JP3011867B2 - Manufacturing method of laminated board - Google Patents
Manufacturing method of laminated boardInfo
- Publication number
- JP3011867B2 JP3011867B2 JP7070084A JP7008495A JP3011867B2 JP 3011867 B2 JP3011867 B2 JP 3011867B2 JP 7070084 A JP7070084 A JP 7070084A JP 7008495 A JP7008495 A JP 7008495A JP 3011867 B2 JP3011867 B2 JP 3011867B2
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- nonwoven fabric
- base material
- glass
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明は、特に電気機器、電子機
器、通信機器等に使用される印刷回路板用として好適な
積層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated board suitable for use in a printed circuit board, particularly for use in electric equipment, electronic equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】民生用電子機器の小型化、高機能化が進
み、それに用いられる印刷回路基板として、ガラス不織
布を中間層基材とし、ガラス織布を表面層基材とした構
成で、エポキシ樹脂を含浸させ加熱加圧成形した積層板
（以下、コンポジット積層板という）が使用されてい
る。最近かかるコンポジット積層板に対し、従来この分
野で使用されている紙基材フェノール積層板と同等の打
抜き加工性、低コスト化が要求されるようになってき
た。2. Description of the Related Art Consumer electronic devices have become smaller and more sophisticated, and a printed circuit board used for the same has a structure in which a glass nonwoven fabric is used as an intermediate layer base material and a glass woven fabric is used as a surface layer base material. A laminate impregnated with a resin and molded by heating and pressurizing (hereinafter, referred to as a composite laminate) is used. In recent years, such composite laminates have been required to have the same punching workability and cost reduction as paper-based phenolic laminates conventionally used in this field.
【０００３】また産業用電子機器分野においても、低コ
スト化の必要性からガラス織布を使用しないか又はその
使用量を減らしたコンポジット積層板が使用されるよう
になってきたが、性能上ガラス織布基材積層板より種々
の点で劣り、これと同等の寸法変化、反りが小さいこと
が要求されるようになってきた。In the field of industrial electronic equipment, composite laminates which do not use glass woven fabric or reduce the amount of glass woven fabric have been used due to the need for cost reduction. It is inferior in various points to a woven fabric laminate, and it has been required to have the same dimensional change and small warpage.
【０００４】[0004]
【発明が解決しようとする課題】コンポジット積層板に
対する上記のような種々の要求に対して、中間層基材と
してガラス不織布を使用しないで、ガラス単繊維を配合
した樹脂ワニスを使用することが検討されたが、寸法変
化や反りは改良されるものの、製造上種々の問題点があ
り、実用化には未だ至っていない。一方、低コスト化の
ために、ガラス織布や不織布の割合を小さくすることも
検討されているが、性能上あるいは製造上の制約から低
コスト化も容易ではない。このような現状から、本発明
はコンポジット積層板としての性能を維持向上させなが
ら、低コスト化を達成することを目的として種々検討し
た結果、完成されたものである。In order to meet the above-mentioned various demands for a composite laminate, it has been studied to use a resin varnish blended with a single glass fiber without using a glass nonwoven fabric as an intermediate layer base material. Although the dimensional change and warpage are improved, there are various problems in manufacturing, and they have not yet been put to practical use. On the other hand, reducing the ratio of the glass woven fabric or nonwoven fabric to reduce the cost is also considered, but it is not easy to reduce the cost due to performance or manufacturing restrictions. Under such circumstances, the present invention has been completed as a result of various studies aimed at achieving cost reduction while maintaining and improving the performance as a composite laminate.
【０００５】[0005]
【課題を解決するための手段】本発明は、長尺の繊維基
材の片面側から熱硬化性樹脂ワニスを塗布する工程、前
記繊維基材のワニス塗布面にガラス繊維不織布を重ね合
わせる工程、これらの積層物を加熱乾燥してプリプレグ
を得る工程、このプリプレグ２枚を前記不織布を内側に
して重ね合わせ加熱加圧成形する工程を有することを特
徴とする積層板の製造方法に関するものであり、製造工
程が簡単で連続成形が可能であり、性能上も従来のコン
ポジット積層板と同等以上のものを得ることができる。
本発明において、プリプレグを製造するまでの工程の一
例（概略）を図１に示す。The present invention comprises a step of applying a thermosetting resin varnish from one side of a long fiber base material, a step of superposing a glass fiber nonwoven fabric on the varnish application surface of the fiber base material, A process for obtaining a prepreg by heating and drying these laminates, and a method for producing a laminate, comprising: laminating two prepregs with the nonwoven fabric inside, and hot-press molding. The production process is simple, continuous molding is possible, and the performance can be equal to or better than that of a conventional composite laminate.
In the present invention, an example (schematic) of a process until a prepreg is manufactured is shown in FIG.
【０００６】巻き出し装置から巻き出された長尺基材
（１）の上面に熱硬化性樹脂ワニス（２）をコーター
（３）により所定の膜厚になるように塗布する。この長
尺基材としては、ガラス繊維織布、ガラス繊維不織布、
合成繊維織布又は不織布、クラフト紙、リンター紙など
特に限定されないが、耐熱性の点からはガラス繊維織布
が好ましい。一方、打抜き加工性、低コスト化が特に要
求される場合はクラフト紙やリンター紙などのセルロー
ス系紙基材が好ましく使用される。A thermosetting resin varnish (2) is applied to the upper surface of the long base material (1) unwound from the unwinding device by a coater (3) so as to have a predetermined thickness. As the long base material, a glass fiber woven fabric, a glass fiber nonwoven fabric,
There is no particular limitation on synthetic fiber woven or nonwoven fabric, kraft paper, linter paper, etc., but glass fiber woven fabric is preferred from the viewpoint of heat resistance. On the other hand, when punching workability and cost reduction are particularly required, a cellulosic paper base such as kraft paper or linter paper is preferably used.
【０００７】本発明に用いられる熱硬化性樹脂ワニスに
おける熱硬化性樹脂はエポキシ樹脂が望ましいが、この
ほか、ポリイミド樹脂、ポリエステル樹脂、フェノール
樹脂などを用いることができる。かかる熱硬化性樹脂ワ
ニスはそのままでも使用することができるが、無機充填
材を配合することが好ましい。無機充填材を加えると、
打抜き加工性や寸法安定性を維持・向上させるととも
に、Ｚ方向の熱膨張率が小さくなるのでスルーホール信
頼性を向上させることも可能である。かかる無機充填材
としは、水酸化アルミニウム、炭酸カルシウム、クレ
ー、タルク、シリカ等であり、樹脂に対する配合割合は
１０〜２００重量％が好ましい。１０重量％以下では、
スルーホール信頼性の向上効果が小さく、２００重量％
を越えると無機充填材の配合が困難となる。The thermosetting resin in the thermosetting resin varnish used in the present invention is preferably an epoxy resin. In addition, a polyimide resin, a polyester resin, a phenol resin and the like can be used. Such a thermosetting resin varnish can be used as it is, but preferably contains an inorganic filler. Add the inorganic filler,
It is possible to maintain and improve the punching processability and the dimensional stability, and also to improve the through-hole reliability because the coefficient of thermal expansion in the Z direction is reduced. Examples of such an inorganic filler include aluminum hydroxide, calcium carbonate, clay, talc, silica, and the like, and the mixing ratio to the resin is preferably from 10 to 200% by weight. Below 10% by weight,
The effect of improving the reliability of through holes is small, 200% by weight
If the ratio exceeds the above range, it becomes difficult to mix the inorganic filler.
【０００８】熱硬化性樹脂ワニスの固形分は、通常、無
機充填材を配合しない場合は６０〜８０重量％、無機充
填材を配合する場合は６５〜９０重量％（無機充填材も
固形分として計算）である。熱硬化性樹脂ワニスの塗布
量は、以下の工程において、使用されるガラス不織布の
目付け量、あるいは長尺基材の下面に樹脂ワニスを塗布
する場合はこの樹脂ワニスの塗布量によっても変化する
が、通常長尺基材１ｍ2 あたり、ワニス固型分６００〜
１４００ｇ程度であり、塗布厚み（乾燥前）は０．２〜
１．０ｍｍ程度である。The solid content of the thermosetting resin varnish is usually 60 to 80% by weight when the inorganic filler is not blended, and 65 to 90% by weight when the inorganic filler is blended (the inorganic filler is also solid Calculation). The application amount of the thermosetting resin varnish varies in the following steps depending on the basis weight of the glass nonwoven fabric used, or the application amount of the resin varnish when applying the resin varnish to the lower surface of the long base material. , usually length Shakumotozai 1m 2 per, varnish solids 600
It is about 1400 g, and the coating thickness (before drying) is 0.2 to
It is about 1.0 mm.
【０００９】コーター３としては、コンマロールコータ
ー、ナイフコーター、ダイスコーター、リバースコータ
ー等があるが、塗工厚みが０．２〜１．０ｍｍと厚いた
め、ワニス粘度を高粘度にする必要がある。このため高
粘度ワニスを塗工できる方式、例えばコンマロールコー
ター、ナイフコーターが好ましい。As the coater 3, there are a comma roll coater, a knife coater, a die coater, a reverse coater and the like. However, since the coating thickness is as thick as 0.2 to 1.0 mm, it is necessary to increase the varnish viscosity. . For this reason, a method capable of applying a high-viscosity varnish, for example, a comma roll coater or a knife coater is preferable.
【００１０】長尺基材に前記熱硬化性樹脂ワニスを塗工
した後、上面よりガラス不織布（４）を重ね合わせ、一
方裏面からは以下に説明するように熱硬化性樹脂ワニス
を塗工する。この塗工は通常ロールコーター（５）によ
り行われるが、これに限定されるものではない。ガラス
不織布は、通常目付け量２０〜１５０ｇ／ｍ2 のものが
使用される。裏面から長尺基材に塗工される熱硬化性樹
脂ワニスは、始めに塗工された熱硬化性樹脂ワニスが長
尺基材に十分に含浸されないのを補うためのもので、塗
工・含浸される樹脂量は少なくてよく、均一に含浸させ
るためには樹脂固形分１０〜３０重量％程度のものが通
常使用される。After applying the thermosetting resin varnish to the long base material, a glass nonwoven fabric (4) is overlaid from the upper surface, and the thermosetting resin varnish is applied from the back surface as described below. . This coating is usually performed by a roll coater (5), but is not limited thereto. A glass nonwoven fabric having a basis weight of 20 to 150 g / m 2 is usually used. The thermosetting resin varnish applied to the long base material from the back side is to supplement that the thermosetting resin varnish applied first is not sufficiently impregnated into the long base material. The amount of the resin to be impregnated may be small, and a resin having a resin solid content of about 10 to 30% by weight is usually used for uniform impregnation.
【００１１】その後、乾燥装置（６）を通して加熱乾燥
することにより、長尺基材上にガラス不織布が重ね合わ
された熱硬化性樹脂含浸プリプレグを得る。加熱乾燥条
件は、基材の全厚さが厚いので、通常よりやや強い条件
とし、１２０〜１８０℃、１〜５分間程度である。その
後、このプリプレグをカッター（７）により所定長さに
切断する。あるいは、切断しないで連続成形に供するこ
とも可能である。Thereafter, the prepreg is dried by heating through a drying device (6) to obtain a thermosetting resin-impregnated prepreg in which a glass nonwoven fabric is laminated on a long base material. The heating and drying conditions are slightly stronger than usual since the total thickness of the base material is large, and are about 120 to 180 ° C. and about 1 to 5 minutes. Thereafter, the prepreg is cut into a predetermined length by a cutter (7). Alternatively, it is also possible to perform continuous molding without cutting.
【００１２】このようにして得られたプリプレグは、ガ
ラス不織布側を内側にして２枚重ね合わせ加熱加圧成形
する。この成形は、通常所定長さに切断したプリプレグ
２枚を重ね合わせ多数プレスにて加熱加圧成形するが、
切断しない長尺のプリプレグ２枚を一方を上下逆向きに
して連続的に加熱加圧することもできる。樹脂がエポキ
シ樹脂の場合は通常前者の成形方法が行われ、この成形
条件は、含浸された樹脂の流動性にもよるが、通常は従
来のコンポジット積層板の場合と同様に、温度１５０〜
１８０℃、圧力２０〜７０ｋｇ／ｃｍ2 、時間６０〜１
２０分間が適当である。また、ポリエステル樹脂の場合
では、低圧成形が可能な後者の連続成形方法を採用する
ことができる。The prepregs thus obtained are superposed on each other with the glass nonwoven fabric side facing inward, and are subjected to heat and pressure molding. In this molding, usually, two prepregs cut to a predetermined length are overlapped and heated and pressed by a large number of presses.
It is also possible to continuously heat and press two uncut long prepregs with one of them turned upside down. When the resin is an epoxy resin, the former molding method is usually performed, and the molding conditions usually depend on the fluidity of the impregnated resin.
180 ° C., pressure 20-70 kg / cm 2 , time 60-1
20 minutes is appropriate. In the case of a polyester resin, the latter continuous molding method capable of low-pressure molding can be employed.
【００１３】なお、長尺基材に始めの熱硬化性樹脂を塗
工した後、ガラス不織布を重ね合わせる前に加熱による
乾燥工程を挿入してもよい。この乾燥工程で溶剤を蒸発
させることにより、ガラス不織布重ね合わせ後の樹脂の
Ｂステージ化が容易となる。After the first thermosetting resin is applied to the long base material, a drying step by heating may be inserted before the glass nonwoven fabric is laminated. By evaporating the solvent in this drying step, it becomes easy to make the resin into the B-stage after the glass nonwoven fabric is overlaid.
【００１４】[0014]
【作用】以上のような工程で、コンポジット積層板を得
ることができるが、本発明においては、ガラス織布等の
長尺基材に熱硬化性樹脂ワニスを塗布した後にガラス不
織布を重ね合わせるので、後の裏面から樹脂ワニスを塗
工する場合を含めても塗布・含浸工程が簡単であり、相
対的にコストの高いガラス不織布の量を少なくすること
ができる。また、ガラス不織布は長尺基材とともに移動
するので、ガラス不織布の切断も生じないし、ガラス繊
維のピットも飛散することが少ない。従って、コンポジ
ット積層板製造時のトラブルが少なく、低コスト化をも
達成することができる。According to the above process, a composite laminate can be obtained. However, in the present invention, a glass nonwoven fabric is laminated after applying a thermosetting resin varnish to a long base material such as a glass woven fabric. In addition, even when a resin varnish is applied from the rear surface, the application / impregnation step is simple, and the amount of the relatively expensive glass nonwoven fabric can be reduced. Further, since the glass nonwoven fabric moves together with the long base material, the glass nonwoven fabric is not cut, and pits of the glass fiber are hardly scattered. Therefore, there are few troubles in the production of the composite laminate, and the cost can be reduced.
【００１５】[0015]
【実施例】次に本発明の実施例を比較例とともに具体的
に説明する。Next, examples of the present invention will be specifically described together with comparative examples.
【００１６】〔実施例〕長尺基材であるガラス織布（日
東紡績製 ＷＥ−１８Ｋ ＲＢ−８４）を巻き出し、続い
てこれに次の配合からなるＦＲ−４用ワニスＡをナイフ
コーターにより厚さ０．９ｍｍ（乾燥前）になるように
塗工した。 （ワニスＡ配合） エポキシ樹脂 １００重量部 （硬化剤ジシアンジアミドと硬化促進剤を含む） 無機充填材（水酸化アルミニウム） ８０重量部 超微粒子シリカ ２０重量部 溶剤（メチルセロソルブ） ５０重量部 次いで、上面側から目付け量７５ｇ／ｍ2 のガラス不織
布（日本バイリーン製ＥＰ-４０７５）を重ね合わせ、
裏面に次の配合のワニスＢをロールコーターにより塗布
した。 （ワニスＢ配合） エポキシ樹脂（上記と同じ） ３０重量部 溶剤（メチルセロソルブ） ７０重量部[Example] A glass woven fabric (WE-18K RB-84 manufactured by Nitto Boseki Co., Ltd.) as a long base material was unwound, and then a varnish A for FR-4 having the following composition was added thereto using a knife coater. Coating was carried out to a thickness of 0.9 mm (before drying). (Containing varnish A) Epoxy resin 100 parts by weight (including curing agent dicyandiamide and curing accelerator) Inorganic filler (aluminum hydroxide) 80 parts by weight Ultrafine silica 20 parts by weight Solvent (methyl cellosolve) 50 parts by weight Next, upper surface side A glass non-woven fabric with a basis weight of 75 g / m 2 (EP-4075 manufactured by Japan Vilene Co., Ltd.)
Varnish B having the following composition was applied to the back surface using a roll coater. (Containing varnish B) Epoxy resin (same as above) 30 parts by weight Solvent (methyl cellosolve) 70 parts by weight
【００１７】続いて、上記のワニスＡ及びＢが塗工され
た基材を、乾燥装置により１４０℃で３分間加熱乾燥
し、ガラス織布及びガラス不織布からなるプリプレグを
得た。これを所定長さ（２ｍ）に切断した後、ガラス不
織布を内側にして２枚重ね合わせ、さらにその上下に厚
さ１８μｍの銅箔を重ね合わせ、温度１６５℃、圧力６
０ｋｇ／ｃｍ2 で９０分間加熱加圧成形して、厚さ１．
６ｍｍの銅張積層板を作製した。Subsequently, the base material coated with the varnishes A and B was dried by heating at 140 ° C. for 3 minutes using a drying device to obtain a prepreg composed of a glass woven fabric and a glass nonwoven fabric. After cutting this to a predetermined length (2 m), two sheets are laminated with the glass non-woven fabric inside, and copper foil having a thickness of 18 μm is laminated on the upper and lower sides, and the temperature is 165 ° C. and the pressure is 6
It was heated and pressed at 0 kg / cm 2 for 90 minutes to obtain a thickness of 1.
A 6 mm copper-clad laminate was produced.
【００１８】〔比較例１〕実施例で使用したＦＲ−４用
エポキシ樹脂を前記溶剤で樹脂固形分６０重量％（０．
３ポイズ）にまで希釈してワニスとした。このワニスを
実施例で使用したガラス織布（日東紡績製 ＷＥ−１８
Ｋ ＲＢ−８４）にディップ方式で塗布含浸させ乾燥し
て表面層用プリプレグを作製した。そして、上記希釈し
たＦＲ−４用エポキシ樹脂ワニスをガラス不織布（日本
バイリーン製 ＥＰ-４０７５）にディップ方式で塗布含
浸し乾燥して中間層用プリプレグを作製した。次いで、
中間用プリプレグを所定枚数（４枚）重ね、その上下に
表面層用プリプレグを重ね、さらにその上下に厚さ１８
μｍ銅箔を重ね合わせ加熱加圧成形して厚さ１．６ｍｍ
の銅張積層板を作製した。[Comparative Example 1] The epoxy resin for FR-4 used in Examples was mixed with the above-mentioned solvent at a resin solid content of 60% by weight (0.1%).
3 poise) to give a varnish. Glass woven fabric (WE-18 manufactured by Nitto Boseki) using this varnish in Examples
K RB-84) by a dip method, followed by impregnation and drying to prepare a prepreg for a surface layer. Then, the diluted epoxy resin varnish for FR-4 was applied to a glass nonwoven fabric (EP-4075 manufactured by Nippon Vileen Co., Ltd.) by a dipping method and dried to prepare a prepreg for an intermediate layer. Then
A predetermined number (4) of intermediate prepregs are stacked, a surface layer prepreg is stacked above and below the intermediate prepreg, and a thickness 18
μm copper foil is overlaid and heated and pressed to a thickness of 1.6mm
Was produced.
【００１９】〔比較例２〕比較例１と同様にして表面層
用ガラス織布プリプレグを作製した。一方、次の配合か
らなるＦＲ−４用ワニスＣを調製した。 （ワニスＣ配合） エポキシ樹脂（ワニスＡと同じ） １００重量部 無機充填材（水酸化アルミニウム） ８０重量部 超微粒子シリカ ２０重量部 溶剤（メチルセロソルブ） ６５重量部 このワニスＣをガラス不織布（日本バイリーン製 ＥＰ-
４０７５）にディップ方式で塗布含浸し乾燥して中間層
用プリプレグを作製した。次いで、中間用プリプレグを
所定枚数（３枚）重ね、その上下に表面層用プリプレグ
を重ね、さらにその上下に厚さ１８μｍ銅箔を重ね合わ
せ加熱加圧成形して厚さ１．６ｍｍの銅張積層板を作製
した。Comparative Example 2 A woven prepreg for a surface layer was prepared in the same manner as in Comparative Example 1. Meanwhile, a varnish C for FR-4 having the following composition was prepared. (Contains varnish C) Epoxy resin (same as varnish A) 100 parts by weight Inorganic filler (aluminum hydroxide) 80 parts by weight Ultrafine silica 20 parts by weight Solvent (methyl cellosolve) 65 parts by weight This varnish C is made of glass nonwoven fabric (Nippon Vilene) Made EP-
4075) by dipping, impregnated and dried to prepare a prepreg for an intermediate layer. Next, a predetermined number (three) of intermediate prepregs are stacked, a prepreg for a surface layer is stacked on top and bottom of the prepreg, and an 18 μm-thick copper foil is stacked on top and bottom of the prepreg. A laminate was prepared.
【００２０】以上実施例及び比較例で得られた銅張積層
板について、打抜き加工性寸法安定性反り曲げ強さ及び
Ｚ方向熱膨張率を測定した。その結果を表１に示す。With respect to the copper-clad laminates obtained in the above Examples and Comparative Examples, the punching workability, dimensional stability, warpage bending strength and coefficient of thermal expansion in the Z direction were measured. Table 1 shows the results.
【００２１】[0021]
【表１】 [Table 1]
【００２２】なお、製造コストについては、実施例の方
法は工程が単純であり、コストの高いガラス繊維不織布
の使用量を少なくしたので、実施例では得られた積層板
は比較例で得られたものに比べ１０％程度低コスト化す
ることができた。Regarding the manufacturing cost, the laminated plate obtained in the example was obtained in the comparative example because the method of the example was simple in steps and the amount of expensive glass fiber nonwoven fabric was reduced. The cost was reduced by about 10% as compared with the case of the above.
【００２３】[0023]
【発明の効果】本発明の方法は、曲げ強度の低下がな
く、打抜き加工性が良好で、反り・寸法変化が小さい積
層板を得ることができる。そして、低コスト化の点で優
れており、製造工程も簡単であるので、工業的な積層板
の製造方法として好適である。According to the method of the present invention, it is possible to obtain a laminated plate which has no reduction in bending strength, good punching workability, and small warpage and dimensional change. Further, since it is excellent in cost reduction and the manufacturing process is simple, it is suitable as an industrial method for manufacturing a laminated board.
【図１】 本発明の製造工程において、プリプレグを作
製するまでの工程を示す概略断面図FIG. 1 is a schematic cross-sectional view showing a process up to manufacturing a prepreg in a manufacturing process of the present invention.
１ 長尺基材 ２ ワニス ３ コーター ４ ガラス不織布 ５ ロールコーター ６ 乾燥装置 ７ カッター ８ プリプレグ DESCRIPTION OF SYMBOLS 1 Long base material 2 Varnish 3 Coater 4 Glass nonwoven fabric 5 Roll coater 6 Drying device 7 Cutter 8 Prepreg
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｂ３２Ｂ 31/20 Ｂ３２Ｂ 31/20 Ｃ０８Ｊ 5/08 ＣＦＣ Ｃ０８Ｊ 5/08 ＣＦＣ 5/24 ＣＦＣ 5/24 ＣＦＣ Ｃ０８Ｋ 3/00 Ｃ０８Ｋ 3/00 Ｃ０８Ｌ 63/00 Ｃ０８Ｌ 63/00 Ｈ０５Ｋ 1/03 ６３０ Ｈ０５Ｋ 1/03 ６３０Ｆ (58)調査した分野(Int.Cl.7，ＤＢ名) B32B 17/04 B05D 7/24 C08J 5/24 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification code FI B32B 31/20 B32B 31/20 C08J 5/08 CFC C08J 5/08 CFC 5/24 CFC 5/24 CFC C08K 3/00 C08K 3 / 00 C08L 63/00 C08L 63/00 H05K 1/03 630 H05K 1/03 630F (58) Field surveyed (Int. Cl. 7 , DB name) B32B 17/04 B05D 7/24 C08J 5/24
Claims (3)
脂ワニスを塗布する工程、前記繊維基材のワニス塗布面
にガラス繊維不織布を重ね合わせる工程、これらの積層
物を加熱乾燥してプリプレグを得る工程、このプリプレ
グ２枚を前記不織布を内側にして重ね合わせ加熱加圧成
形する工程を有することを特徴とする積層板の製造方
法。1. A step of applying a thermosetting resin varnish from one side of a long fiber base material, a step of superposing a glass fiber nonwoven fabric on a varnish application surface of the fiber base material, and heating and drying these laminates. A step of obtaining a prepreg by heating and press-molding the two prepregs with the nonwoven fabric facing inward.
するものである請求項１記載の積層板の製造方法。2. The method for producing a laminate according to claim 1, wherein the thermosetting resin varnish contains an inorganic filler.
不織布を重ね合わせる工程に続いて、反対面から熱硬化
性樹脂ワニスを塗布する工程を有する請求項１又は２記
載の積層板の製造方法。3. The method for producing a laminate according to claim 1, further comprising a step of applying a thermosetting resin varnish from the opposite surface, following the step of superposing the glass fiber nonwoven fabric on the fiber base to which the varnish has been applied. .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7070084A JP3011867B2 (en) | 1995-03-28 | 1995-03-28 | Manufacturing method of laminated board |
| US08/714,264 US6124220A (en) | 1995-03-28 | 1996-09-17 | Laminated board and process for production thereof |
| TW85111363A TW440528B (en) | 1995-03-28 | 1996-09-17 | Laminated board and process for production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7070084A JP3011867B2 (en) | 1995-03-28 | 1995-03-28 | Manufacturing method of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08267664A JPH08267664A (en) | 1996-10-15 |
| JP3011867B2 true JP3011867B2 (en) | 2000-02-21 |
Family
ID=13421329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7070084A Expired - Fee Related JP3011867B2 (en) | 1995-03-28 | 1995-03-28 | Manufacturing method of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3011867B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805663A (en) * | 2020-06-02 | 2020-10-23 | 烟台柳鑫新材料科技有限公司 | Backing plate and preparation method thereof |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117516A (en) * | 1997-04-24 | 2000-09-12 | Sumitomo Bakelite Company Limited | Laminate and process for producing the same |
| EP1178074A4 (en) * | 1999-02-19 | 2002-09-18 | Hitachi Chemical Co Ltd | Prepreg, metal-clad laminate, and printed circuit board obtained from these |
| JP3844109B2 (en) * | 2000-03-22 | 2006-11-08 | 住友ベークライト株式会社 | Laminate manufacturing method |
| JP3998914B2 (en) * | 2001-03-14 | 2007-10-31 | 住友ベークライト株式会社 | Laminate production method |
| JP4784011B2 (en) * | 2001-07-25 | 2011-09-28 | 住友ベークライト株式会社 | Laminate production method |
| JP2003171482A (en) * | 2001-09-25 | 2003-06-20 | Sumitomo Bakelite Co Ltd | Method for producing composite laminated board |
| JP2003236868A (en) * | 2002-02-19 | 2003-08-26 | Sumitomo Bakelite Co Ltd | Method for manufacturing composite laminated sheet |
| JP5750928B2 (en) * | 2011-02-16 | 2015-07-22 | 三菱レイヨン株式会社 | Manufacturing method of prepreg |
| DK2682429T3 (en) | 2011-03-03 | 2019-05-27 | Mitsubishi Chem Corp | PROCEDURE FOR PREPARING A PREPARATION |
| KR101829593B1 (en) | 2012-09-06 | 2018-03-29 | 미쯔비시 케미컬 주식회사 | Prepreg and method for producing same |
| JP2015086293A (en) * | 2013-10-30 | 2015-05-07 | パナソニックＩｐマネジメント株式会社 | Prepreg and multilayer printed wiring board |
-
1995
- 1995-03-28 JP JP7070084A patent/JP3011867B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805663A (en) * | 2020-06-02 | 2020-10-23 | 烟台柳鑫新材料科技有限公司 | Backing plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08267664A (en) | 1996-10-15 |
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