TW200833745A - Prepreg, laminate and printed wiring board - Google Patents

Prepreg, laminate and printed wiring board

Info

Publication number
TW200833745A
TW200833745A TW096128613A TW96128613A TW200833745A TW 200833745 A TW200833745 A TW 200833745A TW 096128613 A TW096128613 A TW 096128613A TW 96128613 A TW96128613 A TW 96128613A TW 200833745 A TW200833745 A TW 200833745A
Authority
TW
Taiwan
Prior art keywords
prepreg
wiring board
printed wiring
epoxy resin
laminate
Prior art date
Application number
TW096128613A
Other languages
Chinese (zh)
Inventor
Masashi Kaji
Koichiro Ogami
Tomomi Fukunaga
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200833745A publication Critical patent/TW200833745A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a printed wiring board having excellent heat-dissipating property because of good heat conductivity of an insulating layer. Also disclosed are a prepreg which enables to obtain such a printed wiring board, and a laminate. Specifically disclosed is a prepreg obtained by impregnating a sheet-like fiber base with an epoxy resin composition containing an epoxy resin and a curing agent, and half-curing the composition. A diphenyl ether epoxy resin obtained by epoxydizing a dihydroxydiphenyl ether is used as a part or all of the epoxy resin. A printed wiring board and a laminate are obtained by arranging materials including the prepreg in layers and subjecting the resulting to heat-press molding. In the prepreg cured product obtained by heat-press molding of the prepreg, a resin layer is crystallized, while having a melting point of 120-280 DEG C.
TW096128613A 2006-08-07 2007-08-03 Prepreg, laminate and printed wiring board TW200833745A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214856 2006-08-07

Publications (1)

Publication Number Publication Date
TW200833745A true TW200833745A (en) 2008-08-16

Family

ID=39032896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128613A TW200833745A (en) 2006-08-07 2007-08-03 Prepreg, laminate and printed wiring board

Country Status (3)

Country Link
JP (1) JP5234962B2 (en)
TW (1) TW200833745A (en)
WO (1) WO2008018364A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477208B (en) * 2010-11-18 2015-03-11 Sumitomo Bakelite Co Semiconductor device
TWI735677B (en) * 2016-10-17 2021-08-11 日商大賽璐股份有限公司 Sheet-like prepreg

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443993B2 (en) * 2007-11-08 2014-03-19 新日鉄住金化学株式会社 Epoxy resin, production method thereof, epoxy resin composition and cured product
WO2009113392A1 (en) * 2008-03-13 2009-09-17 新日本製鐵株式会社 Electromagnetic steel sheet having insulating coating film with excellent thermal conductivity therein, and process for production thereof
TWI494341B (en) * 2008-03-31 2015-08-01 Nippon Steel & Sumikin Chem Co Epoxy resin compositions and shaped articles
JP5681151B2 (en) * 2012-09-03 2015-03-04 新日鉄住金化学株式会社 Epoxy resin composition and molded article
JP5681152B2 (en) * 2012-09-03 2015-03-04 新日鉄住金化学株式会社 Epoxy resin composition and molded article
KR101952356B1 (en) * 2012-12-14 2019-02-26 엘지이노텍 주식회사 Epoxy resin composite and printed circuit board using the same
CN112996836A (en) 2018-11-12 2021-06-18 东丽株式会社 Epoxy resin composition for fiber-reinforced composite material, cured epoxy resin, preform, and fiber-reinforced composite material
WO2022209715A1 (en) * 2021-03-30 2022-10-06 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition, prepreg, and fiber-reinforced plastic obtained using these

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140269A (en) * 1991-11-26 1993-06-08 Matsushita Electric Works Ltd Epoxy resin composition
JP3377241B2 (en) * 1993-02-16 2003-02-17 日本化薬株式会社 Method for producing epoxy resin, epoxy resin composition and cured product thereof
JP3374255B2 (en) * 1993-04-28 2003-02-04 新日鐵化学株式会社 Novel epoxy resin, method for producing the same, and epoxy resin composition using the same
JP4493748B2 (en) * 1999-07-13 2010-06-30 新日鐵化学株式会社 Epoxy resin, method for producing the same, epoxy resin composition and cured product thereof
JP2001329046A (en) * 2000-05-24 2001-11-27 Japan Epoxy Resin Kk Semiconductor sealing epoxy resin composition, resin sealed semiconductor device, and method for packaging semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477208B (en) * 2010-11-18 2015-03-11 Sumitomo Bakelite Co Semiconductor device
TWI735677B (en) * 2016-10-17 2021-08-11 日商大賽璐股份有限公司 Sheet-like prepreg

Also Published As

Publication number Publication date
JPWO2008018364A1 (en) 2009-12-24
WO2008018364A1 (en) 2008-02-14
JP5234962B2 (en) 2013-07-10

Similar Documents

Publication Publication Date Title
TW200833745A (en) Prepreg, laminate and printed wiring board
TW200732415A (en) A curable epoxy resin composition and laminates made therefrom
TW200732414A (en) A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
TW200635985A (en) Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition
TW200704735A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
CN103129042B (en) A kind of carbon fiber base fabric composite material and Synthesis and applications thereof
TW200504146A (en) Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg
MY141911A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
JP6624573B2 (en) Method for manufacturing metal-clad laminate, method for manufacturing printed wiring board, and method for manufacturing multilayer printed wiring board
WO2008087890A1 (en) Thermosetting resin composition
KR102054967B1 (en) Insulation materials, insulation composition comprising the same, substrate using the same
TW200702413A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
JP2016094608A5 (en)
JP5260400B2 (en) Multilayer board for producing multilayer printed wiring boards
US20130295388A1 (en) Epoxy resin composition and copper clad laminate manufactured by using same
MY150635A (en) Resin composition and resin coated copper foil obtained by using the resin composition
WO2008114858A1 (en) Resin composition for forming insulating layer of printed wiring board
WO2013095908A3 (en) Process for preparing cured epoxy composites
JP6481494B2 (en) Inorganic filler-containing cured epoxy resin and laminate using the same
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
WO2014040262A1 (en) Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
MY157363A (en) Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition
JP2017193691A5 (en)
JP2020117714A5 (en)
JP2018514616A5 (en)