JPS588615A - Manufacture of cloth substrate laminated plate - Google Patents

Manufacture of cloth substrate laminated plate

Info

Publication number
JPS588615A
JPS588615A JP10764581A JP10764581A JPS588615A JP S588615 A JPS588615 A JP S588615A JP 10764581 A JP10764581 A JP 10764581A JP 10764581 A JP10764581 A JP 10764581A JP S588615 A JPS588615 A JP S588615A
Authority
JP
Japan
Prior art keywords
resin
laminated plate
cloth substrate
cloth
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10764581A
Other languages
Japanese (ja)
Inventor
Yoshinori Aono
青野　好矩
Tomiyoshi Itagaki
板垣　富栄
Shigeaki Kojima
小島　甚昭
Tetsuo Chinzei
鎮西　哲雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10764581A priority Critical patent/JPS588615A/en
Publication of JPS588615A publication Critical patent/JPS588615A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a laminated plate having high dimensional stability, by impregnating a cloth substrate of water content less than 0.01wt%, also in the state being heated, with a resin form the laminated plate. CONSTITUTION:A prepreg is obtained by impregnating a cloth substrate of water content less than 0.01wt%, also in the state being heated, with a thermosetting resin of an epoxy resin, a phenolic resin, a melamine resin, a polyester resin etc. and drying. A cloth substrate laminated plate is obtained by laminating required ply numbers of said prepregs, further placing a metal foil on one or both faces if necessary and making them integral. By this, the resin can be impregnated in the entire cloth substrates in a short time, dimensional stability is improved and the laminated plate of stabilized and improved properties can be obtained.

Description

【発明の詳細な説明】 本発明はプリント配線板用等のように高寸法安定性を必
要とする積層板に関するもので、その目的とするところ
は板厚精度のよい積層板を得ることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminate that requires high dimensional stability, such as for printed wiring boards, and its purpose is to obtain a laminate with good thickness accuracy. .

従来、プリント配線板用積層板としてはガラス布基材積
層板が使用されているがガラス布には積層板用樹脂が付
着し難く寸法精度、特に板厚がバラツキしかも積層板と
しての性能も低下する欠点があった。Conventionally, glass cloth-based laminates have been used as laminates for printed wiring boards, but resin for laminates is difficult to adhere to glass cloth, resulting in dimensional accuracy, especially variations in board thickness, and poor performance as a laminate. There was a drawback.

本発明の方法は上記欠点を解決するもので、含水率ｏ、
ａ１−１に＝　　重量％（以下単に−と記す）以下で且
つ加熱された状態の布基材に積層板用樹脂を含浸させる
ことによって樹脂が短時間に布基材全体に付着するので
寸法安定性が向上し且つ性能も安定、向上するものであ
る。The method of the present invention solves the above-mentioned drawbacks, and has a water content of o,
By impregnating the heated fabric base material with resin for laminates at a weight% (hereinafter simply referred to as -) or less in a1-1, the resin adheres to the entire fabric base material in a short time, resulting in dimensional stability. This results in improved properties and stable and improved performance.

次に本発明の詳細な説明する本発明に用いる布基材はポ
リアミド、ポリビニルアルコール、ポリエステル、ポリ
アクリル等の有機合成繊維やガラス、アスベスト等の無
機繊維や有機無機合撚繊維の織布、不織布であり日本工
業規格Ｒ−５４２０に規定されている含水率が０゜０１
哄以下で且つ加熱された状態のものである。即ち含水率
が０．０１％をこえると樹脂付着性が低下するためであ
る。加熱方法は特に限定するものではないが好ましくは
加熱を減圧下でおこなうことが望ましい。即ち樹脂付着
性が更に向上する傾向にあるからである。Next, the present invention will be explained in detail.The cloth base material used in the present invention is a woven fabric or non-woven fabric made of organic synthetic fibers such as polyamide, polyvinyl alcohol, polyester, polyacrylic, inorganic fibers such as glass, asbestos, or organic and inorganic twisted fibers. The moisture content specified in Japanese Industrial Standard R-5420 is 0°01.
It is in a heated state and below the boiling point. That is, when the water content exceeds 0.01%, the resin adhesion decreases. Although the heating method is not particularly limited, it is preferable to conduct the heating under reduced pressure. That is, this is because resin adhesion tends to be further improved.

積層板用樹脂としてはエポキシ樹脂、フェノール樹脂、
メラミン樹脂、ポリエステル樹脂、ポリイミド樹脂等の
熱硬化性樹脂全般が用いられる。上配布基材に積層板用
樹脂を含浸、乾燥させてプリプレグを得、該プリプレグ
を所要枚数積層し、更に必要に応じて片面又は両面に金
属箔を載置し一体化させて布基材積層板を得るものであ
る。Resins for laminates include epoxy resin, phenol resin,
All thermosetting resins such as melamine resin, polyester resin, and polyimide resin can be used. The upper distribution base material is impregnated with a resin for laminates and dried to obtain a prepreg, and the required number of prepregs are laminated, and if necessary, metal foil is placed on one or both sides to integrate, and the fabric base material is laminated. This is how you get the board.

以下本発明を実施例にもとすいて説明する。The present invention will be explained below using examples.

実施例１ ガラス布（日東紡績製１品番ＷΣ−ｔｓＫ　）を１３０
℃に加熱した加熱炉を通過させて含水率０．００５％に
し加熱された状態のまま積層板用エポキシ樹脂ワニスを
含浸、乾燥し樹脂量４０　　％のプリプレグを得、該プ
リプレグ８枚を積層した積層体を金型用金属板に挾んで
成形圧力１００′ｊｉ、１７０℃で６０分間積層成形し
て厚さ１．６ｗｍの布基材積層板を得た。Example 1 Glass cloth (product number WΣ-tsK manufactured by Nittobo Co., Ltd.) was 130
It was passed through a heating furnace heated to ℃ to have a water content of 0.005%, impregnated with an epoxy resin varnish for laminates in the heated state, dried to obtain a prepreg with a resin content of 40%, and 8 sheets of the prepreg were laminated. The laminate was sandwiched between metal plates for a mold and laminated and molded at a molding pressure of 100'ji and 170° C. for 60 minutes to obtain a cloth base material laminate having a thickness of 1.6 wm.

実施例２ 実施例１と同じ積層体の両面に厚さ０．０５５−の銅箔
を夫々載置した以外は実施例と同様に処理して厚さ１゜
６霞の布基材銅張積層板を得た。Example 2 A fabric-based copper-clad laminate with a thickness of 1°6 was produced in the same manner as in Example except that copper foils with a thickness of 0.055 mm were placed on both sides of the same laminate as in Example 1. Got the board.

従来例１ 含水率０．０３％のガラス布ｉ東紡績製１品番ＷＥ　＋
　１８Ｋ　）に実施例１と同じ樹脂を含浸した以外は実
施例１と同様に処理して布基材積層板を得た。Conventional Example 1 Glass cloth with a moisture content of 0.03% i Tobo Seki Product No. 1 WE +
A cloth base material laminate was obtained in the same manner as in Example 1, except that the same resin as in Example 1 was impregnated into 18K).

従来例２ 従来例１と同じ積層体の両面に厚さ０．０！＋５　ｔｍ
の銀箔を夫々載置した以外は実施例１と同様に処理して
厚さ１．６露の布基材銅張積層板を得た。Conventional Example 2 The same laminate as Conventional Example 1 has a thickness of 0.0 on both sides! +5 tm
A fabric-based copper-clad laminate having a thickness of 1.6 densities was obtained by processing in the same manner as in Example 1, except that silver foils were placed on each laminate.

実施例１及び２と従来例１及び２の積層板の性能は第１
表から明らかなように本発明の積層板の性能は本発明以
外の積層板より板厚精度、加工性、半田耐熱性がよく、
本発明の優れていることを確認した。The performance of the laminates of Examples 1 and 2 and Conventional Examples 1 and 2 was the first.
As is clear from the table, the performance of the laminate of the present invention is better in thickness accuracy, workability, and soldering heat resistance than the laminates other than the laminates of the present invention.
The superiority of the present invention was confirmed.

第　　１　　表 注　半１エツチング加工時にボイドがないか観察する。Table 1 Note: Observe whether there are any voids during half-etching.

米２　ＪＩＳ、Ｃ・６４８１による。Rice 2 According to JIS, C.6481.

−９：-9:

Claims (2)

【特許請求の範囲】[Claims] （１）含水率０．０１．重量囁以下で且つ加熱された状
態の布基材に積層板用樹脂を含浸させることを特徴とす
る布基材積層板の製造方法。(1) Moisture content 0.01. A method for manufacturing a cloth base material laminate, comprising impregnating a heated cloth base material with a resin for use in the laminate. （２）　　布基材の加熱を減圧下でおこなうことを特徴
とする特許請求の範囲第１項記載の布基材積層板の製造
方法。(2) A method for manufacturing a fabric base material laminate according to claim 1, characterized in that the fabric base material is heated under reduced pressure.
JP10764581A 1981-07-09 1981-07-09 Manufacture of cloth substrate laminated plate Pending JPS588615A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10764581A JPS588615A (en) 1981-07-09 1981-07-09 Manufacture of cloth substrate laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10764581A JPS588615A (en) 1981-07-09 1981-07-09 Manufacture of cloth substrate laminated plate

Publications (1)

Publication Number Publication Date
JPS588615A true JPS588615A (en) 1983-01-18

Family

ID=14464434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10764581A Pending JPS588615A (en) 1981-07-09 1981-07-09 Manufacture of cloth substrate laminated plate

Country Status (1)

Country Link
JP (1) JPS588615A (en)

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