JPH064310B2 - Electric laminate - Google Patents
Electric laminateInfo
- Publication number
- JPH064310B2 JPH064310B2 JP61016216A JP1621686A JPH064310B2 JP H064310 B2 JPH064310 B2 JP H064310B2 JP 61016216 A JP61016216 A JP 61016216A JP 1621686 A JP1621686 A JP 1621686A JP H064310 B2 JPH064310 B2 JP H064310B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aluminum hydroxide
- impregnated
- talc
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 この発明は、電子機器などに用いられる電気用積層板に
関する。Description: TECHNICAL FIELD The present invention relates to an electrical laminate used in electronic devices and the like.
電子機器用基板としては、エポキシ樹脂含浸ガラス布基
材の金属箔張積層板が主流であったが、最近、打抜加工
性が良く、電気絶縁性に優れ、コスト面で有利なコンポ
ジット金属箔張積層板が注目され始めている。As a substrate for electronic equipment, a metal foil-clad laminate of an epoxy resin-impregnated glass cloth substrate has been the mainstream, but recently, a composite metal foil that has good punching workability, excellent electrical insulation, and cost advantages Clad laminates are starting to gain attention.
コンボジット積層板は、基材として２種以上のものが使
用され、表面側にガラス布を、中にガラス不織布，合成
繊維布，紙などが配置される。樹脂は主としてエポキシ
樹脂、また、ポリエステル樹脂なども用いられる。Two or more kinds of materials are used as the base material of the convoygit laminated plate, and a glass cloth is arranged on the surface side, and a glass non-woven fabric, a synthetic fiber cloth, paper, etc. are arranged therein. As the resin, an epoxy resin or a polyester resin is mainly used.
ところで、コンポジット積層板では、その打抜加工性と
耐熱性をより良くするため、中に配置される基材（芯
材）に含浸させる樹脂に充填剤を含ませることが行われ
る。By the way, in the composite laminated board, in order to improve the punching workability and heat resistance thereof, a resin is impregnated into a base material (core material) arranged therein to contain a filler.
このような充填剤としてタルクと水酸化アルミニウムを
併せて用いると良いことが、見出された。しかし、その
後の研究で、これらの使用には工夫が必要であることが
分かった。It has been found that it is preferable to use talc and aluminum hydroxide together as such a filler. However, subsequent studies have found that their use requires ingenuity.
この発明は、上記の問題に鑑みてなされたもので、層間
接着強度が高く、耐アルカリ性，耐熱性，打抜加工性の
良い電気用積層板を提供することを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide an electrical laminate having high interlayer adhesion strength, alkali resistance, heat resistance, and punchability.
発明者の見出したところによれば、タルクの配合比が重
要で、タルクの配合比が高いと、層間接着強度が低くな
る。また、水酸化アルミニウムはギブサイト型を使用す
ると、耐アルカリ性が悪い。According to the finding of the inventor, the blending ratio of talc is important, and when the blending ratio of talc is high, the interlaminar adhesive strength becomes low. Further, if a gibbsite type aluminum hydroxide is used, the alkali resistance is poor.
この発明は、このような知見に基づいてなされたもので
あって、不織布および／または紙に樹脂ワニスが含浸さ
れてなる樹脂含浸芯材の両面に、ガラス布に樹脂ワニス
が含浸されてなる樹脂含浸表層材が貼着され、さらに金
属箔が貼設されてなる電気用積層板において、芯材に用
いられている樹脂ワニスがタルクと水酸化アルミニウム
を併せた充填剤を含有しており、タルクと水酸化アルミ
ニウムの配合比が０．１５〜０．６５：１であり、水酸
化アルミニウムがベーマイト型であることを特徴とする
電気用積層板をその要旨とする。The present invention has been made based on such knowledge, and is a resin obtained by impregnating glass cloth with resin varnish on both sides of a resin-impregnated core material obtained by impregnating nonwoven fabric and / or paper with resin varnish. In an electrical laminate comprising an impregnated surface layer material and a metal foil, the resin varnish used as the core material contains a filler containing talc and aluminum hydroxide. The gist of the present invention is an electrical laminate characterized in that the compounding ratio of aluminum hydroxide and aluminum hydroxide is 0.15 to 0.65: 1, and aluminum hydroxide is a boehmite type.
以下に、この発明を詳しく述べる。The present invention will be described in detail below.
この発明にかかる電気用積層板を作る場合は、たとえば
２種類の基材を用いるが、それぞれに樹脂を含浸する。
第１図にみるように、樹脂含浸芯材１を所定枚重ね合わ
せ、その両外層に樹脂含浸表層材２を配置し、さらに、
必要に応じて、その少なくとも片面に銅箔等の金属箔３
を重ねて積層体とし、これを加熱成形して電気用積層板
を得る。When making the electrical laminate according to the present invention, for example, two types of base materials are used, but each is impregnated with a resin.
As shown in FIG. 1, a predetermined number of resin-impregnated core materials 1 are superposed, a resin-impregnated surface layer material 2 is arranged on both outer layers thereof, and further,
If necessary, metal foil 3 such as copper foil on at least one side
Are laminated to form a laminated body, which is heat-molded to obtain an electric laminated plate.
芯材は、ガラス不織布、合成繊維不織布などの不織布、
および／または、紙が用いられる。これに樹脂固形分１
００重量部に対して充填剤を５０〜１５０重量部含有さ
せた樹脂ワニスを含浸させる。樹脂はエポキシ樹脂が用
いられる。充填剤としては、タルクと水酸化アルミニウ
ムを０．１５〜０．６５：１の割合で配合したものを用
いる。また、水酸化アルミニウムはベーマイト型を用い
る。The core material is non-woven fabric such as glass non-woven fabric, synthetic fiber non-woven fabric,
And / or paper is used. Resin solid content 1
A resin varnish containing 50 to 150 parts by weight of a filler is impregnated with respect to 00 parts by weight. An epoxy resin is used as the resin. As the filler, a mixture of talc and aluminum hydroxide in a ratio of 0.15 to 0.65: 1 is used. Moreover, aluminum hydroxide uses a boehmite type.
樹脂含浸表層材は、ガラス布にエポキシ樹脂などを含浸
させたものなどが用いられる。As the resin-impregnated surface layer material, glass cloth impregnated with epoxy resin or the like is used.
つぎに、実施例および比較例について説明する。Next, examples and comparative examples will be described.
（実施例） 硬化剤含有エポキシ樹脂ワニスの樹脂固形分１００重量
部に対して、タルク２０重量部，ベーマイト型水酸化ア
ルミニウム６０重量部を充填剤として配合し、均一に分
散した。この樹脂ワニスを７５ｇ／m2のガラス不織布に
含浸乾燥させて、７８０ｇ／m2のプリプレグ（以下、プ
リプレグＡという）を得た。また、２００ｇ／m2のガラ
ス布に硬化剤を含むエポキシ樹脂ワニスを含浸乾燥させ
て、４００ｇ／m2のプリプレグ（以下、プリプレグＢと
いう）を得た。つぎに、プリプレグＡを３枚重ね、その
両面にプリプレグＢを１枚ずつ介して厚さ０．０１８mm
の銅箔を載せて積層体を得た。これを金属プレート間に
はさみ、圧力５０kg／cm2，１７０℃で１００分間成形
し、厚さ１．６mmの電気用積層板を得た。(Example) 20 parts by weight of talc and 60 parts by weight of boehmite type aluminum hydroxide were mixed as fillers with respect to 100 parts by weight of the resin solid content of the curing agent-containing epoxy resin varnish, and uniformly dispersed. This resin varnish was impregnated into a glass nonwoven fabric of 75 g / m 2 and dried to obtain a prepreg of 780 g / m 2 (hereinafter referred to as prepreg A). Further, 200 g / m 2 of glass cloth was impregnated with an epoxy resin varnish containing a curing agent and dried to obtain 400 g / m 2 of prepreg (hereinafter referred to as prepreg B). Next, three prepregs A are piled up, and one prepreg B is placed on each side of each prepreg B to have a thickness of 0.018 mm.
A copper foil was placed on the copper foil to obtain a laminate. This was sandwiched between metal plates and molded at 170 ° C. for 100 minutes at a pressure of 50 kg / cm 2 to obtain a 1.6 mm-thick electrical laminate.
比較のために、充填剤としてタルク８０重量部のみを含
有させた樹脂ワニスを使用した以外は実施例と同様の方
法で積層板を得た（比較例１）。また、充填剤の水酸化
アルミニウムとしてギブサイト型のものを使用した以外
は実施例と同様の方法で積層板を得た（比較例２）。For comparison, a laminate was obtained in the same manner as in the example except that a resin varnish containing only 80 parts by weight of talc was used as a filler (Comparative Example 1). Further, a laminated plate was obtained in the same manner as in the example except that a gibbsite type aluminum hydroxide was used as the filler (Comparative example 2).
充填剤としてベーマイト型水酸化アルミニウム７０重量
部およびシリカ３０重量部を含有させた樹脂ワニスを使
用した以外は実施例と同様の方法で積層板を得た（比較
例３）。A laminated board was obtained in the same manner as in the example except that a resin varnish containing 70 parts by weight of boehmite type aluminum hydroxide and 30 parts by weight of silica was used as a filler (Comparative Example 3).
実施例および比較例１〜３の電気用積層板につき、層間
接着強度，引抜抵抗，はんだ耐熱性および耐アルカリ性
を調べた。結果を第１表に示す。ただし、各々の測定方
法は下記のごとくである。With respect to the electrical laminates of Examples and Comparative Examples 1 to 3, the interlayer adhesion strength, pullout resistance, solder heat resistance and alkali resistance were examined. The results are shown in Table 1. However, each measuring method is as follows.
層間接着強度…積層板を縦方向１０mm，横方向１００mm
に切断し、端面を研摩し、プリプレグＡとプリプレグＢ
の層間の一端をナイフで剥離して試験片とし、オートグ
ラフ測定機にかけた。Adhesion strength between layers: 10 mm in the vertical direction and 100 mm in the horizontal direction
Cut into pieces, polish the end faces, and prepreg A and prepreg B
One end between the layers was peeled off with a knife to obtain a test piece, which was placed on an autograph measuring machine.
引抜抵抗…径1.0φのピンをもつ金型プレス間に積層板
をおき、通常の方法でパンチング加工して積層板に穴を
開ける際、ピンが積層板より抜ける時の応力を測定す
る。Pull-out resistance: A laminated plate is placed between mold presses having a pin with a diameter of 1.0φ, and when punching a hole in the laminated plate by a usual method to measure a stress when the pin comes off the laminated plate.
はんだ耐熱性…圧力２kg／cm2の蒸気釜の中に６０分
間、全面エッチングした積層板を入れて、強制吸湿させ
る。その後、積層板を所定の温度になったはんだ上に６
０秒浮かせて、ふくれ等の異常のない温度を測定する。Solder heat resistance: Put the fully-etched laminated plate in a steam pot with a pressure of 2 kg / cm 2 for 60 minutes and forcibly absorb moisture. After that, place the laminated plate on the solder that has reached the specified temperature
Let it float for 0 seconds and measure the temperature without any abnormalities such as blistering.
はんだ耐熱性２８０℃とは、２８０℃のはんだ上に６０
秒浮かせた時に異常がなかったことを示す。Solder heat resistance of 280 ℃ means 60 on solder of 280 ℃.
Indicates that there was no abnormality when lifted for a second.
耐アルカリ性…全面エッチングした積層板を、７０℃の
NaOH４％溶液に１０時間入れる。その後、水洗、乾燥
し、積層板の外観を目視にて検査した。Alkali resistance: Laminated plate with full surface etching at 70 ° C
Place in 4% NaOH solution for 10 hours. Then, it was washed with water and dried, and the appearance of the laminate was visually inspected.
表にみるように、タルクのみを充填剤として用いた比較
例１の積層板は層間接着強度が小さく、ギブサイト型の
水酸化アルミニウムを用いた比較例２の積層板は耐アル
カリ性が悪く、ベーマイト型の水酸化アルミニウムをタ
ルクと併用せず、シリカと併用した比較例３の積層板
は、はんだ処理後の層間接着強度と耐アルカリ性が悪か
った。これに対し、実施例の積層板は層間接着強度が強
く、耐アルカリ性も良い。 As can be seen from the table, the laminate of Comparative Example 1 using only talc as a filler has low interlayer adhesive strength, and the laminate of Comparative Example 2 using gibbsite type aluminum hydroxide has poor alkali resistance and boehmite type. The laminated board of Comparative Example 3 in which the aluminum hydroxide of Example 1 was not used in combination with talc but was used in combination with silica was poor in interlayer adhesion strength and alkali resistance after soldering. On the other hand, the laminates of the examples have high interlayer adhesion strength and good alkali resistance.
この発明にかかる電気用積層板は、上記実施例に限られ
ない。芯材は、ガラス不織布の他、合成繊維不織布，紙
などが用いられる。The electric laminated plate according to the present invention is not limited to the above-mentioned embodiment. As the core material, in addition to glass non-woven fabric, synthetic fiber non-woven fabric, paper and the like are used.
この発明は、以上のように構成されているので、打抜加
工性，耐熱性が良いだけでなく、層間接着強度や耐アル
カリ性も問題のない電気用積層板を得ることができる。Since the present invention is configured as described above, it is possible to obtain an electrical laminate having not only good punching workability and heat resistance, but also no problem in interlayer adhesion strength and alkali resistance.
第１図はこの発明にかかる電気用積層板の一実施例の層
構成を模式的にあらわす説明図である。 １…樹脂含浸芯材 ２…樹脂含浸表層材 ３…金属箔。FIG. 1 is an explanatory view schematically showing the layer structure of an embodiment of an electric laminated plate according to the present invention. 1 ... Resin impregnated core material 2 ... Resin impregnated surface layer material 3 ... Metal foil
Claims (3)
浸されてなる樹脂含浸芯材の両面に、ガラス布に樹脂ワ
ニスが含浸されてなる樹脂含浸表層材が貼着され、さら
に金属箔が貼設されてなる電気用積層板において、芯材
に用いられている樹脂ワニスがタルクと水酸化アルミニ
ウムを併せた充填剤を含有しており、タルクと水酸化ア
ルミニウムの配合比が0.15〜0.65：１であり、水酸化ア
ルミニウムがベーマイト型であることを特徴とする電気
用積層板。1. A resin-impregnated surface layer material obtained by impregnating a glass cloth with a resin varnish is attached to both surfaces of a resin-impregnated core material obtained by impregnating a nonwoven fabric and / or paper with a resin varnish, and further a metal foil is attached. In the electrical laminate to be installed, the resin varnish used for the core material contains a filler that combines talc and aluminum hydroxide, and the mixing ratio of talc and aluminum hydroxide is 0.15 to 0.65: 1. And aluminum hydroxide is a boehmite type.
第１項記載の電気用積層板。2. The electrical laminate according to claim 1, wherein the resin is an epoxy resin.
に対し５０〜１５０重量部である特許請求の範囲第１項
または第２項記載の電気用積層板。3. The electrical laminate according to claim 1 or 2, wherein the content of the filler is 50 to 150 parts by weight based on 100 parts by weight of the resin solid content.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61016216A JPH064310B2 (en) | 1986-01-27 | 1986-01-27 | Electric laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61016216A JPH064310B2 (en) | 1986-01-27 | 1986-01-27 | Electric laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62173245A JPS62173245A (en) | 1987-07-30 |
| JPH064310B2 true JPH064310B2 (en) | 1994-01-19 |
Family
ID=11910328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61016216A Expired - Fee Related JPH064310B2 (en) | 1986-01-27 | 1986-01-27 | Electric laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064310B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5135705B2 (en) * | 2006-04-04 | 2013-02-06 | 三菱瓦斯化学株式会社 | Prepreg, metal foil-clad laminate, printed wiring board |
| JP5263705B2 (en) * | 2007-02-07 | 2013-08-14 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
| JP5776019B2 (en) | 2009-11-20 | 2015-09-09 | パナソニックＩｐマネジメント株式会社 | Prepreg, laminate, metal foil clad laminate, circuit board, and circuit board for LED mounting |
| JP6074883B2 (en) | 2010-10-29 | 2017-02-08 | パナソニックＩｐマネジメント株式会社 | Prepreg, laminate, metal foil clad laminate, circuit board and LED module |
| JP5830718B2 (en) | 2011-05-02 | 2015-12-09 | パナソニックＩｐマネジメント株式会社 | Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board |
| JP5713205B2 (en) * | 2012-04-25 | 2015-05-07 | 三菱瓦斯化学株式会社 | Prepreg, metal foil-clad laminate, printed wiring board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165693A (en) * | 1979-06-13 | 1980-12-24 | Asahi Chemical Ind | Printed circuit board |
| JPS57197892A (en) * | 1981-05-29 | 1982-12-04 | Mitsubishi Gas Chemical Co | Copper-coated laminated plate for bonding chip |
| JPH0245349B2 (en) * | 1983-09-13 | 1990-10-09 | Sumitomo Bakelite Co | INSATSUKAIROYOSEKISOBAN |
-
1986
- 1986-01-27 JP JP61016216A patent/JPH064310B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62173245A (en) | 1987-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |