JPH05162238A - Laminated sheet - Google Patents

Laminated sheet

Info

Publication number
JPH05162238A
JPH05162238A JP33096791A JP33096791A JPH05162238A JP H05162238 A JPH05162238 A JP H05162238A JP 33096791 A JP33096791 A JP 33096791A JP 33096791 A JP33096791 A JP 33096791A JP H05162238 A JPH05162238 A JP H05162238A
Authority
JP
Japan
Prior art keywords
resin
thickness
laminated sheet
impregnated
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33096791A
Other languages
Japanese (ja)
Inventor
Sadahisa Takaura
禎久 高浦
Shigeaki Kojima
甚昭 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP33096791A priority Critical patent/JPH05162238A/en
Publication of JPH05162238A publication Critical patent/JPH05162238A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a laminated sheet having a high permittivity by integrally arranging metal foil to the upper surface and/or rear surface of a laminate composed of a required number of resin impregnated base materials each obtained by impregnating a base material with a resin containing an inorg. filler with a high permittivity. CONSTITUTION:A glass fibric with a thickness of 0.2mm is impregnated with a curing agent-containing epoxy resin with alumina content of 20% in an amount of 45% to be dried. Copper foils with a thickness of 0.018mm are arranged on the upper and rear surfaces of seven epoxy resin impregnated glass fabric prepregs thus obtained to form a laminate which is, in turn, heated and pressed at 165 deg.C for 90min under molding pressure of 40kg/cm<2> by a multistage press to obtain a laminated sheet with a thickness of 1.6mm.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器、電気機器、
コンビュ−タ−、通信機器等に用いられる積層板、特に
高誘電率の積層板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a laminated plate used for a computer, a communication device, etc., particularly a laminated plate having a high dielectric constant.

【0002】[0002]

【従来の技術】従来、高誘電率積層板はアルミナ、窒化
珪素等のセラミック基板を用いているがセラミック基板
は多層化、軽量化、生産性等の点で問題があり、樹脂積
層板による高誘電率積層板が強く要望されていた。
2. Description of the Related Art Conventionally, a ceramic substrate made of alumina, silicon nitride or the like has been used for a high dielectric constant laminated plate, but the ceramic substrate has problems in that it is multi-layered, lightweight and has high productivity. There has been a strong demand for dielectric constant laminates.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の高誘電率積層板には問題があった。本発明
は従来の技術における上述の問題点に鑑みてなされたも
ので、その目的とするところは樹脂積層板による高誘電
率の積層板を提供することにある。
As described in the prior art, the conventional high dielectric constant laminate has a problem. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a laminate having a high dielectric constant made of a resin laminate.

【0004】[0004]

【課題を解決するための手段】本発明は、高誘電率無機
質充填剤含有樹脂を、基材に含浸してなる所要枚数の樹
脂含浸基材の上面及び又は下面に金属箔を配設ー体化し
てなることを特徴とする積層板のため、上記目的を達成
することができたもので、以下本発明を詳細に説明す
る。
DISCLOSURE OF THE INVENTION The present invention provides a metal foil disposed on the upper surface and / or lower surface of a required number of resin-impregnated base materials obtained by impregnating a base material with a resin containing a high dielectric constant inorganic filler. The above-mentioned object can be achieved because the laminated plate is characterized by being made into a material, and the present invention will be described in detail below.

【0005】本発明に用いる高誘電率無機質充填剤含有
樹脂は、フェノ−ル樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエ
チレンテレフタレート樹脂、ポリブチレンテレフタレー
ト樹脂、ポリフェニレンサルファイド樹脂、ポリフェニ
レンオキサイド樹脂、フッソ樹脂、ポリブタジエン樹脂
等の単独、変性物、混合物樹脂に、アルミナ、窒化珪
素、窒化ポロン等の高誘電率無機質充填剤を含有させた
もので、高誘電率の無機質充填剤全般を用いることがで
きる。高誘電率無機質充填剤の量は樹脂中の10〜85
重量%(以下単に%と記す)であることが望ましい。即
ち10%未満では高誘電率になり難く、85%をこえる
と基材への含浸性が低下する傾向にあるからである。基
材としてはガラス、セラミック、アスベスト等の無機質
繊維や、ビニルアルコ−ル、ポリイミド、ポリエチレン
テレフタレート、ポリブチレンテレフタレート、ポリア
ミド、ポリフエニレンサルフアイド、ポリフエニレンオ
キサイド、フッ素樹脂等の有機質繊維や木綿等の天然繊
維からなる織布、不織布、紙等である。基材に含浸させ
る樹脂量は樹脂固形分として35〜70%が好ましい。
更に樹脂は同一の樹脂のみによる含浸でもよいが、同系
樹脂又は異系樹脂により1次含浸、2次含浸というよう
に含浸を複数にし、より含浸が均一になるようにしても
よい。かくして基材に樹脂を含浸後、必要に応じて加熱
等で乾燥して樹脂含浸基材を得るものである。樹脂含浸
基材は必要に応じて所要枚数用いることができる。金属
箔としては銅、アルミニュウム、真鍮、ニッケル、鉄等
の単独、合金、複合箔が用いられ、必要に応じて金属箔
の片面に接着剤層を設けておくことができる。かくして
上記所要枚数の樹脂含浸基材の上面及び又は下面に、上
記金属箔を配設ー体化して積層板を得るものである。一
体化手段はプレス、マルチロール、ダブルベルト、無圧
連続工法等が用いられ特に限定するものではなく任意で
ある。
The high dielectric constant inorganic filler-containing resin used in the present invention is phenol resin, epoxy resin, unsaturated polyester resin, polyimide resin, polyamide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, polyphenylene. Oxide resin, fluorine resin, polybutadiene resin, etc., single, modified or mixed resin containing high dielectric constant inorganic filler such as alumina, silicon nitride, or polon nitride. Can be used. The amount of the high dielectric constant inorganic filler is 10 to 85 in the resin.
It is desirable that the content is weight% (hereinafter simply referred to as%). That is, if it is less than 10%, it becomes difficult to obtain a high dielectric constant, and if it exceeds 85%, the impregnation property into the base material tends to decrease. As the substrate, inorganic fibers such as glass, ceramics, asbestos, organic fibers such as vinyl alcohol, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyphenylene sulfide, polyphenylene oxide, fluororesin and cotton, etc. Woven fabrics, non-woven fabrics, papers, and the like made from natural fibers. The amount of resin with which the base material is impregnated is preferably 35 to 70% as a resin solid content.
Further, the resin may be impregnated only with the same resin, but may be made into a plurality of impregnations such as primary impregnation and secondary impregnation with the same resin or different type resin so that the impregnation becomes more uniform. Thus, after impregnating the base material with the resin, it is dried by heating or the like, if necessary, to obtain a resin-impregnated base material. The required number of resin-impregnated base materials can be used as needed. As the metal foil, copper, aluminum, brass, nickel, iron or the like alone, an alloy or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary. Thus, the above-mentioned metal foil is provided on the upper surface and / or the lower surface of the required number of resin-impregnated base materials to form a laminate. A press, a multi-roll, a double belt, a pressureless continuous method, or the like is used as the integration means, and the integration means is not particularly limited and is arbitrary.

【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.

【0007】[0007]

【実施例1】厚み0.2mmのガラス織布に、アルミナ
を20%含有する硬化剤含有エポキシ樹脂を樹脂量が4
5%になるように含浸、乾燥したエポキシ樹脂含浸ガラ
ス織布プリプレグ7枚の上下面に、厚さ0.018mm
の銅箔を配設した積層体を多段プレスで成形圧力40K
g/cm2 、165℃で90分間加熱加圧成形して厚さ
1.6mmの積層板を得た。
Example 1 A glass woven cloth having a thickness of 0.2 mm was coated with a curing agent-containing epoxy resin containing 20% of alumina in a resin amount of 4
0.018 mm thick on the upper and lower surfaces of seven epoxy resin-impregnated glass woven prepregs
Multi-stage press for forming a laminated body with the copper foil of
The laminate was heat and pressure molded at 165 ° C. for 90 minutes at g / cm 2 to obtain a laminated plate having a thickness of 1.6 mm.

【0008】[0008]

【実施例2】アルミナ量を50%にした以外は実施例1
と同様に処理して厚さ1.6mmの積層板を得た。
Example 2 Example 1 except that the amount of alumina was 50%.
The same treatment as described above was performed to obtain a laminated plate having a thickness of 1.6 mm.

【0009】[0009]

【実施例3】アルミナ量を75%にした以外は実施例1
と同様に処理して厚さ1.6mmの積層板を得た。
Example 3 Example 1 except that the amount of alumina was 75%.
The same treatment as described above was performed to obtain a laminated plate having a thickness of 1.6 mm.

【0010】[0010]

【比較例】アルミナ量を0%にした以外は実施例1と同
様に処理して厚さ1.6mmの積層板を得た。
[Comparative Example] A laminated plate having a thickness of 1.6 mm was obtained in the same manner as in Example 1 except that the amount of alumina was changed to 0%.

【0011】実施例1乃至3及び比較例の積層板の性能
は表1のようである。
Table 1 shows the performance of the laminated plates of Examples 1 to 3 and Comparative Example.

【0012】[0012]

【表1】 [Table 1]

【0013】[0013]

【発明の効果】本発明は上述したごとく構成されてい
る。特許請求の範囲に記載した構成を有する積層板にお
いては、高誘電率樹脂積層板が得られ、本発明の優れて
いることを確認した。
The present invention is constructed as described above. It was confirmed that a high dielectric constant resin laminated plate was obtained in the laminated plate having the structure described in the claims, and the present invention was excellent.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 高誘電率無機質充填剤含有樹脂を、基材
に含浸してなる所要枚数の樹脂含浸基材の上面及び又は
下面に金属箔を配設ー体化してなることを特徴とする積
層板。
1. A metal foil is arranged and formed on the upper surface and / or the lower surface of a required number of resin-impregnated base materials obtained by impregnating a base material with a resin containing a high dielectric constant inorganic filler. Laminated board.
JP33096791A 1991-12-16 1991-12-16 Laminated sheet Pending JPH05162238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33096791A JPH05162238A (en) 1991-12-16 1991-12-16 Laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33096791A JPH05162238A (en) 1991-12-16 1991-12-16 Laminated sheet

Publications (1)

Publication Number Publication Date
JPH05162238A true JPH05162238A (en) 1993-06-29

Family

ID=18238373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33096791A Pending JPH05162238A (en) 1991-12-16 1991-12-16 Laminated sheet

Country Status (1)

Country Link
JP (1) JPH05162238A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2751976A1 (en) * 1996-08-01 1998-02-06 Rogers Corp THERMOSETTING COMPOSITION WITH POLYBUTADIAN RESIN AND POLYISOPRENE, METHOD FOR MANUFACTURING SAME AND APPLICATION THEREOF AS ELECTRIC SUBSTRATE

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2751976A1 (en) * 1996-08-01 1998-02-06 Rogers Corp THERMOSETTING COMPOSITION WITH POLYBUTADIAN RESIN AND POLYISOPRENE, METHOD FOR MANUFACTURING SAME AND APPLICATION THEREOF AS ELECTRIC SUBSTRATE
GB2316101A (en) * 1996-08-01 1998-02-18 Rogers Corp Electrical substrate containing single resin thermosetting compositions
GB2316101B (en) * 1996-08-01 2000-05-03 Rogers Corp An electrical substrate material

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