JPS6040252A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate in which a resin-impregnated propagation material is subjected to vacuum treatment.

[Background technology]

Conventionally, laminates were manufactured by laminating and molding resin-impregnated materials obtained by impregnating a base material with varnish and then heating and drying it, but the air, moisture, and solvent contained in the varnish were A large number of voids are formed in laminates produced by volatile matters such as those present in resin-impregnated materials and free moisture generated on the surface of resin-impregnated substrates during lamination molding. Due to electrical performance problems, it cannot be used for wiring cutting.

[Purpose of the invention]

The object of the present invention is to treat the resin-impregnated base material under reduced pressure to reduce water content, volatile matter, etc., and to allow the molten wood to absorb bubbles of volatile matter such as solvent during lamination molding, and to reduce moisture and volatile matter during lamination molding.
C) A voids in the manufactured laminate that can absorb free moisture on the surface of the resin-impregnated base material! [Disclosure of the Invention] The method for manufacturing a laminate of the present invention involves subjecting a resin-impregnated base material to vacuum treatment, and then stacking a predetermined number of resin-impregnated propagation materials and heating and pressurizing them. It is characterized by laminated molding.

The present invention will be explained in detail below. First, a base material such as paper or cloth is impregnated with a heat varnish such as phenol: il 1 and coated with a prescribed amount of fat to obtain a resin-impregnated product.Next, This fat-impregnated base is 1/1o~1/1
000 atmospheres. This VC reduces moisture, volatile matter such as solvent, and air contained in the resin-impregnated base material. Thereafter, a predetermined number of resin-impregnated base materials subjected to vacuum treatment are stacked under normal conditions, for example, 150 to 170
A laminate is manufactured by lamination molding at 50 to 150 Kf/cr of 1140 to 90°C. Furthermore, metal foils may be stacked on the upper surface of the uppermost resin-impregnated base material and/or the lower surface of the lowest resin-impregnated base material of a predetermined number of resin-impregnated base materials stacked and then laminated and molded to obtain a metal-clad laminate. Alternatively, a multilayer circuit board may be manufactured by interposing a predetermined number of resin-impregnated base materials treated under reduced pressure between the inner layer circuit board and the outer layer circuit board, and performing lamination molding.

Next, tax the embodiment of the eζ-tree invention.

[Example 1] A glass cloth with a thickness of 0.2 tone was impregnated with Evojushi resin containing a hardening agent so that the resin content was 50% by weight, and this resin-impregnated base material was heated to 1/100 atm. The pressure was reduced for 24 hours, and then 6 sheets of this resin-impregnated base material were stacked, and on top of that, a copper foil with a thickness of 0.035 gourd was layered on the bottom surface, and 50 Ky/cd! , 17
Laminated by heating and pressing at 0°C for 90°C to a thickness of 1.6mm.
A copper-clad 1iN board was obtained. 500mm x 50 of this
The number of voids in 0 fins was detected. The results are shown in Table 1.

[Example 2] A double-sided circuit board with a thickness of 1 inch was interposed between two resin-impregnated base materials obtained by vacuum treatment in the same manner as in Example 1, and the resin was placed on the upper and lower surfaces of the resin-impregnated base at position t. 0.03 on the underside of impregnated group 1
Layer 5mmD copper foil, 50Kg/ca, 6 at 170℃
A multilayer circuit board was produced by heating and pressurizing for 0 minutes to perform lamination molding.

The number of voids was also detected for this item.

[Comparative Examples 1 and 2] A copper-clad laminate was manufactured in the same manner as in Example 1 using the resin-impregnated base material of Example 1 that had not been subjected to the vacuum treatment.Comparative Example 1
) A multilayer circuit board was manufactured in the same manner as in Example 2, and the number of voids was detected for each of Comparative Example 2). The results are shown in Table 1.

From the results shown in Table 1, it is understood that according to the examples of the present invention, it is possible to produce a laminate with an extremely small number of voids.

〔Effect of the invention〕

In the VC of the present invention, since the resin-impregnated base material is subjected to a vacuum treatment and then laminated, it is possible to reduce moisture contained in the resin-impregnated base material, volatile matters such as solvents, and air trapped in the varnish. It is capable of absorbing air bubbles generated by the molten resin during lamination molding and free moisture on the surface of the resin-impregnated base material, thereby significantly reducing the number of voids in the manufactured laminate. Therefore, this laminate has excellent not only mechanical properties but also electrical properties and can be suitably used as a wiring board.

Claims (1)

[Claims] (1) A method for producing a laminate, which comprises subjecting the resin-impregnated propagation material to a vacuum treatment, stacking a predetermined number of resin-impregnated propagation materials, heating and pressurizing them, and forming a laminate.