JPH05315717A - Electrical laminated plate - Google Patents
Electrical laminated plateInfo
- Publication number
- JPH05315717A JPH05315717A JP11355892A JP11355892A JPH05315717A JP H05315717 A JPH05315717 A JP H05315717A JP 11355892 A JP11355892 A JP 11355892A JP 11355892 A JP11355892 A JP 11355892A JP H05315717 A JPH05315717 A JP H05315717A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- hygroscopic
- foil
- impregnated base
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる電気用積層板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electronic equipment, electric equipment, calculators, communication equipment and the like.
【0002】[0002]
【従来の技術】近年、電気、電子機器の高出力化、高密
度化対策としてプリント配線板、多層プリント配線板、
電気用積層板の高熱伝導性が強く要求されている。この
ため樹脂中に高熱伝導性に優れたシリカ、アルミナ充填
剤を添加したりしているが、熱伝導率は前者で50〜6
0cal/cm.sec.℃.×10-4、後者で60〜
70cal/cm.sec.℃.×10-4程度である。2. Description of the Related Art In recent years, printed wiring boards, multilayer printed wiring boards,
There is a strong demand for high thermal conductivity of electrical laminates. For this reason, silica and alumina fillers having high thermal conductivity are added to the resin, but the thermal conductivity is 50 to 6 in the former case.
0 cal / cm. sec. ° C. × 10 -4 , the latter 60 ~
70 cal / cm. sec. ° C. It is about 10 −4 .
【0003】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、高熱伝導性に優れたシリカ、アルミナ充填剤を用
いても熱伝導率は50〜70cal/cm.sec.
℃.×10-4程度である。本発明は従来の技術における
上述の問題点に鑑みてなされたもので、その目的とする
ところは熱伝導性に優れた電気用積層板を提供し、プリ
ント配線板、多層プリント配線板に用いられるようにす
ることにある。As described in the prior art, the thermal conductivity is 50 to 70 cal / cm.sup.2 even when silica or alumina filler having excellent high thermal conductivity is used. sec.
° C. It is about 10 −4 . The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electrical laminate having excellent thermal conductivity, which is used for a printed wiring board and a multilayer printed wiring board. To do so.
【0004】[0004]
【課題を解決するための手段】本発明は樹脂被覆した吸
湿性良熱伝導物含有樹脂含浸基材を含む所要枚数の樹脂
含浸基材の上面及び又は下面に、金属箔を配設ー体化し
てなることを特徴とする電気用積層板のため、上記目的
を達成することができたもので以下、本発明を詳細に説
明する。According to the present invention, a metal foil is arranged and integrated on a top surface and / or a bottom surface of a required number of resin-impregnated base materials including a resin-impregnated base material containing a resin-coated hygroscopic and good thermal conductor-containing resin-impregnated base material. Since the electrical laminated board is characterized in that the above-mentioned objects can be achieved, the present invention will be described in detail below.
【0005】本発明に用いる樹脂含浸基材の樹脂は、フ
ェノ−ル樹脂、不飽和ポリエステル樹脂、エポキシ樹
脂、ポリイミド樹脂、ポリフェニレンオキサイド樹脂、
ポリエチレンテレフタレート樹脂、ポリブチレンテレフ
タレート樹脂、ポリフェニレンサルファイド樹脂、フッ
素樹脂等の単独、変性物、混合物である。樹脂には樹脂
被覆した吸湿性良熱伝導物を添加する。吸湿性良熱伝導
物としては窒化アルミニゥム、カオリンクレー、グラフ
ァイト等が用いられ、このままでは吸湿性が大きいので
フェノ−ル樹脂、メラミン樹脂、不飽和ポリエステル樹
脂、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹
脂、フッ素樹脂、シリコン樹脂等の熱硬化性樹脂や熱可
塑性樹脂で被覆してから用いられる。吸湿性良熱伝導物
の添加量は樹脂100重量部(以下単に部と記す)に対
して10〜300部が好ましい。即ち10部未満では熱
伝導性が向上し難く、300部をこえると含浸性が低下
する傾向にあるからである。吸湿性良熱伝導物の樹脂被
覆は樹脂ワニスとの混合後、乾燥したぜの、樹脂粉末を
焼付処理したもの等で、特に限定するものではない。必
要に応じて添加される吸湿性良熱伝導物以外の充填剤と
しては、タルク、クレー、シリカ、炭酸カルシュウム、
水酸化アルミニゥム等の無機質粉末充填剤やガラス繊
維、アスベスト繊維、パルプ繊維、合成繊維、セラミッ
ク繊維等の繊維質充填剤を含有させることができる。樹
脂含浸基材の基材としては、ガラス、アスベスト等の無
機質繊維やポリエステル、ポリアミド、ポリアクリル、
ポリビニルアルコール、ポリイミド、フッ素樹脂等の有
機質繊維や木綿等の天然繊維等の織布、不織布、紙であ
る。更に樹脂は同一の樹脂のみによる含浸でもよいが、
同系樹脂又は異系樹脂による1次含浸、2次含浸という
ように含浸を複数にし、より含浸が均一になるようにす
ることもできる。かくして基材に樹脂を含浸後、必要に
応じて加熱乾燥して樹脂被覆した吸湿性良熱伝導物含有
樹脂含浸基材や吸湿性良熱伝導物を含まない樹脂含浸基
材を得るものである。樹脂含浸基材の組み合わせは芯部
に樹脂被覆した吸湿性良熱伝導物含有樹脂含浸基材を、
その上下面に通常の樹脂含浸基材を配設することが好ま
しい。金属箔としては銅、アルミニュウム、真鍮、ニッ
ケル、鉄等の単独、合金、複合箔が用いられ必要に応じ
て金属箔の片面に接着剤層を設けておくことができる。
一体化の条件は樹脂、基材、厚み等で硬化温度、硬化時
間、成形圧力を選択することができ、無圧連続工法、ダ
ブルベルト成形工法、マルチロール工法等の連続的製造
方法を用いることもできる。The resin of the resin-impregnated base material used in the present invention includes phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyphenylene oxide resin,
The polyethylene terephthalate resin, the polybutylene terephthalate resin, the polyphenylene sulfide resin, the fluororesin, and the like are individual, modified products, and mixtures. A resin-coated hygroscopic and good thermal conductor is added to the resin. Aluminum nitride, kaolin clay, graphite, etc. are used as the heat-conductive material having good hygroscopicity, and since it has high hygroscopicity as it is, phenol resin, melamine resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyester resin, fluorine It is used after being coated with a thermosetting resin such as resin or silicone resin or a thermoplastic resin. The addition amount of the good hygroscopic heat conductive material is preferably 10 to 300 parts with respect to 100 parts by weight of the resin (hereinafter simply referred to as “part”). That is, if it is less than 10 parts, it is difficult to improve the thermal conductivity, and if it exceeds 300 parts, the impregnating property tends to decrease. The resin coating of the material having good hygroscopicity and good thermal conductivity is, for example, a product obtained by baking resin powder after mixing with a resin varnish and drying, and is not particularly limited. As the filler other than the hygroscopic and good thermal conductor added as necessary, talc, clay, silica, calcium carbonate,
Inorganic powder fillers such as aluminum hydroxide and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be contained. As the base material of the resin-impregnated base material, glass, inorganic fibers such as asbestos, polyester, polyamide, polyacrylic,
These are woven fabrics, non-woven fabrics, and papers made of organic fibers such as polyvinyl alcohol, polyimide, and fluororesin, and natural fibers such as cotton. Furthermore, the resin may be impregnated only with the same resin,
It is also possible to make the impregnation more uniform by performing a plurality of impregnations such as primary impregnation with the same type of resin or different type resin and secondary impregnation. Thus, a resin-impregnated base material containing a hygroscopic material having good thermal conductivity and a resin-impregnated base material containing no hygroscopic material having good thermal conductivity, which is obtained by impregnating a resin material with a resin and then heat-drying the resin material, if necessary, is obtained. .. The combination of the resin-impregnated base material is a resin-impregnated base material containing a good hygroscopic material with a resin coated core,
It is preferable to arrange an ordinary resin-impregnated base material on the upper and lower surfaces thereof. As the metal foil, copper, aluminum, brass, nickel, iron or the like alone, an alloy or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary.
As for the integration conditions, the curing temperature, curing time, and molding pressure can be selected depending on the resin, substrate, thickness, etc., and continuous manufacturing methods such as pressureless continuous method, double belt molding method, and multi-roll method should be used. Can also
【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【0007】[0007]
【実施例1】ビスフェノ−ルA型エポキシ樹脂100重
量部(以下単に部と記す)にジシアンジアミド2部、カ
オリンクレー40部にエポキシ樹脂5部を焼付処理した
吸湿性良熱伝導物100部を添加したワニスを、厚み
0.8mmのガラス不織布に樹脂量が45%になるよう
に含浸、乾燥して得た樹脂被覆吸湿性良熱伝導物含有プ
リプレグ1枚の上下面に、ビスフェノ−ルA型エポキシ
樹脂100部にジシアンジアミド2部を添加したワニス
を、厚み0.1mmのガラス布に樹脂量が45%になる
ように含浸、乾燥して得たプリプレグを各々2枚づつ配
し、更にその外側に厚み0.035mmの銅箔を配した
積層体を成形圧力40Kg/cm2 、165℃で90分
間加熱加圧成形して厚み1.2mmの両面銅張積層板を
得た。Example 1 100 parts by weight of a bisphenol A type epoxy resin (hereinafter simply referred to as "part") was added with 2 parts of dicyandiamide, and 40 parts of kaolin clay was added with 100 parts of a hygroscopic and good thermal conductor obtained by baking 5 parts of an epoxy resin. The varnish was impregnated into a glass non-woven fabric having a thickness of 0.8 mm so that the amount of resin was 45%, and dried to obtain a resin-coated hygroscopic and good thermal conductor-containing prepreg. A varnish prepared by adding 2 parts of dicyandiamide to 100 parts of an epoxy resin is impregnated into a glass cloth having a thickness of 0.1 mm so that the amount of the resin is 45%, and dried, and two prepregs are arranged on each side. A laminated body in which a copper foil having a thickness of 0.035 mm was arranged was heat-press molded at 165 ° C. for 90 minutes at a molding pressure of 40 Kg / cm 2 , to obtain a double-sided copper-clad laminate having a thickness of 1.2 mm.
【0008】[0008]
【実施例2】カオリンクレー40部の代わりに窒化アル
ミニゥム150部を用いた以外は実施例1と同様に処理
して厚み1.2mmの両面銅張積層板を得た。Example 2 A double-sided copper-clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 1 except that 150 parts of aluminum nitride was used instead of 40 parts of kaolin clay.
【0009】[0009]
【比施例】ガラス不織布にもガラス布と同じ樹脂ワニス
を用いた以外は実施例1と同様に処理して厚み1.2m
mの両面銅張積層板を得た。[Comparative Example] A glass nonwoven fabric was treated in the same manner as in Example 1 except that the same resin varnish as that of the glass cloth was used, and the thickness was 1.2 m.
A double-sided copper clad laminate of m was obtained.
【0010】実施例1と2及び比較例の積層板の熱伝導
率(cal/cm.sec.℃.×10-4)は表1のよ
うである。Table 1 shows the thermal conductivity (cal / cm.sec. ° C. × 10 -4 ) of the laminated plates of Examples 1 and 2 and Comparative Example.
【0011】[0011]
【表1】 [Table 1]
【0012】[0012]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する電気用積層板に
おいては、熱伝導率が向上し、本発明の優れていること
を確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate having the structure described in the claims has an improved thermal conductivity and is excellent in the present invention.
Claims (1)
浸基材を含む所要枚数の樹脂含浸基材の上面及び又は下
面に、金属箔を配設ー体化してなることを特徴とする電
気用積層板。1. A metal foil is arranged and formed on a top surface and / or a bottom surface of a required number of resin-impregnated base materials including a resin-impregnated base material containing a resin-coated hygroscopic and good thermal conductor-containing resin. Electrical laminate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11355892A JPH05315717A (en) | 1992-05-06 | 1992-05-06 | Electrical laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11355892A JPH05315717A (en) | 1992-05-06 | 1992-05-06 | Electrical laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05315717A true JPH05315717A (en) | 1993-11-26 |
Family
ID=14615334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11355892A Pending JPH05315717A (en) | 1992-05-06 | 1992-05-06 | Electrical laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05315717A (en) |
-
1992
- 1992-05-06 JP JP11355892A patent/JPH05315717A/en active Pending
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