JPH04142338A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH04142338A JPH04142338A JP2266836A JP26683690A JPH04142338A JP H04142338 A JPH04142338 A JP H04142338A JP 2266836 A JP2266836 A JP 2266836A JP 26683690 A JP26683690 A JP 26683690A JP H04142338 A JPH04142338 A JP H04142338A
- Authority
- JP
- Japan
- Prior art keywords
- water
- resin
- varnish
- drying
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000002966 varnish Substances 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- 229920003043 Cellulose fiber Polymers 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000123 paper Substances 0.000 abstract description 9
- 229920000877 Melamine resin Polymers 0.000 abstract description 7
- 239000005011 phenolic resin Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000004640 Melamine resin Substances 0.000 abstract description 5
- 239000002655 kraft paper Substances 0.000 abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 229920003987 resole Polymers 0.000 abstract description 2
- 239000002383 tung oil Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000005012 migration Effects 0.000 description 6
- 238000013508 migration Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- -1 methyl ether ketone Chemical class 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical class CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、打抜加工性、耐湿性、耐銀マイグレーシ冒ン
性、耐電食性、耐熱性に優nた積層板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a laminate having excellent punching workability, moisture resistance, silver migration resistance, electrolytic corrosion resistance, and heat resistance.
最近、電子機器の軽、漣、短、小化に伴って、1.78
m11ピツチ、1.5051jlピツチのXC穴及びコ
ネクター穴を室温で打抜き可能なMCLが必要になって
いる。Recently, as electronic devices have become lighter, shorter, and smaller, 1.78
There is a need for an MCL that can punch out XC holes and connector holes of m11 pitch and 1.5051 jl pitch at room temperature.
従来から打抜き加工性を良くするためKi!l脂の可撓
性化あるいは低弾性の紙基材の便用が行なわれる。Ki! has traditionally been used to improve punching workability. Flexibility of lubricant or use of paper base material with low elasticity is carried out.
一方、電子機器の多機能化、高信頼性化に伴って、紙基
@を用いた積層板の銅めっきスルーホール化、銀ペース
トスルーホール化が進み、かつその高信頼性が必要とな
ってきた。%に耐銀マイダレーシ!ン性及び耐電食性に
gkrtた積層板が必要となっている。On the other hand, as electronic devices become more multi-functional and highly reliable, the use of copper-plated through-holes and silver-paste through-holes in paper-based laminates has progressed, and high reliability has become necessary. Ta. % silver-resistant Maidareshi! There is a need for laminates with excellent electrical resistance and electrical corrosion resistance.
耐鋏マイグレーシ買ン性及び耐電食性’tno土するた
めに、紙基拐に水浴性フェノール樹脂、水溶性メラミン
樹脂等會含浸乾燥して耐湿性ヶ回上する方法が従来から
行なわれてきた。In order to improve resistance to scissor migration and electrolytic corrosion, a conventional method has been used in which paper substrates are impregnated with water-bathable phenolic resins, water-soluble melamine resins, etc. and dried to improve moisture resistance.
又、高密度化に対応して表面英装を行なうが、耐熱性が
低いと基鈑に膨n、反りt発生する。耐熱性を良くする
ためには、樹脂の耐熱性化及び耐熱性成分音添加する。In addition, surface coating is performed in response to higher density, but if the heat resistance is low, swelling (n) and warping (t) will occur in the base plate. To improve heat resistance, make the resin heat resistant and add a heat resistant component.
従来行なわnている対策につい工に、樹脂紮可撓性化す
ると打抜き加工性及びIC等の大関のクラック問題は改
讐さnるが、耐熱性、耐銀マイグレーシ冒ン性、耐電食
性、耐溶剤性&工低下する。In addition to conventional countermeasures, making the resin more flexible will improve punching workability and major crack problems in ICs, etc., but it will improve heat resistance, silver migration resistance, electrolytic corrosion resistance, and resistance to corrosion. Solvent compatibility & deterioration.
低弾性基@上相用すると打抜き加工性は良くなるが、反
り%性及び寸法特性が低下する。When a low elastic group @ upper phase is used, punching workability improves, but warpage % and dimensional properties decrease.
紙基材ケ水浴性フェノール樹脂又は水浴性メラミン樹脂
で処理する方法では、水分等ケ除くために乾燥する必要
があるが、乾燥に、Jっ1耐湿性、耐マイグレーン冒ン
性、耐電食性は向上する。しかし、乾燥によって硬化が
過度に進み却1打扱き加工性が低下する。In the method of treating the paper base material with water-bathable phenol resin or water-bathable melamine resin, it is necessary to dry it to remove water, etc. will improve. However, drying causes excessive hardening and reduces single-stroke workability.
又、耐熱性向上の従来法におい1、樹脂のf性めるいα
熱分W4温変の高い成分の添加九Jる方法では、積層板
は硬くなり打抜加工性が低下する問題がある。In addition, in the conventional method of improving heat resistance, 1.
The method of adding a component with a high heat content W4 temperature change has the problem that the laminate becomes hard and the punching workability decreases.
以上の技術事情のなかで、本発明者は、紙基剃全水溶性
りエノール樹脂又は水溶性メラミン樹脂で処理する方法
すなわち水溶性処理ワニスの方法を深く検討して満足す
べき結果倉得た。Under the above technical circumstances, the inventor of the present invention has deeply studied the method of treating paper-based shavings with a water-soluble enol resin or water-soluble melamine resin, that is, the method of water-soluble treated varnish, and has obtained satisfactory results. .
本発明は、打抜き加工性、耐熱性、耐湿性、耐マイグレ
ーシ盲ン性、耐電食性に優nた積層載r提供すること?
目的とする。The present invention provides a laminated material with excellent punching workability, heat resistance, moisture resistance, migration resistance, and electrolytic corrosion resistance.
purpose.
上記の目的ヶ達成するために、不発f3Aに、紙基材に
水浴性2エノール樹脂または水浴性メラミン樹脂のワニ
スすなわち水溶性処理ワニスを含浸し、減圧雰囲気で6
0℃以下に加熱乾燥し、さらに熱硬化性樹脂ワニスを含
浸乾燥し1得たプリプレグを積場し加熱加圧成形する積
層板の製造方法である。In order to achieve the above objectives, unexploded f3A was impregnated with a water-bathable 2-enol resin or water-bathable melamine resin varnish, that is, a water-soluble treated varnish, on a paper base material, and then heated in a reduced pressure atmosphere.
This is a method for manufacturing a laminate in which prepregs obtained by heating and drying to 0° C. or lower, further impregnating and drying with a thermosetting resin varnish, and then stacking the obtained prepregs and molding them under heat and pressure.
使用する紙基材に、リンター紙、クラフト紙等であるが
、+ルロース呆m維基材であnば良い。The paper base material to be used may be linter paper, kraft paper, etc., but a lurose fiber base material may be used.
水1@性フェノール樹脂及び水溶性メラミンS+脂は、
セルロースとの親和性七利用し、かクセルα−スとの親
和性が良い溶液状態で含浸する工5に溶剤を選ぶ。Water 1@-based phenolic resin and water-soluble melamine S + fat are
Taking advantage of its affinity with cellulose, a solvent is selected for impregnation step 5 in a solution state that has good affinity with cellulose.
溶剤は、水、メタノール、アセトン、メチルエテルケト
ン、トルエン、スチレン、DMFSTHF’、DMSO
勿単独または混液として使用する。Solvents are water, methanol, acetone, methyl ether ketone, toluene, styrene, DMFSTHF', DMSO
Of course, it can be used alone or as a mixture.
上記の水溶性樹脂を上記の溶剤に溶かしたワニス金上記
のセルロース系基匂に含浸した後溶剤r除くKは、減圧
雰囲気で60℃以下で加熱するつ減圧度は200 to
rr以下が良い。After the above water-soluble resin is dissolved in the above solvent, the varnish gold is impregnated with the above cellulose-based base odor, the solvent r is removed, and the K is heated at 60°C or less in a reduced pressure atmosphere, and the degree of vacuum is 200°C.
rr or less is better.
熱硬化性樹脂Q工、2エノ′−ル樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂等とするが、熱硬化性樹脂?変
性し又可撓性化することも良い。%に乾性油変性フェノ
ールa脂は良い。可撓性化は耐熱性を低下しない程度に
行なう。変性材料Q工、乾性油、ポリエステル、ポリエ
ーテル、エポキ7化ポリブタジェン等である。Thermosetting resin Q resin, 2-enol resin, epoxy resin,
Unsaturated polyester resin etc., but thermosetting resin? It is also good to modify it and make it flexible. % drying oil-modified phenol A fat is good. The flexibility should be increased to the extent that heat resistance is not reduced. These include modified materials such as Q-process, drying oil, polyester, polyether, and epoxy-7-polybutadiene.
上記熱硬化性樹脂ワニス化し、このワニス牙水溶性ワニ
ス処理した基材に含浸し通常F)方法で加熱Il:燥(
溶剤除去)LC樹脂を手袋化する。このようにして得た
プリプレグr必要枚数を1ね加熱加圧成形して積層板七
得る。鋼箔と曾わせ1−般の方法によっ又鋼彊積層鈑と
し、さらに加工してプリント配線板1r裂造することが
できる。The above thermosetting resin is made into a varnish, impregnated into a base material treated with a water-soluble varnish, and heated by the usual method (F).
(Solvent removal) LC resin is made into gloves. The required number of prepreg sheets thus obtained are molded under heat and pressure once to obtain seven laminates. A steel laminated sheet can be obtained by rubbing it with a steel foil in a conventional manner, and further processed to form a printed wiring board 1r.
水溶性2エノール樹脂または水溶性メラミン樹脂をセル
ロース系線維1匂に含浸するのは相互の強い親和性χ利
用するもの′l:′ある。したがっ℃、基材接離に良く
含浸して良好な樹脂皮膜耐形成するから、使用した溶剤
を除いた&6エ十分に耐湿性を示すことになる。その結
果、耐鋏マイグレーシ鵞ン性及び耐電食性が向上するが
、同時にこの樹脂皮gI4によって熱硬化性樹脂の含浸
がよくなる。Impregnating a cellulose fiber with a water-soluble 2-enol resin or a water-soluble melamine resin takes advantage of their strong mutual affinity. Therefore, since it is well impregnated with the base material and forms a good resin film at ℃, it shows sufficient moisture resistance except for the solvent used. As a result, the scissors migration resistance and the electrolytic corrosion resistance are improved, and at the same time, the resin skin gI4 improves the impregnation of the thermosetting resin.
従来は、上記の溶剤に除く場曾九、例えは150℃に加
熱するJ5に、加熱m度民配慮がなかった。したがって
WII維而九面成する樹脂皮膜α通硬化金おこし硬く脆
くなつ℃打抜き加工性が悪い。Conventionally, there was no consideration given to the heating process in J5, which is heated to 150°C, except for the above-mentioned solvents. Therefore, the resin film formed on all surfaces of WII becomes hard and brittle and has poor punching workability.
本発明は、こf】皮層形成時の条件を減圧下に60℃以
下としたから、皮膜は過硬化tおこすことなく可撓性?
保つから打抜さ加工性を良くする効果がある。In the present invention, the conditions for forming the skin layer are 60°C or less under reduced pressure, so the film is flexible without over-hardening.
It has the effect of improving punching workability because of its retention.
又、本発明の実施例と比較例1r後述するが、両者のは
んだ耐熱性を比較すると実施例は明らかに良い。何れも
同じ可撓性化した熱硬化性樹脂r1判条件で用いたが、
本発明の水溶性樹脂処理九工って耐熱性が向上したとい
うことができる。Also, as will be described later in Examples of the present invention and Comparative Example 1r, when comparing the soldering heat resistance of the two, the Examples are clearly better. Both were used under the same flexible thermosetting resin R1 size conditions,
It can be said that the water-soluble resin treatment of the present invention has improved heat resistance.
クラフト紙に水溶性フェノール樹脂r言浸した後、50
torrの減圧雰囲気、50℃で乾燥して樹脂付層量
16〜25%とした。さらに、桐油変性率65%のレゾ
ールフェノール桐膓1r含浸して樹脂の曾計付層量ケ4
8〜60%とし又乾燥し、得たプリプレグ8枚と接着剤
性@WJ??3に組甘わせ1加熱加圧成形して1.6a
llの両面鋼張積場鈑葡得た。その特性′(l−表1に
示す。After soaking kraft paper with water-soluble phenolic resin,
It was dried at 50° C. in a reduced pressure atmosphere of torr to give a resin layer amount of 16 to 25%. Furthermore, the resin was impregnated with 1 liter of resol phenol with a tung oil modification rate of 65%, and the measured layer amount of the resin was 4.
8 to 60% and dried again to obtain 8 sheets of prepreg and adhesive properties @WJ? ? 3. Sweeten 1. Heat and pressure mold to 1.6a.
Obtained a double-sided steel-clad loading dock. Its properties' (l - shown in Table 1).
(比較例)
クラフト紙に水浴性2エノール樹脂r含浸し、150℃
で乾燥した後、笑施例と同様にして両囲銅彊槓/il板
七得に。その特性を表1に示す。(Comparative example) Kraft paper was impregnated with water-bathable 2-enol resin r and heated at 150°C.
After drying it, it was made into a ryo-en doji-ku/il plate in the same manner as in the previous example. Its characteristics are shown in Table 1.
(試験)
(1)打抜き加工性は、積層板t80トンプレスにより
工、20℃で穴間ピッチ1.781!111で打抜いた
とき、クラック、歩]離、自白につき良好○、やや悪い
△、不良×として示す。(Test) (1) Punching workability was determined by using a laminate plate T80 ton press and punching at 20°C with a hole pitch of 1.781!111. There were no cracks, separation, or confession, which was good ○, slightly bad △ , indicated as defective x.
(2)はんだ耐熱性は、JIS C6481によった
。(2) Soldering heat resistance was in accordance with JIS C6481.
(3) 吸湿率は、ブレッンヤ−121℃、2.2気
圧、8時間の値。(3) Moisture absorption rate is a value measured at 121°C, 2.2 atm, and 8 hours.
(4)耐銀マイグレーシ璽ン性に、銀ペースト入りスル
ーホール穴10個km気的に通したライン間の印加電圧
50V、40℃、90%RHT + 000時間処理後
のライン間の絶縁抵抗會測足した。(4) Insulation resistance between lines after treatment with applied voltage of 50V, 40℃, 90% RHT + 000 hours between lines passed through 10 km of through holes filled with silver paste for silver migration resistance. I measured my feet.
表 1
〔発明の効果〕
本発明の方法にLつ℃、表IK示すデータで明らかであ
るが、従来法による比較例と比較し又、打抜加工性、は
んだ耐熱性、吸湿率、耐銀マイグレーシ茸ン性が陶土し
優nた横層板となること?確認した。Table 1 [Effects of the Invention] As is clear from the data shown in Table IK, the method of the present invention has improved punching workability, soldering heat resistance, moisture absorption rate, and silver resistance when compared with the comparative example using the conventional method. Is it possible that the mushroom properties of Migraci become a horizontal layer that is superior to that of china clay? confirmed.
〜、−ノ。〜、−ノ.
Claims (1)
た後、減圧雰囲気で60℃以下に加熱乾燥し、さらに熱
硬化性樹脂ワニスを含浸乾燥して得たプリプレグを積層
し加熱加圧成形することを特徴とする積層板の製造方法
。1. After impregnating a cellulose fiber base material with a water-soluble treated varnish, it is heated and dried at 60°C or less in a reduced pressure atmosphere, and then the prepreg obtained by impregnating and drying a thermosetting resin varnish is laminated and heated and pressure molded. A method for manufacturing a laminate, characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2266836A JPH04142338A (en) | 1990-10-04 | 1990-10-04 | Preparation of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2266836A JPH04142338A (en) | 1990-10-04 | 1990-10-04 | Preparation of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04142338A true JPH04142338A (en) | 1992-05-15 |
Family
ID=17436337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2266836A Pending JPH04142338A (en) | 1990-10-04 | 1990-10-04 | Preparation of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04142338A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1055045C (en) * | 1993-02-02 | 2000-08-02 | 松下电工株式会社 | Production of layered board and production of layered board for electric use |
JP2008248092A (en) * | 2007-03-30 | 2008-10-16 | Starlite Co Ltd | Phenol resin composite material and method for producing the same |
-
1990
- 1990-10-04 JP JP2266836A patent/JPH04142338A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1055045C (en) * | 1993-02-02 | 2000-08-02 | 松下电工株式会社 | Production of layered board and production of layered board for electric use |
JP2008248092A (en) * | 2007-03-30 | 2008-10-16 | Starlite Co Ltd | Phenol resin composite material and method for producing the same |
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