14 |
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