JPH0257018B2 - - Google Patents
Info
- Publication number
- JPH0257018B2 JPH0257018B2 JP59269869A JP26986984A JPH0257018B2 JP H0257018 B2 JPH0257018 B2 JP H0257018B2 JP 59269869 A JP59269869 A JP 59269869A JP 26986984 A JP26986984 A JP 26986984A JP H0257018 B2 JPH0257018 B2 JP H0257018B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- glass
- resin
- fabric base
- nonwoven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 21
- 239000012792 core layer Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 10
- 239000004745 nonwoven fabric Substances 0.000 claims description 10
- 238000001879 gelation Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 238000001035 drying Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Description
産業上の利用分野
本発明は、成形性が改良されたコンポジツト積
層板の製造法に関するものである。
従来の技術
コンポジツト積層板は、周知のごとく樹脂ワニ
スをガラス不織布基材、ガラス布基材にそれぞれ
含浸乾燥させプリプレグを得たのち、芯層は所定
枚数のガラス不織布プリプレグを積層し、その両
面に表面層としてガラス布プリプレグを重ね、加
熱加圧して製造される。
発明が解決しようとする問題点
しかしながら、芯層に使用されるガラス不織布
は、密度が小さいためプリプレグに内包される空
気が多く、積層成形時、十分に脱泡されない。こ
の結果、成形した積層板内にボイドが残留し、プ
リント配線板としての加工工程等において層間剥
離が生じやすかつた。
本発明は、成形時に十分脱泡が行なわれて成形
性が良く、ボイドの残留が少ないコンポジツト積
層板を提供することを目的とする。
問題点を解決するための手段
本発明者等はかかる問題点を解決するために検
討を行つた結果、芯層のガラス不織布基材プリプ
レグのゲル化時間を表面層のガラス布基材プリプ
レグのゲル化時間より10〜90秒短かくする事によ
り、成形性が良好となりボイドの残留が少ないコ
ンポジツト積層板を製造できることを見い出し
た。
作 用
脱泡は、プリプレグ中の樹脂がゲル化する前の
溶融状態にある間に行なわれるのであるが、表面
層のガラス布基材プリプレグのゲル化を遅くした
ことにより、芯層のガラス不織布基材プリプレグ
中に含まれる空気は、未だゲル化していない表面
層のガラス布基材プリプレグを通して脱泡され
る。
芯層のガラス不織布基材プリプレグのゲル化時
間と表面層のガラス布基材プリプレグのゲル化時
間の差が10秒未満であると、脱泡が円滑に行なわ
れず、ボイドの残留する量が増大する。一方、前
記差が90秒を越えると、表面層のガラス布基材プ
リプレグの樹脂が成形中に積層板外に流れ出てし
まうため、金属箔を表面に一体貼付成形したとき
のピール強度、表面層と芯層の層間接着強度が著
しく低下する。
実施例
本発明に使用する樹脂は、通常の熱硬化性樹脂
であればよく、特に限定しない。また、使用する
ガラス不織布基材としては、熱硬化性或は熱可塑
性樹脂やセルロース繊維をバインダーとして用い
たものが良好であるが、特に限定しない。
尚、表面層に使用する樹脂と芯層に使用する樹
脂は同種であつても異なつていても良い。
次に、本発明の実施例、比較例を説明する。
商品名エピコート1001(油化シエル製エポキシ
樹脂、mp70℃)100重量部、ジシアンジアミド
3.5重量部、ジメチルベンジルアミン0.4重量部を
配合し、樹脂固形分65%のエポキシ樹脂ワニスを
調製した。これを平織ガラス布に樹脂量41%にな
るよう塗工乾燥し表面層プリプレグとする。ま
た、ガラス不織布(重さ75g/m2)に樹脂量78%
になるよう塗工乾燥し芯層プリプレグとした。各
プリプレグは、第1表に示すゲル化時間に調整し
た。
尚、ゲル化時間の調整は、前記の塗工乾燥工程
で、ガラス布基材とガラス不織基材の間で乾燥温
度に差をつけることで行なつた。温度が高けれ
ば、それだけ樹脂の架橋反応が速く進み、プリプ
レグのゲル化時間は短くなる。ゲル化時間の測定
は、プリプレグから掻き落した樹脂を160〜180℃
の熱盤上で加熱してかき混ぜ、かき混ぜ棒と樹脂
の間で軟化した樹脂の糸をひかなくなるまでの時
間を測定したものである。
第1表に示す芯層プリプレグと表面層プリプレ
グの組合せで、芯層プリプレグを6枚重ね、その
最外層に表面層プリプレグを両面に1枚ずつ配置
し、更に銅箔を両面に重ね、温度170℃、圧力20
Kg/cm2で2時間積層成形し、厚み1.6m/mの両
面銅張り積層板を得た。
INDUSTRIAL APPLICATION FIELD OF THE INVENTION The present invention relates to a method for producing composite laminates with improved formability. Conventional technology Composite laminates are made by impregnating and drying a glass nonwoven fabric base material and a glass fabric base material with resin varnish to obtain a prepreg, as is well known, and then forming the core layer by laminating a predetermined number of glass nonwoven fabric prepregs on both sides. It is manufactured by layering glass cloth prepreg as a surface layer and applying heat and pressure. Problems to be Solved by the Invention However, since the glass nonwoven fabric used for the core layer has a low density, a large amount of air is included in the prepreg, and air cannot be removed sufficiently during lamination molding. As a result, voids remained in the formed laminate, and delamination was likely to occur during processing steps for producing a printed wiring board. An object of the present invention is to provide a composite laminate that is sufficiently defoamed during molding, has good moldability, and has few residual voids. Means for Solving the Problems The present inventors conducted studies to solve the problems and found that the gelling time of the glass nonwoven fabric base material prepreg of the core layer is It has been found that by shortening the curing time by 10 to 90 seconds, it is possible to produce a composite laminate with good moldability and fewer residual voids. Function Defoaming is performed while the resin in the prepreg is in a molten state before it gels, but by slowing down the gelation of the glass fabric base prepreg in the surface layer, the glass nonwoven fabric in the core layer Air contained in the base material prepreg is defoamed through the surface layer of the glass cloth base material prepreg that has not yet gelled. If the difference between the gelation time of the glass nonwoven fabric base material prepreg of the core layer and the gelation time of the glass fabric base material prepreg of the surface layer is less than 10 seconds, defoaming will not be performed smoothly and the amount of remaining voids will increase. do. On the other hand, if the difference exceeds 90 seconds, the resin of the glass cloth base material prepreg of the surface layer will flow out of the laminate during molding, so the peel strength of the surface layer The interlayer adhesion strength of the core layer decreases significantly. Examples The resin used in the present invention may be any ordinary thermosetting resin and is not particularly limited. Further, the glass nonwoven fabric base material to be used is preferably one using a thermosetting or thermoplastic resin or cellulose fiber as a binder, but is not particularly limited. The resin used for the surface layer and the resin used for the core layer may be the same or different. Next, examples and comparative examples of the present invention will be described. Product name Epicote 1001 (epoxy resin manufactured by Yuka Ciel, mp70℃) 100 parts by weight, dicyandiamide
3.5 parts by weight and 0.4 parts by weight of dimethylbenzylamine were blended to prepare an epoxy resin varnish with a resin solid content of 65%. This is coated on plain-woven glass cloth to a resin content of 41% and dried to form a surface layer prepreg. In addition, the amount of resin is 78% in glass nonwoven fabric (weight 75g/m 2 ).
The coating was dried to obtain a core layer prepreg. Each prepreg was adjusted to the gelation time shown in Table 1. The gelation time was adjusted by varying the drying temperature between the glass cloth base material and the glass nonwoven base material in the coating and drying process described above. The higher the temperature, the faster the crosslinking reaction of the resin will proceed, and the gelling time of the prepreg will be shorter. To measure the gelation time, the resin scraped off from the prepreg was heated to 160 to 180℃.
The material was heated and stirred on a heating plate, and the time taken until the softened resin stopped stringing between the stirring rod and the resin was measured. With the combination of core layer prepreg and surface layer prepreg shown in Table 1, six core layer prepregs are stacked, one surface layer prepreg is placed on each side on the outermost layer, and copper foil is further stacked on both sides, and the temperature is 170 °C, pressure 20
Lamination molding was carried out for 2 hours at Kg/cm 2 to obtain a double-sided copper-clad laminate with a thickness of 1.6 m/m.
【表】 上記で得た各積層板の物性を第2表に示す。【table】 Table 2 shows the physical properties of each laminate obtained above.
【表】
発明の効果
第2表から明らかなように、本発明によれば成
形性が良く十分脱泡が行なわれてボイドの残留が
少ない、そして、層間強度の優れたコンポジツト
積層板が得られる点、その工業的価値は極めて大
なるものである。[Table] Effects of the Invention As is clear from Table 2, according to the present invention, a composite laminate with good moldability, sufficient degassing, few residual voids, and excellent interlaminar strength can be obtained. In fact, its industrial value is extremely large.
Claims (1)
表面層にガラス布基材プリプレグを配置して加熱
加圧成形するに際して、ガラス不織布基材プリプ
レグのゲル化時間をガラス布基材プリプレグのゲ
ル化時間より10〜90秒短かくすることを特徴とす
るコンポジツト積層板の製造法。1 When heat-pressing molding is performed by arranging a glass nonwoven fabric base prepreg in the core layer and a glass fabric base prepreg in the surface layer, the gelation time of the glass nonwoven fabric base prepreg is determined by the gelation time of the glass fabric base prepreg. A method for manufacturing a composite laminate, characterized in that the manufacturing time is 10 to 90 seconds shorter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59269869A JPS61146537A (en) | 1984-12-21 | 1984-12-21 | Manufacture of composite laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59269869A JPS61146537A (en) | 1984-12-21 | 1984-12-21 | Manufacture of composite laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61146537A JPS61146537A (en) | 1986-07-04 |
JPH0257018B2 true JPH0257018B2 (en) | 1990-12-03 |
Family
ID=17478340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59269869A Granted JPS61146537A (en) | 1984-12-21 | 1984-12-21 | Manufacture of composite laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61146537A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH056315U (en) * | 1991-07-06 | 1993-01-29 | 巧 岡田 | Tack for surveying |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH074915B2 (en) * | 1990-06-15 | 1995-01-25 | 松下電工株式会社 | Method for manufacturing multilayer wiring board |
-
1984
- 1984-12-21 JP JP59269869A patent/JPS61146537A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH056315U (en) * | 1991-07-06 | 1993-01-29 | 巧 岡田 | Tack for surveying |
Also Published As
Publication number | Publication date |
---|---|
JPS61146537A (en) | 1986-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |