JP2954335B2 - Manufacturing method of laminated board - Google Patents

Manufacturing method of laminated board

Info

Publication number
JP2954335B2
JP2954335B2 JP2329565A JP32956590A JP2954335B2 JP 2954335 B2 JP2954335 B2 JP 2954335B2 JP 2329565 A JP2329565 A JP 2329565A JP 32956590 A JP32956590 A JP 32956590A JP 2954335 B2 JP2954335 B2 JP 2954335B2
Authority
JP
Japan
Prior art keywords
pressure
resin
laminated board
manufacturing
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2329565A
Other languages
Japanese (ja)
Other versions
JPH04201311A (en
Inventor
国夫 池谷
隆久 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2329565A priority Critical patent/JP2954335B2/en
Publication of JPH04201311A publication Critical patent/JPH04201311A/en
Application granted granted Critical
Publication of JP2954335B2 publication Critical patent/JP2954335B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プレス時に発生する歪を減少させることに
より、寸法安定性が良く、反り、ねじれが小さい積層板
を提供するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention provides a laminate having good dimensional stability, small warpage, and small twist by reducing distortion generated during pressing.

〔従来の技術〕[Conventional technology]

従来、プレス時に発生する歪を減少させる手段として
はプレスの最高圧を下げる方法が主である。このために
はプリプレグをノンボイド化するのがよいが、このため
には、真空含浸装置等の大がりがな設備が必要である。
成形工程においては真空プレスの使用も有効であるが、
これも同様に設備が大がかりである。また、通常のプレ
スの後ほぼ無圧状態に加熱することも効果的であるが、
工程が増えてしまう。
Conventionally, as a means for reducing distortion generated at the time of pressing, a method of reducing the maximum pressure of the press is mainly used. For this purpose, it is preferable to make the prepreg non-voided, but for this purpose, a large-scale facility such as a vacuum impregnating apparatus is required.
In the molding process, the use of a vacuum press is also effective,
This is also a large facility. It is also effective to heat to almost no pressure after normal pressing,
The number of processes increases.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

本発明の目的とするところは、通常の塗布機及びプレ
ス機を用いて、成形歪が小さく反り、ねじれ等の小さい
即ち寸法変定性の向上した積層板を得ることである。
An object of the present invention is to obtain a laminate having a small molding distortion, a small warp and the like, that is, a small dimensional changeability, using a usual coating machine and a press machine.

〔課題を解決するための手段〕[Means for solving the problem]

本発明は、樹脂ワニスを基材に含浸して得たプリプレ
グを1枚もしくは複数枚重ねて、必要により金属箔を片
面又は両面に配置し、これらを金属鏡面板にはさみ加熱
加圧成形する積層板の製造方法において、積層板の昇圧
をプリプレグの樹脂のゲル化直後から5分以上の間、毎
分1〜5kg f/cm2の速さで行なうことを特徴とする積層
板の製造方法である。
The present invention is a method of laminating one or more prepregs obtained by impregnating a resin varnish into a substrate, arranging a metal foil on one or both sides as necessary, sandwiching these between metal mirror plates, and heating and pressing. In the method for producing a board, the pressure of the laminate is increased at a rate of 1 to 5 kg f / cm 2 per minute for 5 minutes or more immediately after the gelling of the resin of the prepreg. is there.

本発明の特徴である昇圧速度の範囲は毎分1〜5kg f/
cm2であり、特に毎分2〜3kg f/cm2が好ましい。時間は
プリプレグの樹脂がゲル化した直後から少なくとも5分
間以上、好ましくは10〜20分間続けて行なうものもので
ある。
The range of the boosting speed which is a feature of the present invention is 1 to 5 kg f / min.
cm 2 , particularly preferably 2 to 3 kg f / cm 2 per minute. The time is at least 5 minutes or more, preferably 10 to 20 minutes, immediately after the resin of the prepreg is gelled.

〔作用〕[Action]

本発明で採用される成形時の昇圧方法は、最高圧力を
低くするのではなく、成形歪の発生を小さく抑えながら
必要な圧力まで加圧するもので、圧力不足等による成形
性の不良を生じることがない。
The pressurization method at the time of molding adopted in the present invention is not to lower the maximum pressure, but to pressurize to a required pressure while suppressing the occurrence of molding distortion, which may cause poor moldability due to insufficient pressure or the like. There is no.

成形時のプリプレグの状態と成形圧力についてみる
と、 (i)成形開始直後においては、プリプレグの樹脂が溶
融して流動し、プリプレグ中の空気を排出する程度の圧
力であって、基板の凹凸により金属箔の粗化面を押しつ
ぶさないことが必要である。従って、圧力は0.1〜2kg f
/cm2が適当である。
Looking at the state of the prepreg and the molding pressure at the time of molding, (i) immediately after the start of molding, the pressure is such that the resin of the prepreg melts and flows and the air in the prepreg is discharged. It is necessary not to crush the roughened surface of the metal foil. Therefore, the pressure is 0.1-2kg f
/ cm 2 is appropriate.

(ii)次の段階として、基材の中に深く入り込んだ空気
を追い出すのに必要な圧力をかけていく。この段階では
熱も十分に伝導する。しかし、圧力が高すぎると、脱泡
が効率良く行なわれないうちに樹脂の流れが大きくな
り、積層板の厚み不良の原因となる。樹脂の粘度はこの
段階の途中で最近となる。これらの点を考慮すると圧力
は15〜25kg f/cm2程度が適当である。
(Ii) The next step is to apply the pressure necessary to expel air that has penetrated deep into the substrate. At this stage, heat is sufficiently conducted. However, when the pressure is too high, the flow of the resin becomes large before the defoaming is performed efficiently, which causes a thickness defect of the laminate. The viscosity of the resin is recent during this stage. Considering these points, it is appropriate that the pressure is about 15 to 25 kg f / cm 2 .

(iii)更に樹脂の硬化が進む段階では、樹脂の粘度が
上昇し、脱泡に必要な圧力が時間と共に大きくなる。圧
力は15〜30kg f/cm2が適当である。
(Iii) In the stage where the curing of the resin further proceeds, the viscosity of the resin increases, and the pressure required for defoaming increases with time. An appropriate pressure is 15 to 30 kg f / cm 2 .

しかし、樹脂のゲル化後は急激な昇圧は樹脂の移動に
よる板厚不良だけでなく、基材をも外方へ引張るため歪
を発生してしまう。
However, after the gelation of the resin, the rapid pressure increase causes not only the failure of the plate thickness due to the movement of the resin but also the pulling of the base material outward, causing distortion.

このゲル化後の段階において、本発明の昇圧速度に従
って加圧すると、樹脂の硬化収縮と樹脂の移動とのバラ
ンスがとれ、基材と樹脂の間の歪を発生させないで、良
好な成形性に必要な最終圧力まで到達させるこができ
る。この最終圧力に20〜40分間保つことが成形不良を発
生させないために望ましい。
In the stage after the gelation, when the pressure is applied according to the pressure increasing speed of the present invention, the balance between the curing shrinkage of the resin and the movement of the resin is balanced, and no distortion is generated between the base material and the resin. The required final pressure can be reached. It is desirable to keep the final pressure for 20 to 40 minutes so as not to cause molding defects.

〔実施例〕〔Example〕

第1表に示す成形工程の条件で、厚さ1.6mmの両面銅
張エポキシ樹脂ガラス織布積層板を得た。
Under the conditions of the molding process shown in Table 1, a double-sided copper-clad epoxy resin glass woven laminate having a thickness of 1.6 mm was obtained.

それぞれ得られた積層板について特性測定を行い、第
2表にその結果を示す。
The characteristics of the obtained laminates were measured, and Table 2 shows the results.

実施例では、真空プレスを使用した参考例と同等のも
のが得られるが、比較例では実施例に比較して何らかの
特性が劣っている。
In the example, the same thing as the reference example using the vacuum press can be obtained, but in the comparative example, some characteristics are inferior to the example.

(測定方法) 成形フロー:成形後、積層板端面から流出した樹脂の長
さ,最大値をいう。
(Measurement method) Molding flow: The length and maximum value of the resin flowing out of the end face of the laminate after molding.

外 観:銅箔をエッチング後、表面外観を目視し
た。
Appearance: After etching the copper foil, the surface appearance was visually observed.

寸法収縮率:銅箔をエッチング後、170℃30分間加熱処
理し、加熱処理前の寸法との差から収縮率を求めた。
Dimensional shrinkage: After etching the copper foil, heat treatment was performed at 170 ° C. for 30 minutes, and the shrinkage was determined from the difference from the dimension before the heat treatment.

厚み精度 :最大厚みと最小厚みの差を最大厚みで除し
て求めた。
Thickness accuracy: It was determined by dividing the difference between the maximum thickness and the minimum thickness by the maximum thickness.

〔発明の効果〕〔The invention's effect〕

以上の実施例からも明らかなように、本発明で得られ
た積層板は、寸法安定性が特にすぐれ、外観、厚み精度
もすぐれている。
As is clear from the above examples, the laminate obtained by the present invention has particularly excellent dimensional stability, and also has excellent appearance and thickness accuracy.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B29C 43/00 - 43/58 B32B 1/00 - 35/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 6 , DB name) B29C 43/00-43/58 B32B 1/00-35/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】樹脂ワニスを基材に含浸して得たプリプレ
グを1枚もしくは複数枚重ねて、必要により金属箔を片
面又は両面に配置し、これらを金属鏡面板にはさみ加熱
加圧成形する積層板の製造方法において、積層板の昇圧
をプリプレグの樹脂のゲル化直後から5分以上の間、毎
分1〜5kg f/cm2の速さで行なうことを特徴とする積層
板の製造方法。
1. A prepreg obtained by impregnating a base material with a resin varnish is laminated one or more times, and if necessary, a metal foil is arranged on one side or both sides, and these are sandwiched between metal mirror face plates and heated and pressed. A method of manufacturing a laminated board, wherein the pressure of the laminated board is increased at a rate of 1 to 5 kg f / cm 2 per minute for at least 5 minutes immediately after gelling of the resin of the prepreg. .
JP2329565A 1990-11-30 1990-11-30 Manufacturing method of laminated board Expired - Fee Related JP2954335B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2329565A JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2329565A JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH04201311A JPH04201311A (en) 1992-07-22
JP2954335B2 true JP2954335B2 (en) 1999-09-27

Family

ID=18222780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2329565A Expired - Fee Related JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP2954335B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6226232B2 (en) * 2012-11-12 2017-11-08 パナソニックIpマネジメント株式会社 Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board

Also Published As

Publication number Publication date
JPH04201311A (en) 1992-07-22

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