JPH0397551A - Production of laminated sheet - Google Patents

Abstract

PURPOSE:To obtain a laminated sheet which is free from generation of a warpage and good in interlaminar adhesive property by overlapping a dry base material impregnated with polyphenylene oxide resin, a polyphenylene oxide resin film and a metallic foil and curing the long-sided banklike laminated body while continuously transferring this laminated body and thereafter cutting this cured laminated body into required dimension and furthermore heating it at the heat distortion temp. or higher and thereafter cooling it at the same temp. or below. CONSTITUTION:As a long-sized dry base material 1 impregnated with polyphenylene oxide resin, inorganic fiber such as glass, organic synthetic fiber such as polyester or the base material combined therewith are impregnated with polyphenylene oxide resin and utilized. As a polyphenylene oxide film 2, polyphenylene oxide resin is formed into a film and this film is utilized. As a metallic foil 3, a single foil of copper, etc., and alloy foil and a composite foil are utilized. As the laminating rolls 4, the rolls made of metal and rubber may be arbitrarily utilized. As curing 6 of a long-sized banklike laminated body 5, curing temp. and curing time can be selected by the kind of resin. It is important that curing is performed at from nonpressure to 20 kg/cm<2>. Heating 8 and cooling 9 after cutting 7 are especially not limitted if heating or cooling can be performed at the temp. not lower than the heat distortion temp. of the utilized resin or at the temp.not higher than it.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventionally, laminates used for electrical equipment, etc. are obtained by heating and press-forming a laminate made of resin-impregnated paper, resin-impregnated glass, and metal foil for a long period of time, typically 2 hours or more. As a result, molding distortion remains in the laminate, causing warping due to the heat generated when processing the laminate into a printed layout board or mounting electronic components on a printed wiring board, causing problems in the automation process. There were drawbacks. This tendency was particularly strong for polyphenylene oxide resin laminates to satisfy high frequency characteristics.

[Problem that the invention seeks to solve]

As described in the related art section, the stacked plates obtained by the multi-stage press method are warped during the processing process.

The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to prevent warping.
An object of the present invention is to provide a method for producing a polyphenylene oxide resin laminate having good interlayer adhesion.

[Means for solving problems]

In the present invention, polyphenylene oxide resin 7 inolem is arranged on the upper and/or lower surfaces of each of the required number of long polyphenylene oxide resin-impregnated dried base materials, and further, a long metal foil is stacked on the outermost side as necessary, and the long metal foil is arranged above and below. The long strip-shaped laminate is laminated by passing it through the laminating rolls set up. The method of manufacturing a laminate is characterized by curing the material while continuously transferring it, cutting it to the required size, heating it above the heat distortion temperature, and then cooling it below the heat distortion temperature, which eliminates the need for pressurization. Since it can be minimized, residual strain can be eliminated, and since it is a film, interlayer adhesion can be improved.The present invention will be described in detail below.

The long polyphenylene oxide resin-impregnated dry substrate used in the present invention includes inorganic fibers such as glass and asbestos, polyester, polyacrylic, polyvinyl alcohol,
Woven fabrics made of organic composite fibers such as polyamide, polyimide, polyphenylene sulfite, polyurethane, and natural fibers such as cotton. A polyphenylene oxide resin prepared by adding styrene ptadiene copolymer triallyl isocyanurate, peroxidant, etc. to polyphenylene oxide is added to a nonwoven fabric, mat, paper, or a combination thereof in a resin amount of 20 to 60% by weight ( (hereinafter referred to as ``AA'')
It is preferable to perform the primary impregnation with a low viscosity resin of the same type or a different type because more uniform impregnation can be achieved. Fillers such as aluminum hydroxide, Merck, silica, and alumina can also be added to the resin as needed. Further, the resin may be used as it is, but it is preferable to degas it under reduced pressure before use in order to suppress the generation of air bubbles inside the resin-impregnated area. As a polyphenylene oxide resin film, the above resin is used to a thickness of 0. It is possible to use a film made from OI to 0.2 mx. Copper as metal foil,
Single, alloy, or composite foils of aluminum, iron, nickel, zinc, etc. are used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve adhesiveness.

The laminating roll may be made of metal, rubber, synthetic resin, or a metal roll whose surface is lined with rubber, plastic, or resin. For curing of the long strip-shaped laminate, the curing temperature and curing temperature can be selected depending on the type of resin, but it is important that the curing is done without pressure or at 204 liters. Heating and cooling after cutting are not particularly limited as long as they can be kept at temperatures above or below the thermal deformation temperature of the resin used, but it is desirable that the cooling be capable of rapid cooling.

Hereinafter, one embodiment of the present invention will be described based on the gold-illustrated embodiment.

Embodiment FIG. 1 is a simplified process diagram showing an embodiment of the method for manufacturing a pigeon board according to the present invention.

As shown in Figure 1, width 105011, thickness Q, 2 m
To the right of the long glass is polyphenylene oxide 4Oij.
Polyphenylene prepared by adding 40 parts of styrene ptadiene copolymer, 120 parts of triallyl in cyanurate, and 6 parts of 2.5 dimethyl 2.5 ditertiary butyl peroxyhexine to part i (hereinafter simply referred to as part). A film 2 of the above resin having a thickness of Q, 025 ff is placed between each of the four layers of the long polyphenylene oxide resin-impregnated dry base material 1, which is impregnated with oxide resin to a resin amount of 3 (l) and on the outermost layer. In addition, the top and bottom surfaces have a thickness of Q.035 fl.
The adhesive-coated copper foil 3 is stacked with the adhesive side facing the polyphenylene oxide resin film 2, and the laminated long strip-shaped laminate 5 is sent to a curing furnace 6 at 220° C. by passing it between laminating rolls 4 arranged above and below. , heat-cured with contact pressure. The heat distortion temperature of this cured product was 200°C.

Next, the cured product was cut into pieces of 1000 x 1000 fl with a cutter 7, heated to 210°C in a heating furnace 8, and rapidly cooled to 60°C in a cooling furnace 9 to form a double-sided steel clad laminate 1 with a thickness of 0.9M.
I got 0.

Comparative Example 1 The same long polyphenylene oxide resin-impregnated dried base material f as in the example was cut into squares of 1050 x 1050 tx, stacked on top of each other, and the same copper foil as in the example was placed on the upper and lower surfaces, and the same dimensions were cut as above. Place the items at 220℃, so
Heat and pressurize for 30 minutes with Kg7"c4 to obtain thickness Q, g M
A double-sided copper-clad laminate of 1 was obtained.

Comparative Example 2 A double-sided copper-clad laminate having a thickness of Q and gfi was obtained by processing in the same manner as in the example except that the polyurethane resin film of the example was omitted.

The performances of the laminates of Examples and Comparative Examples 1 and 2 are shown in Table 1.

〔Effect of the invention〕

The present invention is constructed as described above. The method for producing a laminated board having the configuration described in the claims has the effect of producing a laminated board with less warpage and good interlayer adhesion.

[Brief explanation of drawings]

Figure 1 is a simplified process diagram showing one embodiment of the method for manufacturing a laminate of the present invention. 1 is a long resin-impregnated dry base material, 2 is a resin film 3 is a copper foil, 4 is a laminate roll, 5 is a long strip-shaped laminate, 6 is a curing furnace, 7 is a cutter, 8 is a heating furnace, and 9 is a cooling furnace% 10 is a laminate. 1

Claims (1)

[Claims] (1) Arrange a polyphenylene oxide resin film on the top and/or bottom surface of each of the required number of long polyphenylene oxide resin-impregnated dried base materials, and then layer a long metal foil on the outermost side as necessary, and then The laminated long strip-shaped laminate is continuously transferred between the laminating rolls provided, and after hardening, it is cut into required dimensions, further heated above the heat distortion temperature, and then cooled below the heat distortion temperature. A method for manufacturing a laminate.