JPH0397540A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH0397540A JPH0397540A JP23666589A JP23666589A JPH0397540A JP H0397540 A JPH0397540 A JP H0397540A JP 23666589 A JP23666589 A JP 23666589A JP 23666589 A JP23666589 A JP 23666589A JP H0397540 A JPH0397540 A JP H0397540A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- long
- foil
- laminate
- temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011888 foil Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 239000012209 synthetic fiber Substances 0.000 abstract 1
- 229920002994 synthetic fiber Polymers 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- -1 polyacrylic Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 241000272201 Columbiformes Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用hられる積層板の製造方法に関するものである
.
〔従来の技術〕
従来、電気機器等に用込られる積層板はw脂含漫紙、樹
脂含漫ガラス布等と金属箔とからなる積層板を多段プレ
スを用Lh CH l〜2時間という長時間の加熱加圧
或形によって得られるため、積層板中に成形歪が残留し
、積層板を印刷配線板に加工する際や印刷配線板に電子
部品を実装する際の熱によって反りを発生し、自動化工
程に支障を招来する欠点があった。特に高周波特性を充
足するためのポリフエニレンオキサイド樹脂積層板につ
ーてはその傾向が大であった。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc. [Prior art] Conventionally, laminates used in electrical equipment, etc. are made by pressing a laminate made of wreath-impregnated paper, resin-impregnated glass cloth, etc. and metal foil for a long time of 1 to 2 hours using a multistage press. Because it is obtained by heating and pressurizing or shaping over time, molding distortion remains in the laminate, and warping occurs due to the heat generated when processing the laminate into a printed wiring board or when mounting electronic components on the printed wiring board. However, there was a drawback that it caused problems in the automated process. This tendency was particularly strong in the case of polyphenylene oxide resin laminates intended to satisfy high frequency characteristics.
従来の技術で述べたように、多段プレス方式によって得
られる積層板はその加工工程におbで反りを発生する。As described in the prior art section, the laminated plate obtained by the multi-stage press method is warped during the processing process.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは反り発生のな帆ポ
リフエニレンオキサイド樹脂積層板の製造方法を提供す
ることにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for manufacturing a sail polyphenylene oxide resin laminate that does not cause warping.
本発明は所要枚数の長尺ボリ7エニレンオキサイド樹脂
含浸乾燥基材の上面及び又は下面に長尺金属箔を重ね、
上下に配設したラミネートロール間を通しラミネートし
た長尺帯状積層体を轡続的に移行させつつ硬化後、所要
寸法lこ切断し、更に熱変形温度以上jこ加熱後、熱変
形温度以下lこ冷却することを特徴とする積層板の製造
方法のため、加圧することがなくなるか又は最少限にす
ることができ%残留歪をなくすることができたもので、
以下本発明を詳mlc説明する.
本発明に用hる長尺ポリフエニレンオキサイド61脂含
浸乾燥基材としては、ガラス、アスベスト等の無機繊維
やボリエステル、ポリアクリル、ポリビニルアルコール
、ボリアミド、ポリイミド、ボリフエニレンサルファイ
ト、ポリウレタン等ノ有機合或は維や木綿等の天然繊維
力》らなる織布、不織布、マ・ット或は紙又はこれ等の
組合せ基材にボリフエニレンオ牛サイドに対し、スチレ
ンプタジエンコボリマー トリアリルインシアメレート
、過酸化剤等を加えてなるポリフエニレンオキサイド樹
脂を樹脂量が40〜60 重量優(以下単に参と記す
)になるように含浸させたもので,a脂含浸は1次含浸
を同系樹脂又は異系ml脂の低粘度樹脂で行なつことが
より均一含漫ができるので好ましいことである。樹脂に
は必要に応じて水酸化アルミニウム,タルク、シリカ、
アルミナ等の充填剤を添加することもできる。更に樹脂
はそのまま用いてもよいが好ましくは減圧脱泡してから
用いることが樹脂含Is内の気泡発生を抑える上で望ま
しbことである.金属箔としては銅、アルミニウム、鉄
、ニッケル、亜鉛等の単独、合金、複合箔が用いられ、
必要に応じて金属箔の片面に接着剤層を設けておき、よ
り接着性を向上させることもできる.ラミネートロール
としては金礪製、ゴム製%嶺或樹脂製或いは金属ロール
表面にゴムや合成樹脂をライニングしたものでもよく任
意である。長尺帯状積層体の硬化は樹脂の種類によって
硬化温度、硬化時間を選択することができるが硬化は無
圧乃至20KQ/dであることが重要である。The present invention involves stacking a required number of long metal foils on the upper and/or lower surfaces of a dried substrate impregnated with 7-enylene oxide resin,
After curing the laminated long strip-shaped laminate through continuous lamination rolls placed above and below, it is cut to the required size, heated to a temperature above the heat distortion temperature, and then cut to a temperature below the heat distortion temperature. Since the manufacturing method of the laminate is characterized by cooling, pressure can be eliminated or minimized, and residual strain can be eliminated.
The present invention will be explained in detail below. The long polyphenylene oxide 61 resin-impregnated dry base material used in the present invention includes glass, inorganic fibers such as asbestos, polyester, polyacrylic, polyvinyl alcohol, polyamide, polyimide, polyphenylene sulfite, polyurethane, etc. Organic composites or natural fibers such as fibers and cotton, woven fabrics, non-woven fabrics, matte or paper, or combinations thereof, are coated with styrene-butadiene copolymer triallyl insiame. It is impregnated with polyphenylene oxide resin made by adding a peroxidant, etc. so that the resin amount is 40 to 60% by weight (hereinafter simply referred to as reference). It is preferable to use a low viscosity resin such as a resin or a different type of ml fat because it allows for more uniform impregnation. Aluminum hydroxide, talc, silica, etc. are added to the resin as necessary.
Fillers such as alumina can also be added. Furthermore, although the resin may be used as it is, it is preferable to use it after degassing under reduced pressure, in order to suppress the generation of bubbles in the resin-containing Is. As metal foils, single, alloy, and composite foils of copper, aluminum, iron, nickel, zinc, etc. are used.
If necessary, an adhesive layer can be provided on one side of the metal foil to further improve adhesion. The laminating roll may be made of gold, rubber or resin, or a metal roll whose surface is lined with rubber or synthetic resin. The curing temperature and curing time for curing the long strip-shaped laminate can be selected depending on the type of resin, but it is important that the curing is performed under no pressure or at 20 KQ/d.
切断後の加熱.冷却については用bた樹脂の熱変形温度
以上、以下にできるものであれば特に限定しないが、冷
却については急冷できるものであることが望ましh0
以下本発明の一実施例を図示実施例fどもとづbて説明
すれば次のようである.
実施例
第1図は本発明の積層板の製造方法の一実施例を示す簡
略工程図である。Heating after cutting. Cooling is not particularly limited as long as it can be made to a temperature above or below the thermal deformation temperature of the resin used, but it is desirable that the cooling is capable of rapid cooling. The explanation is as follows. Embodiment FIG. 1 is a simplified process diagram showing an embodiment of the method for manufacturing a laminate according to the present invention.
第1図に示すように巾1050fl,厚さ0.2flo
長尺ガラス布に、ポリフエニレンオキサイド40重量部
(以下単に部と記す)に対しスチレンプタジエンコボリ
マ−40部、トリアリルインシアヌレート120部、2
.5.ジメチル2.5ジターシャリープチルバーオキシ
ヘキシン316部加えてなるポリフエニレンオキサイド
樹脂を樹脂量が45t6になるように含浸、乾燥した長
尺ボリフエ=レンオキサイド樹脂含漬乾燥基材1の4枚
の上下面に厚さ0.035mの接看剤付銅箔2の接看剤
側を樹脂含没基材と対向させて富ね、上下に配設したラ
ミネートロール3間を通しラミネートした長尺帯状積層
体4を硬化炉5に送り220℃、接触圧で加熱硬化させ
た.この硬化物の熱変形温度はZaO℃であった。次に
該硬化物を1000 X 1000 ffil毎にカー
lター6で切断後、加熱炉7で210℃に加熱後、冷却
炉8で60℃に急冷して厚さ0. 8 ffの両面鋼張
積層板9を得た。As shown in Figure 1, width 1050fl, thickness 0.2flo
On a long glass cloth, 40 parts by weight of polyphenylene oxide (hereinafter simply referred to as parts), 40 parts of styrene ptadiene cobolymer, 120 parts of triallyl in cyanurate, 2
.. 5. 4 pieces of long polyphenylene oxide resin impregnated with 2.5 parts of dimethyl and 316 parts of ditertiarybutylbaroxyhexine to a resin amount of 45t6 and dried long polyphenylene oxide resin-impregnated dry base material 1 A long piece of copper foil 2 with a adhesive 0.035 m thick is placed on the upper and lower surfaces of the sheet, with the adhesive side facing the resin-impregnated base material, and laminated by passing it between laminating rolls 3 disposed above and below. The strip-shaped laminate 4 was sent to a curing furnace 5 and heated and cured at 220° C. under contact pressure. The heat distortion temperature of this cured product was ZaO°C. Next, the cured product was cut into pieces of 1000 x 1000 ffil with a carter 6, heated to 210°C in a heating furnace 7, and then rapidly cooled to 60°C in a cooling furnace 8 to a thickness of 0. A double-sided steel clad laminate 9 of 8 ff was obtained.
比較例
実施例と同じ長尺ポリフエニレンオキサイド樹脂含浸乾
燥基材f 10sO x 1050m角に切断したもの
4枚を重ね、更にその上下面に実施例と同じ鋼箔と上記
と同じ寸法に切断したものを配設し220℃soitg
7’7で30分間加熱加圧して厚さQ, 8 flの両
面銅張積層板を得た。Comparative Example The same long polyphenylene oxide resin-impregnated dried base material f as in the example, cut into 10sO x 1050m squares, was stacked together, and the same steel foil as in the example was placed on the top and bottom surfaces, and the same steel foil as in the example was cut into the same dimensions as above. Place things at 220℃ soitg
A double-sided copper-clad laminate having a thickness of Q and 8 fl was obtained by heating and pressing at 7'7 for 30 minutes.
実施例及び比較例の積層板の性能は第1表のようである
。The performance of the laminates of Examples and Comparative Examples is shown in Table 1.
〔発明の効果〕
本発明は上述した如く構或されている.%許請求の範囲
に記載した構或を有する積層板の製造方法においては反
りの少ない積層板が得られる効果がある。[Effects of the Invention] The present invention is constructed as described above. % The method for manufacturing a laminate having the structure described in the claims has the effect of producing a laminate with less warpage.
第1図は本発明の8l鳩板の製造方法の一実施例を示す
簡略工程図である。
1は長尺樹脂含漫乾燥基材、2は銅箔、3はラミネート
ロール、4は長尺帝状積層体、5は硬化炉、6はカッタ
ー 7は加熱炉%8は冷却炉、9は積層板である。FIG. 1 is a simplified process diagram showing an embodiment of the method for manufacturing an 8l pigeon board of the present invention. 1 is a long resin-containing dry base material, 2 is a copper foil, 3 is a laminating roll, 4 is a long diagonal laminate, 5 is a curing furnace, 6 is a cutter, 7 is a heating furnace, 8 is a cooling furnace, and 9 is a It is a laminated board.
Claims (1)
浸乾燥基材の上面及び又は下面に長尺金属箔を重ね、上
下に配設したラミネートロール間を通しラミネートした
長尺帯状積層体を連続的に移行させつつ硬化後、所要寸
法に切断し、更に熱変形温度以上に加熱後、熱変形温度
以下に冷却することを特徴とする積層板の製造方法。(1) Long metal foils are layered on the upper and/or lower surfaces of the required number of long polyphenylene oxide resin-impregnated dry substrates, and the laminated long strip-shaped laminate is continuously laminated by passing between lamination rolls arranged above and below. 1. A method for manufacturing a laminate, which comprises curing the laminate while transferring to a temperature, cutting it into required dimensions, heating the plate to a temperature higher than the heat distortion temperature, and cooling the plate to a temperature lower than the heat distortion temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23666589A JPH0397540A (en) | 1989-09-12 | 1989-09-12 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23666589A JPH0397540A (en) | 1989-09-12 | 1989-09-12 | Manufacture of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0397540A true JPH0397540A (en) | 1991-04-23 |
Family
ID=17003975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23666589A Pending JPH0397540A (en) | 1989-09-12 | 1989-09-12 | Manufacture of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0397540A (en) |
-
1989
- 1989-09-12 JP JP23666589A patent/JPH0397540A/en active Pending
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