JPH04201311A - Manufacture of laminated sheet - Google Patents

Manufacture of laminated sheet

Info

Publication number
JPH04201311A
JPH04201311A JP2329565A JP32956590A JPH04201311A JP H04201311 A JPH04201311 A JP H04201311A JP 2329565 A JP2329565 A JP 2329565A JP 32956590 A JP32956590 A JP 32956590A JP H04201311 A JPH04201311 A JP H04201311A
Authority
JP
Japan
Prior art keywords
resin
pressure
prepreg
gelatinization
appropriate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2329565A
Other languages
Japanese (ja)
Other versions
JP2954335B2 (en
Inventor
Kunio Iketani
池谷 国夫
Takahisa Iida
隆久 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2329565A priority Critical patent/JP2954335B2/en
Publication of JPH04201311A publication Critical patent/JPH04201311A/en
Application granted granted Critical
Publication of JP2954335B2 publication Critical patent/JP2954335B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To obtain a laminated sheet whose molding distortion, warp and twist are low, that is, dimensional stability is improved, by a method wherein pressurization of the laminated sheet is performed at a specific speed every minute for at least a specific time directly after gelatinization of resin of prepreg. CONSTITUTION:At the time directly after a start of molding, pressure which is in such an extent as to discharge air in a prepreg and under 0.1-2kgf/cm<2> is appropriate. Necessary pressure to get rid of air gotten deeply into a base is applied away to the base as the next stage. About 15-25kgf/cm<2> is appropriate as the pressure. Furthermore, 15-30kgf/cm<2> is appropriate as the pressure under a stage where curing of resin advances. However, after gelatinization of the resin, not only inferiority in a board thickness by movement of the resin but also a warp by pulling outward even the base have been generated by sudden pressurization. A range of pressurizing speed is 1-5kgf/cm<2>/min, especially 2-3kgf/cm<2>/min is preferable at a stage after gelatinization. As for a time, pressurization is performed for at least 5 minutes or more directly after the gelatinization of the resin of the prepreg, preferably for 10-20min. continuously.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プレス時に発生する歪を減少させることによ
り、寸法安定性か良く、反り、ねしれか小さい積層板を
提供するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention provides a laminate with good dimensional stability and less warping and wrinkling by reducing the strain generated during pressing.

〔従来の技術〕[Conventional technology]

従来、プレス時に発生する歪を減少させる手段としては
プレスの最高圧を下げる方法か主である。
Conventionally, the main method for reducing the strain generated during pressing has been to lower the maximum pressure of the press.

このためにはプリプレグをノンホイト化するのかよいか
、このためには、真空含浸装置等の大かつかな設備か必
要である。成形工程においては真空プレスの使用も有効
であるか、これも同様に設備か大かかりである。また、
通常のプレスの後はぼ無圧状態で加熱することも効果的
であるか、工程か増えてしまう。
For this purpose, it is better to make the prepreg non-hoitized, but this requires large and expensive equipment such as a vacuum impregnation device. Is it effective to use a vacuum press in the forming process, but this also requires a large amount of equipment. Also,
After normal pressing, heating under almost no pressure is either effective or increases the number of steps.

〔発明か解決しようとする課題〕[Invention or problem to be solved]

本発明の目的とするところは、通常の塗布機及びプレス
機を用いて、成形歪か小さく反り、ねじれ等の小さい即
ち寸法安定性の向上した積層板を得ることである。
An object of the present invention is to obtain a laminate with little molding distortion, little warping, little torsion, etc., that is, improved dimensional stability, using a conventional coating machine and press machine.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、樹脂ワニスを基材に含浸して得たプリプレグ
を1枚もしくは複数枚重ねて、必要により金属箔を片面
又は両面に配置し、これらを金属鏡面板間にはさみ加熱
加圧成形する積層板の製造方法において、積層板の昇圧
をプリプレグの樹脂のゲル化直後から5分以上の間、毎
分1〜5kgf/aI!の速さで行なうことを特徴とす
る積層板の製造方法である。
In the present invention, one or more sheets of prepreg obtained by impregnating a base material with resin varnish are stacked, metal foil is placed on one or both sides if necessary, and these are sandwiched between metal mirror plates and molded under heat and pressure. In the method for manufacturing a laminate, the pressure of the laminate is increased at 1 to 5 kgf/aI per minute for 5 minutes or more immediately after gelation of the prepreg resin. This is a method for manufacturing a laminate, characterized in that the manufacturing process is carried out at a speed of .

本発明の特徴である昇圧速度の範囲は毎分1〜5 kg
 f /cmてあり、特に毎分2〜3kgf/aI!か
好ましい。時間はプリプレグの樹脂かゲル化した直後か
ら少なくとも5分間以上、好ましくは10〜20分間続
けて行なうものものである。
The range of pressurization rate, which is a feature of the present invention, is 1 to 5 kg per minute.
f/cm, especially 2 to 3 kgf/aI per minute! Or preferable. Immediately after the resin of the prepreg gels, the heating is continued for at least 5 minutes, preferably 10 to 20 minutes.

〔作   用〕[For production]

本発明で採用される成形時の昇圧方法は、最高圧力を低
くするのではなく、成形歪の発生を小さく抑えなから必
要な圧力まで加圧するもので、圧力不足等による成形性
の不良を生しることがない。
The method of increasing pressure during molding adopted in the present invention does not lower the maximum pressure, but rather increases the pressure to the required pressure in order to minimize the occurrence of molding distortion, which may result in poor moldability due to insufficient pressure, etc. I have nothing to do.

成形時のプリプレグの状態と成形圧力についてみると、 (i)成形開始直後においては、プリプレグの樹脂か溶
融して流動し、プリプレグ中の空気を排出する程度の圧
力であって、基材の凹凸により金属箔の粗化面を押しつ
ぶさないことか必要である。
Looking at the condition of the prepreg and the molding pressure during molding, (i) Immediately after the start of molding, the pressure is such that the resin in the prepreg melts and flows and the air in the prepreg is exhausted, and the unevenness of the base material It is necessary not to crush the roughened surface of the metal foil.

従って、圧力は0.1〜2 kg f /cdか適当で
ある。
Therefore, the pressure is suitably 0.1 to 2 kgf/cd.

(ii)次の段階として、基材の中に深く入り込んだ空
気を追い出すのに必要な圧力をかけていく。
(ii) The next step is to apply the pressure necessary to drive out the air that has penetrated deep into the substrate.

この段階では熱も十分に伝導する。しかし、圧力が高す
ぎると、脱泡か効率良く行なわれないうちに樹脂の流れ
か大きくなり、積層板の厚み不良の原因となる。樹脂の
粘度はこの段階の途中で最近となる。これらの点を考慮
すると圧力は15〜25kgf/ail程度か適当であ
る。
At this stage, heat is also sufficiently conducted. However, if the pressure is too high, the flow of the resin will increase before degassing is carried out efficiently, which will cause poor thickness of the laminate. The viscosity of the resin becomes recent during this stage. Taking these points into consideration, the pressure should be approximately 15 to 25 kgf/ail.

(ii)更に樹脂の硬化か進む段階では、樹脂の粘度か
上昇し、脱泡に必要な圧力か時間と共に大きくなる。圧
力は15〜30kgf/cfflか適当である。
(ii) As the resin hardens further, the viscosity of the resin increases and the pressure required for defoaming increases with time. The pressure is appropriately 15 to 30 kgf/cffl.

しかし、樹脂のゲル化後は急激な昇圧は樹脂の移動によ
る板厚不良たけてなく、基材をも外方へ引張るため歪を
発生してしまう。
However, after the resin has gelled, a rapid increase in pressure will not only result in poor board thickness due to the movement of the resin, but will also pull the base material outward, resulting in distortion.

このゲル化後の段階において、本発明の昇圧速度に従っ
て加圧すると、樹脂の硬化収縮と樹脂の移動とのバラン
スかとれ、基材と樹脂の間の歪を発生させないで、良好
な成形性に必要な最終圧力まて到達させることかできる
。この最終圧力に20〜40分間保つことか成形不良を
発生させないために望ましい。
At this stage after gelation, if pressure is applied according to the pressure increase rate of the present invention, the curing shrinkage of the resin and the movement of the resin are balanced, and good moldability is achieved without causing distortion between the base material and the resin. It is possible to reach the required final pressure. It is desirable to maintain this final pressure for 20 to 40 minutes to avoid molding defects.

〔実施例〕〔Example〕

第1表に示す成形工程の条件で、厚さ1.6化の両面銅
張エポキソ樹脂ガラス織布積層板を得た。
Under the molding process conditions shown in Table 1, a double-sided copper-clad epoxo resin glass woven laminate with a thickness of 1.6 was obtained.

それぞれ得られた積層板について特性測定を行い、第2
表にその結果を示す。
Characteristics were measured for each of the obtained laminates, and the second
The results are shown in the table.

実施例では、真空プレスを使用した参考例と同等のもの
が得られるが、比較例では実施例に比較して何らかの特
性が劣っている。
In the examples, products equivalent to those in the reference examples using a vacuum press are obtained, but in the comparative examples, some characteristics are inferior to those in the examples.

(測定方法) 成形フロー:成形後、積層板端面から流出した樹脂の長
さ、最大値をいう。
(Measurement method) Molding flow: Refers to the maximum length of resin flowing out from the end face of the laminate after molding.

外   観 鋼箔をエツチング後、表面外観を目視した
Appearance After etching the steel foil, the surface appearance was visually observed.

寸法収縮率・銅箔をエツチング後、 170°C参〇分
間加熱処理し、加熱処理前の寸法と の差から収縮率を求めた。
Dimensional Shrinkage Rate - After etching the copper foil, it was heat treated at 170°C for 10 minutes, and the shrinkage rate was determined from the difference in dimension from before the heat treatment.

厚み精度 ・最大厚みと最小厚みの差を最大厚みて除し
て求めた。
Thickness accuracy - Calculated by dividing the difference between the maximum thickness and minimum thickness by the maximum thickness.

〔発明の効果〕〔Effect of the invention〕

以上の実施例からも明らかなように、本発明で得られた
積層板は、寸法安定性か特にすぐれ、外観、厚み精度も
すぐれている。
As is clear from the above examples, the laminates obtained by the present invention have particularly excellent dimensional stability, and excellent appearance and thickness accuracy.

Claims (1)

【特許請求の範囲】[Claims] (1)樹脂ワニスを基材に含浸して得たプリプレグを1
枚もしくは複数枚重ねて、必要により金属箔を片面又は
両面に配置し、これらを金属鏡面板にはさみ加熱加圧成
形する積層板の製造方法において、積層板の昇圧をプリ
プレグの樹脂のゲル化直後から5分以上の間、毎分1〜
5kgf/cm^2の速さで行なうことを特徴とする積
層板の製造方法。
(1) 1 prepreg obtained by impregnating a base material with resin varnish
In the manufacturing method of laminates, in which one or more sheets are piled up, metal foil is placed on one or both sides as necessary, these are sandwiched between metal mirror plates, and heated and pressed, the pressure of the laminate is increased immediately after the prepreg resin gels. 1 to 1 minute every minute for more than 5 minutes from
A method for manufacturing a laminate, characterized in that the manufacturing method is carried out at a speed of 5 kgf/cm^2.
JP2329565A 1990-11-30 1990-11-30 Manufacturing method of laminated board Expired - Fee Related JP2954335B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2329565A JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2329565A JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH04201311A true JPH04201311A (en) 1992-07-22
JP2954335B2 JP2954335B2 (en) 1999-09-27

Family

ID=18222780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2329565A Expired - Fee Related JP2954335B2 (en) 1990-11-30 1990-11-30 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP2954335B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014111361A (en) * 2012-11-12 2014-06-19 Panasonic Corp Metal-clad laminate, printed wiring board, multilayer printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014111361A (en) * 2012-11-12 2014-06-19 Panasonic Corp Metal-clad laminate, printed wiring board, multilayer printed wiring board

Also Published As

Publication number Publication date
JP2954335B2 (en) 1999-09-27

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