JPS63211400A - Paper base material for laminated board - Google Patents
Paper base material for laminated boardInfo
- Publication number
- JPS63211400A JPS63211400A JP4101087A JP4101087A JPS63211400A JP S63211400 A JPS63211400 A JP S63211400A JP 4101087 A JP4101087 A JP 4101087A JP 4101087 A JP4101087 A JP 4101087A JP S63211400 A JPS63211400 A JP S63211400A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- base material
- kraft paper
- paper base
- melamine resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims description 19
- 239000000123 paper Substances 0.000 claims description 30
- 239000002655 kraft paper Substances 0.000 claims description 27
- 229920000877 Melamine resin Polymers 0.000 claims description 19
- 239000004640 Melamine resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000005470 impregnation Methods 0.000 description 11
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000002966 varnish Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012791 sliding layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明は、プリント配線板用などの積層板を製造するた
めに用いられろ紙基材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a filter paper base material used for manufacturing laminates for printed wiring boards and the like.
［背景技術］
積層板は、基材に熱硬化性樹脂ワニスを含浸して乾燥す
ることによって調製したプリプレグを複数枚重ね、これ
を加熱加圧して積層成形することによって作成される。[Background Art] A laminate is produced by stacking a plurality of prepregs prepared by impregnating a base material with a thermosetting resin varnish and drying the prepregs, and then heating and pressing them to form a laminate.
そしてこの積層板を片面乃至両面に銅箔などの金属箔を
張った金属張積層板として作成することによって、プリ
ント配線板に加工して用いることができる。すなわち表
面の金属箔をエツチング処理することによって回路パタ
ーンを作成し、さらに電気部品を半田付けで実装するこ
とによってプリント配線板として仕上げられるのである
。By creating this laminate as a metal-clad laminate with metal foil such as copper foil on one or both sides, it can be processed into a printed wiring board. That is, a circuit pattern is created by etching the metal foil on the surface, and electrical components are mounted by soldering to create a finished printed wiring board.
ここで基材として紙を用いる場合、紙への熱硬化性樹脂
の含浸性を向上させるために、紙基材としてａ−セルロ
ース繊維の含有率の高い紙、具体的には綿実を原料とし
て製造されるリンター紙を用いるようにしている。しか
しリンター紙は機械的強度が弱く、ＴＶやＶＴＲのプリ
ント配線板用の積層板としては強度的に不十分である。When paper is used as the base material, in order to improve the impregnation of the thermosetting resin into the paper, paper with a high content of a-cellulose fibers, specifically cottonseed, is used as the paper base material. I try to use manufactured linter paper. However, linter paper has low mechanical strength and is insufficient in strength as a laminate for printed wiring boards of TVs and VTRs.
この対策のために紙基材として強度が高いクラフト紙を
使用したりしているが、クラフト紙は熱硬化性樹脂のｔ
浸性が悪（、含浸むらのために積層板の電気特性が低下
するという問題がある。To counter this problem, kraft paper with high strength is used as the paper base material, but kraft paper is made of thermosetting resin.
There is a problem that the electrical properties of the laminate deteriorate due to poor impregnation properties (and uneven impregnation).
［発明の目的１
本発明は、上記の点に鑑みて為されたものであり、強度
に優れたり−７７ト紙を紙基材として用いるにあたって
、積層板の電気的特性を向上させることを目的とするも
のである。[Objective of the Invention 1 The present invention has been made in view of the above points, and an object of the present invention is to improve the electrical characteristics of a laminate when using -77 paper with excellent strength as a paper base material. That is.
［発明の開示］
しかして本発明に係る積層板用紙基材は、メラミン樹脂
が混抄されたクラフト紙によって形成されて成ることを
特徴とするものであり、以下本発明の詳細な説明する。[Disclosure of the Invention] The laminated paper base material according to the present invention is characterized by being formed of kraft paper mixed with melamine resin, and the present invention will be described in detail below.
クラフト紙は木材バルブを原料として抄造することによ
って製造されるものであり、本発明においてはメラミン
樹脂を混合した状態で抄造することによって！！遺され
るクラフト紙を紙基材として用いるのである。このよう
にメラミン樹脂を混抄することによってクラフト紙への
熱硬化性樹脂の含浸性を高め、含浸むらの発生を低減す
るものである。このときメラミン樹脂の残留量が０．５
〜１．５重量％の範囲になるように抄造してクラフト紙
を製造するようにするのが好ましく、クラフト紙中のメ
ラミン樹脂の含有量が０．５重量％未満であればクラフ
ト紙への熱硬化性樹脂の含浸性を向上させる効果が不十
分な場合があり、またクラフト紙中のメラミン樹脂の含
有量が１．５重量％を超えると積層板の耐衝撃性が低下
したり強度劣化が生じたりするなど積層板の物性が影響
を受ける場合があるために好ましくない、クラフト紙へ
の熱硬化性樹脂の含浸性を向上させるために、クラフト
紙にポリビニルアルコールなどの水溶性の樹脂を混抄す
ることも考えられるが、このように水溶性樹脂をクラフ
ト紙に含有させると、湿潤時にクラフト紙の強度が大き
く低下してクラフト紙を紙基材として用いてプリプレグ
を作成する工程中に切断が生じることがあり、このため
に本発明ではクラツト紙にメラミン樹脂を混抄させるよ
うにしているものであり、このメラミン樹脂としてはメ
チロール化メラミン樹脂を用いる。Kraft paper is manufactured by papermaking using wood valves as raw materials, and in the present invention, kraft paper is produced by papermaking with melamine resin mixed in! ! The remaining kraft paper is used as the paper base material. By mixing the melamine resin in papermaking in this manner, the impregnation of the thermosetting resin into the kraft paper is enhanced and the occurrence of uneven impregnation is reduced. At this time, the residual amount of melamine resin is 0.5
It is preferable to manufacture kraft paper so that the content of melamine resin in the kraft paper is in the range of ~1.5% by weight.If the content of melamine resin in the kraft paper is less than 0.5% by weight, it is The effect of improving the impregnability of thermosetting resin may be insufficient, and if the content of melamine resin in kraft paper exceeds 1.5% by weight, the impact resistance of the laminate may decrease or strength may deteriorate. In order to improve the impregnation of thermosetting resin into kraft paper, which is undesirable because it may affect the physical properties of the laminate such as It is possible to mix the paper into paper, but if water-soluble resin is added to the kraft paper in this way, the strength of the kraft paper will be greatly reduced when wet, resulting in cutting during the process of making prepreg using the kraft paper as a paper base material. For this reason, in the present invention, a melamine resin is mixed into Kraft paper, and the melamine resin used is a methylolated melamine resin.
そしてこのクラフト紙を紙基材として用いて積層板を製
造するにあたっては、まずクラフト紙を含浸槽に通して
フェノール樹脂ワニスなど熱硬化性樹脂を含浸させ、こ
れをさらに乾燥炉に通して加熱乾燥させることによって
プリプレグを作成し、そしてこのプリプレグを所要枚数
重ねると共にさらに必要に応じてこれの片側の外層もし
くは両側の外層に１７４Ｍなどの金属箔を重ね、これを
加熱加圧して積層成形することによりでおこなうことが
できる。ここで、クラフト紙はリンター紙より強度がは
るかに高く、機械的強度の高い積層板を得ることができ
るものである。またこの本発明で用いるクラ、７ト紙は
メラミン樹脂が混抄しであるために、フェノール樹脂ワ
ニスなどの熱硬化性樹脂の含浸性を向上させて含浸むら
を無くすことができるものであり、積層板の電気的特性
を高めることができるものである。To manufacture a laminate using this kraft paper as a paper base material, the kraft paper is first passed through an impregnating tank to be impregnated with a thermosetting resin such as phenolic resin varnish, and then passed through a drying oven to be heated and dried. By stacking the required number of sheets of prepreg and, if necessary, layering a metal foil such as 174M on one side or both sides of the prepreg, heating and pressing them to form a laminate. It can be done with. Here, kraft paper has much higher strength than linter paper, and it is possible to obtain a laminate with high mechanical strength. Furthermore, since the paper used in the present invention is mixed with melamine resin, it can improve the impregnability of thermosetting resins such as phenolic resin varnish and eliminate uneven impregnation. This can improve the electrical properties of the board.
次ぎに本発明を実施例によって例証する。The invention will now be illustrated by examples.
艮１涯
紙基材としてメラミン樹脂が混抄率が１重量％のクラフ
ト紙を用い、このクラフト紙紙にフェノール樹脂ワニス
を樹脂含量が５０重量％になるように含浸し、これを乾
燥温度１６０℃、乾燥時間５分の条件で乾燥することに
よってプリプレグを作成した。このプリプレグを８枚重
ね、さらに外面に厚み３５μの銅箔を重ね、これを成形
圧力１００ｋｇ／ｃｓ＋”、成形温度１６０℃、成形時
間６０分の条件で熱圧成形することによって、縦横の寸
法が１＋ｍＸ１ｍで厚みが１．６ｅｍ−の銅張り積層板
を作成した。1. Kraft paper containing 1% by weight of melamine resin was used as the paper base material, and the kraft paper was impregnated with phenolic resin varnish to a resin content of 50% by weight, and dried at a temperature of 160°C. A prepreg was prepared by drying under conditions of a drying time of 5 minutes. By stacking 8 sheets of this prepreg and further layering a 35 μm thick copper foil on the outer surface, and hot-pressing this under the conditions of a molding pressure of 100 kg/cs+", a molding temperature of 160°C, and a molding time of 60 minutes, the vertical and horizontal dimensions are A copper-clad laminate having dimensions of 1+m x 1m and a thickness of 1.6em- was prepared.
友１九
紙基材としてメラミン樹脂を混抄していないクラフト紙
を用いるようにした他は、実施例と同様にして銅張り積
層板を作成した。A copper-clad laminate was produced in the same manner as in the example except that kraft paper without melamine resin was used as the Tomo 19 paper base material.
実施例及び比較例で得た銅張り積層板について、電気特
性（滑層絶縁抵抗）、曲げ強度、落球衝撃強度について
それぞれ測定した。試験は滑層絶縁抵抗及び曲げ強度に
ついてはＪＩＳ Ｃ６４８１に基づいておこなった（
滑層絶縁抵抗の測定はＤ−２７１００の処理をおこなっ
た試験片を用いた）、また落球衝撃強度の試験は、５０
０ａ＋ｍＸ５００ｍｍの試験片に紙基材の縦方向（長手
方向）に沿って１３＋ｕ＋間隔で２ 、３１１１ｍφの
孔を設け、試験片の両＃１部を受は兵で支持した状態で
孔の部分に２００ｇの重りを落下させ、試験片に割れが
生じる重りの落下高さを測定することによっておこなっ
た。結果を次表に示す。The electrical properties (sliding layer insulation resistance), bending strength, and falling ball impact strength of the copper-clad laminates obtained in Examples and Comparative Examples were measured. The test was conducted based on JIS C6481 for slip layer insulation resistance and bending strength (
Test pieces treated with D-27100 were used to measure the insulation resistance of the slip layer, and test pieces treated with D-27100 were used to test the falling ball impact strength.
2,3111mφ holes were made in a 0a+m×500mm test piece at 13+u+ intervals along the vertical direction (longitudinal direction) of the paper base material, and with both #1 parts of the test piece supported by a supporter, 200g was applied to the hole area. This was done by dropping a weight and measuring the falling height at which the test piece cracked. The results are shown in the table below.
表の結果、メラミン樹脂を混抄したクラフト紙を紙基材
として用いた実施例のものは、メラミン樹脂を混抄しな
いクラフト紙を紙基材として用いた比較例のものに対し
て、曲げ強度や衝撃強度を低下させることなく電気特性
が向上していることが確認される。尚、比較例の方法で
は、７エ／−ル樹脂の含浸工程で月に１０件程度の紙切
れがあったが、実施例の方法では紙切れは月に１件以下
に低減した。The results in the table show that the example using kraft paper mixed with melamine resin as the paper base material has better bending strength and impact strength than the comparative example using kraft paper without melamine resin as the paper base material. It is confirmed that the electrical properties are improved without decreasing the strength. In addition, in the method of the comparative example, there were about 10 paper breaks per month during the impregnation process with 7 ml resin, but in the method of the example, the number of paper breaks was reduced to less than one per month.
［発明の効果］
上述のように本発明にあっては、メラミン樹脂が混抄さ
れたクラツト紙によって紙基材を形成するようにしたの
で、メラミン樹脂の混抄によってクラフト紙への樹脂ワ
ニスの含浸性を高めて樹脂の含浸むらを低減し、強度の
低いリンター紙を用いるような必要なく積層板の電気特
性を高めることができるものである。[Effects of the Invention] As described above, in the present invention, the paper base material is formed from Kraft paper mixed with melamine resin, so that the impregnation of resin varnish into Kraft paper is improved by mixing the melamine resin. It is possible to improve the electrical properties of the laminate without the need to use linter paper, which has low strength, by increasing the resin impregnation and reducing uneven resin impregnation.
Claims (2)
成されて成ることを特徴とする積層板用紙基材。(1) A laminate paper base material characterized by being formed from kraft paper mixed with melamine resin.
％混抄されていることを特徴とする特許請求の範囲第１
項記載の積層板用紙基材。(2) Claim 1, characterized in that the melamine resin is mixed in an amount of 0.5 to 105% by weight based on the whole paper.
Laminate paper base material as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4101087A JPS63211400A (en) | 1987-02-24 | 1987-02-24 | Paper base material for laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4101087A JPS63211400A (en) | 1987-02-24 | 1987-02-24 | Paper base material for laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63211400A true JPS63211400A (en) | 1988-09-02 |
Family
ID=12596423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4101087A Pending JPS63211400A (en) | 1987-02-24 | 1987-02-24 | Paper base material for laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63211400A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02160998A (en) * | 1988-12-14 | 1990-06-20 | Sanyo Kokusaku Pulp Co Ltd | Raw material for electrical insulation laminate |
| JPH0470334A (en) * | 1990-07-02 | 1992-03-05 | Oji Paper Co Ltd | Laminated sheet composed of sheet like pulp base material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860099A (en) * | 1981-10-06 | 1983-04-09 | 株式会社 興人 | Production of neutralized decorative paperboard with improved yield of titanium dioxide and pigment |
| JPS5876260A (en) * | 1981-10-30 | 1983-05-09 | 松下電工株式会社 | Manufacture of laminated board |
| JPS6052939A (en) * | 1983-09-01 | 1985-03-26 | Nec Corp | Optical head |
-
1987
- 1987-02-24 JP JP4101087A patent/JPS63211400A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860099A (en) * | 1981-10-06 | 1983-04-09 | 株式会社 興人 | Production of neutralized decorative paperboard with improved yield of titanium dioxide and pigment |
| JPS5876260A (en) * | 1981-10-30 | 1983-05-09 | 松下電工株式会社 | Manufacture of laminated board |
| JPS6052939A (en) * | 1983-09-01 | 1985-03-26 | Nec Corp | Optical head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02160998A (en) * | 1988-12-14 | 1990-06-20 | Sanyo Kokusaku Pulp Co Ltd | Raw material for electrical insulation laminate |
| JPH0457794B2 (en) * | 1988-12-14 | 1992-09-14 | Sanyo Kokusaku Pulp Co | |
| JPH0470334A (en) * | 1990-07-02 | 1992-03-05 | Oji Paper Co Ltd | Laminated sheet composed of sheet like pulp base material |
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