CN103813612A - Metal-clad laminate, printed wiring board, and multilayer printed wiring board - Google Patents
Metal-clad laminate, printed wiring board, and multilayer printed wiring board Download PDFInfo
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- CN103813612A CN103813612A CN201310552196.0A CN201310552196A CN103813612A CN 103813612 A CN103813612 A CN 103813612A CN 201310552196 A CN201310552196 A CN 201310552196A CN 103813612 A CN103813612 A CN 103813612A
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- metal
- clad
- etch processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a metal-clad laminate which can reduce warpage to prevent bad conditions generated during the installation. The metal-clad laminate (5) is formed by the following steps, namely, immersing a resin composition (2) to a substrate (1) and forming a pre-preg member (3) through semi-solidification, and then overlapping a metal foil (4) on the pre-preg member (3), and applying heating and pressure. On the basis of taking the size of a laminate (6) after the removing of the metal foil (4) of the metal-clad laminate (5) by means of etching as a reference, the size variation of the laminate (6) after being etched and aged is in the range of +/-0.03%.
Description
Technical field
The present invention relates to metal-clad used in the manufacture of printed circuit board etc. and use printed circuit board and the multilayer printed circuit board that its manufactures.
Background technology
In the past, as metal-clad, known had a flexible metal-coated lamination (for example, with reference to patent documentation 1) obtaining by the metal forming of fitting on adhesive foil.The adhesive foil of particularly recording in patent documentation 1 is the film that is provided with the adhesive layer that contains thermoplastic polyimide on polyimide film, above-mentioned polyimide film be to using as the polyamic acid of presoma partly the film after imidizate heat stretch processing and film.In addition, the rear generation that just can suppress change in size is so set.
Prior art document
Patent documentation
Above-mentioned flexible metal-coated lamination does not contain base material in inside, but in recent years, for the rigidity metal-clad that contains base material in inside, also to tackle miniaturization, slimming, therefore require to suppress in the same manner with flexible metal-coated lamination the generation of change in size.And, below by the rigidity metal-clad that contains base material in inside referred to as metal-clad.
Fig. 6 (b) is the figure of size changing rate after representing the etch processes of common metal-clad and after burin-in process (+for extending ,-for shrinking).Etch processes is equivalent to the formation operation of conductive pattern, heating process when burin-in process is equivalent to form for the protection of the resist of conductive pattern.As shown in Fig. 6 (b), in the size after shaping, as benchmark, the size after etch processes is shunk slightly, and the size after burin-in process is significantly shunk in addition.Like this, in general, in the time significantly shrinking after formation conductive pattern, just have warpage and become large trend, once warpage becomes greatly, in parts installation procedure, producing the not possibility of good situation will raise.Recently, miniaturization, the slimming of substrate constantly advance, and install and become difficulty, thereby require to suppress the change in size with respect to substrate.
Summary of the invention
The present invention completes in view of the above-mentioned problems, and its object is, provides can reduce warpage and make in installation procedure, to be difficult to produce not metal-clad and printed circuit board and the multilayer printed circuit board of good situation.
Metal-clad of the present invention is characterised in that, be to base material infiltration resin combination and its semi-solid preparation is formed after prepreg, after described prepreg stack metal forming, heat the metal-clad that pressurization forms, wherein the plywood after the etch processes of the described metal forming to remove described metal-clad is of a size of benchmark, in the scope that the size changing rate that carries out carrying out again after described etch processes the plywood after burin-in process is ± 0.03%.
Preferably, in described metal-clad, in the case of being of a size of benchmark with the metal-clad carrying out before described etch processes, carry out the size increase of the plywood after described etch processes.
Preferably in described metal-clad, in the case of being of a size of benchmark with the metal-clad carrying out before described etch processes, the size changing rate that carries out the plywood after described etch processes is below 0.1%.
Preferably in described metal-clad, the filler that contains 50～80 quality % in described resin combination.
Preferably, in described metal-clad, the thickness of described metal-clad is below 0.2mm.
Preferably, in described metal-clad, programming rate when described heating pressurization is more than 200 ℃/min.
Printed circuit board of the present invention is characterised in that, on the two sides of described metal-clad or one side conductive pattern be set form.
Multilayer printed circuit board of the present invention is characterised in that, is to use described printed circuit board, the layer of at least 3 layers of above described conductive pattern is set and formation.
According to the present invention, can reduce warpage and make to be difficult in installation procedure to produce not good situation.
Accompanying drawing explanation
Fig. 1 is the figure that represents an example of metal-clad of the present invention, (a) be the profile of two-sided metal-clad, (b) be the profile of one side metal-clad, (c) be the profile of the plywood after the metal forming of all is removed, (d) being the profile that has added the metal-clad of internal layer circuit, is (e) plywood after the metal forming of all is removed, that added internal layer circuit.
Fig. 2 is the figure that represents an example of the manufacturing process of two-sided metal-clad, (a), (b) be profile.
Fig. 3 is the figure that represents an example of the manufacturing process of one side metal-clad, (a), (b) be profile.
Fig. 4 is the figure that has represented to add an example of the manufacturing process of the metal-clad of internal layer circuit, (a)～and (c) be profile.
Fig. 5 is the vertical view that represents an example of size changing rate mensuration sample.
Fig. 6 (a) is the curve chart of an example of the size changing rate after representing the etch processes of metal-clad of the present invention and after burin-in process, is (b) curve chart of an example of the size changing rate after representing the etch processes of common metal-clad and after burin-in process.
Wherein, 1 base material, 2 resin combinations, 3 prepregs, 4 metal formings, 5 metal-clads, 6 plywoods
Embodiment
Below, embodiments of the present invention are described.
As shown in Figure 2 to 4, metal-clad 5 of the present invention is that metal forming 4 is superimposed upon to two sides or the rear heating pressurization of one side of prepreg 3 and forms, and it is as materials'use used for printed circuit board.In metal-clad 5, prepreg 3 solidifies, and forms the insulating barrier 30 with electrical insulating property.Fig. 1 (a) represents two-sided metal-clad.Fig. 1 (b) represents one side metal-clad.Plywood 6 after the metal forming 4 of all of metal-clad 5 is removed in Fig. 1 (c) expression.The inside that Fig. 1 (d) is illustrated in insulating barrier 30 has metal-clad 5 internal layer circuit 7, that added internal layer circuit 7.Plywood 6 after Fig. 1 (e) represents the metal forming 4 of all of metal-clad 5 that has added internal layer circuit 7 to remove, that added internal layer circuit 7.
Here as metal forming 4, for example, can use Copper Foil, aluminium foil, stainless steel foil etc..The thickness of metal forming 4 is for example 2～70 μ m, but is not limited thereto.
In addition, prepreg 3 is by resin combination 2 is infiltrated to base material 1 when, is heated that dry solidification forms to semi-cured state (second scalariform state).
Above-mentioned resin combination 2 preferably contains heat-curing resin and filler.
Here as heat-curing resin, for example, can use epoxy resin, phenolic resins, cyanate ester resin, melamine resin, imide resin etc..Particularly as epoxy resin, for example, can use polyfunctional epoxy resin, bisphenol-type epoxy resin, linear phenolic resin varnish type epoxy resin, biphenyl type epoxy resin etc.
In addition, as filler, for example, can use silicon dioxide, aluminium hydroxide, magnesium hydroxide, calcium carbonate, talcum, aluminium oxide etc.
In addition, the filler that preferably contains 50～80 quality % with respect to the total amount of resin combination 2.Like this, be more than 50 quality % by making the content of filler, just can further reduce after the shaping of metal-clad 5 to after the change in size after etch processes and etch processes to the change in size after burin-in process.In addition, if the content of filler is below 80 quality %, can, in suppressing the rising of viscosity, make to contain filler in resin combination 2.
In addition, resin combination 2 also can contain curing agent and curing accelerator.
Here,, as curing agent, for example can use phenol is curing agent, dicy-curing agent etc.
In addition, as curing accelerator, for example, can use imidazoles, phenolic compounds, amine, organic phosphine class etc.
In addition, by except above-mentioned heat-curing resin, also coordinate as required filler, curing agent, curing accelerator, can prepare resin combination 2, by being used solvent dilution, can prepare the varnish of resin combination 2 in addition.As solvent, for example, can use methylethylketone, toluene, styrene, methoxypropanol etc.
As base material 1, for example, can use the material being formed by inorfil, the material being formed by organic fiber as glass cloth, glassine paper, glass mat etc. as aramid fiber cloth etc.The thickness of base material 1 is for example 20～200 μ m, but is not limited thereto.
Manufacturing when prepreg 3, first to base material 1 resin combination 2 that infiltrates.Then be dried to semi-cured state and just can obtain prepreg 3 by being heated.Heating-up temperature is now for example 100～200 ℃, and be for example 1～10 minute heating time, but be not limited thereto.In addition, with respect to the total amount of prepreg 3, the content of resin combination 2 (resin content) is preferably 40～75 quality %.
In addition, metal-clad 5 of the present invention forms as shown below.
That is, as Fig. 2 (a) (b) as shown in, as the metal-clad 5 of two-sided metal-clad be at the two sides of above-mentioned prepreg 3 laminated metal paper tinsel 4 and form.In this situation, both can be shaped at the two sides of 1 prepreg 3 laminated metal paper tinsel 4, also multi-disc prepreg 3 can be superposeed, be shaped at its two sides laminated metal paper tinsel 4, but the thickness of metal-clad 5 is preferably 0.2mm following (under be limited to 0.015mm).So just can realize miniaturization and the slimming of printed circuit board.
In addition, as Fig. 3 (a) (b) as shown in, be to form at laminated metal paper tinsel 4 of above-mentioned prepreg 3 as the metal-clad 5 of one side metal-clad.In this situation, both can be shaped at of a 1 prepreg 3 laminated metal paper tinsel 4, also multi-disc prepreg 3 can be superposeed, in the folded metal forming 4 of one surface layer and be shaped, but the thickness of metal-clad 5 is preferably 0.2mm following (under be limited to 0.015mm).So just can realize miniaturization and the slimming of printed circuit board.And, also the metal forming of the one side of two-sided metal-clad 4 can be removed comprehensively and form one side metal-clad.
In addition, for the metal-clad 5 that has added internal layer circuit 7, first the core 8 shown in shop drawings 4 (a), then as shown in Fig. 4 (b), (c), fold core 8, fold metal forming 4 and form at another surface layer at a surface layer of above-mentioned prepreg 3.Core 8 for example can utilize subraction that conductive pattern is set and manufacture in the one side of two-sided metal-clad, or utilizes additive process that conductive pattern is set and manufacture in the one side that there is no metal forming 4 of one side metal-clad.The conductive pattern so arranging is embedded in insulating barrier 30 and just becomes internal layer circuit 7.In addition, above-mentioned in the situation that, the prepreg 3 being held between core 8 and metal forming 4 can be both 1, can be also multi-disc, but had added the thickness of the metal-clad 5 of internal layer circuit 7 to be preferably 0.2mm following (under be limited to 0.015mm).So just can realize miniaturization and the slimming of printed circuit board.
In addition, above-mentionedly each cascading into shapely for example can use the enforcement heating pressurizations such as multi-stage vacuum forcing press, double belt press, line pressure roller, vacuum layer pressure machine and carry out.Programming rate when heating in this situation is pressurizeed is preferably more than 200 ℃/min.Like this, just can easily obtain and there is the metal-clad 5 of the distinctive change in size shown in Fig. 6 (a) as described later.On programming rate, be limited to 350 ℃/min, but be not limited thereto.In addition, preferred peak temperature time cascading into shape is 140～350 ℃, and forming pressure is 0.5～6.0MPa, and curring time is 1～240 minute.
For the metal-clad 5 of manufacturing as described above, change in size is as follows.Fig. 6 (a) is the figure of size changing rate after representing the etch processes of metal-clad 5 of the present invention and after burin-in process (+for extending ,-for shrinking).
As shown in Fig. 6 (a), the metal-clad 5 in the size of the metal-clad 5 with after being shaped, carrying out before etch processes is of a size of benchmark, and the size of carrying out the plywood 6 after etch processes easily increases.The strain of inside that so just can shielding layer lamination 6.Because above-mentioned etch processes is equivalent to the formation operation of conductive pattern, therefore mean in the time forming conductive pattern also the strain of inside that can shielding layer lamination 6.Size changing rate now for example can calculate according to JIS C6481.First, determine the surperficial interval between 2 arbitrarily of the metal-clad 5 before etch processes and be made as L
0.Then as the etching solution of principal component, the metal forming 4 of all of metal-clad 5 is removed and carry out after etch processes using copper chloride etc. by using, again measure the interval between above-mentioned 2, be made as L
1.Like this, just can utilize following formula (1) to calculate the size changing rate S after etch processes
1.
S
1=(L
1-L
0)×100/L
0(％)…(1)
When utilizing above-mentioned formula (1), while calculating particularly the size changing rate of the plywood 6 after etch processes, for metal-clad 5 of the present invention, above-mentioned size changing rate easily exceedes 0% and be below 0.1%.Like this, just can carry out by minimal change in size the strain of the inside of shielding layer lamination 6.
In addition, as shown in Fig. 6 (a), be of a size of benchmark at the plywood 6 with after etch processes, the size of carrying out again the plywood 6 after burin-in process after etch processes there is no variation.Size changing rate now for example also can calculate according to JIS C 6481.Within 30 minutes, carry out, after burin-in process, again measuring the interval between above-mentioned 2 by the plywood after etch processes 6 is heated at 150 ℃, be made as L
2.Like this, just can utilize following formula (2) to calculate the size changing rate S after burin-in process
2.
S
2=(L
2-L
1)×100/L
1(％)…(2)
When utilizing above-mentioned formula (2), while calculating particularly the size changing rate of the plywood 6 after burin-in process, for metal-clad 5 of the present invention, above-mentioned size changing rate is ± 0.03% scope in.Like this, even if metal-clad of the present invention 5 carries out burin-in process after etch processes, size also there is no variation.Heating process when this burin-in process is equivalent to form for the protection of the resist of conductive pattern, and can reduce warpage after this kind of heating process finishes, can make to be difficult to produce not good situation in the installation procedure of parts thereafter.
In addition, printed circuit board of the present invention on the two sides of above-mentioned metal-clad 5 or one side conductive pattern be set form.The formation of conductive pattern for example can utilize subraction, additive process etc. to carry out.
In addition, multilayer printed circuit board of the present invention is to use above-mentioned printed circuit board, the layer of at least 3 layers of above conductive pattern is set and formation.In printed circuit board, as a rule the layer of conductive pattern is below 2 layers, but the layer that can manufacture as shown below conductive pattern is 3 layers of above multilayer printed circuit board.
; although diagram is omitted; but multilayer printed circuit board of the present invention can on the two sides of above-mentioned printed circuit board or simultaneously, folder be across above-mentioned prepreg 3 laminated metal paper tinsels 4, the layer that partly not removing of this metal forming 4 is arranged to conductive pattern forms.In this situation, preferably use above-mentioned prepreg 3, but also can use other prepreg 3.In addition, as metal forming 4, can use material same as described above.The situation cascading into shape and metal-clad 5 that molding condition is above-mentioned with manufacture is identical.The formation of conductive pattern can be carried out in the same manner with manufacturing when printed circuit board.That is, in the case of have metal forming 4 can utilize subraction to form the layer of conductive pattern, in the situation that there is no metal forming 4, can utilize additive process to form the layer of conductive pattern.In addition, also can utilize on the two sides of the metal-clad 5 that has added internal layer circuit 7 shown in Fig. 1 (d) subraction to form the layer of conductive pattern, manufacture multilayer printed circuit board.And in multilayer printed circuit board, the number of plies of conductive pattern is not particularly limited.
[embodiment]
Below, utilize embodiment to be specifically described the present invention.
(embodiment 1)
As heat-curing resin, Dainippon Ink Chemicals's system " HP9500 " and " N540 " are used.
In addition, as filler, used as silicon dioxide, the ADMATECHS of Co., Ltd. system " YC100C-MLE " and " S0-25R ".
In addition, as curing agent, used as phenol curing agent, Dainippon Ink Chemicals's system " TD2090 ".
In addition, as curing accelerator, used as imidazoles, Shikoku Chem's system " 2E4MZ ".
In addition, as base material 1, used as glass cloth, (thick 29 μ m) for Nitto Boseki Co. Ltd's system " 1037Cloth ".
After this, by above-mentioned heat-curing resin (" HP9500 ": 46.51 mass parts, " N540 ": 19.94 mass parts), filler (" YC100C-MLE ": 50 mass parts, " S0-25R ": 250 mass parts), curing agent (" TD2090 ": 33.55 mass parts), curing accelerator (" 2E4MZ ": 0.05 mass parts) are coordinated, use again solvent (methylethylketone) dilution, and prepare the varnish of resin combination 2.
Then, by above-mentioned varnish is infiltrated to base material 1 when by its at 150 ℃ with 3 minutes in drying oven heat drying to semi-cured state, and produce prepreg 3.With respect to the total amount of this prepreg 3, the content of resin combination 2 (resin content) is 59 quality %.
Then, by above-mentioned prepreg 3 is superposeed to 2, on its two sides, as metal forming 4 laminated copper foil, (Mitsu Mining & Smelting Co., Ltd's system " 3EC-VLP ", 500mm × 500mm × thick 18 μ m) are also shaped, and produce the two-sided metal-clad (thick 0.096mm) as shown in Fig. 1 (a) as metal-clad 5.Above-mentioned cascading into shape be to use multi-stage vacuum forcing press implement heating pressurization and carry out.Programming rate when heating pressurization is 250 ℃/min, and peak temperature is 250 ℃, and forming pressure is 3.9MPa (40kgf/cm
2), curring time is 5 minutes.
Then, above-mentioned metal-clad 5 is cut out so that 50mm is square, set it as size changing rate and measure and use with sample, measure the interval between 2 arbitrarily in lip-deep orthogonal 2 directions (directions X and Y-direction) of this sample, they are made as respectively to L
0and L (X)
0(Y) (with reference to Fig. 5).
Then, as the etching solution of principal component, the metal forming 4 of all of metal-clad 5 is removed and carry out after etch processes using copper chloride etc. by using, again measure the interval between 2 in 2 above-mentioned directions, they are made as respectively to L
1and L (X)
1(Y).After this, utilize above-mentioned formula (1) to calculate the size changing rate S after etch processes
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=+0.03％
S
1(Y)=+0.03％
Then, by the plywood after etch processes 6 is carried out after burin-in process 150 ℃ of heating for 30 minutes, again measure the interval between 2 in 2 above-mentioned directions, they are made as respectively to L
2and L (X)
2(Y).After this, utilize above-mentioned formula (2) to calculate the size changing rate S after burin-in process
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=+0.01％
S
2(Y)=+0.01％
After this, convex surface is placed on platform upward above-mentioned plywood 6 with uncharged state, utilizes settled process to determine the maximum amount of warpage of plywood 6 according to JIS C 6481.Consequently, maximum amount of warpage is 1.1mm.
(embodiment 2)
As heat-curing resin, use Nippon Kayaku K. K's system " EPPN502H ".
In addition, as filler, used as silicon dioxide, the ADMATECHS of Co., Ltd. system " YC100C-MLE ", " S0-25R " and " S0-C6 ".
In addition, as curing agent, used as phenol curing agent, bright and change into Co., Ltd.'s system " MEH7600 ".
In addition, as curing accelerator, used as imidazoles, Shikoku Chem's system " 2E4MZ ".
In addition, as base material 1, used as glass cloth, (thick 29 μ m) for Nitto Boseki Co. Ltd's system " 1037Cloth ".
After this, by above-mentioned heat-curing resin (" EPPN502H ": 62.83 mass parts), filler (" YC100C-MLE ": 50 mass parts, " S0-25R ": 100 mass parts, " S0-C6 ": 50 mass parts), curing agent (" MEH7600 ": 37.17 mass parts), curing accelerator (" 2E4MZ ": 0.05 mass parts) are coordinated, use again solvent (methylethylketone) dilution, and prepare the varnish of resin combination 2.
Then, except using above-mentioned varnish, manufacture in the same manner prepreg 3 (resin content: 59 quality %) with embodiment 1, use this prepreg 3 to manufacture metal-clad 5.
Then, calculate in the same manner the size changing rate S after etch processes with embodiment 1
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=+0.02％
S
1(Y)=+0.02％
Then, calculate in the same manner the size changing rate S after burin-in process with embodiment 1
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=+0.03％
S
2(Y)=+0.03％
After this, determine in the same manner the maximum amount of warpage of plywood 6 with embodiment 1.Consequently, maximum amount of warpage is 1.3mm.
(embodiment 3)
As base material 1, used as glass cloth, (thick 28 μ m) for Nitto Boseki Co. Ltd's system " 1036 Cloth ".
Prepare in the same manner the varnish of resin combination 2 with embodiment 1.
Then, except using above-mentioned varnish and base material 1, manufacture in the same manner prepreg 3 (resin content: 51 quality %) with embodiment 1, use this prepreg 3 to produce metal-clad 5.
Then, calculate in the same manner the size changing rate S after etch processes with embodiment 1
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=+0.03％
S
1(Y)=+0.03％
Then, calculate in the same manner the size changing rate S after burin-in process with embodiment 1
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=+0.02％
S
2(Y)=+0.01％
After this, determine in the same manner the maximum amount of warpage of plywood 6 with embodiment 1.Consequently, maximum amount of warpage is 0.9mm.
(embodiment 4)
The two sides of 1 by the prepreg 3 identical with embodiment 1 (Mitsu Mining & Smelting Co., Ltd's system " 3EC-VLP ", 500mm × 500mm × thick 18 μ m) and be shaped, produces two-sided metal-clad (thick 0.066mm) as metal-clad 5 as metal forming 4 laminated copper foil.Above-mentioned use multi-stage vacuum forcing press cascading into shape is implemented heating pressurization and is carried out.Programming rate when heating pressurization is 250 ℃/min, and peak temperature is 250 ℃, and forming pressure is 3.9MPa (40kgf/cm
2), curring time is 5 minutes.
Then, utilize subraction that conductive pattern is set and produce core 8 in the one side of above-mentioned two-sided metal-clad.
Then, by the folded core 8 of a surface layer of 1 of the prepreg 3 same as described above, in the folded metal forming 4 of another surface layer shaping, and produce the metal-clad 5 (thick 0.120mm) that has added internal layer circuit 7.Carry out in the same manner above-mentioned cascading into shape with the manufacture of two-sided metal-clad.
Then, calculate in the same manner the size changing rate S after etch processes with embodiment 1
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=+0.02％
S
1(Y)=+0.02％
Then, calculate in the same manner the size changing rate S after burin-in process with embodiment 1
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=+0.03％
S
2(Y)=+0.03％
After this, determine in the same manner the maximum amount of warpage of plywood 6 with embodiment 1.Consequently, maximum amount of warpage is 3.1mm.
(comparative example 1)
By the prepreg identical with embodiment 13 superposeed to 2, in its two sides laminated copper foil, (Mitsu Mining & Smelting Co., Ltd's system " 3EC-VLP ", 500mm × 500mm × thick 18 μ m) are also shaped as metal forming 4, and produce two-sided metal-clad (thick 0.096mm) as metal-clad 5.Above-mentioned use multi-stage vacuum forcing press cascading into shape is implemented heating pressurization and is carried out.Programming rate when heating pressurization is 3 ℃/min, and peak temperature is 220 ℃, and forming pressure is 3.9MPa (40kgf/cm
2), curring time is 80 minutes.
Then, calculate in the same manner the size changing rate S after etch processes with embodiment 1
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=+0.01％
S
1(Y)=+0.01％
Then, calculate in the same manner the size changing rate S after burin-in process with embodiment 1
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=-0.05％
S
2(Y)=-0.05％
After this, determine in the same manner the maximum amount of warpage of plywood 6 with embodiment 1.Consequently, maximum amount of warpage is 2.5mm.
(comparative example 2)
As heat-curing resin, Dainippon Ink Chemicals's system " HP9500 " and " N540 " are used.
In addition, as filler, used as silicon dioxide, the ADMATECHS of Co., Ltd. system " S0-25R ".
In addition, as curing agent, used as phenol curing agent, Dainippon Ink Chemicals's system " TD2090 ".
In addition, as curing accelerator, used as imidazoles, Shikoku Chem's system " 2E4MZ ".
In addition, as base material 1, used as glass cloth, (thick 28 μ m) for Nitto Boseki Co. Ltd's system " 1036Cloth ".
After this, by above-mentioned heat-curing resin (" HP9500 ": 46.51 mass parts, " N540 ": 19.94 mass parts), filler (" S0-25R ": 300 mass parts), curing agent (" TD2090 ": 33.55 mass parts), curing accelerator (" 2E4MZ ": 0.05 mass parts) are coordinated, use again solvent (methylethylketone) dilution, and prepare the varnish of resin combination 2.
Then, except using above-mentioned varnish and base material 1, manufacture in the same manner prepreg 3 (resin content: 72 quality %) with comparative example 1, use this prepreg 3 to produce metal-clad 5.
Then, calculate in the same manner the size changing rate S after etch processes with embodiment 1
1and S (X)
1(Y).Its result is expressed as follows.
S
1(X)=-0.02％
S
1(Y)=-0.02％
Then, calculate in the same manner the size changing rate S after burin-in process with embodiment 1
2and S (X)
2(Y).Its result is expressed as follows.
S
2(X)=-0.06％
S
2(Y)=-0.06％
After this, determine in the same manner the maximum amount of warpage of plywood 6 with embodiment 1.Consequently, maximum amount of warpage is 3.7mm.
Claims (8)
1. a metal-clad, is characterized in that, is to form after prepreg to base material infiltration resin combination semi-solid preparation, and the metal-clad forming to described prepreg stack metal forming heating pressurization,
Wherein the size of the plywood after the etch processes of the described metal forming to remove described metal-clad is as benchmark, in the scope that the size changing rate that carries out carrying out again after described etch processes the plywood after burin-in process is ± 0.03%.
2. metal-clad according to claim 1, is characterized in that,
In the size to carry out the metal-clad before described etch processes, as benchmark, the size of carrying out the plywood after described etch processes increases.
3. metal-clad according to claim 2, is characterized in that,
In the size to carry out the metal-clad before described etch processes, as benchmark, the size changing rate that carries out the plywood after described etch processes is below 0.1%.
4. according to the metal-clad described in any one in claims 1 to 3, it is characterized in that,
The filler that contains 50～80 quality % in described resin combination.
5. according to the metal-clad described in any one in claim 1 to 4, it is characterized in that,
The thickness of described metal-clad is below 0.2mm.
6. according to the metal-clad described in any one in claim 1 to 5, it is characterized in that,
Programming rate when described heating pressurization is more than 200 ℃/min.
7. a printed circuit board, is characterized in that,
The two sides of the metal-clad in claim 1 to 6 described in any one or one side arrange conductive pattern and form.
8. a multilayer printed circuit board, is characterized in that,
Be that right to use requires the printed circuit board described in 7, the layer of at least 3 layers of above described conductive pattern be set and formation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-248686 | 2012-11-12 | ||
| JP2012248686 | 2012-11-12 |
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|---|---|
| CN103813612A true CN103813612A (en) | 2014-05-21 |
| CN103813612B CN103813612B (en) | 2018-03-09 |
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ID=50709655
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310552196.0A Active CN103813612B (en) | 2012-11-12 | 2013-11-08 | Metal-clad, printed circuit board, multilayer printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6226232B2 (en) |
| KR (1) | KR101794874B1 (en) |
| CN (1) | CN103813612B (en) |
| TW (1) | TWI544842B (en) |
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| CN105472895A (en) * | 2014-09-26 | 2016-04-06 | 松下知识产权经营株式会社 | Method for manufacturing double-faced metal laminate, method for manufacturing printed circuit board, method for manufacturing multiple layered laminate and method for manufacturing multiple layered printed circuit board |
| CN106856646A (en) * | 2016-11-13 | 2017-06-16 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of flexibility covers metal lamination |
| CN107205307A (en) * | 2016-03-18 | 2017-09-26 | 松下知识产权经营株式会社 | Metal-clad, printed wiring board, the manufacture method of the manufacture method of metal-clad and printed wiring board |
| CN109923947A (en) * | 2016-11-09 | 2019-06-21 | 日立化成株式会社 | Printed wiring board and semiconductor package body |
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| JP6796791B2 (en) * | 2016-08-01 | 2020-12-09 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of metal-clad laminate, printed wiring board, metal-clad laminate and manufacturing method of printed wiring board |
| JP6960595B2 (en) * | 2017-01-13 | 2021-11-05 | パナソニックＩｐマネジメント株式会社 | Printed wiring board with built-in thick conductor and its manufacturing method |
| TWI775905B (en) * | 2017-07-25 | 2022-09-01 | 日商松下知識產權經營股份有限公司 | Manufacturing method of multi-layered printed wiring board |
| CN115316048A (en) * | 2020-04-03 | 2022-11-08 | 松下知识产权经营株式会社 | Thermosetting resin sheet and printed wiring board |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6226232B2 (en) | 2017-11-08 |
| JP6624573B2 (en) | 2019-12-25 |
| TWI544842B (en) | 2016-08-01 |
| JP2014111361A (en) | 2014-06-19 |
| KR20140061246A (en) | 2014-05-21 |
| KR101794874B1 (en) | 2017-11-07 |
| JP2018001764A (en) | 2018-01-11 |
| CN103813612B (en) | 2018-03-09 |
| TW201440585A (en) | 2014-10-16 |
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