JPH04216022A - Manufacture of thermosetting resin laminate - Google Patents
Manufacture of thermosetting resin laminateInfo
- Publication number
- JPH04216022A JPH04216022A JP2415749A JP41574990A JPH04216022A JP H04216022 A JPH04216022 A JP H04216022A JP 2415749 A JP2415749 A JP 2415749A JP 41574990 A JP41574990 A JP 41574990A JP H04216022 A JPH04216022 A JP H04216022A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- aramid fiber
- molding
- manufacture
- torr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 11
- 239000011347 resin Substances 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000002966 varnish Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000000123 paper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920001494 Technora Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004950 technora Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011101 paper laminate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、アラミド繊維紙を基材
とする耐熱性に優れた積層板の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminate having excellent heat resistance and having aramid fiber paper as a base material.
【０００２】0002
【従来の技術】従来、アラミド繊維紙積層板は、その低
熱膨張性という利点を活かして表面実装用基板として一
部使用されているが、はんだ耐熱性が十分でないという
欠点がありその改良が望まれていた。[Prior Art] Conventionally, aramid fiber paper laminates have been partially used as substrates for surface mounting, taking advantage of their low thermal expansion properties, but they have the disadvantage of insufficient soldering heat resistance, and improvements are desired. It was rare.
【０００３】0003
【発明が解決しようとする課題】本発明者は、アラミド
繊維紙基材の熱硬化性樹脂積層板のはんだ耐熱性不良を
解決することを目的に研究した結果、真空条件下で加熱
加圧成形することが有効であることを見出し、本発明を
完成するに至ったものである。[Problems to be Solved by the Invention] As a result of research aimed at solving the poor solder heat resistance of thermosetting resin laminates made of aramid fiber paper base materials, the present inventors have discovered that the present inventors have developed a method of heat-pressing molding under vacuum conditions. They have found that it is effective to do so, and have completed the present invention.
【０００４】0004
【課題を解決するための手段】本発明は、熱硬化性樹脂
からなるワニスをアラミド繊維紙からなる基材に含浸さ
せてプリプレグを得、これを所定枚数重ね合わせて加熱
加圧成形する際に、真空条件下で加熱加圧成形する事を
特徴とする熱硬化性樹脂積層板の製造方法に関するもの
である。[Means for Solving the Problems] The present invention impregnates a base material made of aramid fiber paper with a varnish made of a thermosetting resin to obtain a prepreg, and when a predetermined number of prepregs are stacked and molded under heat and pressure. This invention relates to a method for producing a thermosetting resin laminate, which is characterized by heat-pressure molding under vacuum conditions.
【０００５】本発明でいう熱硬化性樹脂は、エポキシ樹
脂、フェノール樹脂、ポリイミド樹脂、ポリエステル樹
脂等であり、いずれにも限定されない。[0005] The thermosetting resin referred to in the present invention includes epoxy resin, phenol resin, polyimide resin, polyester resin, etc., and is not limited to any of them.
【０００６】アラミド繊維紙には、パラ配向アラミド繊
維であるＫｅｖｌｅｒ（登録商標）を使用したＫｅｖｌ
ｅｒ（登録商標）繊維紙、Ｔｅｃｈｎｏｒａ（登録商標
）を使用したＴｅｃｈｎｏｒａ（登録商標）繊維紙等が
ある。これらのアラミド繊維紙に前記熱硬化性樹脂から
なるワニスを含浸し、１６５〜１７５℃、２〜５分間程
度乾燥し、アラミド繊維紙基材プリプレグを得る。この
プリプレグを、所定枚数重ね合わせて加熱加圧成形する
際に従来は大気圧条件下で行なわれている。Aramid fiber paper uses Kevler (registered trademark), which is a para-oriented aramid fiber.
er (registered trademark) fiber paper, Technora (registered trademark) fiber paper using Technora (registered trademark), and the like. These aramid fiber papers are impregnated with a varnish made of the thermosetting resin and dried at 165 to 175°C for about 2 to 5 minutes to obtain an aramid fiber paper base prepreg. Conventionally, a predetermined number of prepregs are piled up and heated and press-molded under atmospheric pressure conditions.
【０００７】本発明においては、加熱加圧成形を真空条
件下で行う事によりはんだ耐熱性向上効果を得るのであ
るが、真空条件としては２０Ｔｏｒｒ以下、好ましくは
２Ｔｏｒｒ以下である。真空条件が２０Ｔｏｒｒ以上で
ははんだ耐熱性向上効果を得る事はできない。[0007] In the present invention, the effect of improving solder heat resistance is obtained by performing heating and pressure forming under vacuum conditions, and the vacuum conditions are 20 Torr or less, preferably 2 Torr or less. If the vacuum condition is 20 Torr or more, the effect of improving solder heat resistance cannot be obtained.
【０００８】[0008]
【実施例】以下に、本発明の実施例及び比較例を示す。[Examples] Examples and comparative examples of the present invention are shown below.
【０００９】〔実施例１〕
熱硬化性樹脂としてエポキシ樹脂を用いた。配合は次の
通りである。
エポキシ樹脂（油化シェル製 ＥＰ−１００１）
１００部ジシアンジアミド
４部２−
フェニル−４−メチルイミダゾール
０．１５部メチルセロソルブ
３６部アセトン
６０部
[Example 1] Epoxy resin was used as the thermosetting resin. The formulation is as follows. Epoxy resin (Yuka Shell EP-1001)
100 parts dicyandiamide
Part 4 2-
Phenyl-4-methylimidazole
0.15 parts methyl cellosolve
36 parts acetone
60 copies
【００１０】上記ワニスを混合して均一なワニスを得た
。このワニスをアラミド織維紙（秤量６０ｇ／ｍ２）に
含浸し１６５〜１７５℃で５分間乾燥し、アラミド繊維
紙プリプレグを得た。[0010] The above varnishes were mixed to obtain a uniform varnish. This varnish was impregnated into aramid fiber paper (basis weight: 60 g/m2) and dried at 165 to 175°C for 5 minutes to obtain an aramid fiber paper prepreg.
【００１１】このプリプレグを所定枚数重ね合わせ、さ
らにその上に銅箔を重ね、２Ｔｏｒｒの真空条件下で加
熱加圧成形して厚さ１．２ｍｍの銅張積層板を得た。[0011] A predetermined number of sheets of this prepreg were stacked, a copper foil was further placed on top of the prepregs, and a copper clad laminate having a thickness of 1.2 mm was obtained by heating and press-molding the prepreg under a vacuum condition of 2 Torr.
【００１２】〔実施例２〕
実施例１と同様にして得たプリプレグを所定枚数重ね合
わせ、さらにその上に銅箔を重ね、２０Ｔｏｒｒの真空
条件下で加熱加圧成形して厚さ１．２ｍｍの銅張積層板
を得た。[Example 2] A predetermined number of prepregs obtained in the same manner as in Example 1 were stacked together, a copper foil was further layered on top of the prepregs, and the resultant was molded under heat and pressure under a vacuum condition of 20 Torr to a thickness of 1.2 mm. A copper-clad laminate was obtained.
【００１３】〔比較例１〕
実施例１と同様にして得たプリプレグを所定枚数重ね合
わせ、さらにその上に銅箔を重ね、大気圧条件下で加熱
加圧成形して厚さ１．２ｍｍの銅張積層板を得た。[Comparative Example 1] A predetermined number of prepregs obtained in the same manner as in Example 1 were stacked together, a copper foil was further stacked on top of the prepregs, and a sheet with a thickness of 1.2 mm was formed by heating and pressing under atmospheric pressure conditions. A copper-clad laminate was obtained.
【００１４】以上の実施例及び比較例で得られた銅張積
層板について、ＪＩＳ Ｃ ６４８１によるはんだ
耐熱性を測定し、その結果を表１に示す。The solder heat resistance of the copper-clad laminates obtained in the above examples and comparative examples was measured according to JIS C 6481, and the results are shown in Table 1.
【００１５】[0015]
【表１】[Table 1]
【００１６】以上の様に、本発明により得られた熱硬化
性銅張積層板は、はんだ耐熱性が著しく向上している。As described above, the thermosetting copper-clad laminate obtained according to the present invention has significantly improved solder heat resistance.
【００１７】[0017]
【発明の効果】本発明により得られた積層板は、従来の
大気圧条件下で得られた積層板と比較してはんだ耐熱性
が著しくすぐれている。[Effects of the Invention] The laminate obtained according to the present invention has significantly superior solder heat resistance compared to the conventional laminate obtained under atmospheric pressure conditions.
Claims (1)
ド繊維紙からなる基材に含浸させたプリプレグを所定枚
数重ねて加熱加圧成形する際に、真空条件下で加熱加圧
成形する事を特徴とする熱硬化性樹脂積層板の製造方法
。[Claim 1] A predetermined number of sheets of prepreg in which a base material made of aramid fiber paper is impregnated with a varnish made of a thermosetting resin are stacked and heated and pressure molded, and the method is characterized in that the heat and pressure molding is carried out under vacuum conditions. A method for producing a thermosetting resin laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415749A JPH04216022A (en) | 1990-12-13 | 1990-12-13 | Manufacture of thermosetting resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415749A JPH04216022A (en) | 1990-12-13 | 1990-12-13 | Manufacture of thermosetting resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04216022A true JPH04216022A (en) | 1992-08-06 |
Family
ID=18524045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2415749A Pending JPH04216022A (en) | 1990-12-13 | 1990-12-13 | Manufacture of thermosetting resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04216022A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103395212A (en) * | 2013-07-26 | 2013-11-20 | 上海舟汉纤维材料科技有限公司 | Preparation method for polyimide-based aramid composite material |
-
1990
- 1990-12-13 JP JP2415749A patent/JPH04216022A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103395212A (en) * | 2013-07-26 | 2013-11-20 | 上海舟汉纤维材料科技有限公司 | Preparation method for polyimide-based aramid composite material |
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