JPH0538789A - Manufacture of prepreg and laminated board for silver through-hole printed wiring board - Google Patents

Manufacture of prepreg and laminated board for silver through-hole printed wiring board

Info

Publication number
JPH0538789A
JPH0538789A JP19815691A JP19815691A JPH0538789A JP H0538789 A JPH0538789 A JP H0538789A JP 19815691 A JP19815691 A JP 19815691A JP 19815691 A JP19815691 A JP 19815691A JP H0538789 A JPH0538789 A JP H0538789A
Authority
JP
Japan
Prior art keywords
resin
prepreg
silver
dried
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19815691A
Other languages
Japanese (ja)
Inventor
Hideki Ishihara
秀樹 石原
Kenji Tsukanishi
憲次 塚西
Yoshihiro Nakamura
吉宏 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP19815691A priority Critical patent/JPH0538789A/en
Publication of JPH0538789A publication Critical patent/JPH0538789A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To manufacture a laminated board having excellent silver migration resistance. CONSTITUTION:Kraft paper is impregnated with a water-soluble melamine-phenol resin and a flame retardant as required, dried at a temperature higher than a conventional method or a prolonged time, dried until volatiles reach 1-4%, preferably 2-3%, and impregnated with a phenol resin and dried, thus manufacturing a prepreg. The prepreg is laminated, thus preparing a laminated board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、積層板にしたときに、
絶縁抵抗が高くかつ打ち抜き加工性に優れる紙基材プリ
プレグの製造方法、及び、耐銀マイグレーション性の良
好な銀スルーホール印刷配線板用積層板に関するもので
ある。
BACKGROUND OF THE INVENTION The present invention, when formed into a laminated board,
The present invention relates to a method for producing a paper-based prepreg having high insulation resistance and excellent punching workability, and a silver through-hole printed wiring board laminate having good silver migration resistance.

【0002】[0002]

【従来の技術】紙基材を用いた積層板の銀ペーストスル
ーホール化が進んでいる。銀スルーホール印刷配線板に
は、耐銀マイグレーション性に優れていることを要求さ
れる。耐銀マイグレーション性を良くするためには、耐
湿性を良くして、吸湿しても絶縁抵抗が劣化しないよう
にすれば良い。
2. Description of the Related Art Silver paste through-holes are being developed for laminated sheets using a paper base material. A silver through-hole printed wiring board is required to have excellent silver migration resistance. In order to improve the silver migration resistance, the moisture resistance may be improved so that the insulation resistance does not deteriorate even if moisture is absorbed.

【0003】従来は、紙基材に、下塗り樹脂として水溶
性フェノ−ル樹脂又は水溶性メラミン樹脂を含浸乾燥し
た後、一般の熱硬化性樹脂を含浸乾燥することによって
耐湿性を良くするようにしていた。
Conventionally, a paper base material is impregnated with a water-soluble phenol resin or a water-soluble melamine resin as an undercoat resin and dried, and then a general thermosetting resin is impregnated and dried to improve moisture resistance. Was there.

【0004】[0004]

【発明が解決しようとする課題】下塗り樹脂を含浸した
後の乾燥は一般に揮発分が5%程度以上となるようにさ
れている。乾燥しすぎると上塗り樹脂との親和性が悪く
なるためである。ところが、近年配線が高密度化し、よ
り高い耐銀マイグレーション性を要求されるようになっ
てきた。本発明は、耐銀マイグレーション性に優れた積
層板を製造するためのプリプレグの製造方法を提供する
ことを目的とする。
The drying after impregnating the undercoat resin is generally performed so that the volatile content is about 5% or more. This is because if it is too dry, the affinity with the topcoat resin will deteriorate. However, in recent years, the wiring density has increased, and higher silver migration resistance has been required. It is an object of the present invention to provide a method for producing a prepreg for producing a laminate having excellent silver migration resistance.

【0005】[0005]

【課題を解決するための手段】本発明者らは、プリプレ
グの製造工程における下塗り樹脂の乾燥度合いと絶縁抵
抗との関係について種々検討した。その結果、下塗り工
程で従来よりも高い温度で又は長時間乾燥して、揮発分
が1〜4%好ましくは2〜3%となるようにしついで上
塗り用熱硬化性樹脂を含浸乾燥して得られるプリプレグ
を加熱加圧した積層板は耐銀マイグレーション性に極め
て優れていることがわかった。ここで、揮発分はとは次
のように定義される。 揮発分=〔(乾燥前重量−乾燥後重量)/乾燥前重量〕
×100 乾燥:樹脂ワニスを含浸乾燥した試料を160℃の熱風
乾燥機内で5分間乾燥揮発分を1%以下とすると上塗り
樹脂の含浸性が悪くなり、却って耐湿性を低下させ打ち
抜き加工性も悪くなる。
Means for Solving the Problems The present inventors have made various studies on the relationship between the degree of drying of the undercoat resin and the insulation resistance in the manufacturing process of the prepreg. As a result, it is obtained by drying in the undercoating step at a higher temperature than before or for a long time so that the volatile content becomes 1 to 4%, preferably 2 to 3%, and then impregnating and drying the thermosetting resin for topcoating. It was found that the laminated plate obtained by heating and pressing the prepreg is extremely excellent in silver migration resistance. Here, the volatile matter is defined as follows. Volatile content = [(weight before drying-weight after drying) / weight before drying]
× 100 Drying: A sample dried by impregnation with a resin varnish is dried in a hot air dryer at 160 ° C for 5 minutes to reduce the volatile content to 1% or less, impairing the impregnation of the topcoat resin, and rather reducing the moisture resistance and punching processability. Become.

【0006】下塗り樹脂としては水溶性フェノール樹
脂、メラミン樹脂、メラミン・フェノール共縮合樹脂な
どが挙げられるが、メラミン・フェノール共縮合樹脂が
最も好ましい。メラミン・フェノール共縮合樹脂のメラ
ミン量は重量比で15%以上必要である。20%〜25
%が好ましい。
Examples of the undercoat resin include water-soluble phenol resin, melamine resin, and melamine / phenol co-condensation resin, with melamine / phenol co-condensation resin being most preferred. The melamine content of the melamine / phenol co-condensation resin must be 15% or more by weight. 20% to 25
% Is preferred.

【0007】積層板の難燃性を良くするためには、難燃
剤を配合する。難燃剤は下塗り樹脂、上塗り樹脂いずれ
に配合してもよい。難燃剤としては、ジブトキシホスフ
ィニルプロピルアミド、ジメチル−N、N−ビス(2−
ヒドロキシエチル)アミノメチルホスホネート、ジプロ
ピル−N、N−ビス(2−ヒドロキシエチル)アミノメ
チルホスホネート、ジエチル−N、N−ビス(2−ヒド
ロキシエチル)アミノメチルホスホネートなどが挙げら
れる。難燃剤の配合量は、樹脂100部(重量部以下同
じ)に対して0.5部〜50部、好ましくは2部〜20
部とする。配合量が0.5部未満では難燃効果が不十分
であり、又50部を超えると電気特性の低下を招く。
In order to improve the flame retardancy of the laminate, a flame retardant is added. The flame retardant may be blended with either the undercoat resin or the overcoat resin. As the flame retardant, dibutoxyphosphinylpropylamide, dimethyl-N, N-bis (2-
Hydroxyethyl) aminomethylphosphonate, dipropyl-N, N-bis (2-hydroxyethyl) aminomethylphosphonate, diethyl-N, N-bis (2-hydroxyethyl) aminomethylphosphonate and the like can be mentioned. The amount of the flame retardant compounded is 0.5 parts to 50 parts, preferably 2 parts to 20 parts with respect to 100 parts of the resin (the same applies hereafter by weight).
Part. If the amount is less than 0.5 part, the flame retardant effect is insufficient, and if it exceeds 50 parts, the electrical characteristics are deteriorated.

【0008】上塗り用熱硬化性樹脂としてはフェノール
樹脂、メラミン樹脂、不飽和ポリエステル樹脂などが挙
げられる。特に乾性油変性フェノール樹脂が打ち抜き加
工性も良好であり好ましい。乾性油としては、桐油、脱
水ヒマシ油、オイチシカ油等が使用され、フェノール類
としてはフェノール、メタクレゾール、パラクレゾー
ル、オルソクレゾール、イソプロピルフェノール、パラ
ターシャリーブチルフェノール、パライソプロペニルフ
ェノールオリゴマー、ノニルフェノール、ビスフェノー
ルAなどが使用される。
Examples of the thermosetting resin for top coating include phenol resin, melamine resin and unsaturated polyester resin. Particularly, a dry oil-modified phenol resin is preferable because it has good punching workability. As the drying oil, tung oil, dehydrated castor oil, deer oil, etc. are used, and as the phenols, phenol, metacresol, paracresol, orthocresol, isopropylphenol, paratertiarybutylphenol, paraisopropenylphenol oligomer, nonylphenol, bisphenol A. Etc. are used.

【0009】[0009]

【作用】揮発分が1〜4%まで乾燥することによって、
下塗り樹脂と紙基材とが互いに化学的に結合し、紙の繊
維が吸湿し難くなる。その結果、銀イオンの移動が妨げ
られ、耐銀マイグレーション性が良くなると考えられ
る。
[Function] By drying the volatile matter to 1 to 4%,
The undercoat resin and the paper base material are chemically bonded to each other, and it becomes difficult for the fibers of the paper to absorb moisture. As a result, it is considered that the migration of silver ions is hindered and the silver migration resistance is improved.

【0010】[0010]

【実施例】【Example】

実施例1 メラミン・フェノール共縮合樹脂(メラミン量40%)
50部(重量部、以下同じ)とフェノール樹脂50部を
含む樹脂ワニスを、クラフト基材に樹脂分が17〜20
%なるように含浸し、175℃で2分間乾燥した。揮発
分は2.7%であった。次に、桐油変性フェノール樹脂
100部にトリフェニルホスフェイト28部、テトラブ
ロモビスフェノールAジグリシジルエーテル20部を配
合したワニスを樹脂付着量が50〜54%になるように
含浸し、ついで乾燥してプリプレグとした。
Example 1 Melamine / phenol co-condensation resin (melamine amount 40%)
A resin varnish containing 50 parts (parts by weight, hereinafter the same) and 50 parts of a phenol resin is used as a kraft base material with a resin content of 17-20
%, And dried at 175 ° C. for 2 minutes. The volatile content was 2.7%. Next, 100 parts of a tung oil-modified phenolic resin was impregnated with a varnish containing 28 parts of triphenyl phosphate and 20 parts of tetrabromobisphenol A diglycidyl ether so that the resin adhesion amount was 50 to 54%, and then dried. It was a prepreg.

【0011】実施例2 メラミン・フェノール共縮合樹脂(メラミン量40%)
50部(重量)とフェノール樹脂50部にジエチル−
N、N−ビス(2−ヒドロキシエチル)アミノメチルホ
スホネートを4部配合した樹脂ワニスを、クラフト基材
に樹脂分が17〜20%になるように含浸し、175℃
で2分間乾燥した。揮発分は2.8%であった。以下実
施例1と同様にしてプリプレグとした。
Example 2 Melamine / phenol co-condensation resin (melamine content 40%)
Diethyl-containing 50 parts (by weight) and 50 parts of phenol resin
A kraft base material was impregnated with a resin varnish containing 4 parts of N, N-bis (2-hydroxyethyl) aminomethylphosphonate so that the resin content was 17 to 20%.
And dried for 2 minutes. The volatile content was 2.8%. Thereafter, a prepreg was prepared in the same manner as in Example 1.

【0012】実施例3 メラミン・フェノール共縮合樹脂(メラミン量40%)
100部にジブトキシホスフィニルプロピルアミドを4
部配合した樹脂ワニスを、クラフト基材に樹脂分が17
〜20%になるように含浸し、175℃で2分間乾燥し
た。揮発分は2.6%であった。以下実施例1と同様に
してプリプレグとした。
Example 3 Melamine / phenol co-condensation resin (melamine content 40%)
4 parts of dibutoxyphosphinyl propylamide in 100 parts
Part of resin varnish is mixed with the kraft base material
It was impregnated to ˜20% and dried at 175 ° C. for 2 minutes. The volatile matter was 2.6%. Thereafter, a prepreg was prepared in the same manner as in Example 1.

【0013】比較例 メラミン・フェノール共縮合樹脂(メラミン量40%)
50部(重量)とフェノール樹脂50部にジエチル−
N、N−ビス(2−ヒドロキシエチル)アミノメチルホ
スホネートを4部配合した樹脂ワニスを、クラフト基材
に樹脂分が17〜20%になるように含浸し、150℃
で3分間乾燥した。揮発分は5.8%であった。以下、
実施例1と同様にしてプリプレグとした。
Comparative Example Melamine / phenol co-condensation resin (melamine content 40%)
Diethyl-containing 50 parts (by weight) and 50 parts of phenol resin
A kraft base material was impregnated with a resin varnish containing 4 parts of N, N-bis (2-hydroxyethyl) aminomethylphosphonate so that the resin content was 17 to 20%, and the temperature was 150 ° C.
And dried for 3 minutes. The volatile content was 5.8%. Less than,
A prepreg was prepared in the same manner as in Example 1.

【0014】以上のようにして得られたプリプレグ8枚
と接着剤付き銅箔と組み合わせ、170℃、10MPa
で加熱加圧して、厚み1.6mmの両面銅張積層板を製
造した。この銅張積層板の特性を表1に示す。
Eight prepregs obtained as described above were combined with a copper foil with an adhesive to obtain 170 ° C. and 10 MPa.
By heating and pressurizing, a double-sided copper clad laminate having a thickness of 1.6 mm was manufactured. The characteristics of this copper clad laminate are shown in Table 1.

【0015】[0015]

【表1】 [Table 1]

【0016】試験方法 耐銀マイグレーション性 穴間ピッチ2.0mm、ランド径1.5mm、穴径0.
7mm、90穴連続2回路の銀マイグレーションテスト
パターンで印加電圧50V、相対湿度90%RH、温度
40℃、2000時間処理後の回路間絶縁抵抗。 打抜き加工性 穴間ピッチ2.0mm、穴径0.7mmのの穴あけ加工
を行い、はくり目白の発生評価
Test Method Silver Migration Resistance Hole pitch 2.0 mm, land diameter 1.5 mm, hole diameter 0.
Insulation resistance between circuits after processing for 2000 hours at an applied voltage of 50 V, a relative humidity of 90% RH, and a silver migration test pattern of 2 circuits of 7 mm and 90 holes continuously. Punching workability Punching with a hole pitch of 2.0 mm and a hole diameter of 0.7 mm was performed, and the occurrence of peeled whiteness was evaluated.

【0017】[0017]

【発明の効果】本発明によれば、下塗り樹脂を含浸した
後揮発分が1〜4%となるように乾燥しついで上塗り樹
脂を含浸するようにしたので、耐銀マイグレーション性
が向上した。また打抜き加工性にも優れている。
According to the present invention, the impregnation with the undercoat resin is followed by drying so as to have a volatile content of 1 to 4% and then impregnation with the overcoat resin, so that the silver migration resistance is improved. It also has excellent punching workability.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B32B 27/42 101 7016−4F H05K 1/03 H 7011−4E 1/11 H 6736−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location B32B 27/42 101 7016-4F H05K 1/03 H 7011-4E 1/11 H 6736-4E

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 紙基材に下塗り樹脂ワニスを含浸し、揮
発分が1〜4%となるように乾燥した後、上塗り熱硬化
性樹脂ワニスを含浸乾燥することを特徴とするプリプレ
グの製造方法。
1. A method for producing a prepreg, characterized in that a paper base material is impregnated with an undercoat resin varnish, dried to a volatile content of 1 to 4%, and then impregnated with an overcoat thermosetting resin varnish. ..
【請求項2】 下塗り樹脂がメラミン・フェノール共縮
合樹脂である請求項2記載のプリプレグの製造方法。
2. The method for producing a prepreg according to claim 2, wherein the undercoat resin is a melamine / phenol co-condensation resin.
【請求項3】 上塗り熱硬化性樹脂が乾性油変性フェノ
ール樹脂であることを特徴とする請求項1又は2記載の
プリプレグの製造方法。
3. The method for producing a prepreg according to claim 1, wherein the thermosetting resin for top coating is a drying oil-modified phenol resin.
【請求項4】 請求項1、2又は3記載の方法によって
得られたプリプレグを所定枚数重ね、加熱加圧してなる
銀スルーホール印刷配線板用積層板。
4. A laminate for a silver through-hole printed wiring board, which is obtained by stacking a predetermined number of prepregs obtained by the method according to claim 1, 2 or 3 and heating and pressing.
JP19815691A 1991-08-08 1991-08-08 Manufacture of prepreg and laminated board for silver through-hole printed wiring board Pending JPH0538789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19815691A JPH0538789A (en) 1991-08-08 1991-08-08 Manufacture of prepreg and laminated board for silver through-hole printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19815691A JPH0538789A (en) 1991-08-08 1991-08-08 Manufacture of prepreg and laminated board for silver through-hole printed wiring board

Publications (1)

Publication Number Publication Date
JPH0538789A true JPH0538789A (en) 1993-02-19

Family

ID=16386398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19815691A Pending JPH0538789A (en) 1991-08-08 1991-08-08 Manufacture of prepreg and laminated board for silver through-hole printed wiring board

Country Status (1)

Country Link
JP (1) JPH0538789A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297663A (en) * 1993-04-19 1994-10-25 Hitachi Chem Co Ltd Production of phenol resin laminated sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06297663A (en) * 1993-04-19 1994-10-25 Hitachi Chem Co Ltd Production of phenol resin laminated sheet

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