JPS61137391A - Manufacture of molding for printed wiring - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a molded body for printed wiring, and in particular to a novel flat plate or This product provides a three-dimensional printed wiring molded body, which is suitable for hybrid IC1 wireless equipment, antennas, and the like.

[Conventional methods and their problems]

Conventional methods for producing printed wiring boards include using prepreg, which is obtained by impregnating and drying a reinforcing base material such as glass cloth with an organic solvent solution (varnish) of a thermosetting resin composition; There is a method of using a prepreg made of a reinforcing base material, and a method of using a prepreg made of a reinforcing base material in which thermosetting resin powder is arranged and fixed. In these methods, a prepreg made by applying a resin composition to a cloth or paper-like reinforcing base material is used, and the inclusion of a large amount of powdered inorganic fillers has a negative impact on workability. This makes it extremely difficult to incorporate inorganic fillers at a high content, making it difficult to fully bring out the excellent performance of inorganic fillers.

[Means for solving problems]

The present inventors have significantly improved the workability of the conventional method as described above, and have improved heat resistance, dielectric properties, and heat dissipation by containing an extremely large amount of inorganic filler compared to conventional printed wiring boards. As a result of intensive research into a method for manufacturing metal foil clad sheets with high thermal conductivity and excellent workability, we found that a "sticky" molding composition consisting of a thermosetting resin composition and an inorganic filler was used. We found a method using the sheet obtained by Furthermore, they discovered that a three-dimensional molded body can be easily produced by using the sheet, and completed the present invention.

That is, in the present invention, A, the cured resin has a dielectric constant of 4.0 (
at IMH! , 25°C) or lower, and the melting point of the uncured resin is 80°C or lower 35-1
0 parts by weight, B, dielectric constant 5.0 (at IMH2, 25°
C) A composition containing the following inorganic powder and a C1 curing accelerator as essential components is kneaded to produce a paste-like molding composition, and then a paste-like molding composition is produced. After preforming into a sheet, if necessary, the outside of the sheet of the glue-like composition is glass cloth or quartz cloth, and the glass cloth or quartz cloth is impregnated with a thermosetting resin composition and semi-cured. , or a method for producing a printed wiring molded body in the form of a flat plate or three-dimensional shape, which is characterized by molding by heating and pressurizing a layered metal foil, and the thermosetting resin composition A includes: Preferably, it is selected from the group consisting of epoxy resins, diallyl phthalate resins, polybutadiene resins, polybismaleimide resins, unsaturated polyester resins, polyisocyanate resins, and mixtures of one or more of these. The three-dimensional molded product is preferably a sheet of the cough paste composition, or if necessary, a sheet of the cough paste composition overlaid with at least one layer of glass cloth or quartz cloth, or a cough paste. A three-dimensional molded body is formed by using a sheet of a resinous composition, a small amount of prepreg made by impregnating a glass cloth or a quartz cloth with a thermosetting resin composition, and semi-curing it (in both cases, one layered sheet) and a metal foil. Cut out parts or whole pieces of the shape of the developed diagram, place them in a Q! mold for three-dimensional molding, pre-form, then attach them to the mold for three-dimensional molding, and mold by heating and pressurizing. It is.

Furthermore, a thermosetting resin composition may be applied to a sheet of the cough paste-like molding composition, or a glass cloth or quartz cloth, or a glass cloth or quartz cloth, if necessary, on the outside of the sheet of the paste-like composition. At least one layer of impregnated and semi-cured prepreg is used, heated and pressurized to form Gold R! It is characterized by producing a molded body to which the A foil is not bonded, and forming a conductive layer on the molded body by adhering a metal foil with an adhesive, electroless plating, applying a conductive paint, sputtering, or vapor deposition of a metal. This is a method for producing a molded body for printed wiring.

The present invention will be explained below.

In the component A of the present invention, the cured resin has an LAt ratio of 4.0 (IM
H2, 25℃) or less, and the melting point of the uncured resin is 80
, ℃ or less. Thermosetting resin compositions that satisfy such physical properties usually include
It is selected from the group consisting of epoxy resins, diallyl phthalate resins, polybutadiene resins, polybismaleimide resins, unsaturated polyester resins, polyisocyanate resins, and mixtures of one or more of these.

To explain these more specifically, epoxy resins include bisphenol A epoxy resins with an epoxy equivalent of 500 or less, bisphenol F epoxy resins, halogenated bisphenol A epoxy resins; phenols with an average epoxy equivalent of 225 or less. Novolac type epoxy resin, cresol novola 7 type epoxy resin, halogenated phenol novolac type epoxy resin; melting point is 80℃
The following ring group epoxy resins, hydrogenated bisphenol A diglycidyl ether, triglycidyl isocyanurate,
Triglycidyl ethers of tetraglycidyl-4,4'-diaminodiphenylmethane and tris(hydroxyphenyl)methane are mentioned, and in addition to these, modified epoxy resins include isocyanurate produced from two components of polyfunctional isocyanate and epoxy resin. Examples include oxazolidone resin, resin manufactured from polyfunctional maleimide and epoxy resin, resin manufactured from 1,2-polybutadiene and its modified resin, and epoxy resin. When using these epoxy resins, curing accelerators include amines such as diethylenetriamine and diaminodiphenylmethane; acid anhydrides such as hexahydrophthalic anhydride and methylhexahydrophthalic anhydride; 2-ethylimidazole, etc. Examples include known imidazoles.

Examples of diallyl phthalate resins include diallyl orthophthalate and diallyl isophthalate prepolymer/monomer mixtures, and examples of curing accelerators include benzoyl peroxide, lauroyl peroxide, caprylic peroxide, acetyl peroxide, and parachlorobenzoyl. Known organic peroxides such as peroxide, di-tert-butyl-diberphthalate, and 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyne-3 can be mentioned.

As a polybutadiene resin, the number average molecular weight is s, oo
There are the following 1.2-polybutadiene and 1.4-polybutadiene, and the modified products include boiling modification, urethane modification, maleation, terminal acrylic modification, hydrogenated product,
Examples include epoxy-modified curing accelerators and terminal half-ester-modified curing accelerators, and known organic peroxides are suitable as curing accelerators.

As polybismaleimide resin, Japanese Patent Publication No. 48-827
A composition in which the molar ratio of a maleimide compound and a jepoxy compound is 1:0.2 to 0.5 as described in Japanese Patent Application Laid-open No. 101200/1982, The equivalent ratio of the maleimide compound and the flukenylphenol or alkenylphenol ether is 1:
0.2 to 1.5, a maleimide compound as described in JP-A-55-126451 and 1.2
- A composition with polybutadiene is mentioned, and as the curing accelerator, the above-mentioned amines and f-organic peroxides are suitable.

As the unsaturated polyester resin, a mixture of a known polycondensate of a polybasic acid and a polyhydric alcohol, a polymerizable monomer, and a nil monomer can be used, and a known organic peroxide is suitable as the curing accelerator.

Furthermore, as a polyisocyanate resin, JP-A-55-
Known compositions such as a composition comprising an epoxy resin, a polyfunctional isocyanate compound, and a heterocycle-forming catalyst as described in Japanese Patent No. 75418 may be mentioned.

The thermosetting resin composition of the present invention preferably contains the above-mentioned components, but in addition to these, for the purpose of improving the viscosity behavior, adhesiveness, curability, flexibility, etc. of the composition, Thermosetting resins such as phenolic resins, acrylic resins, and urethane resins; Liquid to elasti such as butadiene-acrylonitrile copolymers, polychloroprene, butadiene-styrene copolymers, polyisoprene, butyl rubber, natural rubber, etc.
resins such as rubbers and their low molecular weight products with a molecular weight of several thousand or less; thermoplastic polyurethane resins, vinyl acetate resins, and other thermoplastic resins having reactive groups and their low molecular weight products with a molecular weight of several thousand or less; Low molecular weight oligomers with a molecular weight of several thousand or less of engineering plastics such as polycarbonate, thermoplastic polyester, polyester carbonate, polyarylate, and polyphenylene ether; Polyolefins with a molecular weight of several thousand or less such as polyethylene, polypropylene, and 4-methylpentene-1 Low molecular weight oligomer; low molecular weight oligomers having a molecular weight of several thousand or less of fluororesin such as polytetrafluoroethylene, polytetrafluoroethylene-propylene L':/copolymer, perfluoroethylene propylene copolymer can be added. I can do it.

B used in the present invention, dielectric constant 5.0 (1MHz, 25°C
) The following inorganic powders are preferably fused silica,
Silica powder such as crystalline silica and synthetic silica, boron nitride powder, boron silicate powder, and Sin!
It is one or a mixture of two or more selected from alkali-free glass with a component of 98% or more, and the particle size of the powder is 5.
It is 0 mesh or less, preferably 150 mesh or less. These inorganic fillers can be used as is or
Silankahubli.

In addition, the amount of inorganic filler used is 65 to 90% by weight of the total composition, and if it is less than 65% by weight, dielectric properties and other The desired properties are insufficiently imparted, and it becomes difficult to form the paste into a sheet after forming it into a dough. On the other hand, if it exceeds 90% by weight, it becomes difficult to form into a dough.

In addition, it is also preferable to improve the processability, flexibility, etc. of the molded product by replacing a part of the above inorganic filler with an existing organic filler, and such a method can be used. Examples of fillers include powders of engineering plastics such as polycarbonate, thermoplastic polyester, polyester carbonate, polyarylate, and polyphenylene ether; powders of polyolefins such as polyethylene, polypropylene, and poly-4-methyl-1-pentene; Examples include powders of fluorine resins such as tetrafluoroethylene, polytetrafluoroethylene-propylene copolymer, and perfluoroethylene propylene copolymer, and the preferred particle size is 50 mesh or less, preferably 1.
50 mesh or less.

The curing accelerator C of the present invention is a known curing catalyst or curing agent as exemplified in the explanation of the various thermosetting resin compositions described above, and is a curing accelerator that includes amines, imidazoles, polybasic acid anhydrides, etc. Examples include metal salts, inorganic metal salts, and organic peroxides.

The amount used is sufficient within a general range, for example, in the case of a catalyst, it is 5 wt% based on the total resin composition.
In particular, it is used in an amount of 1 wt% or less, and in the case of a curing agent, it is used in an amount of 40-t% or less, especially 30 wt%, based on the total resin composition.
It is used in an amount of t% or less.

The above components are mixed by mixing the thermosetting resin composition and the inorganic filler at a temperature of 20 to 130°C using a roll, Banbury mixer, Henschel mixer, extruder, or other known kneading machine. The components may be added at the same time or during crosstalk. In addition, when using physical or solid low molecules, it is possible to increase the molecular weight by heating or kneading under heating to pre-react the resin components of the thermosetting resin composition. A molding composition in the form of a paste according to the invention.

The optimum kneading time is appropriately selected depending on the type of thermosetting resin composition used, the molecular weight, the compositional component ratio, the kneading equipment used, and the like.

Generally, in the case of an extruder, kneading may be carried out for a short time, but in other cases, kneading is completed within a range of 0.5 to 10 hours, when a paste-like composition is obtained. The viscosity of the cough paste-like molding composition is at a temperature of 80°C or less, preferably from O to
60'C1 Particularly within the range where a sheet-like molded product that has self-retention properties at room temperature (= temperature range of about 10 to 35 ° C) and is easy to handle such as cutting, wrapping, and pasting can be obtained. When a metal rod with a diameter of 6flφ is pressed with a load of 150g onto a 10fl thick sheet of molding material in the form of a mold, the viscosity is 0.000000000000 by measuring the time it takes for the metal rod to enter the sheet by 500°. A range of 5 to 300 seconds, preferably 1 to 150 seconds, especially 1 to 30 seconds is suitable.

When using an extruder, the paste-like composition can be processed into a sheet by extruding it as it is with a T-die, etc. When using rolls for kneading, it can be processed into a sheet as it is from the roll. Depending on the method of taking it out as a thick sheet, in the case of other kneading methods,
By forming a cough paste-like composition into a sheet shape using a roll, press, or other means. When taking out the sheet from the roll, if the viscosity of the sticky molding composition of the present invention is low, it may be difficult to peel the sheet from the roll. For example, by cooling the roll (for example, by adjusting the viscosity to about 100 seconds using the method described above), it is possible to easily take out the roll as a sheet.

In manufacturing the sheet of the present invention, reinforcing base materials such as woven or non-woven fabrics are usually inserted into a sheet-forming roll in a number of sheets or less, especially about one sheet, and integrated, or the reinforcing base materials are overlapped during molding. If desired, it is also possible to form a base material composite sheet by molding and integrating the composite materials. The reinforcing base materials include cloth-like reinforcing materials of various shapes such as roving, nitrogen strand mantle, continuous mantle, cloth, roving cloth, surfacing mat, and nitrogen strand mantle, as well as quartz fiber, glass fiber, and carbon. Fibers, wholly aromatic polyamide fibers, blends thereof, etc. can be used, and glass fiber woven fabrics and quartz fiber woven fabrics are particularly suitable.

Furthermore, instead of the above-mentioned reinforcing base material such as woven fabric or non-woven fabric, a semi-cured prepreg obtained by impregnating the reinforcing base material with a thermosetting resin composition and drying it can also be used in layers during molding. The thermosetting resin composition to be impregnated into the reinforcing base material is preferably the same as the thermosetting resin composition used for producing the sticky composition from the viewpoint of adhesion and other aspects. , other thermosetting resin compositions with better physical properties of the cured resin - for example, cyanate ester-based resin compositions -
By using a material impregnated with the inorganic filler, it is possible to obtain a molded product having surface characteristics similar to or better than that of a molded product made solely of the sheet of the present invention mixed with an inorganic filler. The amount of resin impregnated in such prepreg is 1 to 70% by weight for woven fabrics, and 10 to 70% by weight for nonwoven fabrics.
85% by weight is preferred.

If desired, one or both sides of the sheet of the present invention obtained by the above method is coated with a surface treated with a thickness of 5 to 200 t- of copper, iron, nickel, aluminum, stainless steel, or other known surface treatment for improving adhesion. gold or untreated gold [
Preferably, the foil is placed and formed by a known lamination forming method, such as a hot roll forming machine, a hydraulic press, a continuous press that forms by sandwiching between belts, an autoclave type forming machine, a vacuum bank forming machine, etc. Pressure 3-100 kg
/cd, heated and pressurized at a temperature of 160 to 240°C to form the metal foil-clad printed wiring molded body of the present invention. Here, the molding time is selected in the range of 30 seconds to 30 hours, and 3
In the case of a relatively short time in the range of 0 seconds to 100 minutes or in the case of using a low temperature, it is preferable to post-cure in an oven after taking out from the molding machine to obtain a sufficiently cured wiring board.

Furthermore, in the case of a three-dimensional molded object, the sheets and metal foil of the present invention may be cut out into pieces in the shape of a developed view of the three-dimensional molded object or the entire shape, and the molded object may be molded by being mounted or placed in a mold as it is. The method of preforming and main forming is preferable from the viewpoint of productivity and prevention of defects, and in this case, the sheet of the present invention and the metal foil that is unprocessed or drawn according to the desired shape of the molded product are combined. are cut out into parts or whole pieces in the shape of the developed figure of the three-dimensional molded object, and these are cut out into three-dimensional molding preforming molds (for example, made of wood, plastic, or other materials, and metal foil is molded into the desired shape by vacuum or other means). (which can be attached to the parts) and placed at room temperature or under heating at 70°C or less at a pressure of 10 to 100 kg/
- After obtaining a preformed body to which a metal foil is temporarily bonded, it is preferable to perform main molding and further post-curing if desired.

Furthermore, in the above method, a molded body is manufactured without using gold rIk foil, and a conductive layer is bonded to a desired portion of the molded body using a metal foil adhesive, electroless plating, application of a conductive paint,
Naturally, it can also be formed by a known method such as sputtering or metal vapor deposition. The metal used in this method is preferably copper, silver, nickel, tin, gold or an alloy thereof.

Here, adhesives include resins similar to component A of the present invention with addition of a curing accelerator component C, modified materials such as thermoplastic resins such as polyethylene, diene rubbers, etc., and other adhesives. Examples include known adhesive compositions for laminates.

Electroless plating involves mechanically or chemically treating the surface of the molded object, then attaching a plating catalyst, and electroless plating; or applying a plateable paint to the surface of the molded object, and then electroless plating. According to the method.

Furthermore, the conductive paint or ink may be a known conductive paint or ink containing metal powders such as silver, gold, copper, or nickel and a binder resin as essential components.

Incidentally, the sheet of the present invention can naturally be used after being stored as it is at room temperature.

Normally, by taking advantage of the fact that the curing reaction of the resin component proceeds gradually even at room temperature due to the catalyst component used to shorten the molding time, it is possible to store and use it until the viscosity reaches a suitable range at the usage temperature. In addition, for long-term storage, etc.
Cooling and storage is a preferred method since there is virtually no change in viscosity.

〔Example〕

Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, parts in Examples and Comparative Examples are parts by weight unless otherwise specified.

In addition, the viscosity in the examples shows that at a predetermined temperature, a 10 fl thick sheet of glue-like molding material is coated with a diameter of 6 fl.
When a metal rod of φ is pressed with a load of 150g, the time it takes for the metal rod to enter the sheet by 500Ina (sec)
This is due to the method of measuring.

Example-1 Bisphenol A type epoxy resin (manufactured by Shell Chemical ■, trade name: Epicote 828, epoxy equivalent: 185~
192), 400 g of fused silica powder, 7 g of diaminodiphenylmethane, and 0.1 g of benzyldimethylamine were kneaded at 30°C for 30 minutes to obtain a sticky composition (viscosity: 1.0 seconds, 25°C).

This composition is passed between a pair of rolls cooled to 10°C,
A sheet with a thickness of 0.85 tm was formed and returned to room temperature.

Electrolytic copper foil with a thickness of 35 mm is placed on both sides of this sheet, and
After passing between a pair of rolls heated to ℃, it was pressed at 5 kHz/ci for 20 minutes at 170 ℃, then taken out from the press, placed horizontally in a constant temperature bath at 170 ℃ purged with nitrogen, and kept for 1 hour. After curing, a copper clad board with a thickness of 0.8 cm was produced.

The properties of this copper clad board are shown in Table 1.

Example-2 After uniformly mixing 75 g of diallyl phthalate prepolymer and 25 g of diallyl phthalate monomer at 80°C,
Cool, then add 350 g of crystalline silica powder and 2 g of t-butyl peroxybenzoate, and heat at 40°C.
Knead for minutes to form a paste-like composition (viscosity 1.8 seconds, 25
°C) was obtained.

A sheet and then a copper clad board were manufactured in the same manner as in Example 1 except that this composition was used.

The properties of this copper clad board are shown in Table 1.

Example-3 80 g of 1,2-polybutadiene homopolymer with a number average molecular weight f#3,000 and a number average molecular weight f#1.2 of 1,000
- 15% maleic anhydride to polyptadiene homopolymer
20 g of maleated 1,2-polybutadiene (trade name: BN-1015, manufactured by Nippon Shodatsu) added with 250 g of boron silicate, 50 g of low-density polyethylene powder with an average particle size of 25 mm, and 33 g of 2,5-dimethyl-'l,5-di(butylperoxy)hexyne was added and kneaded at 40°C for 50 minutes to form a paste-like composition (viscosity 1.2 seconds, 25°C ) was obtained.

This is passed between rolls cooled to 15°C to a thickness of 0.
A sheet of 85 ta was taken out.

Electrolytic iron foil with a thickness of 35 mm is placed on both sides of this sheet, and
Pressing was carried out at a pressure of 10 kg/- for 1 hour at a temperature of 0° C. to produce a steel clad board with a thickness of 0.8 fi.

The properties of this iron clad plate are shown in Table 1.

Example-4 30 g of bis(4-maleimidophenyl)propane and bisphenol A type epoxy resin (manufactured by Shell Chemical Co., Ltd., trade name: Epicote 828, epoxy equivalent 185-19
2) Mixed with 70g at 120°C for 30 minutes, cooled to room temperature, added 400g of boron silicate powder, 5g of dichlorodiaminodiphenylmethane and 0.5g of dicumyl peroxide, kneaded at 50°C for 1 hour, and A liquid composition (viscosity: 4 seconds, 25°C) was obtained.

This composition was passed between a pair of rolls at 30°C to a thickness of 1.
050 sheet was molded.

Electrolytic copper foil with a thickness of 35 g is placed on both sides of this sheet,
Pressing was carried out at 200°C for 2 hours at 20ksr/- to produce an Ii4 clad board with a thickness of 1.0fi.

The properties of this copper clad board are shown in Table 1.

Example-5 30 g of bis(4-maleimidophenyl)propane 1 bisphenol A type epoxy resin (manufactured by Shell Chemical ■, trade name: Epicote 828 Epoxy equivalent weight 185-19
2) 30g and bisphenol A type epoxy resin (manufactured by Shell Chemical Co., Ltd., trade name: Epicote 104)'1
, epoxy equivalent: 450 to 500) and 50 g of diphenylmethane diisocyanate (manufactured by Mitsui Toatsu Chemical Co., Ltd., trade name, MDI-CR) were uniformly mixed.

430 g of crystalline silica powder and 0.5 g of 2-dithyl-4-methylimidazole were added to this mixture, and the mixture was heated to 60°C.
Knead for 2 hours to form a paste-like composition (viscosity 20 seconds, 2
5°C) was obtained.

This composition was passed between a pair of rolls at 50°C to a thickness of 1.
A 35 fi sheet was molded.

Electrolytic copper foil with a thickness of 18I3 is placed on both sides of this sheet, and 1
After pressurizing at 35 kg/- for 2 hours at 70°C, it was placed horizontally in a constant temperature bath at 200°C purged with nitrogen, and cured after 4 hours to obtain a copper-clad board with a thickness of 1.3 fl.

The properties of this copper clad board are shown in Table 1.

Example 6 Diallyl phthalate was added as a polymerizable monomer to an unsaturated polyester resin synthesized by a conventional method using maleic acid, isophthalic acid, and ethylene glycol as raw materials in a molar ratio of 82:18:100. 3% by weight
They were added and mixed so that

For 100g of this mixture, 500g of fused silica powder
and 2.0 g of dicumyl peroxide were added thereto and kneaded for 2 hours at 25°C using a niegu to obtain a paste-like composition (viscosity: 2 seconds, 25°C).

This composition was extruded through a T-die at a temperature of 50°C to a thickness of 1.
A sheet of 0.05 tm was molded.

An adhesive consisting of 70 parts by weight of epoxy resin, 30 parts by weight of acrylonitrile-butadiene rubber with a terminal carboxyl group, and a catalyst was applied to both sides of this sheet to a thickness of 20 parts by weight.
U-coated electrolytic copper foil of 35-thickness is arranged, 170-
Press at 10 kg/c+J for 30 minutes at ℃ to a thickness of 1. A copper clad board of On was manufactured.

The properties of this copper clad board are shown in Table 1.

Table 1 Example-7 After layering one sheet of plain-woven glass fabric with a thickness of 0.05 on both sides of the molding sheet produced in the same manner as in Example-1, a layer of plain-woven glass fabric with a thickness of 35-35 was placed on the outside. A copper clad board was produced in the same manner except that the electrolytic copper foils were stacked.

The bending strength of this product was 20 kg/J, which was significantly improved compared to 14 kg/J of Example-1, and there was no difference in dielectric properties.

Example 8 A sheet for molding produced in the same manner as in Example 1 was coated with bisphenol A type epoxy resin (manufactured by Shell Chemical ■, trade name;
Epikote 82B) 100 g of diaminodiphenylmethane, 7 g of benzyldimethylamine, and 0.1 g of benzyldimethylamine impregnated with a methyl ethyl ketone solution and dried at 130°C for 6 minutes. After stacking one sheet at a time, a prepreg with a resin fi of 30 tf% is layered one by one. An m-clad board was manufactured in the same manner except that the electrolytic copper foil of 35 haze was layered.

The bending strength of this material is 21 kg/J, the dielectric constant is 4.1 (IMHz), 4.0 (IGHz), and the dielectric loss tangent is 0.0115 (IMHz), 0.0255 (IGHz).
)Met.

Example 9 Male and female molds for molded articles having a regular square truncated pyramid shape with a base side of 20 am, a top side of 12 cm, and a height of 10 cs and a wall pressure of 0.8 m were prepared. A copper foil with a surface treatment for adhesion having a thickness of 7 of
The molding sheet obtained in the same manner as in 3 was heated to 40°C to increase flexibility, then pasted, the mold was closed, and the pressure was 20°C.
After press molding at 170° C. for 1 hour, the mold was taken out and cooled to room temperature to obtain a molded product in which RFf was firmly adhered to the entire front and back surfaces of the slope portion of the square pyramid.

The properties of this molded product are shown in Table 1.

Note that this molded product is used by selectively removing the copper foil by a known method to form a desired printed wiring body.

Example-10 The same mold as in Example-9 was prepared, the molding sheet obtained in the same manner as in Example-3 was heated to 40°C to increase flexibility, and then pasted, the mold was closed, A three-dimensional molded body was obtained by molding under the same conditions as in Example-9.

After temporarily adhering copper foil with an adhesive similar to that in Example 6 to this molded body using a hot iron, it was again placed in the above mold.
After press-molding at a temperature of 170° C. and a pressure of 5 kg/cd for 30 minutes, it was taken out from the mold and cooled to room temperature to obtain a hemispherical molded body to which the iq foil was firmly adhered.

[Operation and effects of the invention]

According to the method for manufacturing a wiring board of the present invention as described above, a wiring board containing an extremely high content of inorganic filler compared to the conventional method can be obtained, and has excellent dielectric properties, It can be manufactured by a simple manufacturing process that effectively imparts the characteristics of other inorganic fillers, and provides an extremely practical industrial manufacturing method.Furthermore, the printing of the present invention using this manufacturing method Utilizing these characteristics, molded products for wiring can be used as a material suitable for conventional applications such as S-shaped, hybrid ICs, wireless devices, antennas, and other fields where it is difficult or unsatisfactory to use them. Accordingly, it is possible to provide a printed wiring board.

Claims (1)

[Claims] 1. A. The cured resin has a dielectric constant of 4.0 (at 1 MHz, 2
35 to 10 parts by weight of a thermosetting resin composition in which the melting point of the uncured resin is 80°C or lower, B, an inorganic powder with a dielectric constant of 5.0 (at 1MHz, 25°C) or lower ,
and C, a composition containing a curing accelerator as an essential component is kneaded to produce a paste-like molding composition, and then the paste-like molding composition is preformed into a sheet, and then Depending on the situation, a glass cloth or quartz cloth, a prepreg made by impregnating a glass cloth or quartz cloth with a thermosetting resin composition and semi-curing it, or a metal foil layered on the outside of the sheet of the glue-like composition. 1. A method for manufacturing a printed wiring molded body, which is a flat plate or three-dimensional shape, characterized by molding by heating and pressurizing. 2. Thermosetting resin composition A is selected from the group consisting of epoxy resin, diallyl phthalate resin, polybutadiene resin, polybismaleimide resin, unsaturated polyester resin, polyisocyanate resin, and one or a mixture of two or more thereof. Claim 1 which is
Manufacturing method described in section. 3. A sheet of the paste-like composition, or if necessary, a sheet of the paste-like composition overlaid with at least one layer of glass cloth or quartz cloth, or a sheet of the paste-like composition. At least one prepreg made by impregnating glass cloth or quartz cloth with a thermosetting resin composition and semi-curing is used, and metal foil is used. The three-dimensional printing according to claim 1, which is obtained by cutting out shaped pieces, placing them in a preforming mold for three-dimensional molding, preforming them, and then mounting them in the mold for three-dimensional molding and applying heat and pressure. A method for producing a molded body for wiring. 4. A. The cured resin has a dielectric constant of 4.0 (at 1 MHz, 2
35 to 10 parts by weight of a thermosetting resin composition in which the melting point of the uncured resin is 80°C or lower, B, an inorganic powder with a dielectric constant of 5.0 (at 1MHz, 25°C) or lower ,
and C, a composition containing a curing accelerator as an essential component is kneaded to produce a paste-like molding composition, and then the paste-like molding composition is preformed into a sheet, and then Depending on the situation, on the outside of the sheet of the glue-like composition, at least one layer of glass cloth, quartz cloth, or glass cloth or quartz cloth impregnated with a thermosetting resin composition and semi-cured is layered. A conductive layer is bonded to the molded body using a metal foil adhesive, electroless plating, application of conductive paint, sputtering, or metal vapor deposition. A method for producing a molded body for printed wiring, characterized in that the molded body is formed by: