JPH0771839B2 - Laminated board manufacturing method - Google Patents
Laminated board manufacturing methodInfo
- Publication number
- JPH0771839B2 JPH0771839B2 JP691089A JP691089A JPH0771839B2 JP H0771839 B2 JPH0771839 B2 JP H0771839B2 JP 691089 A JP691089 A JP 691089A JP 691089 A JP691089 A JP 691089A JP H0771839 B2 JPH0771839 B2 JP H0771839B2
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- metal foil
- resin
- laminated
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Description
本発明は、プリント配線板に加工して用いられる積層板
の製造方法に関するものである。The present invention relates to a method for manufacturing a laminated board which is processed into a printed wiring board and used.
銅箔などの金属箔を張った積層板を製造するにあたって
は、ガラス布に硬化剤入りエポキシ樹脂など熱硬化性樹
脂を含浸して乾燥することによってプリプレグを調製
し、このプリプレグを８枚程度重ねると共にその片側も
しくは両側に銅箔等の金属箔を重ね、これを金属プレー
ト間にはさんで成形圧力50kg/cm2、成形温度170℃、成
形時間100分程度の条件で、積層成形することによって
おこなうことができる。When manufacturing a laminated sheet of metal foil such as copper foil, a glass cloth is impregnated with a thermosetting resin such as an epoxy resin containing a curing agent and dried to prepare a prepreg, and about eight prepregs are stacked. A metal foil such as copper foil is layered on one side or both sides of the metal plate, and it is sandwiched between metal plates to form a laminate under the conditions of a forming pressure of 50 kg / cm 2 , a forming temperature of 170 ° C, and a forming time of about 100 minutes. You can do it.
そしてこのようにして得られる積層板にあって、熱硬化
性樹脂が硬化する際の収縮や成形後の冷却する際の収縮
等によって、表層に積層される金属箔の表面の平滑さが
損なわれ、ファインパターンで回路形成することが困難
になるという問題がある。特に金属箔として18μの薄い
銅箔を用いる多層プリント配線板用の場合は金属箔が薄
いために樹脂の収縮等の影響が表面にあらわれ易く、ま
たガラス布としてガラス不織布を用いるコンポジット積
層板の場合はガラス布に熱硬化性樹脂が多量に含浸され
るために樹脂の収縮等が大きく発生し、これらの場合に
は金属箔の表面粗度は５μ以上に大きく生じるものであ
る。 本発明は上記の点に鑑みて為されたものであり、表層に
積層される金属箔の表面の平滑性を保持することができ
る積層板の製造方法を提供することを目的とするもので
ある。In the thus obtained laminated plate, the smoothness of the surface of the metal foil laminated on the surface layer is impaired due to the contraction when the thermosetting resin cures and the contraction when cooling after molding. However, there is a problem that it becomes difficult to form a circuit with a fine pattern. In particular, in the case of a multilayer printed wiring board using a copper foil of 18μ thin as a metal foil, the influence of resin shrinkage etc. is likely to appear on the surface because the metal foil is thin, and in the case of a composite laminated board using a glass nonwoven fabric as a glass cloth. Since the glass cloth is impregnated with a large amount of the thermosetting resin, the resin shrinks greatly, and in these cases, the surface roughness of the metal foil is as large as 5 μm or more. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for producing a laminated plate capable of maintaining the smoothness of the surface of a metal foil laminated on the surface layer. .
本発明に係る積層板の製造方法は、ガラス布基材に熱硬
化性樹脂が含浸乾燥して調製したプリプレグに、表面に
硬化させた熱硬化性樹脂の樹脂層を設けた金属箔を樹脂
層側で重ね、これを積層成形することを特徴とするもの
である。 また本発明にあって、金属箔に設けた樹脂層は厚みが30
μ以上であることが望ましい。 以下本発明を詳細に説明する。 プリプレグは従来より周知の方法で、すなわち、ガラス
織布やガラス不織布などガラス布を基材とし、このガラ
ス布にエポキシ樹脂などの熱硬化性樹脂を含浸してＢス
テージ状態に乾燥することによって、得ることができ
る。 一方、金属箔としては銅箔などが用いられるものであ
り、金属箔の片側表面には熱硬化性樹脂の樹脂層を形成
しておく。樹脂層の熱硬化性樹脂としてはプリプレグを
調製する樹脂と同じ種類の樹脂を用いるのが好ましく、
たとえばプリプレグがエポキシ樹脂で調製される場合に
は、樹脂層もエポキシ樹脂で形成するのが好ましく、こ
の場合、樹脂層を形成するエポキシ樹脂にブチラール樹
脂等を混合することもできる。金属箔に樹脂層を形成す
るにあたっては、金属箔の片側表面に熱硬化性樹脂を塗
布して加熱することによって、Ｂステージよりもさらに
硬化を進めたＣステージ状態に硬化させておこなうこと
ができる。またこの樹脂層による後述の金属箔の表面平
滑を保持する効果を有効に発揮させるためには、樹脂層
は30μ以上の厚みで形成するのが好ましい。 そして、上記プリプレグを複数枚重ね、さらにこの重ね
たプリプレグの片側もしくは両側に樹脂層を設けた金属
箔を重ねる。金属箔は樹脂層がプリプレグの側を向くよ
うに重ねられるものである。このように重ねたものを従
来から周知の方法で加熱加圧して積層成形することによ
って、金属箔を表層に積層した積層板を得ることができ
るものである。The method for producing a laminated sheet according to the present invention is a resin layer comprising a metal foil having a resin layer of a thermosetting resin cured on the surface of a prepreg prepared by impregnating and drying a glass cloth substrate with a thermosetting resin. It is characterized in that it is stacked on the side and laminated and molded. In the present invention, the resin layer provided on the metal foil has a thickness of 30.
It is desirable that it is μ or more. The present invention will be described in detail below. The prepreg is a conventionally known method, that is, by using a glass cloth such as a glass woven cloth or a glass nonwoven cloth as a base material, impregnating this glass cloth with a thermosetting resin such as an epoxy resin, and drying it in a B stage state, Obtainable. On the other hand, a copper foil or the like is used as the metal foil, and a resin layer of thermosetting resin is formed on one surface of the metal foil. As the thermosetting resin of the resin layer, it is preferable to use the same type of resin as the resin for preparing the prepreg,
For example, when the prepreg is made of an epoxy resin, it is preferable that the resin layer is also made of an epoxy resin. In this case, a butyral resin or the like can be mixed with the epoxy resin forming the resin layer. The resin layer can be formed on the metal foil by applying a thermosetting resin to one surface of the metal foil and heating the resin layer so that the resin layer is cured to a C stage state, which is a further cured state than the B stage. . Further, in order to effectively exert the effect of maintaining the surface smoothness of the metal foil described later by this resin layer, the resin layer is preferably formed with a thickness of 30 μm or more. Then, a plurality of the above prepregs are stacked, and further, a metal foil provided with a resin layer is stacked on one side or both sides of the stacked prepregs. The metal foil is laminated so that the resin layer faces the prepreg side. By heating and pressurizing and stacking the thus stacked ones by a conventionally known method, it is possible to obtain a laminated plate in which the metal foil is laminated on the surface layer.
上記のようにして製造される積層板にあって、プリプレ
グに含浸した熱硬化性樹脂が硬化の際に収縮したり、成
形後の冷却の際に収縮したりしても、金属箔に設けた樹
脂層による緩和作用と補強作用とによって、熱硬化性樹
脂の収縮等が金属箔の表面に影響することを防ぐことが
できるものであり、金属箔の表面を平滑に保持して表面
粗度を小さくすることができるものである。従って本発
明は多層プリント配線板やコンポジット積層板において
特に有用である。In the laminated plate manufactured as described above, even if the thermosetting resin impregnated in the prepreg contracts during curing or contracts during cooling after molding, it is provided on the metal foil. The relaxation effect and the reinforcement effect of the resin layer can prevent the shrinkage of the thermosetting resin from affecting the surface of the metal foil, and keep the surface of the metal foil smooth to reduce the surface roughness. It can be made smaller. Therefore, the present invention is particularly useful in multilayer printed wiring boards and composite laminated boards.
次に本発明を実施例によって詳述する。 実施例１ エポキシ樹脂（シェル化学社製エピコート1001）100重
量部、ジシアンジアミド４重量部、ベンジルジメチルア
ミン0.2重量部、メチルオキシトール100重量部の配合の
エポキシ樹脂ワニスを調製し、これを18μ厚の銅箔の片
面に塗布して165℃で60分間加熱することによって、Ｃ
ステージ状態に硬化させた厚み10μの樹脂層を銅箔に形
成した。一方、厚み0.18mmのガラス織布に上記エポキシ
樹脂ワニスを乾燥後の樹脂分が50重量％になるように含
浸し、これをＢステージ状態になるように乾燥してプリ
プレグを調製した。 次に、上記プリプレグを８枚上下に重ねると共に、その
上下の両側にそれぞれ樹脂層がプリプレグの側を向くよ
うに上記銅箔を重ね、これを金属プレート間にはさんで
成形圧力50kg/cm2、成形温度170℃、成形時間100分の条
件で積層成形することによって、1.6mm厚の両面銅箔張
りの積層板を得た。 実施例２ 銅箔の片面に形成する樹脂層の厚みを35μに設定するよ
うにした他は、実施例１と同様にして両面銅箔張りの積
層板を得た。 実施例３ 銅箔の片面に形成する樹脂層の厚みを40μに設定するよ
うにした他は、実施例１と同様にして両面銅箔張りの積
層板を得た。 比較例１ 銅箔に形成する樹脂層をＢステージ状態のものとして形
成した。このＢステージの樹脂層の170℃でのゲルタイ
ムは85秒であり（実施例１〜３の樹脂層はＣステージに
まで完全硬化しているためにゲルタイムの測定は不可
能）、また厚みは35μであった。このＢステージ状態の
樹脂層を設けた金属箔を用い、あとは実施例１と同様に
して両面銅箔張りの積層板を得た。 比較例２ 樹脂層を設けない金属箔を用い、あとは実施例１と同様
にして両面銅箔張りの積層板を得た。 実施例１〜３及び比較例１〜２で得た両面金属箔張り積
層板について、銅箔の表面の平均粗度を測定した。結果
を次表に示す。 表にみられるように、銅箔にＣステージに硬化させた樹
脂層を設けた各実施例のものは、Ｂステージの樹脂層を
銅箔に設けた比較例１や樹脂層を設けない比較例２のも
のより銅箔の表面粗度が小さく、銅箔の表面の平滑性を
保持できることが確認される。また、実施例１と実施例
2,3との比較から、銅箔に設ける樹脂層の厚みを30μ以
上に設定すると効果が大きいことが確認される。Next, the present invention will be described in detail by way of examples. Example 1 An epoxy resin varnish having a composition of 100 parts by weight of an epoxy resin (Epicoat 1001 manufactured by Shell Chemical Co., Ltd.), 4 parts by weight of dicyandiamide, 0.2 parts by weight of benzyldimethylamine, and 100 parts by weight of methyloxytol was prepared. By applying to one side of copper foil and heating at 165 ° C for 60 minutes, C
A resin layer having a thickness of 10 μ and cured in a stage state was formed on the copper foil. On the other hand, a glass woven cloth having a thickness of 0.18 mm was impregnated with the above-mentioned epoxy resin varnish so that the resin content after drying was 50% by weight, and this was dried so as to be in a B stage state to prepare a prepreg. Next, the above eight prepregs are stacked on top of each other, and the copper foils are stacked on both upper and lower sides of the prepreg so that the resin layers face the prepregs, respectively, and a molding pressure of 50 kg / cm 2 is sandwiched between the metal plates. By laminating under conditions of a molding temperature of 170 ° C. and a molding time of 100 minutes, a 1.6 mm-thick double-sided copper foil-clad laminate was obtained. Example 2 A double-sided copper foil-clad laminate was obtained in the same manner as in Example 1 except that the thickness of the resin layer formed on one surface of the copper foil was set to 35 μm. Example 3 A double-sided copper foil-clad laminate was obtained in the same manner as in Example 1 except that the thickness of the resin layer formed on one surface of the copper foil was set to 40 μm. Comparative Example 1 A resin layer formed on a copper foil was formed in a B stage state. The gel time of the B-stage resin layer at 170 ° C. was 85 seconds (the gel time cannot be measured because the resin layers of Examples 1 to 3 are completely cured up to the C stage), and the thickness is 35 μm. Met. Using this metal foil provided with the resin layer in the B stage state, the same procedure as in Example 1 was followed to obtain a laminated sheet having both sides coated with copper foil. Comparative Example 2 A metal foil having no resin layer was used, and thereafter the same procedure as in Example 1 was carried out to obtain a double-sided copper foil-clad laminate. With respect to the double-sided metal foil-clad laminates obtained in Examples 1 to 3 and Comparative Examples 1 to 2, the average roughness of the surface of the copper foil was measured. The results are shown in the table below. As can be seen from the table, each of the examples in which the resin layer cured to the C stage is provided on the copper foil is the comparative example 1 in which the resin layer of the B stage is provided on the copper foil or the comparative example in which the resin layer is not provided. It is confirmed that the surface roughness of the copper foil is smaller than that of No. 2 and the smoothness of the surface of the copper foil can be maintained. In addition, Example 1 and Example
From a comparison with 2 and 3, it is confirmed that the effect is great when the thickness of the resin layer provided on the copper foil is set to 30 μm or more.
上述のように本発明にあっては、ガラス布基材に熱硬化
性樹脂を含浸乾燥して調製したプリプレグに、表面にＣ
ステージ状態にまで硬化させた熱硬化性樹脂の樹脂層を
設けた金属箔を樹脂層側で重ね、これを積層成形して積
層板を製造するようにしたので、金属箔に設けたＣステ
ージ状態に硬化した樹脂層による緩和作用と補強作用と
によって、プリプレグの熱硬化性樹脂の収縮が金属箔の
表面に影響することを防ぐことができるものであり、金
属箔の表面を平滑に保持して表面粗度を小さくすること
ができ、プリプレグ配線板に加工する際の回路形成等が
容易になるものである。As described above, in the present invention, a prepreg prepared by impregnating and drying a glass cloth substrate with a thermosetting resin has a C
Since the metal foil provided with the resin layer of the thermosetting resin cured to the stage state is laminated on the resin layer side and laminated to form the laminated plate, the C-stage state provided on the metal foil is produced. By the relaxation effect and the reinforcing effect of the cured resin layer, it is possible to prevent the shrinkage of the thermosetting resin of the prepreg from affecting the surface of the metal foil, and keep the surface of the metal foil smooth. It is possible to reduce the surface roughness and facilitate circuit formation and the like when processing into a prepreg wiring board.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 福本 恭文 大阪府門真市大字門真1048番地 松下電工 株式会社内 (56)参考文献 特開 昭59−190846（ＪＰ，Ａ) 特開 昭61−214495（ＪＰ，Ａ) 特開 昭61−237633（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kyofumi Fukumoto 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) References JP 59-190846 (JP, A) JP 61-214495 (JP, A) JP-A-61-237633 (JP, A)
Claims (2)
て調製したプリプレグに、表面にＣステージ状態にまで
硬化させた熱硬化性樹脂の樹脂層を設けた金属箔を樹脂
層側で重ね、これを積層成形することを特徴とする積層
板の製造方法。1. A metal foil having a resin layer of thermosetting resin cured to a C stage state on the surface of a prepreg prepared by impregnating and drying a glass cloth substrate with a thermosetting resin. A method for producing a laminated plate, which comprises stacking the layers with each other and molding the layers.
あることを特徴とする請求項１記載の積層板の製造方
法。2. The method for producing a laminated board according to claim 1, wherein the resin layer provided on the metal foil has a thickness of 30 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691089A JPH0771839B2 (en) | 1989-01-14 | 1989-01-14 | Laminated board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691089A JPH0771839B2 (en) | 1989-01-14 | 1989-01-14 | Laminated board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02187332A JPH02187332A (en) | 1990-07-23 |
| JPH0771839B2 true JPH0771839B2 (en) | 1995-08-02 |
Family
ID=11651395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP691089A Expired - Lifetime JPH0771839B2 (en) | 1989-01-14 | 1989-01-14 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0771839B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003094571A (en) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | Material for producing printed wiring board and its production method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0911397A (en) | 1995-06-30 | 1997-01-14 | Hitachi Ltd | Copper clad laminated sheet, production thereof, printed circuit board and production thereof |
-
1989
- 1989-01-14 JP JP691089A patent/JPH0771839B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003094571A (en) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | Material for producing printed wiring board and its production method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02187332A (en) | 1990-07-23 |
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