JPS63233810A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPS63233810A JPS63233810A JP62067398A JP6739887A JPS63233810A JP S63233810 A JPS63233810 A JP S63233810A JP 62067398 A JP62067398 A JP 62067398A JP 6739887 A JP6739887 A JP 6739887A JP S63233810 A JPS63233810 A JP S63233810A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- pressing
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 abstract description 9
- 239000004744 fabric Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
この発明は、積層板の製造方法に関するものである。さ
らに詳しくは、この発明は、電気、電子機器、通信機器
、計算機器等に用いられるプリント配線板用の積層板の
製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a laminate. More specifically, the present invention relates to a method of manufacturing a laminate for a printed wiring board used in electrical, electronic equipment, communication equipment, computing equipment, and the like.
（背景技術）
従来、プリント配線板用に用いられている金属箔を配設
した樹脂含浸基材からなる積層板は、大気圧の常圧条件
下において加熱加圧プレス成形を行って製造か、または
、電子計３ＥＩ用などの特に精度を要する積層板につい
ては、減圧条件下において加熱加圧プレス成形して製造
している。(Background technology) Conventionally, laminates made of a resin-impregnated base material on which metal foil is arranged, which are used for printed wiring boards, are manufactured by heating and press-forming under normal atmospheric pressure conditions. Alternatively, laminates that require particularly high precision, such as those for electronic meters 3EI, are manufactured by press molding under reduced pressure.
このうち、減圧下での成形は、積層板中の微細気泡をよ
り完全に除去し、高精度なプリント配線板としての信頼
性を向上させるために行われている。Among these, molding under reduced pressure is performed in order to more completely remove microbubbles in the laminate and improve reliability as a high-precision printed wiring board.
成形における精度向上のための減圧条件下での加熱加圧
成形は有効な方法であるが、一方で減圧下で成形を行う
ことによる欠点も避けられなかった。Although heat-pressing molding under reduced pressure conditions is an effective method for improving precision in molding, on the other hand, disadvantages due to molding under reduced pressure cannot be avoided.
減圧下で積層体の加熱加圧成形を行うと、成形時の溶融
樹脂が発泡して巨大化し、パリが成形プレート、熟熱に
付着し易くなる。このパリが成形プレートに付着する場
合には、次の成形時に、積層体成形品に凹部等の打痕を
発生させる。When a laminate is heated and pressure molded under reduced pressure, the molten resin during molding foams and becomes gigantic, making it easier for particles to adhere to the molding plate and maturing heat. If this debris adheres to the molding plate, it will cause dents such as recesses in the laminate molded product during the next molding.
また、樹脂溶融によるパリの発生は、積層板の仕上げ切
断を困難にする０通常積層板は、成形後にベルトコンベ
アによって搬送しながら四周を仕上切断するが、たとえ
ば第２図に示したように、積層板（ア）にバリ（イ）が
生成していると、切断丸鋸（つ）を有する切断ＩＩ！Ｉ
Ｉ（工）の上下の隙間（オ）に積層板が入らないなめ、
仕上切断は不可能となる。In addition, the occurrence of cracks due to resin melting makes finishing cutting of the laminate difficult. Normally, after forming, a laminate is finished cut on all four sides while being transported by a belt conveyor, but as shown in Fig. 2, for example, If burrs (B) are formed on the laminate (A), cut with a circular saw (2)! I
Make sure the laminate does not fit into the gap (E) above and below I (work),
Finish cutting becomes impossible.
これらの打痕の発生や仕上切断のトラブルは、積層板の
品質低下、製造工程の生産性の低下として大きな問題と
なる。このため、減圧条件下での成形の特長を生かしつ
つ、これらの欠点のない高精度の積層板の製造方法の実
現が望まれていた。The occurrence of these dents and troubles in finishing cutting become a major problem as they degrade the quality of the laminate and reduce the productivity of the manufacturing process. Therefore, it has been desired to realize a high-precision method for manufacturing laminates that does not have these drawbacks while taking advantage of the advantages of molding under reduced pressure conditions.
（発明の目的）
この発明は、以上の通りの事情を鑑みてなされたもので
あり、従来の減圧下での成形方法の欠点を改善し、樹脂
打痕、切断トラブルのない高精度の積層体の製造方法を
提供することを目的としている。(Object of the invention) This invention was made in view of the above circumstances, and it improves the drawbacks of the conventional molding method under reduced pressure, and provides a high-precision laminate without resin dents or cutting troubles. The purpose is to provide a manufacturing method for.
（発明の開示）
この発明の積層板の製造方法は、上記の目的を実現する
ために、樹脂含浸基材の上面および／または下面に金属
箔を配設し、該樹脂含浸基材の樹脂が最低溶融粘度に到
達するまでは減圧下で加熱加圧成形し、次いで常圧下で
加熱加圧成形することを特徴としている。(Disclosure of the Invention) In order to achieve the above object, the method for manufacturing a laminate of the present invention includes disposing metal foil on the upper surface and/or lower surface of a resin-impregnated base material, and in which the resin of the resin-impregnated base material is It is characterized by heat-pressing molding under reduced pressure until the lowest melt viscosity is reached, and then heat-pressing molding under normal pressure.
この発明が対象とするｖａｙｆ！ｌ板は、たとえば添付
した図面の第１図に示すことができるもので、樹脂含浸
基材からなる層１の上面および／または下面に金属箔２
を配設して一体成形したものである。vayf! targeted by this invention! The l plate can be shown, for example, in FIG. 1 of the attached drawings, in which a metal foil 2 is provided on the upper and/or lower surface of a layer 1 made of a resin-impregnated base material.
It is integrally molded.
この際に、樹脂含浸基材層１には、その厚さに応じて、
所要枚数の樹脂含浸基材を重ね合せて用いることができ
る。At this time, depending on the thickness of the resin-impregnated base material layer 1,
A required number of resin-impregnated base materials can be stacked and used.
樹脂含浸基材としては、フェノール樹脂、エポキシ樹脂
、不飽和ポリエステル樹脂、メラミン樹脂、ポリイミド
樹脂等の熱硬化性樹脂を、紙、ガラス布、織布、不織布
等の基材に含浸したものが用いられる。さらに必要に応
じて乾燥して取扱いを容易としたものも用いられる。As the resin-impregnated base material, a base material such as paper, glass cloth, woven fabric, or non-woven fabric impregnated with a thermosetting resin such as phenol resin, epoxy resin, unsaturated polyester resin, melamine resin, or polyimide resin is used. It will be done. Furthermore, if necessary, it may be dried to make it easier to handle.
基材の厚さは、約０．０５〜ｌ１ｍ１１程度で、これ以
上の厚さになると樹脂が含浸しにくくなり、また気泡も
発生しやすい、プリント配線板用の積層板としての必要
環（規格では０．８〜３．２ｍ＋）とするには、所要の
枚数を重ね合わせて使用する。The thickness of the base material is approximately 0.05 to 11 m11, and if it is thicker than this, it will be difficult to impregnate the resin and bubbles will be generated easily. Then, in order to obtain a length of 0.8 to 3.2 m+), the required number of sheets are stacked and used.
含浸する樹脂の量としては、乾燥後または揮発分なしで
、樹脂量が約４０〜５５重量％とするのが好ましい、も
ちろん、この範囲は限定的なものではない。The amount of resin to be impregnated is preferably about 40 to 55% by weight after drying or without volatile content, although this range is of course not limiting.
金属箔については、鉄、銅、アルミニウム、ニッケル等
の金属、またはそれらの合金を用いることができる。こ
れら金属箔は、必要に応じてその片面に接着層を設ける
ことができる。金属箔の厚さは、０．０１８〜０．０７
ｍｍ （規格）とすることができる０通常、この金属
箔としては、銅が最も一般的なものとして用いられる。As for the metal foil, metals such as iron, copper, aluminum, nickel, or alloys thereof can be used. These metal foils can be provided with an adhesive layer on one side, if necessary. The thickness of the metal foil is 0.018 to 0.07
mm (standard) 0 Usually, copper is the most common metal foil used.
以上の樹脂含浸基材およびば金属箔を加熱加圧プレス成
形するにあたっては、樹脂含浸基材プリプレグの材質に
最適な温度、圧力を適宜に選択する。プレス圧力として
は、通常は４０〜５０ｋｇ／ｄ程度であるが、紙フェノ
ールでは７０ｋｔ／−以上、エポキシ樹脂プリプレグの
場合には２０ｋｔ／−以下などの条件も選択される。When heat-pressing press-molding the resin-impregnated base material and metal foil as described above, the optimum temperature and pressure are appropriately selected for the material of the resin-impregnated base material prepreg. The press pressure is usually about 40 to 50 kg/d, but conditions such as 70 kt/- or more for paper phenol and 20 kt/- or less for epoxy resin prepreg are also selected.
プレス装置は従来公知の方式のものを用いることができ
る。いずれの方式においても、周囲の圧力を減圧または
常圧に制御できるものであればよい。As the press device, a conventionally known type can be used. Any method may be used as long as the surrounding pressure can be controlled to reduced pressure or normal pressure.
樹脂含浸基材の樹脂が最低溶融粘度に達するまでの減圧
条件は、１０ Ｔｏｒｒ粘度とすればよく、この減圧は
、８ＦＭ工程のプレス、マルチロール、ラミネート等の
全部を減圧室に入れるようにして実現してもよいし、ま
た多段プレスの場合には、段間のみを減圧にしてもよい
。The reduced pressure conditions until the resin of the resin-impregnated base material reaches the minimum melt viscosity may be 10 Torr viscosity. Alternatively, in the case of a multi-stage press, the pressure may be reduced only between the stages.
次にこの発明の実施例を示し、さらに詳しくこの発明の
製造方法について説明する。もちろん、この発明は、以
下の実施例によって限定されるものではない。Next, examples of the present invention will be shown, and the manufacturing method of the present invention will be explained in more detail. Of course, the invention is not limited to the following examples.
実施例
厚さ０．２Ｉ１ｍ＋のガラス布に、樹脂量が５０重量％
となるように、エポキシ樹脂フェス（（シェル化学株式
会社製、エピコート８２８）１００重量部、ジアミノジ
フェニルスルホン２ＯｆｆＥ量部、三弗化ホウ素モノエ
チルアミン錯化合物１重量部、メチルエチルケトン９０
重量部）を含浸、乾燥して得た樹脂含浸布を７枚重ね合
わせ、上下の面に厚さ０．０３５０１１１１の銅箔を各
々配設した。Example: Glass cloth with a thickness of 0.2I1m+ and a resin content of 50% by weight.
So that
Seven sheets of resin-impregnated cloth obtained by impregnating and drying a resin-impregnated cloth (parts by weight) were stacked on top of each other, and copper foil with a thickness of 0.03501111 mm was placed on each of the upper and lower surfaces.
この積層体を厚さ１１１１１のステンレス鋼板間に挾ん
でからオートクレーブ内の積層プレスにて、１７０°Ｃ
の温度で、４０ ｋｇ ／ ａｉの圧力により１２０分
間加熱加圧した。This laminate was sandwiched between stainless steel plates with a thickness of 11111, and then heated at 170°C in a lamination press in an autoclave.
It was heated and pressurized at a temperature of 40 kg/ai for 120 minutes.
この加熱加圧成形の過程において、樹脂含浸布のエポキ
シ樹脂の溶融粘度が１００ ｃｐｓの最低溶融粘度に到
達するまでの４０分間は、１０ＴＯｒｒの減圧下で加熱
加圧プレスし、それ以後は、常圧下で加熱加圧プレスし
た。In this hot-pressing process, the epoxy resin of the resin-impregnated cloth was hot-pressed under a reduced pressure of 10 TOrr for 40 minutes until the melt viscosity of the epoxy resin reached the minimum melt viscosity of 100 cps. It was heated and pressed under pressure.
厚さ １．６市の両面鋼張積層板を得た。A double-sided steel clad laminate with a thickness of 1.6 mm was obtained.
表−１に示した通り、この両面銅張積層板には内部気泡
は全く認められず、打痕も、仕上切断のトラブルもなか
った６次の比較例のものに比べて明らかなように、加熱
加圧プレスを減圧−常圧の制御のもとに行うこの方法は
、積層板の品質において優れ、製造工程上のトラブルの
ないものであることがわかる。As shown in Table 1, this double-sided copper-clad laminate did not have any internal air bubbles, and was clearly compared to the 6th comparative example, which had no dents or problems with finishing cutting. It can be seen that this method, in which heating and pressurizing is carried out under the control of reduced pressure and normal pressure, provides an excellent quality of the laminate and is free from troubles in the manufacturing process.
比較例 １
減圧としないで、全て常圧の条件下で、実施例と同様に
加熱加圧プレスして両面銅張積層板を製造した。Comparative Example 1 A double-sided copper-clad laminate was produced by heating and pressing in the same manner as in the examples under normal pressure conditions without reducing the pressure.
得られた積層板には、表−１に示した通り残留内部気泡
が認められた。As shown in Table 1, residual internal air bubbles were observed in the obtained laminate.
比較例 ２
全て減圧の条件下で、実施例と同様に加熱加圧プレスし
て両面銅張積層板を製造した。Comparative Example 2 A double-sided copper-clad laminate was manufactured by heating and pressing in the same manner as in the example, all under reduced pressure conditions.
得られた積層板には、表−１に示した通り打痕、切断ト
ラブルがあった。The obtained laminate had dents and cutting troubles as shown in Table 1.
表−１
（注１）１０ａＪ内に存在する残留気泡数（注２） １
ｄ内に存在する凹部の数
（発明の効果）
この発明の方法により、以上の通り、従来方法のような
打痕や切断トラブル等の欠点のない高精度なプリント配
線板として有用な積層板が得られる。Table-1 (Note 1) Number of residual bubbles existing within 10aJ (Note 2) 1
Number of recesses existing within d (effects of the invention) As described above, the method of the present invention can produce a laminate useful as a high-precision printed wiring board that does not have the disadvantages of dents and cutting troubles unlike conventional methods. can get.
第１図は、この発明の積層板を例示した断面図である。
第２図は、従来の方法による積層板の切断工程を示した
概念図である。
１・・・樹脂含浸基材層、２・・・金属箔。
代理人 弁理士 西 澤 利 失策 １
図FIG. 1 is a sectional view illustrating a laminate of the present invention. FIG. 2 is a conceptual diagram showing a process of cutting a laminate using a conventional method. 1...Resin-impregnated base material layer, 2...Metal foil. Agent Patent Attorney Toshi Nishizawa Mistake 1
figure
Claims (1)
を配設し、該樹脂含浸基材の樹脂が最低溶融粘度に到達
するまでは減圧下で加熱加圧成形し、次いで常圧下で加
熱加圧成形することを特徴とする積層板の製造方法。(1) Metal foil is placed on the upper and/or lower surface of the resin-impregnated base material, and the resin in the resin-impregnated base material is heated and pressure molded under reduced pressure until it reaches the minimum melt viscosity, and then molded under normal pressure. A method for manufacturing a laminate, characterized by heat and pressure molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067398A JPS63233810A (en) | 1987-03-20 | 1987-03-20 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62067398A JPS63233810A (en) | 1987-03-20 | 1987-03-20 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63233810A true JPS63233810A (en) | 1988-09-29 |
Family
ID=13343815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62067398A Pending JPS63233810A (en) | 1987-03-20 | 1987-03-20 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63233810A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112658A (en) * | 1989-09-27 | 1991-05-14 | Shin Kobe Electric Mach Co Ltd | Manufacture of epoxy resin laminated board |
| JPH03138141A (en) * | 1989-10-25 | 1991-06-12 | Matsushita Electric Works Ltd | Preparation of metal-based laminated sheet |
| JP2008296495A (en) * | 2007-06-01 | 2008-12-11 | Denki Kagaku Kogyo Kk | Manufacturing method of metal base substrate |
-
1987
- 1987-03-20 JP JP62067398A patent/JPS63233810A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112658A (en) * | 1989-09-27 | 1991-05-14 | Shin Kobe Electric Mach Co Ltd | Manufacture of epoxy resin laminated board |
| JPH03138141A (en) * | 1989-10-25 | 1991-06-12 | Matsushita Electric Works Ltd | Preparation of metal-based laminated sheet |
| JP2008296495A (en) * | 2007-06-01 | 2008-12-11 | Denki Kagaku Kogyo Kk | Manufacturing method of metal base substrate |
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