JPS6369635A - Electrical laminated board - Google Patents
Electrical laminated boardInfo
- Publication number
- JPS6369635A JPS6369635A JP21466986A JP21466986A JPS6369635A JP S6369635 A JPS6369635 A JP S6369635A JP 21466986 A JP21466986 A JP 21466986A JP 21466986 A JP21466986 A JP 21466986A JP S6369635 A JPS6369635 A JP S6369635A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- electrical
- impregnated
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 12
- 239000004744 fabric Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- DKQVJMREABFYNT-UHFFFAOYSA-N ethene Chemical group C=C.C=C DKQVJMREABFYNT-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用りられる電気用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
従来より、紙やガラス織布くフェノール樹脂、エボキV
樹脂、ボリイミF樹脂を含浸、乾燥させた樹脂含浸基材
の所要枚数と金属箔を重ねた積層体を積層成形して電気
用積層板が製造されてbるが、この電気用積層板のn電
率は、エポキシ樹脂含浸ガラス布を用いた場合で5、ポ
リイミド樹脂ガラス布の場合には4.0 と比較的大
きく、従って通信機!S%計算機器用プリント配線板と
して用すた場合には高周波特性が不足となり、高周波、
演算回路や通信機器回路用には制約が加えられてbだ。Traditionally, paper, glass woven fabric, phenolic resin, and ebony V
An electrical laminate is manufactured by laminating and molding a laminate in which a required number of resin-impregnated base materials impregnated with a resin, Boliimi F resin and dried, and metal foil are layered. The electrical constant is relatively large, 5 when using epoxy resin-impregnated glass cloth and 4.0 when using polyimide resin glass cloth, so it is a communication device! When used as a printed wiring board for S% calculation equipment, the high frequency characteristics are insufficient;
For arithmetic circuits and communication equipment circuits, restrictions are added and it is rated B.
この対策として高周波特性のよりフッ素樹脂で全体を形
成した積層板がオ見られたが高価で一般に広く使用する
ことかできない欠点があった。As a countermeasure to this problem, a laminated plate made entirely of fluororesin, which has better high-frequency characteristics, has been developed, but it is expensive and cannot be widely used.
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、誘電率が小さく、高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装か可能で絶縁特性に優れた電
気用積層板を提供することにある。The present invention has been made in view of the above circumstances, and its purpose is to provide a small dielectric constant, good high frequency characteristics, and to enable mounting of high frequency arithmetic circuits and communication circuits when used as a printed wiring board. The object of the present invention is to provide an electrical laminate that can be used in a variety of applications and has excellent insulation properties.
本発明は樹脂、]−の上、下面に、金1箔側を外側にし
て片面金、’II箔張フッ素樹脂積、1板を夫々配設し
た積層体を積;a 成形してなることを特徴とする電気
用積層板で、高周波特性に優れたフッ素樹脂層のため積
層板の高周波特性を向上させることができたもので以下
本発明の詳細な説明する。The present invention is made by laminating and molding a laminate in which one plate of gold on one side and one plate of 'II foil-clad fluororesin resin are placed on the upper and lower surfaces of resin, with the gold foil side facing outward. This invention is an electrical laminate having the following characteristics, and the high frequency characteristics of the laminate can be improved due to the fluororesin layer having excellent high frequency characteristics.The present invention will be described in detail below.
本発明に周込る片面金属張フッ素樹脂積層板の樹脂とし
ては、四フッ化エチVン樹脂、四フッ化エチレンパーフ
ルオロビニルエーテル共重合体、四フッ化エチレン六プ
ツ化プロピレン共重合体、四フッ化エチレンエチレン共
重合体、三フフ化塩化エチレン樹脂等のようなフッ素樹
脂全般を用込ることができ、基材としてはガラス、アス
ベスト等の無機繊維やポリエステル、ポリアミド、ポリ
ビニルアルコール、アクリル、7ツx樹m等の有機合成
繊維や木綿等の天然ffi維からなる織布、不織布、マ
ット或は紙等を周込ることができ、上記基材に上記樹脂
を含浸させた樹脂含浸基材に、更に必要に応じてフッ素
樹脂フィルムを所要位置に介在させて所要枚数重ねた積
層体の片面に銅箔等の金属箔を配設し積層成形して得ら
れるものである。なお片面金属張フッ素樹脂積層板の金
属箔反対面は粗面化しておくことがより層間接着性を向
上させるため望ましbことである。樹脂層としてはフェ
ノール樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポ
リエステル樹脂、メラミン樹脂、ボリイミF、ポリブタ
ジェン、ポリアミド、ポリアミドイミド、ポリスルフォ
ン、ポリフェニレンサルファイド、ポリフェニレンオキ
サイド、ポリブチレンテレフタレート、ポリエーテルエ
ーテルケトン等の単独、変性物、混合物等の樹脂令布層
、樹脂フィルム、樹脂シート或はこれら樹脂を前記基材
に含浸、乾燥させた樹脂含浸基材であるが、好ましくは
より厚み精度の同上する樹脂含浸基材を用することが望
ましい、更に好ましくは樹脂含浸基材の樹脂としてフッ
素樹脂より融点の低いエポキシ樹脂、ポリイミド樹脂等
を用いることにより積層成形時の温度をフッ素樹脂積層
板のそれより低温にすることができる利点がある。なお
、金属箔としては銅、鉄、アルミニウム、ニッケル、亜
鉛等の単独1合金箔が用すられる。The resins of the single-sided metal-clad fluororesin laminate included in the present invention include tetrafluoroethylene V resin, tetrafluoroethylene perfluorovinyl ether copolymer, tetrafluoroethylene hexapropylene copolymer, and tetrafluoroethylene hexapropylene copolymer. All fluororesins such as fluorinated ethylene ethylene copolymer, trifluorinated chlorinated ethylene resin, etc. can be used, and as base materials, inorganic fibers such as glass and asbestos, polyester, polyamide, polyvinyl alcohol, acrylic, A resin-impregnated base in which the base material is impregnated with the resin, which can be wrapped around a woven fabric, non-woven fabric, mat, paper, etc. made of organic synthetic fibers such as 7 x wood or natural FFI fibers such as cotton. It is obtained by laminating a laminate in which a required number of fluororesin films are stacked on top of each other, with fluororesin films interposed at required positions as necessary, and a metal foil such as copper foil is provided on one side of the laminate. Note that it is desirable to roughen the surface of the single-sided metal-clad fluororesin laminate opposite to the metal foil in order to further improve interlayer adhesion. The resin layer may include phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, Polyimide F, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, etc. A resin layer, a resin film, a resin sheet, or a resin-impregnated base material obtained by impregnating the base material with these resins and drying them, preferably a resin-impregnated base material with higher thickness accuracy. It is desirable to use a base material, and more preferably, by using an epoxy resin, polyimide resin, etc., which has a lower melting point than the fluororesin as the resin-impregnated base material, the temperature during lamination molding can be lower than that of the fluororesin laminate. There are advantages to being able to do so. Note that as the metal foil, a single alloy foil of copper, iron, aluminum, nickel, zinc, etc. is used.
以下本発明を実施例にもとづbて説明する。The present invention will be explained below based on examples.
実施例1
厚さ0.15 fIIのガラス布に硬化剤含有エポキシ
樹脂を含浸、乾燥して得た樹mason量係(以下単に
傷と記t)のエボキV樹脂含浸〃ラス布2枚の上、下面
に、厚さQ、 4 fiの片面鋼張ガラス布基材フッ素
樹脂積層板を銅箔側を外側にし、更に鋼箔反対面をサン
ドブラストで粗面化して夫々配設した積層体を成形圧力
zo4儲、170℃で90分間積層成形して電気用積層
板を得た。Example 1 A glass cloth with a thickness of 0.15 fII was impregnated with an epoxy resin containing a curing agent and dried, and the epoxy V resin was impregnated with a masonry resin (hereinafter simply referred to as scratches) on two pieces of glass cloth. , A laminate is formed in which a single-sided steel-clad glass cloth base fluororesin laminate with a thickness of Q and 4 fi is placed on the bottom surface with the copper foil side facing outward, and the opposite surface of the steel foil is roughened by sandblasting. Laminate molding was carried out at 170° C. for 90 minutes at a pressure of 4°C to obtain an electrical laminate.
実施列2
厚さQ、15 mのガラス布にポリイミド樹脂(ロース
ブーラン社遁、商品名ケルイミド601)を含浸、乾燥
して得た樹脂量5G憾のポリイミド樹脂含浸ガラス布2
枚の上、下面に、実施例1と同じ片面銅張ガラス布基材
フッ系樹脂積層板を鋼箔側を外側にし、更に銅箔反対面
をサンドブラストで粗面化して夫々配設した積層体を成
形圧力2o’v’d −200℃で90分間積層成形し
て電気用積層板を得た。Practical row 2 Polyimide resin-impregnated glass cloth 2 with a resin amount of 5G obtained by impregnating a glass cloth with a thickness of Q and 15 m with polyimide resin (Roosboulin Co., Ltd., trade name: Kelimide 601) and drying it.
The same single-sided copper-clad glass cloth base fluorocarbon resin laminate as in Example 1 was placed on the upper and lower surfaces of the sheet, with the steel foil side facing outward, and the opposite side of the copper foil was roughened by sandblasting. An electrical laminate was obtained by lamination molding for 90 minutes at a molding pressure of 2 o'v'd -200°C.
比較例1
実施f41と同じエボキV樹脂含浸ガラス布8枚の上、
下面に厚さ0.018augの銅箔を夫々配設した積層
体を成形圧力211kid 、 170℃で90分聞積
層成形して電気用積層板を得た。Comparative Example 1 On 8 sheets of Evoki V resin-impregnated glass cloth, which is the same as in Example f41,
The laminates each having a copper foil with a thickness of 0.018 aug arranged on the lower surface were laminated and molded at 170° C. for 90 minutes at a molding pressure of 211 kid to obtain an electrical laminate.
比較例2
実施例2と同じポリイミド樹脂含浸ガラス布8枚の上、
下面に淳さ0.018flの銅箔を夫々配設した積層体
を成形圧力204り、200℃で90分間積層成形して
電気用積層板を得た。Comparative Example 2 On 8 sheets of the same polyimide resin-impregnated glass cloth as in Example 2,
The laminates each having a copper foil of 0.018 fl thick disposed on the lower surface were laminated and molded at 200° C. for 90 minutes under a molding pressure of 204° C. to obtain an electrical laminate.
実施例1と2及び比較例1と2の電気用積層板のsiI
!sは第1表のようである。siI of electrical laminates of Examples 1 and 2 and Comparative Examples 1 and 2
! s is as shown in Table 1.
第1表
〔発明の効果〕
本発明にあってはフッ素樹脂漬ノー板を層内に存在せし
めているため訪電峯が小さり、高周波特性が良好となり
、プリント配線板として使用した場合に為周波クロ・ツ
クを用いた篩周波演算回路、通信t−&回路の実装が可
能となるものである。Table 1 [Effects of the Invention] In the present invention, since the fluororesin-soaked plate is present in the layer, the power peak is small and the high frequency characteristics are good, resulting in improved efficiency when used as a printed wiring board. It is possible to implement a sieve frequency calculation circuit and a communication T-& circuit using a frequency clock.
Claims (2)
属箔張フッ素樹脂積層板を夫々配設した積層体を積層成
形してなることを特徴とする電気用積層板。(1) An electrical laminate characterized in that it is formed by laminating and molding a laminate in which single-sided metal foil-clad fluororesin laminates are disposed on the upper and lower surfaces of a resin layer, respectively, with the metal foil on the outside.
許請求の範囲第1項記載の電気用積層板。(2) The electrical laminate according to claim 1, wherein the resin layer is a resin-impregnated base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21466986A JPS6369635A (en) | 1986-09-11 | 1986-09-11 | Electrical laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21466986A JPS6369635A (en) | 1986-09-11 | 1986-09-11 | Electrical laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6369635A true JPS6369635A (en) | 1988-03-29 |
Family
ID=16659607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21466986A Pending JPS6369635A (en) | 1986-09-11 | 1986-09-11 | Electrical laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6369635A (en) |
-
1986
- 1986-09-11 JP JP21466986A patent/JPS6369635A/en active Pending
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