JPH05162245A - Laminated sheet - Google Patents
Laminated sheetInfo
- Publication number
- JPH05162245A JPH05162245A JP33097791A JP33097791A JPH05162245A JP H05162245 A JPH05162245 A JP H05162245A JP 33097791 A JP33097791 A JP 33097791A JP 33097791 A JP33097791 A JP 33097791A JP H05162245 A JPH05162245 A JP H05162245A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pts
- thickness
- epoxy resin
- prepregs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子機器、電気機器、
コンビュ−タ−、通信機器等に用いられる電気用積層板
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to an electric laminated plate used for a computer, a communication device and the like.
【0002】[0002]
【従来の技術】従来、紙フェノ−ルの金属箔張積層板、
プリント配線板等を、銀ペーストでスルホール加工をし
た場合、銀のマイグレーションに起因するショートガ発
生することがある。又ガラスエポキシの金属箔張積層
板、プリント配線板等で、フアインパターン、高密度配
線をすると、ライン間隔が狭くなり銅のマイグレーショ
ンに起因する絶縁不良が発生することがある。2. Description of the Related Art Conventionally, a metal foil-clad laminate of paper phenol,
When a printed wiring board or the like is subjected to through-hole processing with silver paste, short-circuiting may occur due to silver migration. In addition, if a fine pattern or high-density wiring is formed on a metal foil-clad laminate of glass epoxy, a printed wiring board, or the like, the line spacing may be narrowed, and insulation failure due to copper migration may occur.
【0003】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の積層板、プリント配線板では、ショート、
絶縁不良を発生することがある。本発明は従来の技術に
おける上述の問題点に鑑みてなされたもので、その目的
とするところは樹脂中にPPMオーダーで残っている塩
素イオン、ナトリゥムイオン、鉄イオン等のイオン性不
純物、加水分解性塩素、加水分解性臭素を捕捉すると共
に印加することにより、イオンとなり移動する銀イオン
をトラップしてパターン間の絶縁信頼性を確保すること
のできる積層板を提供することにある。As described in the prior art, in the conventional laminated board and printed wiring board, short circuit,
Poor insulation may occur. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to leave chlorine ions, sodium ions, iron ions and other ionic impurities remaining in the resin in the PPM order, and hydrolyzability. It is an object of the present invention to provide a laminated plate capable of trapping chlorine and hydrolyzable bromine and applying them to trap silver ions moving as ions to secure insulation reliability between patterns.
【0004】[0004]
【課題を解決するための手段】本発明は、所要枚数の樹
脂含浸基材を重ねた最外層に、無機イオン交換体含有樹
脂層を介在させてから、金属箔を配設ー体化してなるこ
とを特徴とする積層板のため、上記目的を達成すること
ができたもので、以下本発明を詳細に説明する。According to the present invention, an inorganic ion exchanger-containing resin layer is interposed in the outermost layer in which a required number of resin-impregnated base materials are stacked, and then a metal foil is disposed and integrated. Since the laminated plate is characterized by the fact that the above object can be achieved, the present invention will be described in detail below.
【0005】本発明に用いる樹脂含浸基材の樹脂として
は、フェノ−ル、エポキシ樹脂、不飽和ポリエステル樹
脂、ポリイミド樹脂、ポリフェニレンオキサイド樹脂、
ポリフェニレンサルファイド樹脂、フッ素樹脂等の単
独、変性物、混合物が用いられ、必要に応じてタルク、
クレー、シリカ、炭酸カルシュウム、水酸化アルミニゥ
ム等の無機質粉末充填剤や、ガラス繊維、アスベスト繊
維、パルプ繊維、合成繊維、セラミック繊維等の繊維質
充填剤を添加することができる。基材としてはガラス、
アスベスト等の無機質繊維や、ポリエステル、ポリアミ
ド、ポリアクリル、ポリビニルアルコール、ポリイミ
ド、フッ素樹脂等の有機質繊維や、木綿等の天然繊維の
織布、不織布、紙を用いることができる。樹脂含浸基材
の樹脂は同一の樹脂のみによる含浸でもよいが、同系樹
脂又は異系樹脂による1次含浸、2次含浸というように
含浸を複数にし、より均一含浸ができるようにしてもよ
い。かくして基材に樹脂を含浸後、必要に応じて加熱等
で乾燥して樹脂含浸基材を得るものである。金属箔とし
ては、厚さ0.018〜0.07mmの銅、アルミニュ
ウム、真鍮、ニッケル、鉄等の単独、合金、複合箔の金
属箔を用いることができる。無機イオン交換体含有樹脂
層としては、燐、砒素、アンチモン、ビスマス、アルミ
ニウム、ガリウム、インジウム等の遷移金属含有金属酸
化物を主とする無機イオン交換体を含む樹脂層で、樹脂
としては、フェノ−ル樹脂、エポキシ樹脂、ポリイミド
樹脂、ブチラール樹脂、メラミン樹脂等の熱硬化性樹
脂、熱可塑性樹脂の単独、変性物、混合物に必要に応じ
て硬化剤、硬化促進剤、架橋剤、溶剤を添加したもの
に、上記無機イオン交換体を樹脂固形分100重量部
(以下単に部と記す)に対して、1〜20部添加したも
のである。即ち1部未満ではパターン間の絶縁信頼性が
向上し難く、20部をこえても効果が向上し難いためで
ある。なお樹脂には必要に応じてタルク、クレ−、炭酸
カルシュウム、水酸化アルミニュ−ム、シリカ等の無機
質粉末充填剤を添加することができる。樹脂層の形成
は、液状樹脂の塗布、樹脂フイルム、プリプレグ等であ
り、樹脂の厚さは0.001〜0.5mm厚になるよう
に配設することが好ましい。一体化手段としてはプレ
ス、マルチロール、ダブルベルト、無圧連続工法等で特
に限定するものではない。The resin of the resin-impregnated base material used in the present invention includes phenol, epoxy resin, unsaturated polyester resin, polyimide resin, polyphenylene oxide resin,
Polyphenylene sulfide resin, fluororesin, etc. alone, modified product, or mixture is used. If necessary, talc,
Inorganic powder fillers such as clay, silica, calcium carbonate and aluminum hydroxide, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be added. Glass as the base material,
Inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, and fluororesin, and natural fibers such as cotton, woven cloth, nonwoven cloth, and paper can be used. The resin of the resin-impregnated base material may be impregnated with only the same resin, but may be plural impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation so that more uniform impregnation can be performed. Thus, after impregnating the base material with the resin, it is dried by heating or the like, if necessary, to obtain a resin-impregnated base material. As the metal foil, a metal foil having a thickness of 0.018 to 0.07 mm, such as copper, aluminum, brass, nickel, iron, etc., alone, alloy, or composite foil can be used. The inorganic ion exchanger-containing resin layer is a resin layer containing an inorganic ion exchanger mainly containing a transition metal-containing metal oxide such as phosphorus, arsenic, antimony, bismuth, aluminum, gallium, indium, and the like. -A thermosetting resin such as an epoxy resin, an epoxy resin, a polyimide resin, a butyral resin, and a melamine resin, and a thermoplastic resin alone, a modified product, or a mixture, if necessary, with a curing agent, a curing accelerator, a crosslinking agent, or a solvent added. 1 to 20 parts of the above inorganic ion exchanger was added to 100 parts by weight of the resin solid content (hereinafter simply referred to as "part"). That is, if it is less than 1 part, it is difficult to improve the insulation reliability between the patterns, and if it exceeds 20 parts, it is difficult to improve the effect. If necessary, an inorganic powder filler such as talc, clay, calcium carbonate, aluminum hydroxide or silica can be added to the resin. The resin layer is formed by applying a liquid resin, a resin film, a prepreg, or the like, and it is preferable that the resin layer is arranged so as to have a thickness of 0.001 to 0.5 mm. The uniting means is not particularly limited to a press, a multi-roll, a double belt, a pressureless continuous method and the like.
【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【0007】[0007]
【実施例1】厚さ0.2mmのエポキシ樹脂含浸ガラス
布7枚を重ねた最上下面のプリプレグ面に、ビスフェノ
−ルA型エポキシ樹脂90部、フェノ−ルノボラック型
エポキシ樹脂10部、ジシアンジアミド2部、2エチル
4メチルイミダゾ−ル0.1部、DMFとメチルセロソ
ルブの等量混合溶剤50部、無機イオン交換体(東亜合
成化学工業株式会社製、品番IXE−600)5部から
なる樹脂液を厚さ0.01mmになるように塗布、乾燥
してから、厚さ0.035mmの銅箔を各々配設した積
層体を成形圧力40Kg/cm2 、165℃で90分間
積層成形して厚み1.6mmの積層板を得、該積層板に
ライン幅0.45mm、ライン間隔0.4mmの電気回
路を作成した。Example 1 90 parts of bisphenol A type epoxy resin, 10 parts of phenol novolac type epoxy resin, and 2 parts of dicyandiamide were placed on the prepreg surface on the top and bottom surfaces of seven glass cloths impregnated with epoxy resin having a thickness of 0.2 mm. A resin solution consisting of 0.1 part of 2 ethyl 4-methyl imidazole, 50 parts of a mixed solvent of DMF and methyl cellosolve in an equal amount, and 5 parts of an inorganic ion exchanger (manufactured by Toagosei Chemical Industry Co., Ltd., product number IXE-600). After coating and drying so as to have a thickness of 0.01 mm, a laminate having copper foil with a thickness of 0.035 mm is laminated and molded at a molding pressure of 40 Kg / cm 2 and 165 ° C. for 90 minutes to obtain a thickness of 1 A laminated plate of 0.6 mm was obtained, and an electric circuit having a line width of 0.45 mm and a line interval of 0.4 mm was prepared on the laminated plate.
【0008】[0008]
【実施例2】厚さ0.2mmのフェノ−ル樹脂含浸紙7
枚を重ねた最上下面のプリプレグ面に、ブチラール樹脂
35部、クレゾールノボラック型エポキシ樹脂10部、
レゾール型フェノ−ル樹脂50部、トルエン60部、メ
タノール80部、MEK115部、無機イオン交換体
(東亜合成化学工業株式会社製、品番IXE−300)
3部からなる樹脂液を厚さ0.02mmになるように塗
布、乾燥してから、厚さ0.035mmの接着剤付銅箔
を各々配設した積層体を、成形圧力100Kg/c
m2 、160℃で60分間積層成形して厚み1.6mm
の積層板を得、該積層板の銅箔をエッチング後、エッチ
ング面に銀ペーストでライン幅0.45mm、ライン間
隔0.4mmの電気回路を形成した。Example 2 Paper 0.2 impregnated with phenol resin having a thickness of 0.2 mm
35 parts of butyral resin, 10 parts of cresol novolac type epoxy resin,
50 parts of resol type phenol resin, 60 parts of toluene, 80 parts of methanol, 115 parts of MEK, inorganic ion exchanger (manufactured by Toa Gosei Chemical Industry Co., Ltd., product number IXE-300)
A resin liquid consisting of 3 parts was applied to a thickness of 0.02 mm and dried, and then a laminated body in which copper foil with an adhesive having a thickness of 0.035 mm was arranged was formed at a molding pressure of 100 Kg / c.
m 2 at 160 ° C. for 60 minutes by lamination molding and thickness 1.6 mm
After the copper foil of the laminate was etched, an electric circuit having a line width of 0.45 mm and a line interval of 0.4 mm was formed on the etched surface with silver paste.
【0009】[0009]
【比較例1】最外層プリプレグ面に樹脂液を塗布せず、
そのまま用いた以外は実施例1と同様に処理して厚み
1.6mmの積層板を得た。[Comparative Example 1] The resin liquid was not applied to the outermost prepreg surface,
A laminate having a thickness of 1.6 mm was obtained by the same treatment as in Example 1 except that the laminate was used as it was.
【0010】[0010]
【比較例2】最外層プリプレグ面に樹脂液を塗布せず、
そのまま用いた以外は実施例2と同様に処理して厚み
1.6mmの積層板を得た。[Comparative Example 2] The resin liquid was not applied to the outermost prepreg surface,
A laminated plate having a thickness of 1.6 mm was obtained by the same process as in Example 2 except that the laminate was used as it was.
【0011】実施例1と2及び比較例1と2の積層板の
性能は表1のようである。The performance of the laminates of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1.
【0012】[0012]
【表1】 ※ 実施例1、比較例1については85℃、85%R
H、100VDCでパターン間の絶縁抵抗を測定し、実
施例2、比較例2については60℃、90%RH、50
VDCでバターン間の絶縁抵抗を測定した。[Table 1] * 85 ° C, 85% R for Example 1 and Comparative Example 1
The insulation resistance between the patterns was measured at H, 100 VDC, and for Example 2 and Comparative Example 2, 60 ° C., 90% RH, 50
The insulation resistance between the patterns was measured at VDC.
【0013】[0013]
【発明の効果】本発明は上述したごとく構成されてい
る。特許請求の範囲に記載した構成を有する積層板にお
いては、パターン間の絶縁信頼性が向上し、本発明の優
れていることを確認した。The present invention is constructed as described above. It was confirmed that in the laminated plate having the structure described in the claims, the insulation reliability between the patterns was improved, and the present invention was excellent.
Claims (1)
に、無機イオン交換体含有樹脂層を介在させてから、金
属箔を配設ー体化してなることを特徴とする積層板。1. A laminated plate comprising a resin foil impregnated base material of a required number and an inorganic ion exchanger-containing resin layer interposed in the outermost layer, and then a metal foil is disposed and formed into a body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33097791A JPH05162245A (en) | 1991-12-16 | 1991-12-16 | Laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33097791A JPH05162245A (en) | 1991-12-16 | 1991-12-16 | Laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05162245A true JPH05162245A (en) | 1993-06-29 |
Family
ID=18238464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33097791A Pending JPH05162245A (en) | 1991-12-16 | 1991-12-16 | Laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05162245A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1077395C (en) * | 1995-09-07 | 2002-01-02 | 日立化成工业株式会社 | Method for producing metal layer coated pressboard |
-
1991
- 1991-12-16 JP JP33097791A patent/JPH05162245A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1077395C (en) * | 1995-09-07 | 2002-01-02 | 日立化成工业株式会社 | Method for producing metal layer coated pressboard |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0824011B2 (en) | Electric laminated board and printed wiring board using the same | |
JPH05162245A (en) | Laminated sheet | |
JPH05162231A (en) | Metal foil with adhesive | |
JP3107218B2 (en) | Electric laminate | |
JPH049396B2 (en) | ||
JPH06260765A (en) | Multilayer wiring board and manufacture thereof | |
JP2923343B2 (en) | Manufacturing method of electrical laminate | |
JPS6219447A (en) | Electric laminated board | |
JPH0977886A (en) | Glass nonwoven fabric for laminated plate and laminated plate | |
JPS6311985B2 (en) | ||
JPH05315718A (en) | Electrical laminated plate | |
JPH05147167A (en) | Laminate sheet for electrical use | |
JPH0661598A (en) | Laminated plate for electricity | |
JPS588615A (en) | Manufacture of cloth substrate laminated plate | |
JPH05315716A (en) | Electrical laminate plate | |
JPH01150387A (en) | Printed wiring sheet | |
JPH06232551A (en) | Electric laminated board | |
JPH0771839B2 (en) | Laminated board manufacturing method | |
JPH06260764A (en) | Multilayer wiring board and manufacture thereof | |
JPS61118430A (en) | Production of metal-clad laminated sheet | |
JPS60257598A (en) | Multilayer printed circuit board | |
JPS6369635A (en) | Electrical laminated board | |
JPH0655559A (en) | Manufacture for laminated sheet | |
JPH04170084A (en) | Manufacture of printed wiring board | |
JPH05315717A (en) | Electrical laminated plate |