JPH04142338A - Preparation of laminated sheet - Google Patents

Preparation of laminated sheet

Info

Publication number
JPH04142338A
JPH04142338A JP2266836A JP26683690A JPH04142338A JP H04142338 A JPH04142338 A JP H04142338A JP 2266836 A JP2266836 A JP 2266836A JP 26683690 A JP26683690 A JP 26683690A JP H04142338 A JPH04142338 A JP H04142338A
Authority
JP
Japan
Prior art keywords
water
resin
varnish
drying
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2266836A
Other languages
Japanese (ja)
Inventor
Kenichi Ikeda
謙一 池田
Mitsuo Yokota
横田 光雄
Yoshihiro Nakamura
吉宏 中村
Kiyoshi Saito
清 斉藤
Hiroyuki Kimura
裕之 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2266836A priority Critical patent/JPH04142338A/en
Publication of JPH04142338A publication Critical patent/JPH04142338A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To improve punchability, heat resistance, humidity resistance, etc., by impregnating a cellulose fiber substrate with a water-sol. varnish, drying the substrate, impregnating it with a thermosetting resin varnish, drying the substrate, and laminating and molding the resulting prepreg. CONSTITUTION:A cellulose fiber substrate, i.e. a paper substrate (e.g. kraft paper), is impregnated with a water-sol. varnish, pref. a water-sol. phenol or melamine resin warnish, thermally dried under a reduced pressure at 60 deg.C or lower, impregnated with a thermosetting resin varnish, pref. a drying oil- modified phenol resin (e.g. a resol phenol resin 35% modified with tung oil), and dried to give a prepreg. Required pieces of the prepregs are laminated and thermally pressed to give a laminated sheet.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、打抜加工性、耐湿性、耐銀マイグレーシ冒ン
性、耐電食性、耐熱性に優nた積層板の製造方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a laminate having excellent punching workability, moisture resistance, silver migration resistance, electrolytic corrosion resistance, and heat resistance.

〔従来の技術〕[Conventional technology]

最近、電子機器の軽、漣、短、小化に伴って、1.78
m11ピツチ、1.5051jlピツチのXC穴及びコ
ネクター穴を室温で打抜き可能なMCLが必要になって
いる。
Recently, as electronic devices have become lighter, shorter, and smaller, 1.78
There is a need for an MCL that can punch out XC holes and connector holes of m11 pitch and 1.5051 jl pitch at room temperature.

従来から打抜き加工性を良くするためKi!l脂の可撓
性化あるいは低弾性の紙基材の便用が行なわれる。
Ki! has traditionally been used to improve punching workability. Flexibility of lubricant or use of paper base material with low elasticity is carried out.

一方、電子機器の多機能化、高信頼性化に伴って、紙基
@を用いた積層板の銅めっきスルーホール化、銀ペース
トスルーホール化が進み、かつその高信頼性が必要とな
ってきた。%に耐銀マイダレーシ!ン性及び耐電食性に
gkrtた積層板が必要となっている。
On the other hand, as electronic devices become more multi-functional and highly reliable, the use of copper-plated through-holes and silver-paste through-holes in paper-based laminates has progressed, and high reliability has become necessary. Ta. % silver-resistant Maidareshi! There is a need for laminates with excellent electrical resistance and electrical corrosion resistance.

耐鋏マイグレーシ買ン性及び耐電食性’tno土するた
めに、紙基拐に水浴性フェノール樹脂、水溶性メラミン
樹脂等會含浸乾燥して耐湿性ヶ回上する方法が従来から
行なわれてきた。
In order to improve resistance to scissor migration and electrolytic corrosion, a conventional method has been used in which paper substrates are impregnated with water-bathable phenolic resins, water-soluble melamine resins, etc. and dried to improve moisture resistance.

又、高密度化に対応して表面英装を行なうが、耐熱性が
低いと基鈑に膨n、反りt発生する。耐熱性を良くする
ためには、樹脂の耐熱性化及び耐熱性成分音添加する。
In addition, surface coating is performed in response to higher density, but if the heat resistance is low, swelling (n) and warping (t) will occur in the base plate. To improve heat resistance, make the resin heat resistant and add a heat resistant component.

従来行なわnている対策につい工に、樹脂紮可撓性化す
ると打抜き加工性及びIC等の大関のクラック問題は改
讐さnるが、耐熱性、耐銀マイグレーシ冒ン性、耐電食
性、耐溶剤性&工低下する。
In addition to conventional countermeasures, making the resin more flexible will improve punching workability and major crack problems in ICs, etc., but it will improve heat resistance, silver migration resistance, electrolytic corrosion resistance, and resistance to corrosion. Solvent compatibility & deterioration.

低弾性基@上相用すると打抜き加工性は良くなるが、反
り%性及び寸法特性が低下する。
When a low elastic group @ upper phase is used, punching workability improves, but warpage % and dimensional properties decrease.

紙基材ケ水浴性フェノール樹脂又は水浴性メラミン樹脂
で処理する方法では、水分等ケ除くために乾燥する必要
があるが、乾燥に、Jっ1耐湿性、耐マイグレーン冒ン
性、耐電食性は向上する。しかし、乾燥によって硬化が
過度に進み却1打扱き加工性が低下する。
In the method of treating the paper base material with water-bathable phenol resin or water-bathable melamine resin, it is necessary to dry it to remove water, etc. will improve. However, drying causes excessive hardening and reduces single-stroke workability.

又、耐熱性向上の従来法におい1、樹脂のf性めるいα
熱分W4温変の高い成分の添加九Jる方法では、積層板
は硬くなり打抜加工性が低下する問題がある。
In addition, in the conventional method of improving heat resistance, 1.
The method of adding a component with a high heat content W4 temperature change has the problem that the laminate becomes hard and the punching workability decreases.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

以上の技術事情のなかで、本発明者は、紙基剃全水溶性
りエノール樹脂又は水溶性メラミン樹脂で処理する方法
すなわち水溶性処理ワニスの方法を深く検討して満足す
べき結果倉得た。
Under the above technical circumstances, the inventor of the present invention has deeply studied the method of treating paper-based shavings with a water-soluble enol resin or water-soluble melamine resin, that is, the method of water-soluble treated varnish, and has obtained satisfactory results. .

本発明は、打抜き加工性、耐熱性、耐湿性、耐マイグレ
ーシ盲ン性、耐電食性に優nた積層載r提供すること?
目的とする。
The present invention provides a laminated material with excellent punching workability, heat resistance, moisture resistance, migration resistance, and electrolytic corrosion resistance.
purpose.

〔課題?解決するための手段〕〔assignment? Means to solve]

上記の目的ヶ達成するために、不発f3Aに、紙基材に
水浴性2エノール樹脂または水浴性メラミン樹脂のワニ
スすなわち水溶性処理ワニスを含浸し、減圧雰囲気で6
0℃以下に加熱乾燥し、さらに熱硬化性樹脂ワニスを含
浸乾燥し1得たプリプレグを積場し加熱加圧成形する積
層板の製造方法である。
In order to achieve the above objectives, unexploded f3A was impregnated with a water-bathable 2-enol resin or water-bathable melamine resin varnish, that is, a water-soluble treated varnish, on a paper base material, and then heated in a reduced pressure atmosphere.
This is a method for manufacturing a laminate in which prepregs obtained by heating and drying to 0° C. or lower, further impregnating and drying with a thermosetting resin varnish, and then stacking the obtained prepregs and molding them under heat and pressure.

使用する紙基材に、リンター紙、クラフト紙等であるが
、+ルロース呆m維基材であnば良い。
The paper base material to be used may be linter paper, kraft paper, etc., but a lurose fiber base material may be used.

水1@性フェノール樹脂及び水溶性メラミンS+脂は、
セルロースとの親和性七利用し、かクセルα−スとの親
和性が良い溶液状態で含浸する工5に溶剤を選ぶ。
Water 1@-based phenolic resin and water-soluble melamine S + fat are
Taking advantage of its affinity with cellulose, a solvent is selected for impregnation step 5 in a solution state that has good affinity with cellulose.

溶剤は、水、メタノール、アセトン、メチルエテルケト
ン、トルエン、スチレン、DMFSTHF’、DMSO
勿単独または混液として使用する。
Solvents are water, methanol, acetone, methyl ether ketone, toluene, styrene, DMFSTHF', DMSO
Of course, it can be used alone or as a mixture.

上記の水溶性樹脂を上記の溶剤に溶かしたワニス金上記
のセルロース系基匂に含浸した後溶剤r除くKは、減圧
雰囲気で60℃以下で加熱するつ減圧度は200 to
rr以下が良い。
After the above water-soluble resin is dissolved in the above solvent, the varnish gold is impregnated with the above cellulose-based base odor, the solvent r is removed, and the K is heated at 60°C or less in a reduced pressure atmosphere, and the degree of vacuum is 200°C.
rr or less is better.

熱硬化性樹脂Q工、2エノ′−ル樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂等とするが、熱硬化性樹脂?変
性し又可撓性化することも良い。%に乾性油変性フェノ
ールa脂は良い。可撓性化は耐熱性を低下しない程度に
行なう。変性材料Q工、乾性油、ポリエステル、ポリエ
ーテル、エポキ7化ポリブタジェン等である。
Thermosetting resin Q resin, 2-enol resin, epoxy resin,
Unsaturated polyester resin etc., but thermosetting resin? It is also good to modify it and make it flexible. % drying oil-modified phenol A fat is good. The flexibility should be increased to the extent that heat resistance is not reduced. These include modified materials such as Q-process, drying oil, polyester, polyether, and epoxy-7-polybutadiene.

上記熱硬化性樹脂ワニス化し、このワニス牙水溶性ワニ
ス処理した基材に含浸し通常F)方法で加熱Il:燥(
溶剤除去)LC樹脂を手袋化する。このようにして得た
プリプレグr必要枚数を1ね加熱加圧成形して積層板七
得る。鋼箔と曾わせ1−般の方法によっ又鋼彊積層鈑と
し、さらに加工してプリント配線板1r裂造することが
できる。
The above thermosetting resin is made into a varnish, impregnated into a base material treated with a water-soluble varnish, and heated by the usual method (F).
(Solvent removal) LC resin is made into gloves. The required number of prepreg sheets thus obtained are molded under heat and pressure once to obtain seven laminates. A steel laminated sheet can be obtained by rubbing it with a steel foil in a conventional manner, and further processed to form a printed wiring board 1r.

〔作用〕[Effect]

水溶性2エノール樹脂または水溶性メラミン樹脂をセル
ロース系線維1匂に含浸するのは相互の強い親和性χ利
用するもの′l:′ある。したがっ℃、基材接離に良く
含浸して良好な樹脂皮膜耐形成するから、使用した溶剤
を除いた&6エ十分に耐湿性を示すことになる。その結
果、耐鋏マイグレーシ鵞ン性及び耐電食性が向上するが
、同時にこの樹脂皮gI4によって熱硬化性樹脂の含浸
がよくなる。
Impregnating a cellulose fiber with a water-soluble 2-enol resin or a water-soluble melamine resin takes advantage of their strong mutual affinity. Therefore, since it is well impregnated with the base material and forms a good resin film at ℃, it shows sufficient moisture resistance except for the solvent used. As a result, the scissors migration resistance and the electrolytic corrosion resistance are improved, and at the same time, the resin skin gI4 improves the impregnation of the thermosetting resin.

従来は、上記の溶剤に除く場曾九、例えは150℃に加
熱するJ5に、加熱m度民配慮がなかった。したがって
WII維而九面成する樹脂皮膜α通硬化金おこし硬く脆
くなつ℃打抜き加工性が悪い。
Conventionally, there was no consideration given to the heating process in J5, which is heated to 150°C, except for the above-mentioned solvents. Therefore, the resin film formed on all surfaces of WII becomes hard and brittle and has poor punching workability.

本発明は、こf】皮層形成時の条件を減圧下に60℃以
下としたから、皮膜は過硬化tおこすことなく可撓性?
保つから打抜さ加工性を良くする効果がある。
In the present invention, the conditions for forming the skin layer are 60°C or less under reduced pressure, so the film is flexible without over-hardening.
It has the effect of improving punching workability because of its retention.

又、本発明の実施例と比較例1r後述するが、両者のは
んだ耐熱性を比較すると実施例は明らかに良い。何れも
同じ可撓性化した熱硬化性樹脂r1判条件で用いたが、
本発明の水溶性樹脂処理九工って耐熱性が向上したとい
うことができる。
Also, as will be described later in Examples of the present invention and Comparative Example 1r, when comparing the soldering heat resistance of the two, the Examples are clearly better. Both were used under the same flexible thermosetting resin R1 size conditions,
It can be said that the water-soluble resin treatment of the present invention has improved heat resistance.

〔実施例〕〔Example〕

クラフト紙に水溶性フェノール樹脂r言浸した後、50
 torrの減圧雰囲気、50℃で乾燥して樹脂付層量
16〜25%とした。さらに、桐油変性率65%のレゾ
ールフェノール桐膓1r含浸して樹脂の曾計付層量ケ4
8〜60%とし又乾燥し、得たプリプレグ8枚と接着剤
性@WJ??3に組甘わせ1加熱加圧成形して1.6a
llの両面鋼張積場鈑葡得た。その特性′(l−表1に
示す。
After soaking kraft paper with water-soluble phenolic resin,
It was dried at 50° C. in a reduced pressure atmosphere of torr to give a resin layer amount of 16 to 25%. Furthermore, the resin was impregnated with 1 liter of resol phenol with a tung oil modification rate of 65%, and the measured layer amount of the resin was 4.
8 to 60% and dried again to obtain 8 sheets of prepreg and adhesive properties @WJ? ? 3. Sweeten 1. Heat and pressure mold to 1.6a.
Obtained a double-sided steel-clad loading dock. Its properties' (l - shown in Table 1).

(比較例) クラフト紙に水浴性2エノール樹脂r含浸し、150℃
で乾燥した後、笑施例と同様にして両囲銅彊槓/il板
七得に。その特性を表1に示す。
(Comparative example) Kraft paper was impregnated with water-bathable 2-enol resin r and heated at 150°C.
After drying it, it was made into a ryo-en doji-ku/il plate in the same manner as in the previous example. Its characteristics are shown in Table 1.

(試験) (1)打抜き加工性は、積層板t80トンプレスにより
工、20℃で穴間ピッチ1.781!111で打抜いた
とき、クラック、歩]離、自白につき良好○、やや悪い
△、不良×として示す。
(Test) (1) Punching workability was determined by using a laminate plate T80 ton press and punching at 20°C with a hole pitch of 1.781!111. There were no cracks, separation, or confession, which was good ○, slightly bad △ , indicated as defective x.

(2)はんだ耐熱性は、JIS  C6481によった
(2) Soldering heat resistance was in accordance with JIS C6481.

(3)  吸湿率は、ブレッンヤ−121℃、2.2気
圧、8時間の値。
(3) Moisture absorption rate is a value measured at 121°C, 2.2 atm, and 8 hours.

(4)耐銀マイグレーシ璽ン性に、銀ペースト入りスル
ーホール穴10個km気的に通したライン間の印加電圧
50V、40℃、90%RHT + 000時間処理後
のライン間の絶縁抵抗會測足した。
(4) Insulation resistance between lines after treatment with applied voltage of 50V, 40℃, 90% RHT + 000 hours between lines passed through 10 km of through holes filled with silver paste for silver migration resistance. I measured my feet.

表  1 〔発明の効果〕 本発明の方法にLつ℃、表IK示すデータで明らかであ
るが、従来法による比較例と比較し又、打抜加工性、は
んだ耐熱性、吸湿率、耐銀マイグレーシ茸ン性が陶土し
優nた横層板となること?確認した。
Table 1 [Effects of the Invention] As is clear from the data shown in Table IK, the method of the present invention has improved punching workability, soldering heat resistance, moisture absorption rate, and silver resistance when compared with the comparative example using the conventional method. Is it possible that the mushroom properties of Migraci become a horizontal layer that is superior to that of china clay? confirmed.

〜、−ノ。〜、−ノ.

Claims (1)

【特許請求の範囲】[Claims] 1 セルロース系繊維基材に水溶性処理ワニスを含浸し
た後、減圧雰囲気で60℃以下に加熱乾燥し、さらに熱
硬化性樹脂ワニスを含浸乾燥して得たプリプレグを積層
し加熱加圧成形することを特徴とする積層板の製造方法
1. After impregnating a cellulose fiber base material with a water-soluble treated varnish, it is heated and dried at 60°C or less in a reduced pressure atmosphere, and then the prepreg obtained by impregnating and drying a thermosetting resin varnish is laminated and heated and pressure molded. A method for manufacturing a laminate, characterized by:
JP2266836A 1990-10-04 1990-10-04 Preparation of laminated sheet Pending JPH04142338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2266836A JPH04142338A (en) 1990-10-04 1990-10-04 Preparation of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2266836A JPH04142338A (en) 1990-10-04 1990-10-04 Preparation of laminated sheet

Publications (1)

Publication Number Publication Date
JPH04142338A true JPH04142338A (en) 1992-05-15

Family

ID=17436337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2266836A Pending JPH04142338A (en) 1990-10-04 1990-10-04 Preparation of laminated sheet

Country Status (1)

Country Link
JP (1) JPH04142338A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055045C (en) * 1993-02-02 2000-08-02 松下电工株式会社 Production of layered board and production of layered board for electric use
JP2008248092A (en) * 2007-03-30 2008-10-16 Starlite Co Ltd Phenol resin composite material and method for producing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055045C (en) * 1993-02-02 2000-08-02 松下电工株式会社 Production of layered board and production of layered board for electric use
JP2008248092A (en) * 2007-03-30 2008-10-16 Starlite Co Ltd Phenol resin composite material and method for producing the same

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