KR102172298B1 - Epoxy resin composite and printed curcuit board comprising insulating layer using the same - Google Patents

Abstract

The epoxy resin composition according to an embodiment of the present invention includes 3 to 60 wt% of an epoxy compound, 0.5 to 5 wt% of a curing agent, 0 to 30 wt% of aluminum oxide, 0 to 30 wt% of silicon carbide, and 30 to 30 to a carbon-based filler coated with MnO ₂ It contains 90wt%.

Description

A printed circuit board including an epoxy resin composition and an insulating layer using the same TECHNICAL FIELD [EPOXY RESIN COMPOSITE AND PRINTED CURCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME}

The present invention relates to an epoxy resin composition, and more particularly to a printed circuit board including an epoxy resin composition and an insulating layer using the same.

The printed circuit board includes a circuit pattern formed on the insulating layer, and various electronic components may be mounted on the printed circuit board.

The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element may degrade the performance of the printed circuit board.

As electronic components become highly integrated and have higher capacity, interest in the heat dissipation problem of a printed circuit board is increasing. In general, an epoxy resin composition containing a bisphenol A type epoxy compound or a bisphenol F type epoxy compound is used for the insulating layer of a printed circuit board. However, the bisphenol A type epoxy compound or the bisphenol F type epoxy compound has a problem in that the viscosity is low and the curability, mechanical strength, toughness, and the like are insufficient.

Accordingly, an epoxy resin composition including a crystalline epoxy compound having a mesogenic structure may be used. Such an epoxy resin composition is excellent in storage stability and curability before curing, but there is a limit to obtaining the required level of heat resistance and thermal conductivity.

The technical problem to be achieved by the present invention is to provide a printed circuit board including an epoxy resin composition and an insulating layer using the same.

The epoxy resin composition according to an embodiment of the present invention includes 3 to 60 wt% of an epoxy compound, 0.5 to 5 wt% of a curing agent, 0 to 30 wt% of aluminum oxide, 0 to 30 wt% of silicon carbide, and 30 to 30 to a carbon-based filler coated with MnO ₂ It contains 90wt%.

The epoxy compound may include 3 to 40 parts by weight of an amorphous epoxy compound based on 10 parts by weight of the crystalline epoxy compound.

The crystalline epoxy compound may include a mesogen structure.

The curing agent may include diaminodiphenylsulfone.

The carbon-based filler may include at least one of silicon carbide, carbon nanotubes, graphite, and carbon fibers.

The epoxy resin composition may include 5 to 25 wt% of the aluminum oxide, 5 to 25 wt% of the silicon carbide, and 40 to 80 wt% of the carbon-based filler coated with MnO ₂ .

The epoxy resin composition may include 10 to 20wt% of the aluminum oxide, 10 to 20wt% of the silicon carbide, and 50 to 70wt% of the carbon-based filler coated with MnO ₂ .

A printed circuit board according to an embodiment of the present invention includes a metal plate, an insulating layer formed on the metal plate, and a circuit pattern formed on the insulating layer, wherein the insulating layer is 3 to 60 wt% of an epoxy compound, An epoxy resin composition comprising 0.5 to 5 wt% of a curing agent, 0 to 30 wt% of aluminum oxide, 0 to 30 wt% of silicon carbide, and 30 to 90 wt% of a carbon-based filler coated with MnO ₂ .

According to an embodiment of the present invention, it is possible to obtain an epoxy resin composition excellent in thermal conductivity and withstand voltage. By using this, an insulating material having high heat resistance and thermal conductivity can be obtained, and heat dissipation performance and reliability of a printed circuit board can be improved.

1 to 4 are SEM (Scanning Electron Microscope) images of a carbon-based filler coated with MnO ₂ contained in an epoxy resin composition according to an embodiment of the present invention.
5 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

The present invention is intended to illustrate and describe specific embodiments in the drawings, as various changes may be made and various embodiments may be provided. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a second component may be referred to as a first component, and similarly, a first component may be referred to as a second component. The term and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when one part is "right above" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, but the same reference numerals are assigned to the same or corresponding components regardless of the reference numerals, and redundant descriptions thereof will be omitted.

In the present specification, wt% may be replaced by parts by weight.

The epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent, and an inorganic filler, and the inorganic filler is a carbon-based filler coated with aluminum oxide (Al ₂ O ₃ ), silicon carbide (SiC), and MnO ₂ Includes at least one of (filler).

More specifically, the epoxy resin composition according to the embodiment of the present invention is an epoxy compound 3 to 60wt%, a curing agent 0.5 to 5wt%, aluminum oxide (Al ₂ O ₃ ) 0 to 30wt%, silicon carbide (SiC) 0 to 30wt% %, and 30 to 90 wt% of a carbon-based filler coated with MnO ₂ .

When the epoxy resin composition contains 3 to 60 wt% of the epoxy compound, the strength is good, so that adhesion is excellent, and thickness control is easy. In addition, when the curing agent is contained in an amount of 0.5 to 5 wt% in the epoxy resin composition, it is easy to cure, and the strength is good, so that adhesion is excellent. In addition, as an inorganic filler in the epoxy resin composition, aluminum oxide (Al ₂ O ₃ ) 0 to 30 wt%, silicon carbide (SiC) 0 to 30 wt%, and a carbon-based filler coated with MnO ₂ at 30 to 90 wt% If so, not only has excellent thermal conductivity, but also has a low electrical conductivity effect, excellent low thermal expansion, high heat resistance, and moldability.

The epoxy resin composition according to an embodiment of the present invention includes a crystalline epoxy compound and an amorphous epoxy compound, but may include 3 to 40 parts by weight of an amorphous epoxy compound based on 10 parts by weight of the crystalline epoxy compound. When the crystalline epoxy compound and the amorphous epoxy compound are included in such a ratio, crystallization is easy, the heat conduction effect can be increased, and room temperature stabilization is possible.

Here, the crystalline epoxy compound may include a mesogen structure. Mesogen is a basic unit of a liquid crystal and includes a rigid structure. Mesogen may contain, for example, a rigid structure such as the following (a) to (e).

(a)

(b)

(c)

(d)

(e)

The crystalline epoxy compound containing a mesogenic structure may include, for example, 4,4'-biphenolether diglycidyl ether, that is, SE-4280, It is not limited.

In addition, the amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule.

An amorphous epoxy compound is, for example, bisphenol A, bisphenol F, 3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl Sulfone, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylketone, fluorenebisphenol, 4,4'-biphenol,3,3',5,5'-tetra Methyl-4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol, t-butylcatechol, hydroquinone, t-butylhydroquinone, 1,2-dihydroxynaphthalene, 1 ,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydr Roxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2, Divalent phenols such as 8-dihydroxynaphthalene, allylated or polyallylated dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolac, or phenol novolac, bisphenol A novolac , o-cresol novolac, m-cresol novolac, p-cresol novolac, xylenol novolac, poly-p-hydroxystyrene, tris-(4-hydroxyphenyl)methane, 1,1,2,2 -Tetrakis(4-hydroxyphenyl)ethane, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallyled pyrogallol, 1,2,4-benzenetriol, 2, One of trivalent or higher phenols such as 3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, halogenated bisphenols such as tetrabromobisphenol A, and mixtures selected from these It may be a glycidyl ether product derived from.

An example of the amorphous epoxy compound is the same as in Formula 1.

[Formula 1]

In addition, the curing agent included in the epoxy resin composition according to an embodiment of the present invention is an amine-based curing agent, a phenolic curing agent, an acid anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent and a block isocyanate-based It may contain at least one of curing agents.

The amine-based curing agent may be, for example, 4, 4'-diamino diphenyl sulfone. Formula 2 below is an example of diaminodiphenylsulfone.

[Formula 2]

Other examples of the amine curing agent may be aliphatic amines, polyether polyamines, alicyclic amines, aromatic amines, and the like, and examples of the aliphatic amines include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexa Methylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis(hexamethylene)triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, tetra(hydroxyethyl)ethylenediamine, etc. are mentioned. As the polyether polyamine, it may be one of triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and a mixture selected from these. As alicyclic amines, isophoronediamine, metasenediamine, N-aminoethylpiperazine, bis(4-amino-3-methyldicyclohexyl)methane, bis(aminomethyl)cyclohexane, 3,9-bis(3 -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. As aromatic amines, tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2 ,4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4-diaminodi Phenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl)phenol, triethanolamine, methylbenzylamine, α-(m-aminophenyl)ethylamine, α-(p-amino Phenyl)ethylamine, diaminodiethyldimethyldiphenylmethane, α,α'-bis(4-aminophenyl)-p-diisopropylbenzene, and a mixture selected from these.

The phenolic curing agent is, for example, bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis(4-hydroxyphenoxy). )Benzene, 1,3-bis(4-hydroxyphenoxy)benzene, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylketone, 4,4'-dihydr Roxydiphenylsulfone, 4,4'-dihydroxydiphenylester, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10-(2,5-dihydroxyphenyl )-10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolac, bisphenol A novolac, o-cresol novolac, m-cresol novolac, p-cresol novolac, xylenol novolac , Poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallyl Hwapirogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydro Roxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2, 4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allyl of the dihydroxynaphthalene It may be one of a cargo or polyallylate, allylated bisphenol A, allylated bisphenol F, allylated phenol novolac, allylated pyrogallol, and mixtures selected from these.

Acid anhydride-based curing agents include, for example, dodecenyl succinic anhydride, polyadipic anhydride, polyazeleic anhydride, polysebacic anhydride, poly(ethyloctadecanedioic acid) anhydride, poly(phenylhexadecanedioic acid) anhydride, methyltetrahydro Phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, phthalic anhydride, Trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimelitate, hetic anhydride, nadic anhydride, methylnadic anhydride, 5-(2,5-dioxotetrahydro-3 -Furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic anhydride, 1- It may be one of methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic anhydride and mixtures selected from these.

It is also possible to mix and use two or more types of hardeners.

The epoxy resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator includes, for example, an amine curing accelerator, an imidazole curing accelerator, an organic phosphine curing accelerator, a Lewis acid curing accelerator, and the like. Specifically, 1,8-diazabicyclo (5,4,0) Tertiary amines such as sen-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol, 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole and 2-heptadecylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, Tetra-substituted phosphonium-tetra-substituted borates such as tetraphenylphosphonium-tetraphenylborate, tetraphenylphosphonium-ethyltriphenylborate, tetrabutylphosphonium-tetrabutylborate, 2-ethyl-4-methylimidazole-tetra And tetraphenyl boron salts such as phenyl borate and N-methylmorpholine tetraphenyl borate.

And, the epoxy resin composition according to an embodiment of the present invention as an inorganic filler, aluminum oxide (Al ₂ O ₃ ) 0 to 30 wt%, preferably 5 to 25 wt%, more preferably 10 to 20 wt%, silicon carbide ( SiC) 0 to 30 wt%, preferably 5 to 25 wt%, more preferably 10 to 20 wt%, and 30 to 90 wt% of a carbon-based filler coated with MnO ₂ , preferably 40 to 80 wt%, further Preferably it may contain 50 to 70wt%. When the carbon-based filler coated with aluminum oxide, silicon carbide, and MnO 2 is included within the above numerical range, it is possible to obtain an epoxy resin composition suitable for use in an insulating layer of a printed circuit board due to high thermal conductivity and low electrical conductivity.

Here, the carbon-based filler may include at least one of silicon carbide (SiC), carbon nanotube (CNT), graphite, and carbon fiber. In general, carbon-based fillers have better thermal conductivity than ceramic-based fillers. However, since carbon-based fillers have high electrical conductivity, there is a limit to being used as an insulating material. According to an embodiment of the present invention, when an inorganic filler coated with MnO ₂ having excellent insulation performance on the surface of a carbon-based filler having excellent thermal conductivity is used, an epoxy resin composition having excellent thermal conductivity but low electrical conductivity can be obtained.

According to one embodiment of the present invention, the carbon-based filler coated with MnO ₂ is dispersed by sonicating MnCl ₂ 4H ₂ O in isopropyl alcohol (①), and after dispersing KMnO ₄ in distilled water ( ②), Put 10g of silicon carbide powder with an average diameter of about 80㎛ in ①, raise the temperature to about 80℃ (③), add ② in ③ and react for about 1 hour (④), filter It can be obtained by drying (⑤) at ℃ for 12 hours. At this time, MnO ₂ may be coated with a thickness of about 20 nm on the carbon-based filler. However, the present invention is not limited thereto, and a carbon-based filler coated with MnO ₂ may be obtained using various methods.

1 to 4 are SEM (Scanning Electron Microscope) images of a carbon-based filler coated with MnO ₂ contained in an epoxy resin composition according to an embodiment of the present invention. Figures 1 to 2 is aggregation type (aggromerate type) or spherical (spherical type) and with a MnO ₂ coating on the silicon carbide for example, 3 to 4 is an example in which the MnO ₂ coating on the amorphous silicon carbide.

The epoxy resin composition according to the embodiment of the present invention may further include a catalyst, an additive, and a solvent. The catalyst may include, for example, an imidazole-based additive such as Chemical Formula 3.

[Formula 3]

When the epoxy resin composition according to an embodiment of the present invention includes the catalyst of Formula 3, adhesion with metal may be improved. Accordingly, the adhesion between the insulating layer and the circuit pattern made of copper or the like is increased, and the possibility of separation and disconnection of the circuit pattern is lowered, thereby facilitating processing of the printed circuit board and increasing the reliability of the printed circuit board.

The epoxy resin composition according to an embodiment of the present invention may be applied to a printed circuit board. 5 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 5, the printed circuit board 100 includes a metal plate 110, an insulating layer 120, and a circuit pattern 130.

The metal plate 110 may be made of copper, aluminum, nickel, gold, platinum, and an alloy selected from these.

An insulating layer 120 made of an epoxy resin composition according to an embodiment of the present invention is formed on the metal plate 110.

A circuit pattern 130 is formed on the insulating layer 120. The circuit pattern 130 may be made of a metal such as copper or nickel.

The insulating layer 120 insulates between the metal plate 110 and the circuit pattern 130.

By curing the epoxy resin composition according to an embodiment of the present invention and using it as an insulating layer, a printed circuit board having excellent heat dissipation performance can be obtained.

In particular, according to an embodiment of the present invention, it is possible to obtain an insulating layer including an epoxy resin composition having a thermal conductivity of 8 W/Km or more and an electrical conductivity of 10 ^-5 S/cm or less. Preferably, an insulating layer comprising an epoxy resin composition having a thermal conductivity of 10 W/Km or more and an electrical conductivity of 10 ^-7 S/cm or less can be obtained.

Hereinafter, it will be described in more detail using Examples and Comparative Examples.

<Example 1>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) was dissolved for 20 minutes, and then 90wt% of silicon carbide coated with MnO ₂ and 0.5wt% of the catalyst of Formula 3 were stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 1.

<Example 2>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, aluminum oxide 25wt%, silicon carbide 25wt%, MnO ₂ coated silicon carbide 40wt% and the catalyst of formula 3 0.5wt% were stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 2.

<Example 3>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) after dissolving for 20 minutes, aluminum oxide 20wt%, silicon carbide 20wt%, MnO ₂ coated silicon carbide 50wt% and the catalyst of formula 3 0.5wt% were stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 3.

<Example 4>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, aluminum oxide 10wt%, silicon carbide 10wt%, MnO ₂ coated silicon carbide 70wt%, and the catalyst of formula 3 0.5wt% were stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 4.

<Example 5>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) after dissolving for 20 minutes, aluminum oxide 5wt%, silicon carbide 5wt%, MnO ₂ coated silicon carbide 80wt% and the catalyst of formula 3 0.5wt% was stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 5.

<Comparative Example 1>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, and then 90wt% of aluminum oxide and 0.5wt% of the catalyst of Formula 3 were stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 1.

<Comparative Example 2>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, and then 90wt% of silicon carbide and 0.5wt% of the catalyst of Formula 3 were stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 2.

<Comparative Example 3>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, aluminum oxide 20wt%, silicon carbide 70wt%, and 0.5wt% of the catalyst of Formula 3 were stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 3.

<Comparative Example 4>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) for 20 minutes, aluminum oxide 45wt%, silicon carbide 45wt%, and 0.5wt% of the catalyst of Formula 3 were stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain an epoxy resin composition of Comparative Example 4.

<Comparative Example 5>

4.5 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 4 wt% of the amorphous epoxy compound of Formula 1, and 1 wt% of 4,4'-diaminodiphenylsulfone were added to MEK (Methyl Ethly). Ketone) after dissolving for 20 minutes, aluminum oxide 80wt%, silicon carbide 5wt%, MnO ₂ coated silicon carbide 5wt% and the catalyst of formula 3 0.5wt% was stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 5.

<Experimental Example>

After curing the compositions obtained from Examples 1 to 5 and Comparative Examples 1 to 5, thermal conductivity was measured by an abnormal heating wire method using an LFA447 type thermal conductivity meter manufactured by NETZSCH, and electrical conductivity was measured.

Table 1 shows the results.

Experiment number Thermal conductivity (W/mK) Electrical conductivity (S/cm) Example 1 9.84 1.89*10 ^-8 Example 2 8.65 5.02*10 ^-6 Example 3 10.70 9.63*10 ^-8 Example 4 12.88 5.57*10 ^-8 Example 5 8.94 0.16*10 ^-9 Comparative Example 1 6.32 3.21*10 ^-10 Comparative Example 2 13.46 4.40*10 ^-2 Comparative Example 3 10.3 3.21*10 ^-5 Comparative Example 4 8.09 4.40*10 ^-3 Comparative Example 5 6.32 2.94*10 ^-10

Referring to Table 1, the epoxy resin compositions of Examples 1 to 5 comprising a crystalline epoxy compound, an amorphous epoxy compound, and a curing agent, and containing 30 to 90 wt% of silicon carbide coated with MnO ₂ as an inorganic filler are thermally conductive. Since the degree is 8W/mK or more and the electrical conductivity is 10 ^-5 or less, it can be seen that it is suitable for use in an insulating layer of a printed circuit board. In particular, the epoxy resin compositions of Examples 3 to 4 containing 10 to 20 wt% of aluminum oxide, 10 to 20 wt% of silicon carbide, and 50 to 70 wt% of silicon carbide coated with MnO ₂ as inorganic fillers have a thermal conductivity of 10 W/mK or more. And it can be seen that the electrical conductivity is 10 ^-7 S/cm or less.

On the other hand, it can be seen that the epoxy resin composition of Comparative Example 1 containing 90wt% of aluminum oxide without including silicon carbide coated with MnO ₂ as an inorganic filler has a low thermal conductivity (6.32W/mK). In addition, the epoxy resin composition of Comparative Example 2 containing 90 wt% silicon carbide as an inorganic filler has high thermal conductivity (13.46 W/mK), but has high electrical conductivity (4.40 * 10 ^-2 ), so it is not suitable for use as an insulating material. You can see that it is not. In addition, it can be seen that even if the inorganic filler includes silicon carbide coated with MnO 2, the epoxy resin composition of Comparative Example 5 having a low content also has low thermal conductivity and is not suitable for application to an insulating layer of a printed circuit board.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. You will understand that you can do it.

100: printed circuit board
110: metal plate
120: insulating layer
130: circuit pattern

Claims (8)

3 to 60 wt% of an epoxy compound,
0.5 to 5 wt% of a curing agent,
0 to 30 wt% aluminum oxide,
0 to 30 wt% silicon carbide, and
An epoxy resin composition comprising 30 to 90wt% of silicon carbide coated with MnO ₂ . The method of claim 1,
The epoxy compound is an epoxy resin composition comprising 3 to 40 parts by weight of an amorphous epoxy compound based on 10 parts by weight of the crystalline epoxy compound. The method of claim 2,
The crystalline epoxy compound is an epoxy resin composition comprising a mesogenic structure. The method of claim 3,
The curing agent is an epoxy resin composition containing diaminodiphenylsulfone. delete The method of claim 1,
An epoxy resin composition comprising 5 to 25wt% of the aluminum oxide, 5 to 25wt% of the silicon carbide, and 40 to 80wt% of silicon carbide coated with the MnO ₂ . The method of claim 6,
An epoxy resin composition comprising 10 to 20wt% of the aluminum oxide, 10 to 20wt% of the silicon carbide, and 50 to 70wt% of silicon carbide coated with the MnO ₂ . Metal plate,
An insulating layer formed on the metal plate, and
It includes a circuit pattern formed on the insulating layer,
The insulating layer is an epoxy resin composition comprising 3 to 60 wt% of an epoxy compound, 0.5 to 5 wt% of a curing agent, 0 to 30 wt% of aluminum oxide, 0 to 30 wt% of silicon carbide, and 30 to 90 wt% of silicon carbide coated with MnO ₂ A printed circuit board comprising.

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