KR102172297B1 - Epoxy resin composite and printed curcuit board comprising insulating layer using the same - Google Patents

Abstract

The epoxy resin composition according to an embodiment of the present invention includes 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers.

Description

A printed circuit board including an epoxy resin composition and an insulating layer using the same TECHNICAL FIELD [EPOXY RESIN COMPOSITE AND PRINTED CURCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME}

The present invention relates to an epoxy resin composition, and more particularly to a printed circuit board including an epoxy resin composition and an insulating layer using the same.

The printed circuit board includes a circuit pattern formed on the insulating layer, and various electronic components may be mounted on the printed circuit board.

The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element may degrade the performance of the printed circuit board.

As electronic components become highly integrated and have higher capacity, interest in the heat dissipation problem of a printed circuit board is increasing. In order to solve the heat dissipation problem of a printed circuit board, an insulating layer having high thermal conductivity and low dielectric constant is required. In general, an epoxy resin composition including a bisphenol A type epoxy compound or a bisphenol F type epoxy compound is impregnated with glass fiber to be used as an insulating layer of a printed circuit board, but such an insulating layer has a problem in that thermal conductivity is not high.

The technical problem to be achieved by the present invention is to provide a printed circuit board including an epoxy resin composition and an insulating layer using the same.

The epoxy resin composition according to an embodiment of the present invention includes 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers.

The glass fiber may be included in 25 to 55wt% of the epoxy resin composition.

The inorganic filler may further include at least one of boron nitride and alumina.

At least one of the boron nitride and alumina may be included as 1 to 25 wt% of the epoxy resin composition.

It may contain 3 to 7 parts by weight of the boron nitride based on 10 parts by weight of the glass fiber.

It may further include 3 to 5 parts by weight of the alumina based on 10 parts by weight of the glass fiber.

The crystalline epoxy compound may include a mesogen structure.

The curing agent may include diaminodiphenylsulfone.

The epoxy compound may further include an amorphous epoxy compound.

The epoxy resin composition according to an embodiment of the present invention includes a metal plate, an insulating layer formed on the metal plate, and a circuit pattern formed on the insulating layer, and the insulating layer includes a crystalline epoxy compound. An epoxy resin composition comprising 3 to 60 wt% of an epoxy compound, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers.

The epoxy resin composition according to another embodiment of the present invention includes a plurality of circuit pattern layers that are sequentially arranged, and a plurality of insulating layers formed between the plurality of circuit pattern layers, and at least some of the plurality of insulating layers The insulating layer includes an epoxy resin composition comprising 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers.

According to an embodiment of the present invention, an epoxy resin composition having high thermal conductivity and low dielectric constant can be obtained. By using this, an insulating material having excellent heat dissipation effect can be obtained, and heat dissipation performance and reliability of the printed circuit board can be improved.

1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.
2 is a cross-sectional view of a printed circuit board according to another embodiment of the present invention.

The present invention is intended to illustrate and describe specific embodiments in the drawings, as various changes may be made and various embodiments may be provided. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a second component may be referred to as a first component, and similarly, a first component may be referred to as a second component. The term and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when one part is "right above" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, but the same reference numerals are assigned to the same or corresponding components regardless of the reference numerals, and redundant descriptions thereof will be omitted.

In the present specification, wt% may be replaced by parts by weight.

The epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent, and an inorganic filler.

More specifically, the epoxy resin composition according to the embodiment of the present invention comprises 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers. Include.

When the epoxy resin composition contains 3 to 60 wt% of the epoxy compound, the strength is good, so that adhesion is excellent, and thickness control is easy. In addition, when the curing agent is contained in an amount of 0.5 to 22 wt% in the epoxy resin composition, curing is easy, strength is good, and adhesion is excellent. In addition, when the epoxy resin composition contains 18 to 96.5 wt% of an inorganic filler containing glass fibers, not only has excellent thermal conductivity but also has a low electrical conductivity effect, and is excellent in low thermal expansion, high heat resistance, and moldability.

Here, the crystalline epoxy compound may include a mesogen structure. Mesogen is a basic unit of a liquid crystal and includes a rigid structure. Mesogen may contain, for example, a rigid structure such as the following (a) to (e).

(a)

(b)

(c)

(d)

(e)

In an embodiment of the present invention, the crystalline epoxy compound containing a mesogenic structure is, for example, 4,4'-biphenolether diglycidyl ether, that is, SE-4280 It may include, but is not limited thereto.

In an embodiment of the present invention, the crystalline epoxy compound may contain at least one of Formulas 1 to 12, for example.

[Formula 1]

[Formula 2]

[Formula 3]

[Formula 4]

[Formula 5]

[Formula 6]

[Formula 7]

[Formula 8]

[Formula 9]

[Formula 10]

[Formula 11]

[Formula 12]

And, the epoxy resin composition according to an embodiment of the present invention may further include an amorphous epoxy compound. The amorphous epoxy compound may include 1 to 40 parts by weight of an amorphous epoxy compound based on 10 parts by weight of the crystalline epoxy compound. When the crystalline epoxy compound and the amorphous epoxy compound are included in such a ratio, room temperature stability can be improved.

The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule.

An amorphous epoxy compound is, for example, bisphenol A, bisphenol F, 3,3',5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl Sulfone, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylketone, fluorenebisphenol, 4,4'-biphenol,3,3',5,5'-tetra Methyl-4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol, t-butylcatechol, hydroquinone, t-butylhydroquinone, 1,2-dihydroxynaphthalene, 1 ,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydr Roxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2, Divalent phenols such as 8-dihydroxynaphthalene, allylated or polyallylated dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolac, or phenol novolac, bisphenol A novolac , o-cresol novolac, m-cresol novolac, p-cresol novolac, xylenol novolac, poly-p-hydroxystyrene, tris-(4-hydroxyphenyl)methane, 1,1,2,2 -Tetrakis(4-hydroxyphenyl)ethane, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallyled pyrogallol, 1,2,4-benzenetriol, 2, One of trivalent or higher phenols such as 3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, halogenated bisphenols such as tetrabromobisphenol A, and mixtures selected from these It may be a glycidyl ether product derived from.

An example of the amorphous epoxy compound is the same as in Formula 13.

[Formula 13]

In addition, the curing agent included in the epoxy resin composition according to an embodiment of the present invention is an amine-based curing agent, a phenolic curing agent, an acid anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent and a block isocyanate-based It may contain at least one of curing agents.

The amine-based curing agent may be, for example, 4, 4'-diamino diphenyl sulfone. Formula 14 below is an example of diaminodiphenylsulfone.

[Formula 14]

Other examples of the amine curing agent may be aliphatic amines, polyether polyamines, alicyclic amines, aromatic amines, and the like, and examples of the aliphatic amines include ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexa Methylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis(hexamethylene)triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, tetra(hydroxyethyl)ethylenediamine, etc. are mentioned. As the polyether polyamine, it may be one of triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and a mixture selected from these. As alicyclic amines, isophoronediamine, metasenediamine, N-aminoethylpiperazine, bis(4-amino-3-methyldicyclohexyl)methane, bis(aminomethyl)cyclohexane, 3,9-bis(3 -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. As aromatic amines, tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2 ,4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4-diaminodi Phenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl)phenol, triethanolamine, methylbenzylamine, α-(m-aminophenyl)ethylamine, α-(p-amino Phenyl)ethylamine, diaminodiethyldimethyldiphenylmethane, α,α'-bis(4-aminophenyl)-p-diisopropylbenzene, and a mixture selected from these.

The phenolic curing agent is, for example, bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis(4-hydroxyphenoxy). )Benzene, 1,3-bis(4-hydroxyphenoxy)benzene, 4,4'-dihydroxydiphenylsulfide, 4,4'-dihydroxydiphenylketone, 4,4'-dihydr Roxydiphenylsulfone, 4,4'-dihydroxydiphenylester, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10-(2,5-dihydroxyphenyl )-10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolac, bisphenol A novolac, o-cresol novolac, m-cresol novolac, p-cresol novolac, xylenol novolac , Poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallyl Hwapirogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydro Roxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2, 4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allyl of the dihydroxynaphthalene It may be one of a cargo or polyallylate, allylated bisphenol A, allylated bisphenol F, allylated phenol novolac, allylated pyrogallol, and mixtures selected from these.

Acid anhydride-based curing agents include, for example, dodecenyl succinic anhydride, polyadipic anhydride, polyazeleic anhydride, polysebacic anhydride, poly(ethyloctadecanedioic acid) anhydride, poly(phenylhexadecanedioic acid) anhydride, methyltetrahydro Phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, phthalic anhydride, Trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimelitate, hetic anhydride, nadic anhydride, methylnadic anhydride, 5-(2,5-dioxotetrahydro-3 -Furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic anhydride, 1- It may be one of methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic anhydride and mixtures selected from these.

It is also possible to mix and use two or more types of hardeners.

The epoxy resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator includes, for example, an amine curing accelerator, an imidazole curing accelerator, an organic phosphine curing accelerator, a Lewis acid curing accelerator, and the like. Specifically, 1,8-diazabicyclo (5,4,0) Tertiary amines such as sen-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol, 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole and 2-heptadecylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, Tetra-substituted phosphonium-tetra-substituted borates such as tetraphenylphosphonium-tetraphenylborate, tetraphenylphosphonium-ethyltriphenylborate, tetrabutylphosphonium-tetrabutylborate, 2-ethyl-4-methylimidazole-tetra And tetraphenyl boron salts such as phenyl borate and N-methylmorpholine tetraphenyl borate.

Formula 15 shows an example of an imidazole-based hardening accelerator.

[Formula 15]

When the epoxy resin composition according to an embodiment of the present invention contains the curing accelerator of Formula 15, adhesion with metal may be improved. Accordingly, the adhesion between the insulating layer and the circuit pattern made of copper or the like is increased, and the possibility of separation and disconnection of the circuit pattern is lowered, thereby facilitating processing of the printed circuit board and increasing the reliability of the printed circuit board.

And, the epoxy resin composition according to an embodiment of the present invention comprises 18 to 96.5wt% of an inorganic filler containing glass fibers. When the inorganic filler including glass fibers is included in such an amount, an epoxy resin composition having a low dielectric constant and excellent thermal conductivity can be obtained.

Here, the glass fiber may be included in 25 to 55 wt%, preferably 30 to 50 wt% of the total epoxy resin composition. When the glass fiber is contained in an amount of less than 25wt%, there is a problem that it is difficult to use as an insulating layer due to a low dielectric constant. When the glass fiber is contained in an amount exceeding 55wt%, a desired level of thermal conductivity may not be obtained, and processing may not be easy.

Meanwhile, the epoxy resin composition according to an embodiment of the present invention may further include at least one of boron nitride and alumina as an inorganic filler. Here, at least one of boron nitride and alumina may be included in an amount of 1 to 25 wt%, preferably 5 to 25 wt%, and more preferably 10 to 20 wt% of the total epoxy resin composition. Here, the content may mean the content of boron nitride or alumina when the epoxy resin composition contains boron nitride or alumina, and when the epoxy resin composition contains boron nitride and alumina, it may mean the combined content of boron nitride and alumina. . When at least one of boron nitride and alumina is contained in an amount of less than 1 wt% of the total epoxy resin composition, there is a problem in that it is difficult to obtain a desired level of thermal conductivity. When at least one of boron nitride and alumina is contained in excess of 25 wt% of the total epoxy resin composition, there is a problem that the dielectric constant is increased.

At this time, 3 to 7 parts by weight of boron nitride may be included based on 10 parts by weight of the glass fiber, and 3 to 5 parts by weight of alumina may be further included based on 10 parts by weight of the glass fiber. When glass fibers, boron nitride, and alumina are included within these numerical ranges, an epoxy resin composition having high thermal conductivity and good dielectric constant can be obtained.

In addition, the epoxy resin composition according to an embodiment of the present invention may further include at least one of aluminum nitride and silica as an inorganic filler.

The epoxy resin composition according to an embodiment of the present invention may be applied to a printed circuit board. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 1, the printed circuit board 100 includes a metal plate 110, an insulating layer 120, and a circuit pattern 130.

The metal plate 110 may be made of copper, aluminum, nickel, gold, platinum, and an alloy selected from these.

An insulating layer 120 made of an epoxy resin composition according to an embodiment of the present invention is formed on the metal plate 110.

A circuit pattern 130 is formed on the insulating layer 120. The circuit pattern 130 may be made of a metal such as copper or nickel.

The insulating layer 120 insulates between the metal plate 110 and the circuit pattern 130.

2 is a cross-sectional view of a printed circuit board according to another embodiment of the present invention.

Referring to FIG. 2, the multilayer printed circuit board 200 includes a plurality of circuit pattern layers 210 that are sequentially disposed, and a plurality of insulating layers 220 formed between the plurality of circuit pattern layers 210. . That is, the printed circuit board 200 includes an insulating layer 220-1 with a circuit pattern layer 210-1 formed on the lower surface thereof, and an insulating layer with circuit pattern layers 210-2 and 210-3 formed on the upper and lower surfaces thereof ( 220-2) and an insulating layer 220-3 on which the circuit pattern layer 210-4 is formed on the upper surface.

Here, the insulating layer 220 insulates the circuit pattern layer 210. The epoxy resin composition according to an embodiment of the present invention may be applied to at least one of the insulating layers 220-1, 220-2, and 220-3.

In addition, the circuit pattern layer 210 may be made of a metal such as copper or nickel. Although not shown, the multilayer printed circuit board 200 may be formed on a metal plate. Here, the metal plate may include copper, aluminum, nickel, gold, platinum, and an alloy selected from these.

For convenience of explanation, a four-layer printed circuit board is described as an example, but the epoxy resin composition according to an embodiment of the present invention may be variously applied to a 10-layer printed circuit board, a 12-layer printed circuit board, and the like.

By curing the epoxy resin composition according to an embodiment of the present invention and using it as an insulating layer, a printed circuit board having excellent heat dissipation performance can be obtained.

Hereinafter, it will be described in more detail using Examples and Comparative Examples.

<Example 1>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 50wt% of glass fiber was added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 1.

<Example 2>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 40 wt% of glass fiber and 10 wt% of boron nitride were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 2.

<Example 3>

20 wt% of a crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether), 15 wt% of an amorphous epoxy compound of formula 13, 12.5 wt% of 4,4'-diaminodiphenylsulfone, and 2.5 wt of a curing accelerator % Was dissolved in MEK (Methyl Ethly Ketone) for 20 minutes, and then 40wt% of glass fiber and 10wt% of boron nitride were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 3.

<Example 4>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 30wt%, amorphous epoxy compound of formula 13 5wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt % Was dissolved in MEK (Methyl Ethly Ketone) for 20 minutes, and then 40 wt% of glass fiber and 10 wt% of boron nitride were added and stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 4.

<Example 5>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 40 wt% of glass fiber and 10 wt% of alumina were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 5.

<Example 6>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 30 wt% of glass fiber and 20 wt% of boron nitride were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 6.

<Example 7>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 30 wt% of glass fiber and 20 wt% of alumina were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 7.

<Example 8>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 30wt% of glass fiber, 10wt% of boron nitride, and 10wt% of alumina were added and stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 8.

<Comparative Example 1>

After dissolving 35wt% of the amorphous epoxy compound of Formula 13, 12.5wt% of 4,4'-diaminodiphenylsulfone and 2.5wt% of a hardening accelerator for 20 minutes in MEK (Methyl Ethly Ketone), 50wt% of glass fiber was added And stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 1.

<Comparative Example 2>

After dissolving 35wt% of the amorphous epoxy compound of Formula 13, 12.5wt% of 4,4'-diaminodiphenylsulfone and 2.5wt% of a curing accelerator for 20 minutes in MEK (Methyl Ethly Ketone), 30wt% of glass fiber, nitriding Boron 10wt% and alumina 10wt% were added and stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 2.

<Comparative Example 3>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 50wt% of alumina was added and stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 3.

<Comparative Example 4>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 35wt%, 4,4'-diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) 20 After dissolving for a minute, 20 wt% of glass fiber, 15 wt% of boron nitride, and 15 wt% of alumina were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain an epoxy resin composition of Comparative Example 4.

<Comparative Example 5>

Crystalline epoxy compound (4,4'-biphenol ether diglycidyl ether) 25wt%, 4,4'diaminodiphenylsulfone 12.5wt% and curing accelerator 2.5wt% in MEK (Methyl Ethly Ketone) for 20 minutes After dissolving during, 60wt% of glass fiber was added and stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 5.

<Experimental Example>

After curing the compositions obtained from Examples 1 to 8 and Comparative Examples 1 to 3, thermal conductivity was measured by an abnormal heating wire method using an LFA447 type thermal conductivity meter manufactured by NETZSCH, and E4991A RF impedance/material analysis manufactured by Agilent Technologies. The dielectric constant was measured using the RF/IV technique using an instrument.

Tables 1 to 3 are results of comparing the thermal conductivity and dielectric constant of Examples and Comparative Examples.

Experiment number Vertical thermal conductivity (W/mK) Horizontal thermal conductivity (W/mK) Dielectric constant Example 1 2.234 2.343 3.68 Comparative Example 1 0.443 0.502 3.50

Experiment number Vertical thermal conductivity (W/mK) Horizontal thermal conductivity (W/mK) Dielectric constant Example 8 5.231 5.926 4.18 Comparative Example 2 2.63 2.71 4.14

Experiment number Vertical thermal conductivity (W/mK) Horizontal thermal conductivity (W/mK) Dielectric constant Example 1 2.234 2.343 3.68 Example 2 4.002 4.536 3.80 Example 3 3.142 3.277 3.71 Example 4 3.403 3.851 3.78 Example 5 3.643 3.825 4.54 Example 6 5.013 5.316 4.11 Example 7 3.824 4.002 4.73 Example 8 5.231 5.926 4.18 Comparative Example 3 5.831 5.937 5.58 Comparative Example 4 5.456 6.002 5.12 Comparative Example 5 0.762 0.931 3.62

Referring to Table 1, the epoxy resin composition of Example 1 including glass fibers as a crystalline epoxy compound, a curing agent, and an inorganic filler was Comparative Example 1 including an amorphous epoxy compound, a curing agent, and glass fibers as an inorganic filler at the same content ratio. Although the dielectric constant of the epoxy resin composition is similar, it can be seen that the thermal conductivity is high.

Referring to Table 2, the epoxy resin composition of Example 8 including glass fibers as a crystalline epoxy compound, a curing agent, and an inorganic filler was Comparative Example 2 including an amorphous epoxy compound, a curing agent and glass fibers as an inorganic filler at the same content ratio. Although the dielectric constant of the epoxy resin composition is similar, it can be seen that the thermal conductivity is high.

In addition, referring to Table 3, it can be seen that the epoxy resin compositions of Examples 1 to 8 including glass fibers as inorganic fillers have a dielectric constant (less than 5) in a commercially available range. The epoxy resin composition of Comparative Example 3, which does not contain glass fibers as an inorganic filler, has higher thermal conductivity than the epoxy resin compositions of Examples 1 to 8, but the dielectric constant (5.58) is outside the commercially available range, so it is used as an insulating layer. You can see it is not appropriate In addition, it can be seen that Comparative Example 4 in which the glass fiber is contained in an amount of less than 25 wt% of the epoxy resin composition is not suitable for use as an insulating layer because the dielectric constant (5.12) is outside the commercially available range. In Comparative Example 5, in which the glass fiber is contained in an amount exceeding 55wt% of the epoxy resin composition, it can be seen that the dielectric constant (3.62) is a commercially available range, but the thermal conductivity is low.

Continuing to refer to Table 3, the thermal conductivity of the epoxy resin compositions of Examples 2 to 8 further containing boron nitride and/or alumina was higher than that of the epoxy resin composition of Example 1 containing only glass fibers as an inorganic filler. Can be seen. In addition, the epoxy resin composition of Example 6 containing 3 to 7 parts by weight of boron nitride and 3 to 5 parts by weight of alumina with respect to 10 parts by weight of glass fibers further included in Examples 2 to 5 and It can be seen that the dielectric constant of the epoxy resin composition of Example 7 is similar, but the thermal conductivity is higher.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. You will understand that you can do it.

100: printed circuit board
110: metal plate
120: insulating layer
130: circuit pattern

Claims (11)

3 to 60 wt% of an epoxy compound comprising a crystalline epoxy compound containing a mesogenic structure,
0.5 to 22 wt% of a curing agent,
Including 18 to 96.5wt% of an inorganic filler containing glass fiber,
The inorganic filler is an epoxy resin composition comprising 3 to 7 parts by weight of boron nitride and 3 to 5 parts by weight of alumina based on 10 parts by weight of the glass fiber. The method of claim 1,
The glass fiber is an epoxy resin composition containing 25 to 55wt% of the epoxy resin composition. delete The method of claim 2,
At least one of the boron nitride and alumina is an epoxy resin composition containing 1 to 25wt% of the epoxy resin composition. delete delete delete The method of claim 1,
The curing agent is an epoxy resin composition containing diaminodiphenylsulfone. The method of claim 1,
The epoxy compound is an epoxy resin composition further comprising an amorphous epoxy compound. Metal plate,
An insulating layer formed on the metal plate, and
It includes a circuit pattern formed on the insulating layer,
The insulating layer includes 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound containing a mesogenic structure, 0.5 to 22 wt% of a curing agent, and 18 to 96.5 wt% of an inorganic filler including glass fibers, and the inorganic filler A printed circuit board comprising an epoxy resin composition comprising 3 to 7 parts by weight of boron nitride and 3 to 5 parts by weight of alumina based on 10 parts by weight of the glass fiber. A plurality of circuit pattern layers sequentially arranged, and
And a plurality of insulating layers formed between the plurality of circuit pattern layers,
At least some of the insulating layers of the plurality of insulating layers are 3 to 60 wt% of an epoxy compound including a crystalline epoxy compound having a mesogenic structure, 0.5 to 22 wt% of a hardener, and 18 to 96.5 wt of an inorganic filler including glass fibers %, wherein the inorganic filler comprises 3 to 7 parts by weight of boron nitride and 3 to 5 parts by weight of alumina based on 10 parts by weight of the glass fiber.

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