JPS6411448B2 - - Google Patents
Info
- Publication number
- JPS6411448B2 JPS6411448B2 JP58134643A JP13464383A JPS6411448B2 JP S6411448 B2 JPS6411448 B2 JP S6411448B2 JP 58134643 A JP58134643 A JP 58134643A JP 13464383 A JP13464383 A JP 13464383A JP S6411448 B2 JPS6411448 B2 JP S6411448B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- laminate
- heating
- mirror
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Description
本発明は、成形に際して熱盤に最も近い所に位
置する積層板の反りを少なくすることを目的とす
る積層板の製造法に関するものである。
一般に積層板は、熱硬化性樹脂を紙、ガラス布
などの基材に含浸させ、Ｂステージ化したプリプ
レグを作製し、そのプリプレグを１枚ないし数枚
重ね合せ、必要に応じて銅箔などを重ね合せて鏡
面板に挾み、この６〜８組を重ね、その両側にク
ツシヨン材（通常クラフト紙を20枚程度重ねて構
成したもの）を介在させて熱盤間で加熱加圧して
製造される。ところで、プリント配線板製造にお
いては、最近、配線回路の設計が高密度化される
と同時に、加工工程の自動化が進んできた為、基
板である積層板の反りの減少については、厳しい
要求がされている。
しかしながら、通常、積層板製造においては、
生産性を上げるため、上述のように熱盤間に複数
組のプリプレグを投入しており、熱盤の近くで成
形された積層板は、中央部で成形されたものにく
らべ反りが大きくなり、このものが、プリント配
線板加工の際、問題となりやすかつた。
本発明は、このような問題を解決するために鋭
意研究をすすめたところ、従来使用しているクツ
シヨン材の内側で、熱盤に最も近い鏡面板に、１
枚の金属平面板を重ねることにより、積層板全体
としての特性を低下させることなく、熱盤の近く
で成形された積層板の反りを、中央部で成形され
た積層板の反りと同等に小さくさせ得ることを見
い出した。これは、熱盤に最も近く位置する鏡面
板が、クツシヨン材の存在により加熱加圧下でた
わみ、積層板に反りの原因を作るのを、金属平面
板の介在で前記鏡面板のたわみを防ぎ、前記反り
の原因を除くためである。
鏡面板の材質は、特に限定しないが、硬度の大
きいものが望ましい。通常ステンレス鋼板が使用
される事が多い。また、熱盤に最も近い鏡面板に
重ねる１枚の金属平面板は、他の鏡面板と同一で
あつても、なくても良いが、曲げ弾性係数、硬度
が大きく、厚みの大きなものが望ましい。
本発明に使用される基材としては紙、ガラス、
合成繊維などで、特に限定されない。
本発明の実施例について説明する。
実施例 １
紙基材フエノール樹脂のプリプレグ８枚を重ね
合せその両面に35μ厚の銅箔を配置したものをス
テンレス鋼からなる1.5mm厚の鏡面板に挾み、そ
の８組を熱盤間に投入する。熱盤に最も近い鏡面
板には更に同様の鏡面板を重ね、熱盤との間にク
ラフフト紙20枚からなるクツシヨン材を介在させ
て、圧力100Kg／cm2で70分間加熱加圧成形した。
実施例 ２
熱盤に最も近い鏡面板にもう１枚重ねる鏡面板
としてステンレス鋼からなる2.5mm厚の鏡面板を
用いる以外は実施例１と同様に加熱加圧成形し
た。
比較例 １
熱盤に最も近い鏡面板に別の鏡面板を重ねるこ
となく、他は実施例１と同様に加熱加圧成形し
た。
実施例１〜２、比較例１で得られた1.6mm厚の
両面鈍張り積層板について、熱盤に最も近い位置
で成形された積層板Ａ、熱盤間の中央で成形され
た積層板Ｂの特性を第１表に示す。
尚、第１表における耐半田性および絶縁抵抗は
JIS―Ｃ―6481に準拠して測定した。また、積層
板の反り量は、400×400mmの試験片を全面エツチ
ングし、150℃で30分間加熱後の反りをJIS―Ｃ―
6481に準拠して測定した。
The present invention relates to a method for manufacturing a laminate, the purpose of which is to reduce warping of the laminate located closest to the hot platen during molding. Generally, laminates are made by impregnating a base material such as paper or glass cloth with a thermosetting resin to create a B-stage prepreg, then stacking one or several sheets of the prepreg, and applying copper foil etc. as necessary. These 6 to 8 pairs are stacked and sandwiched between mirrored plates, and a cushion material (usually made up of about 20 layers of kraft paper) is placed on both sides, and the fabric is heated and pressed between hot plates. Ru. By the way, in the manufacturing of printed wiring boards, as wiring circuit designs have recently become more dense and processing processes have become more automated, strict requirements have been placed on reducing warping of the laminates that serve as substrates. ing. However, usually in laminate manufacturing,
In order to increase productivity, as mentioned above, multiple sets of prepreg are placed between the hot platens, and the laminates formed near the hot plate will warp more than those formed in the center. This tended to cause problems during printed wiring board processing. As a result of intensive research in order to solve these problems, the present invention was developed by adding 1 layer to the mirrored plate closest to the heating plate inside the conventional cushion material.
By stacking two flat metal plates, the warpage of the laminate formed near the heating plate can be reduced to the same level as the warpage of the laminate formed in the center, without degrading the properties of the laminate as a whole. I found out that it can be done. This prevents the mirror plate located closest to the heating plate from bending under heat and pressure due to the presence of the cushioning material, causing warpage in the laminate. This is to eliminate the cause of the warpage. The material of the mirror plate is not particularly limited, but a material with high hardness is desirable. Stainless steel plates are usually used. Also, the metal flat plate that overlaps the mirror plate closest to the heating plate may or may not be the same as the other mirror plates, but it is preferable that it has a large bending elastic modulus, hardness, and thickness. . The base materials used in the present invention include paper, glass,
Synthetic fibers, etc., and are not particularly limited. Examples of the present invention will be described. Example 1 Eight sheets of paper-based phenolic resin prepregs with 35 μ thick copper foil placed on both sides were sandwiched between 1.5 mm thick mirror plates made of stainless steel, and the 8 sets were placed between hot plates. throw into. A similar mirror plate was placed on the mirror plate closest to the heating plate, and a cushion material made of 20 sheets of kraft paper was interposed between the plate and the plate, and heat and pressure molding was carried out at a pressure of 100 kg/cm 2 for 70 minutes. Example 2 Heat and pressure molding was carried out in the same manner as in Example 1, except that a 2.5 mm thick mirror plate made of stainless steel was used as another mirror plate to overlap the mirror plate closest to the heating plate. Comparative Example 1 Heat and pressure molding was carried out in the same manner as in Example 1, except that another mirror plate was not placed on the mirror plate closest to the heating plate. Regarding the double-sided dull-stretched laminates with a thickness of 1.6 mm obtained in Examples 1 to 2 and Comparative Example 1, laminate A was formed at the position closest to the hot platen, and laminate B was formed at the center between the hot platens. The characteristics are shown in Table 1. In addition, the solder resistance and insulation resistance in Table 1 are
Measured in accordance with JIS-C-6481. In addition, the amount of warpage of the laminate was measured by etching a 400 x 400 mm test piece over the entire surface and measuring the warp after heating it at 150°C for 30 minutes using JIS-C.
Measured in accordance with 6481.
【表】
実施例 ３
ガラス織布基材エポキシ樹脂のプリプレグ８枚
を重ね合わせその両面に35μ厚の銅箔を配置した
ものをステンレス鋼からなる1.5mm厚の鏡面板に
挾み、その８組を熱盤間に投入する。熱盤に最も
近い鏡面板には更に同様の鏡面板を重ね、熱盤と
の間にクラフト紙20枚からなるクツシヨン材を介
在させて、圧力100Kg／cm2で70分間加熱加圧した。
実施例 ４
ガラス織布基材エポキシ樹脂のプリプレグ８枚
を重ね合わせその両面に35μ厚の銅箔を配置した
ものをステンレス鋼からなる1.5mm厚の鏡面板に
挾み、その８組を熱盤間に投入する。熱盤に最も
近い鏡面板は更に同様の鏡面板を重ね、熱盤との
間にアスベスト紙10枚からなるクツシヨン材を介
在させて、圧力100Kg／cm2で70分間加熱加圧した。
比較例 ２
熱盤に最も近い鏡面板に別の鏡面板を重ねるこ
となく、他は実施例３と同様に加熱加圧成形し
た。
実施例３〜４、比較例２で得られた1.5mm厚の
両面銅張り積層板について、第１表の場合と同様
に、第２表に積層板の特性を示す。[Table] Example 3 Eight sets of glass woven fabric base epoxy resin prepregs were stacked together and 35 μ thick copper foil was placed on both sides, which was sandwiched between 1.5 mm thick mirror plates made of stainless steel. is placed between the heating plates. A similar mirror plate was placed on the mirror plate closest to the heating plate, and a cushion material consisting of 20 sheets of kraft paper was interposed between the plate and the plate, and the mixture was heated and pressurized at a pressure of 100 kg/cm 2 for 70 minutes. Example 4 Eight sheets of glass woven fabric base epoxy resin prepregs were stacked together and 35 μ thick copper foil was placed on both sides, which was sandwiched between 1.5 mm thick mirror plates made of stainless steel, and the 8 sets were placed on a hot platen. Insert in between. The mirror plate closest to the heating plate was further stacked with a similar mirror plate, and a cushion material consisting of 10 sheets of asbestos paper was interposed between it and the heating plate, and heated and pressurized at a pressure of 100 kg/cm 2 for 70 minutes. Comparative Example 2 Heat and pressure molding was carried out in the same manner as in Example 3, except that another mirror plate was not placed on the mirror plate closest to the heating plate. Table 2 shows the properties of the 1.5 mm thick double-sided copper-clad laminates obtained in Examples 3 and 4 and Comparative Example 2, as in Table 1.
【表】
第１表、第２表から明らかなように、本発明に
よれば熱盤の近くで成形された積層板の反りを熱
盤間の中央で成形された積層板の反りと同程度に
小さくすることができ、また耐半田性、絶縁抵抗
も何ら低下させるものでない点、その工業的価値
は極めて大なるものである。[Table] As is clear from Tables 1 and 2, according to the present invention, the warpage of the laminate formed near the hot plates is the same as the warp of the laminate formed in the center between the hot plates. Its industrial value is extremely great because it can be made smaller in size and does not reduce solder resistance or insulation resistance in any way.
Claims (1)
プリプレグを鏡面板に挾みこれの複数組を重ね、
その両側にクツシヨン材を介在させて熱盤間で加
熱加圧するに際し、前記クツシヨン材の内側で、
熱盤に最も近く位置する鏡面板に更に１枚の金属
平面板を重ねることを特徴とする積層板の製造
法。1 Multiple sheets of prepreg obtained by impregnating a base material with a thermosetting resin are sandwiched between mirror plates, and multiple sets of these are stacked,
When heating and pressurizing between hot platens with a cushion material interposed on both sides, inside the cushion material,
A method for manufacturing a laminated plate, characterized in that one metal flat plate is further superimposed on the mirrored plate located closest to the heating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134643A JPS6025714A (en) | 1983-07-22 | 1983-07-22 | Manufacture of laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58134643A JPS6025714A (en) | 1983-07-22 | 1983-07-22 | Manufacture of laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025714A JPS6025714A (en) | 1985-02-08 |
| JPS6411448B2 true JPS6411448B2 (en) | 1989-02-23 |
Family
ID=15133156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58134643A Granted JPS6025714A (en) | 1983-07-22 | 1983-07-22 | Manufacture of laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025714A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8556611B2 (en) * | 2011-06-21 | 2013-10-15 | Xerox Corporation | Method for interstitial polymer planarization using a flexible flat plate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586690Y2 (en) * | 1978-12-28 | 1983-02-04 | 日立化成工業株式会社 | Upper plate for laminate production |
| JPS5670916A (en) * | 1979-11-14 | 1981-06-13 | Toshiba Chem Corp | Manufacture of lamination sheet |
| JPS5923693B2 (en) * | 1980-12-08 | 1984-06-04 | 日立化成工業株式会社 | Molding method for laminate products |
-
1983
- 1983-07-22 JP JP58134643A patent/JPS6025714A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6025714A (en) | 1985-02-08 |
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