JPH03183186A - Laminated board for electrical use - Google Patents
Laminated board for electrical useInfo
- Publication number
- JPH03183186A JPH03183186A JP32167089A JP32167089A JPH03183186A JP H03183186 A JPH03183186 A JP H03183186A JP 32167089 A JP32167089 A JP 32167089A JP 32167089 A JP32167089 A JP 32167089A JP H03183186 A JPH03183186 A JP H03183186A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- fluororesin
- paper
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 abstract description 23
- 239000011347 resin Substances 0.000 abstract description 23
- 239000000463 material Substances 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 11
- 238000001035 drying Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- -1 polybutylene terephthalate Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- RRZIJNVZMJUGTK-UHFFFAOYSA-N 1,1,2-trifluoro-2-(1,2,2-trifluoroethenoxy)ethene Chemical compound FC(F)=C(F)OC(F)=C(F)F RRZIJNVZMJUGTK-UHFFFAOYSA-N 0.000 description 1
- YMRMDGSNYHCUCL-UHFFFAOYSA-N 1,2-dichloro-1,1,2-trifluoroethane Chemical compound FC(Cl)C(F)(F)Cl YMRMDGSNYHCUCL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、コンピューター通信機器
隻に用いられる電気用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, and computer communication equipment.
従来より、紙やガラス織布に7二ノール樹脂、エポキシ
樹脂、ポリイミド樹脂を含浸、乾燥させた樹脂含浸基材
の所要枚数と金属箔を重ねた積層体を積層成形して電気
用積層板が製造されているが、この電気用積層板の誘電
率は、エポキシ樹脂含浸ガラス布を用いた場合で5.0
、ポリイミド樹脂ガラス布の場合には4.0と比較的大
きく、従ってプリント配線板として用すた場合には高周
波特性が不足となり、高周波演算回路や通信機器回路用
には制約が加えられてbた。このためクラフト紙やガラ
ス織布にプリ素樹脂を含浸させたフッ素餠脂含浸クラフ
ト紙やフッ素樹脂含浸ガラス不織布を用いることが試み
られたがフッ素樹脂液はエマルジョン形態での供給しか
ないため、基材に所要樹脂竜を付看させるには含浸、乾
燥を反復する手間があり、更に積層成形時にフッ素樹脂
の融点以上に加熱する必要があるため250℃以上の高
温成形が必要となる問題がありだ。Conventionally, electrical laminates have been made by laminating and molding a laminate of paper or glass woven fabric impregnated with 7-dinol resin, epoxy resin, or polyimide resin and then drying a required number of resin-impregnated base materials and metal foil. However, the dielectric constant of this electrical laminate is 5.0 when using epoxy resin-impregnated glass cloth.
In the case of polyimide resin glass cloth, it is relatively large at 4.0, so when used as a printed wiring board, the high frequency characteristics are insufficient, and restrictions are added for use in high frequency arithmetic circuits and communication equipment circuits. Ta. For this reason, attempts have been made to use fluororesin-impregnated kraft paper or fluororesin-impregnated glass nonwoven fabric, which are kraft paper or glass woven cloth impregnated with pre-resin, but since fluororesin liquid can only be supplied in the form of an emulsion, In order to give the material the required resin curve, it is time-consuming to repeat impregnation and drying, and furthermore, it is necessary to heat the material above the melting point of the fluororesin during laminated molding, which poses the problem of requiring high-temperature molding at 250°C or higher. is.
従来の技術で述べたよろに、エポキシ樹脂、ポリイミド
樹脂をクラフト紙、ガラス織布に含浸させた樹脂含浸基
材からなる電気用積層板は高周波特性が不足する。そう
かといってツーJ素樹脂をクラフト紙、ガラス織布に含
浸させた樹脂含浸:1&材からなる電気用積層板は生産
性が低い。本発明は従来の技術における上述の問題点に
鑑みてなされたもので、その目的とするところは、生産
性を維持したまま、高周波特性に優れた電気用種層*1
提供することlこある。As described in the prior art, electrical laminates made of resin-impregnated base materials in which kraft paper or glass woven cloth is impregnated with epoxy resin or polyimide resin lack high frequency characteristics. On the other hand, electrical laminates made of resin-impregnated materials such as kraft paper and glass woven fabric with 2J resin have low productivity. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide an electrical seed layer*1 with excellent high frequency characteristics while maintaining productivity.
There is so much to offer.
本発明は所要枚数の樹脂含浸基材の上面及び又は下面に
金属箔を配設した積層体を一体化してなる′電気用積層
板におhて、樹脂含浸基材の少くとも1枚が、厚さ30
〜350ミクロンの樹脂含浸フッ素樹脂ベーパーである
ことを特徴とする電気用積層板のため、高周波粋性がよ
く、且つ含浸用樹脂としてフッ素樹脂を用論た以外は生
産性を維持することができるもので、以下本発明の詳細
な説明する。The present invention provides an electrical laminate formed by integrating a laminate in which a required number of resin-impregnated substrates are provided with metal foil on the upper and/or lower surfaces, in which at least one of the resin-impregnated substrates is Thickness 30
This electrical laminate is characterized by being made of resin-impregnated fluororesin vapor of ~350 microns, so it has good high-frequency properties and can maintain productivity except for the use of fluororesin as the impregnating resin. The present invention will now be described in detail.
本発明に巾論る樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エボキV樹脂不飽和ポリエス
テル41N脂、メラミン樹脂、ポリイミド、ポリブタジ
エン、ポリアミド、ポリアミドイミド、ポリスルフォン
、ポリフェニレンサルファイド、ポリフェニレンオキサ
イド、ポリブチレンテレフタレート、ポリエーテルエー
テルケトン、フッ素樹脂等の単独、変性物、混合初筆が
用いられ必要に応じて粘度調整に水、メチルアルコール
、アセトン、シクロへ牛すノン、スチレン等の溶媒を添
加したもので、基材としては三フヴ化塩化エチレン樹脂
、四7ツ化エチレン樹脂、四7ツ化エチレン六フリ化プ
ロピレン共重合体樹脂。Examples of resins for the resin-impregnated base material discussed in the present invention include phenolic resin, cresol resin, EBOKI V resin, unsaturated polyester 41N resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, and polyphenylene oxide. , polybutylene terephthalate, polyether ether ketone, fluororesin, etc. alone, modified products, and mixed materials are used. If necessary, solvents such as water, methyl alcohol, acetone, cyclohexone, and styrene are used to adjust the viscosity. The base materials are trifluoroethylene chloride resin, tetra7fluoroethylene resin, and tetrafluoroethylene hexafluoropropylene copolymer resin.
四ツ−’化エチレンパーフルオロビニルエーテル共夏合
体樹脂等のフッ素樹脂繊維を抄紙してなる厚さ30〜3
50ミクロンの7.素樹脂ペーパーヲ、所要枚数の樹脂
含浸基材の全部に用いてもよく、父所要枚数積層された
中央部のみ、或は最外層のみ、更には通常の樹脂含浸基
材と交互に積1)1 t、た状態で用りでもよく任意で
あるが樹脂含浸基材の少くとも1枚に用いることが必要
である。フリ素樹脂ペーパーとしては厚さが30〜35
0ミクロンであることが必要である。即ち30ミクロン
未満では取扱時lこ破損しやすく、350ミクロンをこ
えると樹脂含浸時に破損しやすくなるからである。金属
箔としては銅、アルミニウム、ニーIケル、 亜鉛、鉄
等の単独、合金、複合の箔が用いられ、必要に応じて接
看性をより向上させるため、金属箔の片面に接看剤)#
ヲ設けておくこともできる。積層一体化手jlこついて
はプレス、多段プレス、マルチロール、ダブルベルト、
無圧加熱等の任意方式を選択することができ、特に限定
するものではなり0以下本発明ケ実施例にもとづいて説
明する。Paper made from fluororesin fibers such as tetra-ethylene perfluorovinyl ether copolymerized resin and has a thickness of 30 to 3
50 micron 7. The base resin paper may be used for all of the required number of resin-impregnated base materials, or only for the central portion where the required number of sheets are laminated, or only for the outermost layer, or alternatively, laminated alternately with ordinary resin-impregnated base materials. It is optional, but it is necessary to use it on at least one of the resin-impregnated substrates. Thickness of free resin paper is 30-35
It needs to be 0 microns. That is, if it is less than 30 microns, it will be easily damaged during handling, and if it exceeds 350 microns, it will be easily damaged during resin impregnation. As the metal foil, single, alloy, or composite foils of copper, aluminum, aluminum, zinc, iron, etc. are used, and if necessary, to further improve visibility, a viewing agent may be added to one side of the metal foil. #
You can also set it up. When it comes to lamination and integration, presses, multi-stage presses, multi-rolls, double belts,
Any method such as pressureless heating can be selected, and the method is not particularly limited and will be described based on the following embodiments of the present invention.
実施例
四7ツ化エチレンパーフルオロアルキルビニルエーテル
共重合体樹脂繊維を抄紙してなる厚さ100ミクロンの
7・I素樹脂ペーパーに、乾燥後樹脂量が45重量係に
なるように硬化剤含有エポキシ樹脂ワニスを含浸、乾慄
して褥た樹脂含浸フッ素樹脂ペーパー6枚を重ねた上下
面に厚さ0.0351nIの接看剤付鋼箔を夫々配設し
たPjt層体′I−成形圧力aoKg/cd、 170
℃で90分間積層成形して厚さ0.6nの両面鋼彊電気
用積層板を得た。Example A hardening agent-containing epoxy resin was added to a 100 micron thick 7-I resin paper made from a 7-ethylene perfluoroalkyl vinyl ether copolymer resin fiber so that the amount of resin after drying would be 45% by weight. Pjt layered body 'I' in which 6 sheets of resin-impregnated fluororesin paper impregnated with resin varnish, dried and then placed on the bed are stacked, and a steel foil with adhesive of 0.0351 nI is arranged on the upper and lower surfaces respectively - molding pressure aoKg /cd, 170
Lamination molding was carried out at .degree. C. for 90 minutes to obtain a 0.6 nm thick double-sided electrical laminate made of steel.
比較例1
硬化剤含有エポキシ樹脂ワニスを、厚さ0.1flのガ
ラス織布屹乾燥後樹脂量が45重敏係になるようlこ含
浸、乾燥して得た樹脂含浸ガラス織布6枚を重ねた上下
面に、厚さ0.035In+の接看剤付銅箔を夫々配設
した積層体を用いた以外は実施例と同様に処理して厚さ
0.6 flの電気用積層板を得た。Comparative Example 1 A glass woven fabric having a thickness of 0.1 fl was impregnated with an epoxy resin varnish containing a curing agent so that the amount of resin after drying was 45%, and dried. Six sheets of resin-impregnated glass woven fabric were stacked. An electrical laminate with a thickness of 0.6 fl was obtained by processing in the same manner as in the example except that a laminate having adhesive-coated copper foil with a thickness of 0.035 In+ was disposed on the upper and lower surfaces of the laminate. Ta.
比較例2
四7 、J化エチレン樹脂エマルジ冒ンを、厚さ0.1
鰭のガラス織右に、乾燥後樹脂量が45重fit係にな
るようlζ含浸、乾俤して得たm#If含浸ガラス織布
6枚を重ねた上下面に、厚さ0.035Mの接看剤付銅
箔を夫々配設した積層体音成形圧力30Kg/d。Comparative Example 2 47 J-ethylene resin emulsion was mixed with a thickness of 0.1
On the right side of the fin glass fabric, six sheets of m#If-impregnated glass fabric obtained by impregnating lζ and drying so that the amount of resin after drying is 45 times the fit ratio are layered, and on the upper and lower surfaces, a layer of 0.035M thick Laminated body sound molding pressure 30Kg/d with copper foil with adhesion agent respectively arranged.
335℃で60分間檀#収形して厚さQ、 01nMの
電気用積層板を得た。It was molded at 335° C. for 60 minutes to obtain an electrical laminate having a thickness Q of 01 nM.
実施例及び比較例1と2の電気用8層板の性能は第1表
のようである。The performances of the electrical 8-layer boards of Examples and Comparative Examples 1 and 2 are shown in Table 1.
注 ※ 比較例1 i Zooとした場合の比である。note * Comparative Example 1 i This is the ratio when Zoo is used.
本発明は上述した如く構成されてhる。特許請求の範囲
に記載した構成を有する電気用積層板にお論では生産性
を維持したまま、高周波特性を向上させることのできる
効果がある。The present invention is constructed as described above. The electrical laminate having the structure described in the claims has the effect of improving high frequency characteristics while maintaining productivity.
特許出頴人 松下電工株式会社patent issuer Matsushita Electric Works Co., Ltd.
Claims (1)
属箔を配設した積層体を一体化してなる電気用積層板に
おいて、樹脂含浸基材の少くとも1枚が、厚さ30〜3
50ミクロンの樹脂含浸フッ素樹脂ペーパーであること
を特徴とする電気用積層板。(1) In an electrical laminate formed by integrating a laminate in which a required number of resin-impregnated substrates are provided with metal foil on the upper and/or lower surfaces, at least one of the resin-impregnated substrates has a thickness of 30 to 30 mm. 3
An electrical laminate characterized by being made of 50 micron resin-impregnated fluororesin paper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32167089A JPH03183186A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32167089A JPH03183186A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03183186A true JPH03183186A (en) | 1991-08-09 |
Family
ID=18135103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32167089A Pending JPH03183186A (en) | 1989-12-12 | 1989-12-12 | Laminated board for electrical use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03183186A (en) |
-
1989
- 1989-12-12 JP JP32167089A patent/JPH03183186A/en active Pending
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