JPS61228938A - Manufacture of molded body for printed wiring - Google Patents

Abstract

PURPOSE:To obtain a molded body for printed wiring, which contains a large quantity of inorganic filler and has excellent dielectric characteristics and heat dissipating property, by a structure wherein paste-like molding composition consisting of thermosetting resin composition and the inorganic filler is employed. CONSTITUTION:Firstly, paste-like molding composition is obtained by kneading a composition consistingof 40-10pts.wt. of ester cyanate resin composition, 60-90pts.wt. of inorganic filler and curing catalyst. Secondly, a molded body is manufactured by heating and pressurizing the sheet-like performed molding composition. Finally, a conductor layer is formed by bonding a metal foil with bonding agent, plating, deposition of metal, spraying of metal, or coating or printing of conductive paint or ink. The essential ingredient of the cyanate ester resin composition is polyfunction is polyfunctional cyanate ester represented by the general formula (1), its prepolymer or the like, in which (m) is an integer from 2 through normally 5, R represents an organic group of aromatic series as cyanate groups bond with the aromatic ring of the organic group.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a molded body for printed wiring, which has high heat resistance and excellent dielectric properties, and also has excellent thermal conductivity, processability, etc. This is an excellent new method for producing a flat or three-dimensional printed wiring molded body.

[Conventional methods and their problems]

Conventional methods for producing printed wiring boards include using prepreg, which is obtained by impregnating and drying a reinforcing base material such as glass cloth with an organic solvent solution (varnish) of a thermosetting resin composition; There is a method of using a prepreg made of a reinforcing base material, and a method of using a prepreg made of a reinforcing base material in which thermosetting resin powder is arranged and fixed. In these methods, a prepreg made by applying a resin composition to a cloth or paper-like reinforcing base material is used, and the inclusion of a large amount of powdered inorganic fillers has a negative impact on workability. This makes it extremely difficult to substantially increase the content of the inorganic filler, and it has been difficult to fully bring out the excellent performance of the inorganic filler.

[Means for solving problems]

The present inventors have significantly improved the workability of the conventional method as described above, and have improved heat resistance, dielectric properties, and heat dissipation by containing an extremely large amount of inorganic filler compared to conventional printed wiring boards. (high thermal conductivity), and as a result of intensive research into methods for manufacturing molded bodies for printed wiring with excellent workability,
We have discovered a method using a sheet obtained using a "sticky" molding composition consisting of a thermosetting resin composition and an inorganic filler. Furthermore, they discovered that a three-dimensional molded body can be easily manufactured by using the sheet, and completed the present invention.

That is, the present invention comprises as essential components a cyanate ester resin composition (A) having a number average molecular weight of 2.500 or less, 40 to 10 parts by weight, an inorganic filler (B) 60 to 90 parts by weight, and a curing catalyst (C). The composition is kneaded to form a paste-like molding composition, the composition is preformed into a sheet, and the preformed sheet or the preformed sheet is laminated with at least one reinforcing base cloth. heating and using it as a molding material.
A flat or three-dimensional molded body is produced by molding under pressure, and then a conductive layer is applied to the molded body by adhesion of metal foil with an adhesive, plating, metal vapor deposition, metal spraying, or conductive paint or This is a method for producing a molded body for printed wiring, characterized in that it is formed by applying ink or by printing.

The present invention will be explained below.

The cyanate ester resin composition (A) of the present invention consists of a polyfunctional cyanate ester represented by the following general formula (1), its prepolymer, etc. as essential components, and contains cyanato resin (Japanese Patent Publication No. 41-1928 No. 45-11712,
44-1222, German Patent No. 1190184, etc.), cyanate ester-maleimide resin, cyanate ester-maleimide-epoxy resin (Japanese Patent Publication No. 54-304
No. 40, etc., Special Publication No. 52-31279, USP-411
0364, etc.), cyanate ester-epoxy resin (Japanese Patent Publication No. 46-41112), and the like.

Here, suitable polyfunctional cyanate esters are expressed by the following general formula (1) % formula % (1) (- in the formula is an integer of 2 or more and usually 5 or less, and R is an aromatic organic group, in which the cyanato group is bonded to the aromatic ring of the organic group. To give a concrete example, 1゜3-
or 1.4-dicyanatobenzene, L3+5-tricyanatobenzene, 1.3-. 1.4-. 1.6-. 1.8
−． 2.6- or 2°7-dicyanatonaphthalene, 1.
3.6-1-lycyanatonaphthalene, 4.4”-dicyanatobiphenyl, bis(4-cyanatophenyl)methane, 2.2-bis(4-cyanatophenyl)propane, 2
．． 2-bis(3,5-dichloro-4-cyanatophenyl)propane, 2,2-bis(3,5-dibromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)ether, bis( 4-cyanatophenyl) thioether, bis(4-cyanatophenyl) sulfone, tris(4-cyanatophenyl) phosphite, tris(4-
cyanatophenyl) phosphate, and a cyanate ester (υ5P-402
6913), cyanic acid esters obtained by the reaction of novolacs with cyanogen halides (USP-4022
755, USP-344807). In addition to these, Special Publications No. 41-1928, No. 43-18468,
44-4791, 45-11712, 46-4
1112, 47-26853, JP-A-51-6314
9, USP-3553244, 3755402, 374
034B, 3595900.3694410 and 41
Cyanic acid esters described in 16946 and the like can also be used.

In addition, a prepolymer obtained by polymerizing the above-mentioned polyfunctional cyanate ester in the presence or absence of a mineral acid, a Lewis acid, a salt such as sodium carbonate or lithium chloride, a phosphate ester such as tributylphosphine, etc. used as. These prepolymers generally have a sym-triazine ring in the molecule, which is formed by trimerization of the cyanide group in the cyanate ester.

Furthermore, the polyfunctional cyanate esters described above can also be used in the form of prepolymers with amines. Examples of amines that can be suitably used include meta- or para-phenylenediamine;
meta- or para-xylylene diamine, 1,4- or 1
．． 3-Cyclohexanediamine, hexahydroxylylenediamine, 4,4'-diaminobiphenyl, bis(4
-aminophenyl)methane, bis(4-aminophenyl)ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane, bis(
4-amino-3,5-dimethylphenyl)methane, bis(4-aminophenyl)cyclohexane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-
Amino-3-methylphenyl)propane, 2,2-bis(4-amino-3-chlorophenyl)propane, bis(
4-amino-3-chlorophenyl)methane, 2.2-bis(4-amino-3,5-dibromophenyl)propane, bis(4-aminophenyl)phenylmethane, 3.4
-diaminophenyl-4-aminophenylmethane, 1.
1-bis(4-aminophenyl)-1-phenylethane and the like.

The above-mentioned polyfunctional cyanate esters, prepolymers thereof, and prepolymers with amines can be used alone or in the form of mixtures, and the number average molecular weight of the individual and mixtures is preferably 1.500 or less, especially 300 to 1,000. A range of is preferred.

Cyanate ester-maleimide resin (Special Publication No. 54-30
440, etc.), cyanate ester-maleimide-epoxy resin (Japanese Patent Publication No. 52-31279, etc.) and cyanate ester-epoxy resin (Japanese Patent Publication No. 46-41112)
Maleimide, which is a component of the cyanate ester resin composition represented by the following, is a compound represented by the following general formula (2), or a prepolymer thereof.

(In the formula, R1 is an aromatic or alicyclic organic group having a valence of 2 or more and usually a valence of 5 or less, Xt and Xg are hydrogen, halogen, or an alkyl group, and n is usually an integer of 2 to 5. ) Maleimides represented by the above formula are produced by a method known per se in which maleic anhydride and polyamines containing 2 to 5 amino groups are reacted to prepare maleamic acid, and then maleamic acid is cyclized by dehydration. can do. The polyamines used are preferably aromatic polyamines in terms of the heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. good. Further, it is desirable that the polyamines be primary amines from the viewpoint of reactivity, but secondary amines can also be used. Suitable amines include those exemplified as those used as prepolymers with cyanate esters, and melamines having an s-) lyazine ring;
These are polyamines made by reacting aniline with formalin and linking benzene rings with methylene bonds.

Epoxy resins can be any resins that have been conventionally used for laminates or electronic materials, and specifically include bisphenol A epoxy resin, bisphenol F epoxy resin, and phenol. Novolac type epoxy resin, Talesol novolac type epoxy resin, halogenated bisphenol A type epoxy resin, halogenated phenol novolac type epoxy resin, polyglycol type epoxy resin, alicyclic epoxy resin, etc., and these alone or two or more types used as a mixture of

The above cyanate ester resin composition preferably has a number average molecular weight 1i of 2.500 or less, particularly 400 to 1,500, which improves the moldability and physical properties of a molded article using the paste-like molding composition of the present invention. From the viewpoint of retention, the amount of cyanate ester compound used should be 40 wt in the total resin components.
%t% or more, and when a maleimide component is included, the cyanate ester compound should be used in an amount of 42-t% or more based on the total resin component, and the maleimide component should be 40% by weight.
Preferably, it is prepared as follows.

The cyanate ester resin composition (^) of the present invention preferably contains the above components, but in addition to these, the composition has improved viscosity behavior, adhesiveness, curability, flexibility, etc. For the purpose of liquid ~ elasti
resins such as rubbers and their low molecular weight products with a molecular weight of several thousand or less; thermoplastic polyurethane resins, vinyl acetate resins, and other thermoplastic resins having reactive groups and their low molecular weight products with a molecular weight of several thousand or less; Low molecular weight oligomers with a molecular weight of several thousand or less of engineering plastics such as polycarbonate, thermoplastic polyester, polyester carbonate, polyarylate, and polyphenylene ether; Polyolefins with a molecular weight of several thousand or less such as polyethylene, polypropylene, and 4-methylpentene-1 Low molecular weight oligomer; polytetrafluoroethylene, polytetrafluoroethylene-propylene copolymer,
A low molecular weight oligomer having a molecular weight of several thousand or less of a fluororesin such as perfluoroethylene propylene copolymer can be added.

The inorganic filler (8) used in the present invention may be any known one, and its type is appropriately selected depending on the intended use or desired physical properties of the wiring board. In the case of a wiring board with a low dielectric constant and a low dielectric loss tangent, silica powder such as fused silica and crystalline silica, poron nitride powder, boron silicate powder, etc. are suitable. In addition, in the case of high thermal conductivity wiring boards, in addition to the above, alumina, magnesium oxide (magnesia), etc. are exemplified, and in addition,
Preferred examples include inorganic fillers such as wollastonite, mica, calcium carbonate, and talc. These inorganic fillers may be used as they are or may be surface-treated with a silane coupling agent, a titanate coupling agent, etc., and the average particle size is preferably 50 mesh or less. In addition, the amount of inorganic filler used is 65 to 90% by weight of the total composition, and if it is less than 65% by weight, dielectric properties and other desired properties will not be imparted sufficiently. If the amount exceeds 90% by weight, it becomes difficult to form into a sheet.

It is also a preferred embodiment to improve the processability, flexibility, etc. of the molded article by replacing some of the above inorganic fillers with organic fillers. Examples include powders of engineering plastics such as polycarbonate, thermoplastic polyester, polyester carbonate, polyarylate, and polyphenylene ether; powders of polyolefins such as polyethylene, polypropylene, and poly-4-methyl-1-pentene; and polytetrafluoroethylene. Examples include powders of fluororesins such as polytetrafluoroethylene-propylene copolymer, perfluoroethylene propylene copolymer, and the like.

The curing catalyst (C) of the present invention may be any known curing catalyst for cyanate ester resin compositions, including amines, imidazoles, organic metal salts, and inorganic metal salts. , organic peroxides, etc. Among these catalysts, those suitable for use in the sticky molding material of the present invention include organic metal salts alone and combination systems of organic metal salts and organic peroxides. Examples of organic metal salts include zinc naphthenate, lead stearate, lead naphthenate, zinc octylate, tin oleate, tin octylate, dibutyltin malate, manganese naphthenate, cobalt tephthenate, iron acetylacetone, manganese acetylacetone, etc. Examples of the organic peroxide include benzoyl peroxide, lauroyl peroxide, caprylic peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert-butyl-di-perphthalate, and the like. The amount of these curing catalysts to be used is sufficient within the range of catalytic amounts in a general sense, for example, in an amount of 10 wt% or less, particularly 5 wt% or less, based on the total resin composition.

The above components are mixed by mixing the cyanate ester resin composition and the inorganic filler at a temperature of 20 to 130°C using a roll, Banbury mixer, Henschel mixer, extruder, or other known kneading machine. These components may be added at the same time or during kneading. When using a low molecular weight substance or a solid substance as the cyanate ester resin component, increase the molecular weight by heating or kneading under heating to pre-react the cyanate ester resin component. The paste-like molding composition of the present invention is obtained by this method.

The optimum kneading time is appropriately selected depending on the molecular weight of the cyanate ester resin composition used, the compositional component ratio, the kneading equipment used, and the like.

Generally, in the case of an extruder, a short time is sufficient, but in other cases, 0.5 to 10 I? The kneading is completed when a paste-like composition is obtained within a range between 1 and 2. The viscosity of the molding composition in the form of a paste is set at a temperature of 80°C or less, preferably 0.
~60℃, especially at room temperature (=temperature range of about 10-35℃)
This is the range in which a sheet-like molded product that has self-retention properties and is easy to handle such as cutting, wrapping, and pasting can be obtained. The viscosity is in the range of 0.5 to 300 seconds, preferably 1 to 150 seconds, especially 1 to 30 seconds, as measured by the time it takes for the metal rod to enter the sheet when pressed with a load of 150 g. A range of seconds is preferred.

As for the method of processing the paste-like composition into a sheet, in the case of using an extruder, it may be formed into a sheet by directly extruding it with a T-die, or the like. If rolls are used for mixing, the method is to take out the sheet as it is from the roll as a sheet of a specified thickness, or if other kneading methods are used,
The paste-like composition is formed into a sheet by using a roll, press, or other means. When taking out the sheet from the roll, if the viscosity of the sticky molding composition of the present invention is low, it may be difficult to peel the sheet from the roll. For example, by cooling the roll (for example, by adjusting the viscosity to around Loose C using the method described above), it is possible to easily take out the roll as a sheet.

In producing the sheet of the present invention, reinforcing base materials such as woven or non-woven fabrics are usually inserted into a roll for forming the sheet in several sheets, especially about one sheet, and integrated, or the reinforcing base materials are overlapped during molding. If desired, it is also possible to form a base material composite sheet by integrating the base materials.

The reinforcing base materials include cloth-like reinforcing materials of various shapes such as roving, chopped strand mat, continuous mat, cloth, roving cloth, surfacing mat, and chopped strand mat, quartz fiber, glass fiber, etc. , fully aromatic polyamide fibers, and blends thereof, and quartz fiber woven fabrics are particularly suitable for applications with low dielectric constant and low dielectric loss tangent.

Incidentally, the sheet of the present invention can naturally be used after being stored as it is at room temperature.

Normally, by taking advantage of the fact that the curing reaction of the resin component proceeds gradually even at room temperature due to the catalyst component used to shorten the molding time, it is possible to store and use it until the viscosity reaches a suitable range at the usage temperature. In addition, for long-term storage, etc.
Cooling and storage is a preferred method since there is virtually no change in viscosity.

The sheet of the present invention obtained by the above method is molded to obtain a molded article of the present invention.

The molded article may be a single sheet of the glue-like composition described above, a reinforcing base material laminated thereon, or a reinforcing base material and a thermosetting resin composition such as the above-mentioned cyanate ester type. This is done by molding a stack of semi-cured prepregs impregnated with a resin composition and dried.

The molding method is a known lamination molding method, such as pressing,
A method using a hot roll forming machine, an autoclave type forming machine, a vacuum bag forming machine, etc., preferably at a forming pressure of 3.
By heating and pressurizing and molding at ~100 kg/d and a temperature of 160 to 240°C. Here, the molding time is selected in the range of 30 seconds to 30 hours, and in the case of a relatively short time in the range of 30 seconds to 100 minutes or when low temperature is used, the molding time is selected in the oven after taking out from the molding machine. It is preferable to post-cure the wiring board by post-curing.

In the case of a three-dimensional molded object, the sheet of the present invention, which is laminated with a reinforcing base material or I'If'Jj prepreg, is cut out into a portion or a piece of the entire shape of the developed view of the three-dimensional molded object, Although it may be mounted or placed in a mold as it is and molded, a method of preforming and then main molding is preferable from the viewpoint of productivity and prevention of defects, and in this case,
The sheet of the present invention alone is obtained by laminating a reinforcing base material or a semi-cured prepreg, and cutting it into pieces in the shape of a developed view of a three-dimensional molded object or the entire shape, and using these as a preliminary for three-dimensional molding. Place it in the mold and leave it at room temperature or 70℃.
It is preferable to carry out preforming at a pressure of 10 to 100 kg/cd under heating at a temperature of 0.degree.

A conductor layer is formed by a known method on the molded product of the present invention having no conductor layer manufactured by the following method to obtain a molded product for printed wiring of the present invention.

When the conductor layer is formed by bonding metal foil with an adhesive, copper, iron, nickel, aluminum, stainless steel, or other known metal foil with a thickness of 5 to 200 mm may be used as it is or with surface treatment for bonding. A method of forming an adhesive layer on one side of the metal foil, cutting it out as desired, and adhering it to a desired part; forming an adhesive layer on a molded body, cutting out the metal foil as desired, and adhering it to a desired part. A method in which the metal foil is temporarily adhered to a releasable paper or other base material is also preferable from the viewpoint that it is possible to easily adhere the metal foil to a desired portion. In the case of electroless plating, the surface of the molded body is mechanically or chemically treated, activated, electroless plated, and electrolytically plated if desired; adhesion for improving the adhesion of electroless plating. This method is based on a method in which a single layer of primer is previously formed on the surface of the molded body, surface treated, activated, and then electroless plated and, if desired, electrolytically plated. In the case of using conductive paint or ink, a method is used in which a conductive paint or ink containing metal powders such as silver, copper, nickel, etc. and binder resin as essential components is applied or printed on the desired area. or,
In the case of sputtering or metal vapor deposition, unnecessary parts are covered and then formed by a known method such as sputtering or metal vapor deposition, or a conductive layer is formed on the entire surface and the unnecessary parts are removed by etching or other methods. It depends on the method of removal. The metals used in these methods include:
Copper, silver, nickel, tin, gold or alloys thereof are preferred.

Here, the adhesive or adhesive primer layer is made by adding a curing accelerator as component C to the same resin as component A of the present invention, and adding a thermoplastic resin such as polyester, diene rubber, etc. Examples of modified products include known adhesives for laminates and primer compositions for electroless plating.

Among these methods, in the case of bonding metal foil, when forming fine wiring patterns, etc., it is preferable to further perform etching using a known method to obtain the desired printed wiring molded body. If the shape is not minute, it is preferable to directly adhere a piece of metal foil cut out into the desired shape.

〔Example〕

Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, parts in Examples and Comparative Examples are parts by weight unless otherwise specified.

In addition, the viscosity in the examples is the viscosity when a metal rod with a diameter of 6 mm is pressed against a sheet of glue-like molding material with a thickness of 10 mm under a load of 150 g at a predetermined temperature. This is based on a method of measuring the time (sec) until 5001na enters.

Example-1 2,2-bis(4-cyanatophenyl)propane'tc
400 g of fused silica powder and 0.1 g of iron acetylacetonate were added to a semi-solid resin (number average molecular weight: 1600) at room temperature that had been pre-reacted at fA degree of 150°C for 480 minutes.
Knead at 5°C for 1 hour to obtain a sticky composition (viscosity: 2 seconds,
25°C) was obtained.

This composition is passed between a pair of rolls cooled to 10°C,
A 0.85 mm thick sheet was formed and cooled to room temperature.

This sheet was sandwiched between polytetrafluoroethylene films and 5k
g/cal, 2 hours at 170°C7. Thickness: 0
．． Seventy-five fin plates were produced.

On the other hand, 657 parts of 2,2-his(4-cyanatophenyl)propane and 75 parts of bis(4-maleimidophenyl)methane
250 parts of a thermoplastic saturated polyester resin (manufactured by Nippon Gosei Kagaku ■, trade name: Polyester-LP-035) was added to the pre-reacted product obtained by pre-reacting 1 part at 160°C for 2 hours, and methyl ethyl ketone was dissolved therein. Next, 0.12 parts of zinc octylate was added and mixed uniformly to prepare an adhesive composition, and this adhesive composition was applied to a 35-thick electrolytic copper foil.
It was dried at 140° C. for 5 minutes to produce a copper foil with an adhesive layer on one side having a thickness of 30 haze.

The copper foil was cut out into a predetermined shape, placed on a predetermined surface of a flat plate, and pressed at 5 kg/aJ and 170° C. for 2 hours to obtain a flat plate with copper foil.

The test results for this flat plate are shown in Table 1.

Example 2 A crane sheet with a thickness of 0.85 manufactured in the same manner as in Example 1 was heated to 50°C to increase its flexibility, and then the base 2
0 cm, top side 12 cm, and height 10 holes in a square pyramid-shaped male and female mold, close the mold, and apply a pressure of 20 k.
After press-molding for 90 minutes at a temperature of 170° C. and a temperature of 170° C., the molded product was taken out from the mold and cooled to room temperature to obtain a molded product.

An electrolytic copper foil with an adhesive layer obtained in the same manner as in Example 1 was attached to a predetermined portion of the slope of the mold described above, and the molded product obtained above was placed on this. Temporarily glued.

Next, this molded body was post-cured in an oven at 170° C. for 2 hours to obtain a molded body to which the copper foil was adhered.

The test results for this molded body are shown in Table 1.

Example-3 2,
After preliminarily reacting 100 parts of 2-bis(4-cyanatophenyl)propane at 160°C for 150 minutes, 40 parts of glycidyl methacrylate and 30 parts of butadiene-acrylonitrile copolymer (trade name HN1po11312, manufactured by Nippon Zeon ■) were added thereto. and zinc octylate as catalyst 0.0
A mixture of 2 parts of benzoyl peroxide and 0.03 parts of benzoyl peroxide was applied and heated at 160° C. for 2 hours to obtain a flat plate with an adhesive layer.

This flat plate was heated to HzOz 150g/l, HgS
After treatment with a treatment solution of O440volχ at 40°C for 15 minutes, it was washed with water. After activating this flat plate with a tin chloride/palladium chloride aqueous solution, a resist film was formed except for the predetermined wiring network forming area, and then electroless nickel plating (NBW chemical nickel liquid; manufactured by Okuno Pharmaceutical Co., Ltd.) was applied at 40°C and 25°C. A metal layer was formed by electroless plating for minutes, washing with water, and drying.

The test results for this flat plate are shown in Table 1.

Example-4 Cyanate ester-maleimide resin (trade name: BT21
70, manufactured by Mitsubishi Gas Chemical @) 20 parts, average particle size 13 f
After mixing 70 parts of copper powder with a particle diameter of m and 10 parts of a silver powder with an average particle size of 5 using methyl ethyl ketone, 10 parts of phosphorous acid was mixed to produce a conductive paint. This was applied to a predetermined portion of a molded body obtained in the same manner as in Example 2, and heated and cured at 140° C. for 2 hours to obtain a molded body having a conductor layer with a thickness of 30 Irm.

The test results for this molded body are shown in Table 1.

Example 5 An adhesive obtained in the same manner as in Example 1 was applied to a flat plate obtained in the same manner as in Example 1, and dried at 140°C for 5 minutes to a thickness of 40. A flat plate with an adhesive layer was obtained.

Cover parts where there is no need to form a metal film with aluminum foil, then spray zinc to a thickness of 70 #-1 using flame spraying, remove the aluminum foil, and heat-spray at 170°C.
Cured by heating for hours.

The test results for this flat plate are shown in Table 1.

Note) *1: Measurement after electrolytic copper plating *2: Measurement not possible due to metal layer cutting [Operations and Effects of the Invention] According to the method for manufacturing a wiring board of the present invention as described above, the inorganic filler is In comparison, a wiring substrate with an extremely high content can be obtained, and one that effectively imparts properties such as excellent dielectric properties and high thermal conductivity can be easily manufactured. Further, it has the advantage that it is easy to form a conductor layer on a three-dimensional molded body or the like.

Taking advantage of these characteristics, conventional applications include heat theory,
It is possible to provide an excellent molded body for printed wiring that can be used as a material suitable for hybrid IC1 radio equipment, antennas, and other fields where conventional methods are difficult or unsatisfactory.

Claims (1)

[Claims] cyanate ester resin composition (A) with a number average molecular weight of 2,500 or less, 40 to 10 parts by weight, inorganic filler (B) 6
A composition containing 0 to 90 parts by weight and a curing catalyst (C) as essential components is kneaded to form a paste-like molding composition, and the composition is preformed into a sheet. A flat or three-dimensional molded body is produced by heating and pressurizing a preformed sheet overlaid with at least one reinforcing base cloth as a molding material, and then a conductor layer is applied to the molded body. A method for producing a molded body for printed wiring, characterized in that it is formed by bonding metal foil with an adhesive, plating, metal vapor deposition, metal spraying, or coating or printing with conductive paint or ink.