JPH05315717A - Electrical laminated plate - Google Patents

Abstract

PURPOSE:To provide an electrical laminate plate excellent in heat resistance by integrally disposing a metal foil on the upper foil on the upper or lower surface of predetermined sheets of resin-impregnated base materials, each resin- impregnated base material including a hygroscopic good heat conductor containing resin-impregnated base material coated with resin. CONSTITUTION:Resin used for a resin-impregnated base material includes single materials, and mixtures of phenol resin and epoxy resin and the like for example. To the resin there is added a resin coated hygroscopic good heat conductor. For the hygroscopic good heat conductor there are employed aluminum nitride, kaolin cray graphic, etc. For the amount of radiation of the hygroscopic good heat conductor 10 to 300 pts. are preferable for 100 pts. by weight of the resin. For the metal foil there are employed a single foil, an alloy foil, and a composite foil of copper, aluminum brass, nickel, and iron, and the like. For conditions of integration, there may be selected hardening temperature, hardening time, and molding pressure for the resin, and there may be employed a continuous fabrication method such as a zero-pressure continuous process, a double belt process, and a multi-roll process, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electronic equipment, electric equipment, calculators, communication equipment and the like.

[0002]

2. Description of the Related Art In recent years, printed wiring boards, multilayer printed wiring boards,
There is a strong demand for high thermal conductivity of electrical laminates. For this reason, silica and alumina fillers having high thermal conductivity are added to the resin, but the thermal conductivity is 50 to 6 in the former case.
0 cal / cm. sec. ° C. × 10 ^-4 , the latter 60 ~
70 cal / cm. sec. ° C. It is about 10 ⁻⁴ .

[0003]

As described in the prior art, the thermal conductivity is 50 to 70 cal / cm.sup.2 even when silica or alumina filler having excellent high thermal conductivity is used. sec.
° C. It is about 10 ⁻⁴ . The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electrical laminate having excellent thermal conductivity, which is used for a printed wiring board and a multilayer printed wiring board. To do so.

[0004]

According to the present invention, a metal foil is arranged and integrated on a top surface and / or a bottom surface of a required number of resin-impregnated base materials including a resin-impregnated base material containing a resin-coated hygroscopic and good thermal conductor-containing resin-impregnated base material. Since the electrical laminated board is characterized in that the above-mentioned objects can be achieved, the present invention will be described in detail below.

The resin of the resin-impregnated base material used in the present invention includes phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyphenylene oxide resin,
The polyethylene terephthalate resin, the polybutylene terephthalate resin, the polyphenylene sulfide resin, the fluororesin, and the like are individual, modified products, and mixtures. A resin-coated hygroscopic and good thermal conductor is added to the resin. Aluminum nitride, kaolin clay, graphite, etc. are used as the heat-conductive material having good hygroscopicity, and since it has high hygroscopicity as it is, phenol resin, melamine resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyester resin, fluorine It is used after being coated with a thermosetting resin such as resin or silicone resin or a thermoplastic resin. The addition amount of the good hygroscopic heat conductive material is preferably 10 to 300 parts with respect to 100 parts by weight of the resin (hereinafter simply referred to as “part”). That is, if it is less than 10 parts, it is difficult to improve the thermal conductivity, and if it exceeds 300 parts, the impregnating property tends to decrease. The resin coating of the material having good hygroscopicity and good thermal conductivity is, for example, a product obtained by baking resin powder after mixing with a resin varnish and drying, and is not particularly limited. As the filler other than the hygroscopic and good thermal conductor added as necessary, talc, clay, silica, calcium carbonate,
Inorganic powder fillers such as aluminum hydroxide and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be contained. As the base material of the resin-impregnated base material, glass, inorganic fibers such as asbestos, polyester, polyamide, polyacrylic,
These are woven fabrics, non-woven fabrics, and papers made of organic fibers such as polyvinyl alcohol, polyimide, and fluororesin, and natural fibers such as cotton. Furthermore, the resin may be impregnated only with the same resin,
It is also possible to make the impregnation more uniform by performing a plurality of impregnations such as primary impregnation with the same type of resin or different type resin and secondary impregnation. Thus, a resin-impregnated base material containing a hygroscopic material having good thermal conductivity and a resin-impregnated base material containing no hygroscopic material having good thermal conductivity, which is obtained by impregnating a resin material with a resin and then heat-drying the resin material, if necessary, is obtained. .. The combination of the resin-impregnated base material is a resin-impregnated base material containing a good hygroscopic material with a resin coated core,
It is preferable to arrange an ordinary resin-impregnated base material on the upper and lower surfaces thereof. As the metal foil, copper, aluminum, brass, nickel, iron or the like alone, an alloy or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary.
As for the integration conditions, the curing temperature, curing time, and molding pressure can be selected depending on the resin, substrate, thickness, etc., and continuous manufacturing methods such as pressureless continuous method, double belt molding method, and multi-roll method should be used. Can also

The present invention will be described below based on examples.

[0007]

Example 1 100 parts by weight of a bisphenol A type epoxy resin (hereinafter simply referred to as "part") was added with 2 parts of dicyandiamide, and 40 parts of kaolin clay was added with 100 parts of a hygroscopic and good thermal conductor obtained by baking 5 parts of an epoxy resin. The varnish was impregnated into a glass non-woven fabric having a thickness of 0.8 mm so that the amount of resin was 45%, and dried to obtain a resin-coated hygroscopic and good thermal conductor-containing prepreg. A varnish prepared by adding 2 parts of dicyandiamide to 100 parts of an epoxy resin is impregnated into a glass cloth having a thickness of 0.1 mm so that the amount of the resin is 45%, and dried, and two prepregs are arranged on each side. A laminated body in which a copper foil having a thickness of 0.035 mm was arranged was heat-press molded at 165 ° C. for 90 minutes at a molding pressure of 40 Kg / cm ² , to obtain a double-sided copper-clad laminate having a thickness of 1.2 mm.

[0008]

Example 2 A double-sided copper-clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 1 except that 150 parts of aluminum nitride was used instead of 40 parts of kaolin clay.

[0009]

[Comparative Example] A glass nonwoven fabric was treated in the same manner as in Example 1 except that the same resin varnish as that of the glass cloth was used, and the thickness was 1.2 m.
A double-sided copper clad laminate of m was obtained.

Table 1 shows the thermal conductivity (cal / cm.sec. ° C. × 10 ^-4 ) of the laminated plates of Examples 1 and 2 and Comparative Example.

[0011]

[Table 1]

[0012]

The present invention is constructed as described above.
It was confirmed that the electrical laminate having the structure described in the claims has an improved thermal conductivity and is excellent in the present invention.

Claims (1)

[Claims] 1. A metal foil is arranged and formed on a top surface and / or a bottom surface of a required number of resin-impregnated base materials including a resin-impregnated base material containing a resin-coated hygroscopic and good thermal conductor-containing resin. Electrical laminate.