JP6624573B2 - Method for manufacturing metal-clad laminate, method for manufacturing printed wiring board, and method for manufacturing multilayer printed wiring board - Google Patents

Description

The present invention relates to a method for manufacturing a metal-clad laminate used for manufacturing a printed wiring board and the like, a method for manufacturing a printed wiring board manufactured using the metal-clad laminate , and a method for manufacturing a multilayer printed wiring board. .

  Conventionally, as a metal-clad laminate, a flexible metal-clad laminate obtained by bonding a metal foil to an adhesive film is known (for example, see Patent Document 1). In particular, the adhesive film described in Patent Document 1 is a polyimide film provided with an adhesive layer containing a thermoplastic polyimide, wherein the polyimide film is a film obtained by partially imidizing a precursor polyamic acid. Is obtained by heating and stretching. Then, the occurrence of the dimensional change can be suppressed in this manner.

JP-A-2004-338160

  Although the above-mentioned flexible metal-clad laminate does not contain a base material inside, in recent years, a rigid metal-clad laminate containing a base material inside has also It is required to suppress the occurrence of dimensional change as in the case of the laminated laminate. Hereinafter, a rigid metal-clad laminate including a base material therein is simply referred to as a metal-clad laminate.

  FIG. 6B shows a dimensional change rate (+ indicates elongation and − indicates shrinkage) of a general metal-clad laminate after etching and aging. The etching process corresponds to a conductor pattern forming process, and the aging process corresponds to a heating process at the time of forming a resist for protecting the conductor pattern. As shown in FIG. 6B, when the dimension after molding is used as a reference, the dimension after etching is slightly reduced, and the dimension after aging is significantly reduced. As described above, in general, when the conductor pattern is formed and then significantly shrunk, the warp tends to increase, and when the warp increases, the possibility of occurrence of a defect in the component mounting process increases. In recent years, as the size and thickness of substrates have been reduced and mounting has become difficult, suppression of dimensional change with respect to the substrates has been demanded.

The present invention has been made in view of the above points, and has a method of manufacturing a metal-clad laminate, a method of manufacturing a printed wiring board , and a method of manufacturing a metal-clad laminate, which can reduce warpage and hardly cause problems in a mounting process. It is an object of the present invention to provide a method for manufacturing a printed wiring board.

The method for producing a metal-clad laminate according to the present invention includes a step of impregnating a resin composition containing a thermosetting resin into an opened glass cloth base material and a step of semi-curing the resin composition to form a prepreg. And a laminating step of curing the resin composition by laminating a metal foil on the prepreg and heating and pressurizing, wherein the laminating step includes heating and pressurizing. heating rate is the 200 to 350 ° C. / min, in the laminate forming step, the peak temperature is one hundred and forty to three hundred and fifty ° C., layered after etching process for removing the metal foil of the metal-clad laminate The dimensions of the plate increased compared to the dimensions of the metal-clad laminate before performing the etching process, and after performing the etching process, an aging process of heating at 150 ° C. for 30 minutes was further performed. The dimensions of the laminate are increased compared to the dimensions of the metal-clad laminate before the etching treatment, and the dimensions of the laminate after the aging treatment are increased after the etching treatment is performed. Is reduced as compared to the dimensions of

  The method for manufacturing a printed wiring board according to the present invention is a method for manufacturing a printed wiring board in which a conductive pattern is formed on both surfaces or one surface of an insulating layer cured by impregnating a resin composition into a glass cloth base material, Forming a conductive pattern by removing unnecessary portions of the metal foil of the metal-clad laminate.

  The method for manufacturing a multilayer printed wiring board according to the present invention is a method for manufacturing a multilayer printed wiring board having three or more conductive pattern layers, by removing unnecessary portions of the metal foil of the metal-clad laminate. Forming the conductive pattern.

  According to the present invention, it is possible to reduce the warpage and to make it difficult to cause a problem in the mounting process.

1 shows an example of a metal-clad laminate according to the present invention, in which (a) is a cross-sectional view of a double-sided metal-clad laminate, (b) is a cross-sectional view of a single-sided metal-clad laminate, and (c) is an entire metal foil. FIG. 4D is a cross-sectional view of the metal-clad laminate with the inner layer circuit removed, and FIG. 4E is a cross-sectional view of the metal-clad laminate with the inner layer circuit removed. It shows an example of the manufacturing process of the double-sided metal-clad laminate, and (a) and (b) are cross-sectional views. It is an example of a manufacturing process of a single-sided metal-clad laminate, and (a) and (b) are cross-sectional views. It is an example of a manufacturing process of a metal-clad laminate containing an inner layer circuit, and (a) to (c) are cross-sectional views. It is a top view which shows an example of a sample for dimensional change rate measurement. (A) is a graph showing an example of a dimensional change rate of the metal-clad laminate according to the present invention after the etching process and after the aging process, and (b) is a graph after the etching process and the aging process of a general metal-clad laminate. It is a graph which shows an example of the dimensional change rate after.

  Hereinafter, embodiments of the present invention will be described.

  As shown in FIGS. 2 to 4, the metal-clad laminate 5 according to the present invention is formed by laminating a metal foil 4 on both sides or one side of the prepreg 3 and applying heat and pressure, and is used as a material for a printed wiring board. In the metal-clad laminate 5, the prepreg 3 is cured to form an insulating layer 30 having electrical insulation. FIG. 1A shows a double-sided metal-clad laminate. FIG. 1B shows a single-sided metal-clad laminate. FIG. 1C shows the laminate 6 after the entire surface of the metal foil 4 of the metal-clad laminate 5 has been removed. FIG. 1D shows the metal-clad laminate 5 including the inner layer circuit 7 having the inner layer circuit 7 inside the insulating layer 30. FIG. 1E shows the laminated board 6 containing the inner circuit 7 after the metal foil 4 of the metal-clad laminated board 5 containing the inner circuit 7 has been entirely removed.

  Here, as the metal foil 4, for example, a copper foil, an aluminum foil, a stainless steel foil or the like can be used. The thickness of the metal foil 4 is, for example, 2 to 70 μm, but is not limited thereto.

  The prepreg 3 is formed by impregnating the base material 1 with the resin composition 2 and heating and drying the base material 1 until it becomes a semi-cured state (B-stage state).

  It is preferable that the resin composition 2 contains a thermosetting resin and a filler.

  Here, as the thermosetting resin, for example, an epoxy resin, a phenol resin, a cyanate resin, a melamine resin, an imide resin, or the like can be used. In particular, as the epoxy resin, for example, a polyfunctional epoxy resin, a bisphenol-type epoxy resin, a novolak-type epoxy resin, a biphenyl-type epoxy resin, or the like can be used.

  As the filler, for example, silica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, talc, alumina and the like can be used.

  Further, the filler is preferably contained in an amount of 50 to 80% by mass based on the total amount of the resin composition 2. As described above, when the content of the filler is 50% by mass or more, the dimensional change from after forming the metal-clad laminate 5 to after the etching process and the dimensional change from after the etching process to after the aging process are more improved. It can be made smaller. When the content of the filler is 80% by mass or less, the filler can be contained in the resin composition 2 while suppressing an increase in viscosity.

  The resin composition 2 may contain a curing agent and a curing accelerator.

  Here, as the curing agent, for example, a phenolic curing agent, a dicyandiamide curing agent, or the like can be used.

  As the curing accelerator, for example, imidazoles, phenol compounds, amines, organic phosphines and the like can be used.

  Then, in addition to the above-mentioned thermosetting resin, if necessary, a filler, a curing agent, and a curing accelerator can be blended to prepare the resin composition 2. The resin composition 2 can be further diluted with a solvent to obtain a resin composition. A varnish of Article 2 can be prepared. As the solvent, for example, methyl ethyl ketone, toluene, styrene, methoxypropanol and the like can be used.

  As the substrate 1, for example, a material made of inorganic fibers such as glass cloth, glass paper, and glass mat, and a material made of organic fibers such as aramid cloth can be used. The thickness of the substrate 1 is, for example, 20 to 200 μm, but is not limited thereto.

  In producing the prepreg 3, first, the base material 1 is impregnated with the resin composition 2. Next, the prepreg 3 can be obtained by heating and drying this until it becomes a semi-cured state. The heating temperature at this time is, for example, 100 to 200 ° C., and the heating time is, for example, 1 to 10 minutes, but is not limited thereto. Further, the content (resin content) of the resin composition 2 is preferably 40 to 75% by mass based on the total amount of the prepreg 3.

  The metal-clad laminate 5 according to the present invention is formed as follows.

  That is, the metal-clad laminate 5 which is a double-sided metal-clad laminate is formed by laminating the metal foil 4 on both sides of the prepreg 3 as shown in FIGS. 2 (a) and 2 (b). In this case, the metal foil 4 may be laminated and molded on both surfaces of one prepreg 3 or a plurality of prepregs 3 may be laminated and the metal foil 4 may be laminated and molded on both surfaces. The thickness of the metal-clad laminate 5 is preferably 0.2 mm or less (the lower limit is 0.015 mm). This makes it possible to reduce the size and thickness of the printed wiring board.

  The metal-clad laminate 5 which is a single-sided metal-clad laminate is formed by laminating a metal foil 4 on one side of the prepreg 3 as shown in FIGS. In this case, the metal foil 4 may be laminated and molded on one surface of one prepreg 3 or a plurality of prepregs 3 may be laminated and the metal foil 4 may be laminated and molded on one surface thereof, The thickness of the metal-clad laminate 5 is preferably 0.2 mm or less (the lower limit is 0.015 mm). This makes it possible to reduce the size and thickness of the printed wiring board. The metal foil 4 on one side of the double-sided metal-clad laminate may be entirely removed to form a single-sided metal-clad laminate.

  Further, as for the metal-clad laminate 5 containing the inner layer circuit 7, first, a core material 8 shown in FIG. 4A is manufactured, and then, as shown in FIGS. 4B and 4C, one of the prepregs 3 is formed. And the metal foil 4 is laminated on the other surface. The core material 8 is manufactured, for example, by providing a conductor pattern on one surface of a double-sided metal-clad laminate by a subtractive method, or by providing a conductor pattern by an additive method on a surface of the single-sided metal-clad laminate without the metal foil 4. And can be manufactured. The conductor pattern thus provided is embedded in the insulating layer 30 to form the inner circuit 7. In the above case, the number of prepregs 3 sandwiched between the core material 8 and the metal foil 4 may be one or more, but the thickness of the metal-clad laminate 5 containing the inner layer circuit 7 is 0.2 mm or less. (The lower limit is preferably 0.015 mm). This makes it possible to reduce the size and thickness of the printed wiring board.

  Each of the above-mentioned lamination moldings can be performed by heating and pressing using, for example, a multi-stage vacuum press, a double belt press, a linear pressure roll, a vacuum laminator, or the like. In this case, the rate of temperature rise during heating and pressurization is preferably 200 ° C./min or more. Thereby, the metal-clad laminate 5 exhibiting a characteristic dimensional change behavior as shown in FIG. 6A described later can be easily obtained. The upper limit of the heating rate is 350 ° C./min, but is not limited to this. Further, it is preferable that the peak temperature during lamination molding is 140 to 350 ° C., the molding pressure is 0.5 to 6.0 MPa, and the molding time is 1 to 240 minutes.

  The behavior of the dimensional change of the metal-clad laminate 5 manufactured as described above is as follows. FIG. 6A shows the dimensional change rate (+ indicates elongation and − indicates shrinkage) of the metal-clad laminate 5 according to the present invention after the etching process and the aging process.

As shown in FIG. 6A, when the dimensions of the metal-clad laminate 5 after molding, that is, the dimensions of the metal-clad laminate 5 before performing the etching process, are used as a reference, the laminate after the etching process is performed. The size of 6 is likely to increase. Thereby, the strain inside the laminated plate 6 can be removed. Since the above-described etching process corresponds to a conductor pattern forming step, it means that the strain inside the laminate 6 can be removed when the conductor pattern is formed. The dimensional change rate at this time can be calculated according to, for example, JIS C6481. First, the distance between any two points on the surface of the metal-clad laminate 5 before the etching process is measured, and this is defined as _L0 . Next, after performing an etching treatment by removing the entire metal foil 4 of the metal-clad laminate 5 using an etching solution containing cupric chloride or the like as a main component, the distance between the two points is measured again. This is referred to as _{L 1} Te. Then, it is possible by the following equation (1) to calculate the dimensional change rate S ₁ after the etching treatment.

S ₁ = (L ₁ −L ₀ ) × 100 / L ₀ (%) (1)
When the dimensional change rate of the laminated plate 6 after the etching treatment is specifically calculated by the above equation (1), the dimensional change rate of the metal-clad laminate 5 according to the present invention exceeds 0% to 0%. .1% or less. Thus, the strain inside the laminate 6 can be removed with a minimum dimensional change.

Further, as shown in FIG. 6A, when the dimensions of the laminated plate 6 after the etching process are used as a reference, the dimensions of the laminated plate 6 after further performing the aging process after the etching process hardly change. The dimensional change rate at this time can also be calculated according to, for example, JIS C6481. After the aging treatment by heating for 30 minutes the laminate 6 after the etching treatment at 0.99 ° C., which is referred to as L ₂ by measuring the distance between two points in the re. Then, it is possible to calculate the dimensional change rate S ₂ after aging treatment by the following equation (2).

S ₂ = (L ₂ −L ₁ ) × 100 / L ₁ (%) (2)
When the dimensional change rate of the laminated board 6 after the aging treatment is specifically calculated by the above equation (2), the dimensional change rate of the metal-clad laminate 5 according to the present invention is ± 0.03%. Within the range. As described above, the dimensions of the metal-clad laminate 5 according to the present invention hardly change even when the aging treatment is performed after the etching treatment. This aging treatment is equivalent to a heating step at the time of forming a resist for protecting the conductor pattern. However, after such a heating step, the warpage can be reduced, and a problem occurs in a subsequent component mounting step. It can be difficult.

  The printed wiring board according to the present invention is formed by providing a conductor pattern on both surfaces or one surface of the metal-clad laminate 5 described above. The formation of the conductor pattern can be performed by, for example, a subtractive method, an additive method, or the like.

  Further, a multilayer printed wiring board according to the present invention is formed by providing at least three or more conductive pattern layers using the above printed wiring board. The printed wiring board usually has two or less conductive pattern layers, but a multilayer printed wiring board having three or more conductive pattern layers can be manufactured as follows.

  That is, although not shown, the multilayer printed wiring board according to the present invention has a metal foil 4 laminated on both sides or one side of the printed wiring board via the prepreg 3, and unnecessary portions of the metal foil 4 are unnecessary. And a layer of a conductor pattern is provided. In this case, it is preferable to use the prepreg 3 described above, but other prepregs 3 may be used. Further, as the metal foil 4, the same one as described above can be used. The lamination molding and molding conditions are the same as in the case of manufacturing the metal-clad laminate 5 described above. The formation of the conductor pattern can be performed in the same manner as when manufacturing a printed wiring board. That is, when there is a metal foil 4, a conductor pattern layer can be formed by a subtractive method, and when there is no metal foil 4, a conductor pattern layer can be formed by an additive method. Further, a multilayer printed wiring board may be manufactured by forming a conductive pattern layer on both sides of the metal-clad laminate 5 containing the inner layer circuit 7 shown in FIG. 1D by a subtractive method. In the multilayer printed wiring board, the number of layers of the conductor pattern is not particularly limited.

  Hereinafter, the present invention will be described specifically with reference to Examples.

(Example 1)
“HP9500” and “N540” manufactured by DIC Corporation were used as thermosetting resins.

  As the filler, silica “YC100C-MLE” and “S0-25R” manufactured by Admatechs Co., Ltd. were used.

  As a curing agent, “TD2090” manufactured by DIC Corporation, which is a phenolic curing agent, was used.

  As a curing accelerator, imidazole "2E4MZ" manufactured by Shikoku Chemicals Co., Ltd. was used.

  As the substrate 1, a glass cloth “1037 cloth” (29 μm thickness) manufactured by Nitto Boseki Co., Ltd. was used.

  And the above-mentioned thermosetting resin ("HP9500": 46.51 mass parts, "N540": 19.94 mass parts), filler ("YC100C-MLE": 50 mass parts, "S0-25R": 250 mass parts) Parts), a curing agent ("TD2090": 33.55 parts by mass), and a curing accelerator ("2E4MZ": 0.05 parts by mass), and further diluted with a solvent (methyl ethyl ketone) to prepare the resin composition 2. A varnish was prepared.

  Next, the varnish was impregnated into the base material 1 and heated and dried in a drying furnace at 150 ° C. for 3 minutes until it became a semi-cured state, thereby producing a prepreg 3. The content (resin content) of the resin composition 2 was 59% by mass based on the total amount of the prepreg 3.

Next, two sheets of the prepreg 3 are stacked, and a copper foil (“3EC-VLP”, manufactured by Mitsui Mining & Smelting Co., Ltd., 500 mm × 500 mm × 18 μm in thickness) is formed as a metal foil 4 on both surfaces by molding. As a metal-clad laminate 5, a double-sided metal-clad laminate (0.096 mm in thickness) as shown in FIG. The above-mentioned lamination molding was performed by heating and pressing using a multi-stage vacuum press. The heating rate during heating and pressurization was 250 ° C./min, the peak temperature was 250 ° C., the molding pressure was 3.9 MPa (40 kgf / cm ² ), and the molding time was 5 minutes.

Next, the above-mentioned metal-clad laminate 5 was cut out into a square of 50 mm, and this was used as a sample for measuring the dimensional change, and any two points in two orthogonal directions (X direction and Y direction) on the surface of this sample were measured. Were measured, and these were defined as L ₀ (X) and L ₀ (Y), respectively (see FIG. 5).

Next, after performing an etching process by removing the entire metal foil 4 of the metal-clad laminate 5 using an etching solution containing cupric chloride or the like as a main component, the interval between the two points in the above two directions is performed. Was measured again, and these were defined as L ₁ (X) and L ₁ (Y), respectively. Then, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching process were calculated by the above equation (1). The results are shown below.

S ₁ (X) = + 0.03%
S ₁ (Y) = + 0.03%
Next, after performing the aging treatment by heating the laminated plate 6 after the etching treatment at 150 ° C. for 30 minutes, the interval between the two points in the above two directions is measured again, and these are measured as L ₂ (X). And L ₂ (Y). Then, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated by the above equation (2). The results are shown below.

S ₂ (X) = + 0.01%
S ₂ (Y) = + 0.01%
Then, the laminated plate 6 was placed on a surface plate with a convex surface facing upward without any load, and the maximum amount of warpage of the laminated plate 6 was measured by a static method according to JIS C6481. As a result, the maximum warpage was 1.1 mm.

(Example 2)
"EPPN502H" manufactured by Nippon Kayaku Co., Ltd. was used as the thermosetting resin.

  As a filler, silica, "YC100C-MLE", "S0-25R" and "S0-C6" manufactured by Admatechs Co., Ltd. was used.

  As the curing agent, a phenolic curing agent “MEH7600” manufactured by Meiwa Kasei Co., Ltd. was used.

  As a curing accelerator, imidazole "2E4MZ" manufactured by Shikoku Chemicals Co., Ltd. was used.

  As the substrate 1, a glass cloth “1037 cloth” (29 μm thickness) manufactured by Nitto Boseki Co., Ltd. was used.

  And the above-mentioned thermosetting resin ("EPPN502H": 62.83 mass parts), filler ("YC100C-MLE": 50 mass parts, "S0-25R": 100 mass parts, "S0-C6": 50 mass parts) Parts), a curing agent ("MEH7600": 37.17 parts by mass), and a curing accelerator ("2E4MZ": 0.05 parts by mass), and further diluted with a solvent (methyl ethyl ketone) to prepare the resin composition 2. A varnish was prepared.

  Next, a prepreg 3 (resin content: 59% by mass) was produced in the same manner as in Example 1 except that the above-described varnish was used, and a metal-clad laminate 5 was produced using the prepreg 3.

Next, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₁ (X) = + 0.02%
S ₁ (Y) = + 0.02%
Next, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₂ (X) = + 0.03%
S ₂ (Y) = + 0.03%
Then, the maximum amount of warpage of the laminate 6 was measured in the same manner as in Example 1. As a result, the maximum amount of warpage was 1.3 mm.

(Example 3)
As the base material 1, a glass cloth “1036 cloth” (28 μm thickness) manufactured by Nitto Boseki Co., Ltd. was used.

  A varnish of Resin Composition 2 was prepared in the same manner as in Example 1.

  Next, a prepreg 3 (resin content: 51% by mass) was produced in the same manner as in Example 1 except that the varnish and the substrate 1 were used, and a metal-clad laminate 5 was prepared using the prepreg 3. Was manufactured.

Next, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₁ (X) = + 0.03%
S ₁ (Y) = + 0.03%
Next, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₂ (X) = + 0.02%
S ₂ (Y) = + 0.01%
Then, the maximum amount of warpage of the laminate 6 was measured in the same manner as in Example 1. As a result, the maximum amount of warpage was 0.9 mm.

(Example 4)
A copper foil (“3EC-VLP”, manufactured by Mitsui Mining & Smelting Co., Ltd., 500 mm × 500 mm × 18 μm in thickness) was formed as a metal foil 4 on both surfaces of one prepreg 3 similar to that of Example 1 by molding. As the metal-clad laminate 5, a double-sided metal-clad laminate (0.066 mm in thickness) was manufactured. The above-described lamination molding was performed by heating and pressing using a multi-stage vacuum press. The heating rate during heating and pressurization was 250 ° C./min, the peak temperature was 250 ° C., the molding pressure was 3.9 MPa (40 kgf / cm ² ), and the molding time was 5 minutes.

  Next, a core material 8 was manufactured by providing a conductor pattern on one surface of the double-sided metal-clad laminate by a subtractive method.

  Next, a core material 8 is laminated on one surface of one of the prepregs 3 and a metal foil 4 is laminated on the other surface of the prepreg 3 to form a metal-clad laminate 5 containing an inner layer circuit 7 (thickness: 0.120 mm). The lamination molding was performed in the same manner as in the production of the double-sided metal-clad laminate.

Next, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₁ (X) = + 0.02%
S ₁ (Y) = + 0.02%
Next, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₂ (X) = + 0.03%
S ₂ (Y) = + 0.03%
Then, the maximum amount of warpage of the laminate 6 was measured in the same manner as in Example 1. As a result, the maximum amount of warpage was 3.1 mm.

(Comparative Example 1)
Two prepregs 3 similar to those in Example 1 are stacked, and a copper foil (“3EC-VLP”, manufactured by Mitsui Mining & Smelting Co., Ltd., 500 mm × 500 mm × 18 μm in thickness) is laminated and molded on both surfaces of the prepreg 3. Thus, a double-sided metal-clad laminate (thickness: 0.096 mm) was manufactured as the metal-clad laminate 5. The above-described lamination molding was performed by heating and pressing using a multi-stage vacuum press. The heating rate during heating and pressing was 3 ° C./min, the peak temperature was 220 ° C., the molding pressure was 3.9 MPa (40 kgf / cm ² ), and the molding time was 80 minutes.

Next, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₁ (X) = + 0.01%
S ₁ (Y) = + 0.01%
Next, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₂ (X) = − 0.05%
_{S 2 (Y) = - 0.05} %
Then, the maximum amount of warpage of the laminate 6 was measured in the same manner as in Example 1. As a result, the maximum amount of warpage was 2.5 mm.

(Comparative Example 2)
“HP9500” and “N540” manufactured by DIC Corporation were used as thermosetting resins.

  As the filler, silica “S0-25R” manufactured by Admatechs Co., Ltd. was used.

  As a curing agent, “TD2090” manufactured by DIC Corporation, which is a phenolic curing agent, was used.

  As a curing accelerator, imidazole "2E4MZ" manufactured by Shikoku Chemicals Co., Ltd. was used.

  As the substrate 1, a glass cloth “1036 cloth” (28 μm thick) manufactured by Nitto Boseki Co., Ltd. was used.

  Then, the above thermosetting resin (“HP9500”: 46.51 parts by mass, “N540”: 19.94 parts by mass), a filler (“S0-25R”: 300 parts by mass), and a curing agent (“TD2090”: 33.55 parts by mass) and a curing accelerator (“2E4MZ”: 0.05 parts by mass) were blended, and further diluted with a solvent (methyl ethyl ketone) to prepare a varnish of Resin Composition 2.

  Next, a prepreg 3 (resin content: 72% by mass) was produced in the same manner as in Comparative Example 1 except that the varnish and the base material 1 were used, and the prepreg 3 was used to prepare a metal-clad laminate 5. Was manufactured.

Next, the dimensional change rates S ₁ (X) and S ₁ (Y) after the etching treatment were calculated in the same manner as in Example 1. The results are shown below.

S ₁ (X) = − 0.02%
S ₁ (Y) = − 0.02%
Next, the dimensional change rates S ₂ (X) and S ₂ (Y) after the aging treatment were calculated in the same manner as in Example 1. The results are shown below.

_{S 2 (X) = - 0.06} %
_{S 2 (Y) = - 0.06} %
Then, the maximum amount of warpage of the laminate 6 was measured in the same manner as in Example 1. As a result, the maximum amount of warpage was 3.7 mm.

REFERENCE SIGNS LIST 1 base material 2 resin composition 3 prepreg 4 metal foil 5 metal-clad laminate 6 laminate

Claims (13)

A step of impregnating a resin composition containing a thermosetting resin into an opened fiber cloth substrate,
A step of semi-curing the resin composition to form a prepreg,
A lamination molding step of curing the resin composition by heating and pressing a metal foil on the prepreg, and a method of manufacturing a metal-clad laminate,
In the laminate forming step, heating rate during heating and pressurization is 200 to 350 ° C. / min,
In the lamination molding step, the peak temperature is 140 to 350 ° C.,
The dimensions of the laminate after performing the etching process for removing the metal foil of the metal-clad laminate are increased compared to the dimensions of the metal-clad laminate before performing the etching process,
The dimensions of the laminate after performing the aging treatment of heating at 150 ° C. for 30 minutes after performing the etching treatment are increased as compared with the dimensions of the metal-clad laminate before performing the etching treatment,
The dimensions of the laminate after performing the aging process are reduced as compared to the dimensions of the laminate after performing the etching process,
A method for manufacturing a metal-clad laminate. Based on the dimensions of the laminate after the etching, the dimensional change of the laminate after the aging is in the range of −0.03% or more and less than 0%.
A method for producing a metal-clad laminate according to claim 1 . Including a filler in the resin composition,
Method for producing a metal-clad laminate according to claim 1 or 2. The resin composition contains the filler in an amount of 50 to 80% by mass,
The method for producing a metal-clad laminate according to claim 3 .   In the lamination molding step, the molding pressure is 0.5 to 6.0 MPa.
  A method for producing a metal-clad laminate according to any one of claims 1 to 4.   In the lamination molding step, the molding time is 1 to 240 minutes,
  A method for producing a metal-clad laminate according to any one of claims 1 to 5.   In the step of forming the prepreg, the heating temperature is 100 to 200 ° C.
  A method for producing a metal-clad laminate according to any one of claims 1 to 6.   In the step of forming the prepreg, the heating time is 1 to 10 minutes,
  A method for producing a metal-clad laminate according to any one of claims 1 to 7.   The content (resin content) of the resin composition with respect to the total amount of the prepreg is 40 to 75% by mass,
  A method for producing a metal-clad laminate according to any one of claims 1 to 8.   The resin composition contains a phenolic curing agent as a curing agent,
  A method for producing a metal-clad laminate according to any one of claims 1 to 9.   The thermosetting resin is one or more resins selected from the group consisting of an epoxy resin, a phenol resin, a cyanate resin, a melamine resin, and an imide resin,
  A method for producing a metal-clad laminate according to any one of claims 1 to 10. A method for manufacturing a printed wiring board in which a conductive pattern is formed on both surfaces or one surface of an insulating layer cured and impregnated with a resin composition in a glass cloth base material,
A step of forming the conductor pattern by removing an unnecessary portion of the metal foil of the metal-clad laminate obtained by the manufacturing method according to any one of claims 1 to 11 ,
Manufacturing method of printed wiring board. A method for producing a multilayer printed wiring board having three or more conductive pattern layers,
A step of forming the conductor pattern by removing an unnecessary portion of the metal foil of the metal-clad laminate obtained by the manufacturing method according to any one of claims 1 to 11 ,
A method for manufacturing a multilayer printed wiring board.

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