JPS57197892A - Copper-coated laminated plate for bonding chip - Google Patents

Copper-coated laminated plate for bonding chip

Info

Publication number
JPS57197892A
JPS57197892A JP8234181A JP8234181A JPS57197892A JP S57197892 A JPS57197892 A JP S57197892A JP 8234181 A JP8234181 A JP 8234181A JP 8234181 A JP8234181 A JP 8234181A JP S57197892 A JPS57197892 A JP S57197892A
Authority
JP
Japan
Prior art keywords
copper
laminated plate
bonding chip
coated laminated
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8234181A
Other languages
Japanese (ja)
Other versions
JPH0245348B2 (en
Inventor
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP8234181A priority Critical patent/JPS57197892A/en
Publication of JPS57197892A publication Critical patent/JPS57197892A/en
Publication of JPH0245348B2 publication Critical patent/JPH0245348B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
JP8234181A 1981-05-29 1981-05-29 Copper-coated laminated plate for bonding chip Granted JPS57197892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8234181A JPS57197892A (en) 1981-05-29 1981-05-29 Copper-coated laminated plate for bonding chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8234181A JPS57197892A (en) 1981-05-29 1981-05-29 Copper-coated laminated plate for bonding chip

Publications (2)

Publication Number Publication Date
JPS57197892A true JPS57197892A (en) 1982-12-04
JPH0245348B2 JPH0245348B2 (en) 1990-10-09

Family

ID=13771856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8234181A Granted JPS57197892A (en) 1981-05-29 1981-05-29 Copper-coated laminated plate for bonding chip

Country Status (1)

Country Link
JP (1) JPS57197892A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137391A (en) * 1984-12-10 1986-06-25 三菱瓦斯化学株式会社 Manufacture of molding for printed wiring
JPS62173245A (en) * 1986-01-27 1987-07-30 松下電工株式会社 Electric laminated board
US4894414A (en) * 1987-07-30 1990-01-16 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
US5079294A (en) * 1987-07-30 1992-01-07 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
KR101222097B1 (en) * 2009-12-11 2013-01-14 시벨코 아시아 피티이. 엘티디. Copper clad laminate and impregnating liquids for manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839028A (en) * 1971-09-17 1973-06-08
JPS5036599A (en) * 1973-08-03 1975-04-05
JPS50153098A (en) * 1974-06-03 1975-12-09
JPS51103169A (en) * 1975-03-08 1976-09-11 Toyo Cloth Co
JPS557033A (en) * 1978-06-30 1980-01-18 Kubota Ltd Tailings returning device of thresher
JPS5521204A (en) * 1978-08-01 1980-02-15 Sumitomo Bakelite Co Thermal hardening resin laminated structure and its preparation
JPS5640296A (en) * 1979-09-10 1981-04-16 Hitachi Chemical Co Ltd Producing copperrclad laminate for printed circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839028A (en) * 1971-09-17 1973-06-08
JPS5036599A (en) * 1973-08-03 1975-04-05
JPS50153098A (en) * 1974-06-03 1975-12-09
JPS51103169A (en) * 1975-03-08 1976-09-11 Toyo Cloth Co
JPS557033A (en) * 1978-06-30 1980-01-18 Kubota Ltd Tailings returning device of thresher
JPS5521204A (en) * 1978-08-01 1980-02-15 Sumitomo Bakelite Co Thermal hardening resin laminated structure and its preparation
JPS5640296A (en) * 1979-09-10 1981-04-16 Hitachi Chemical Co Ltd Producing copperrclad laminate for printed circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137391A (en) * 1984-12-10 1986-06-25 三菱瓦斯化学株式会社 Manufacture of molding for printed wiring
JPS62173245A (en) * 1986-01-27 1987-07-30 松下電工株式会社 Electric laminated board
US4894414A (en) * 1987-07-30 1990-01-16 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
US5079294A (en) * 1987-07-30 1992-01-07 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
KR101222097B1 (en) * 2009-12-11 2013-01-14 시벨코 아시아 피티이. 엘티디. Copper clad laminate and impregnating liquids for manufacturing the same

Also Published As

Publication number Publication date
JPH0245348B2 (en) 1990-10-09

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