JPH0245141A - Manufacture of laminate board - Google Patents
Manufacture of laminate boardInfo
- Publication number
- JPH0245141A JPH0245141A JP19667588A JP19667588A JPH0245141A JP H0245141 A JPH0245141 A JP H0245141A JP 19667588 A JP19667588 A JP 19667588A JP 19667588 A JP19667588 A JP 19667588A JP H0245141 A JPH0245141 A JP H0245141A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- thickness
- copper foils
- impregnated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 abstract description 18
- 239000011347 resin Substances 0.000 abstract description 18
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 229920000742 Cotton Polymers 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000002759 woven fabric Substances 0.000 abstract description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000012784 inorganic fiber Substances 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- -1 polyphenylene Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用いられる積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
積層板はその表面の金R箔にwt9C回路を形成し、プ
リント配線板、多層プリント配線板に用いられるが、最
近はよシコンパクト化が求められ従来主流を占めていた
厚み1.611Mの積層板に代って厚み1.2(1)g
、0.8nという薄物積層板が主流を占めつつある。し
かし積層板厚みが薄くなる程、積層板の反シは大きくな
シ配譲、仮加エエ糧での自動化に支障をきたすという問
題があった。The laminate has a wt9C circuit formed on the gold R foil on its surface and is used for printed wiring boards and multilayer printed wiring boards, but recently there has been a demand for more compactness, and laminates with a thickness of 1.611M have been the mainstream. Thickness 1.2 (1) g instead of board
, 0.8n thin laminates are becoming mainstream. However, as the thickness of the laminate becomes thinner, there is a problem in that the deformation of the laminate becomes larger, which impedes automation in handling and temporary processing.
従来の技術で述べたように厚み1.2#J1%0.81
という薄物積層板は反りが大きく、配線板加工工程で反
シ直し工程等を必要とし、生産効率が悪い。As mentioned in the conventional technology, the thickness is 1.2#J1%0.81
Thin laminates have a large degree of warpage and require a rectification process during the wiring board processing process, resulting in poor production efficiency.
本発明は従来の技術における上述の問題点に嫌みてなさ
れたもので、その目的とするところは、薄物積層板の反
シを減少できる@層板の製造方法を・提供することにあ
る。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for manufacturing a laminate that can reduce the amount of warpage of thin laminates.
t〔問題点全解決するための手段〕
本発明は所要枚数の樹脂含浸基材をjヒねた上面、及び
又は下面に、エポキシ樹脂を主成分とする接着剤を銅箔
K15〜!1iOpre塗布してなる接着剤層け7銅2
&分配設した積層体をp!層底成形、厚さ1.2(1)
!ト1以下の積層板を得ること全特徴とする積層板の製
1、進方法のため、接着剤の主成分であるエポキシ樹1
.脂と塗布地とがパフンスよく反りを減少せしめること
ができたもので、以下本発明の詳細な説明する。t [Means for solving all problems] The present invention applies an adhesive mainly composed of epoxy resin to the upper and/or lower surfaces of a required number of twisted resin-impregnated substrates using copper foil K15~! 1 Adhesive layer coated with iOpre 7 Copper 2
&p the distributed laminate! Layer bottom molding, thickness 1.2 (1)
! To obtain a laminate with a thickness of 1 or less
.. The oil and the coating material were able to reduce warpage with good puffiness, and the present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては。The resin for the resin-impregnated base material used in the present invention includes:
フェノール樹脂、クレゾー/L’樹脂、エポキシ樹脂、
不飽和ポリエーテA/樹脂、メラミン樹脂、ポリイミド
、ポリブタジェン、ポリアミド、ポリアミドイミド、ポ
リスルフォン、ポリフェニレンサシファイド、ポリフェ
ニレンオキサイド、ポリブチレンテレフタレート、ポリ
エーテルエーテルケトン、弗化樹脂等の単独、変性物、
混合物等が用いられ必要に応じて粘度調整に水、メチル
アルコール、アセトン、シクロヘキサノン、スチレン等
の溶媒を添加したもので、木材としてはがフス、アスベ
スト等の無機uXi維やポリエステル、ポリアミド、ポ
リビニμアルコール、アクリル等の存噴合成繊維や木綿
等の天然繊維からなる織布、不織布、マット或は紙又は
これらの組合せ基材等である。接M 剤としてはビスフ
ェノールム型エポキシ樹脂、ノボフック型エボキVm脂
、レゾール型エポキシ樹脂、可撓性エポキシ樹脂、ハロ
ゲン化エボキク樹脂、グリクジルエステ/L’型エボキ
ン樹脂等のエポキシ樹脂に必要に応じて架橋剤、硬化剤
、硬化促進剤、着色剤、溶剤を加え更に必要に応じてプ
≠フー4/ 樹II! −ゴム、フェノ−/L/樹脂、
メラミン樹脂等を添加してなるものであるがエポキシ樹
脂が主成分であることが必要である。鋼箔としては厚み
o、ois〜O,Q7 flを用いることが好ましいが
特に限定するものではない。鋼箔に対する接着剤の塗布
肚ば15〜−fAfである。即ち15 f/n1未満で
は充分な接着力が篩られず、(イ)νIをこえると反シ
が大きくなるからである。積層板厚みは1.20以下で
あることが必要である。即ち1.2ffJをこえるlゾ
みの積N!I仮では木質的に反りが小ざぐ本発明の幼果
が顕著にならないからである。蹟、響成形に”りいては
多段プレス法、マルチロール法、ダブルベルト法、無圧
積層成形法、真空成形法等が用いられ特に限定するもの
ではない。Phenol resin, creso/L' resin, epoxy resin,
Single or modified products of unsaturated polyether A/resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sacinate, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc.
A mixture is used, and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, or styrene is added to adjust the viscosity.As for the wood, it is made of inorganic uXi fibers such as plaster, asbestos, polyester, polyamide, polyvinyl μ, etc. These include woven fabrics, nonwoven fabrics, mats, paper, or combinations of these materials made of synthetic fibers such as alcohol and acrylic, and natural fibers such as cotton. As a contacting agent, it can be crosslinked as necessary to epoxy resins such as bisphenol type epoxy resin, Novohook type Evoki Vm resin, resol type epoxy resin, flexible epoxy resin, halogenated Evoki resin, Glycyl ester/L' type Evoki resin, etc. Add agent, curing agent, curing accelerator, coloring agent, and solvent, and then add P≠Fu 4/ Tree II! as necessary. -Rubber, phenol/L/resin,
Although it is made by adding melamine resin or the like, it is necessary that epoxy resin be the main component. It is preferable to use the steel foil with a thickness of o, ois to O, Q7 fl, but it is not particularly limited. The thickness of the adhesive applied to the steel foil is 15 to -fAf. That is, if it is less than 15 f/n1, sufficient adhesive force will not be obtained, and (a) if it exceeds νI, the resistance will increase. The thickness of the laminate needs to be 1.20 or less. In other words, the product N of 1.2ffJ exceeds 1.2ffJ! This is because the young fruits of the present invention, which are slightly warped in terms of wood quality, do not become noticeable in the case of Ikari. For molding and sound molding, a multi-stage press method, a multi-roll method, a double belt method, a pressureless lamination molding method, a vacuum molding method, etc. are used, and there are no particular limitations.
以下本発明を実施例シζもとづいて説明する。The present invention will be explained below based on Examples ζ.
実施例1乃至3と比較例1及び2
淘+III層50重量%(以下単に%と記す)のフェノ
−/I/樹脂フェワニ、厚み0.2目のクラフト紙に乾
燥後の樹脂量が50%になるように含浸、乾燥して得た
樹脂含浸基材4枚の上下面に、レゾー/L/型フェノー
ル樹脂io重量部(以下単に部と記す)、クレゾールノ
ボフック型エポキシ樹脂80部、ポリビニルブチフール
樹脂■部、メチルエチルケトン120部、トルエン12
0部、メチルアルコ−47120部よりなる接着剤を厚
み0.035ggの鋼箔の片面に実施例1については2
0 y7rpr 、実施例2については37.5fl/
ln’ 、実施例3については55p7、比較例1につ
いては10 f/17/、比較例2については65 f
ld 塗布してなる接着剤層付銅箔を夫々配設した積層
体を成形圧力100 k4/cノ、160°Cでω分間
積層成形して厚み0.8Hの両面銅張積層板を得た。Examples 1 to 3 and Comparative Examples 1 and 2 A 50% by weight (hereinafter simply referred to as %) phenol/I/resin phenol/I/resin phenol + III layer on kraft paper with a thickness of 0.2 and a resin amount of 50% after drying. The upper and lower surfaces of four resin-impregnated substrates obtained by impregnating and drying the resin to give ■ parts of butyfur resin, 120 parts of methyl ethyl ketone, 12 parts of toluene
For Example 1, an adhesive consisting of 0 parts and 47120 parts of methyl alcohol was applied to one side of a steel foil having a thickness of 0.035 gg.
0 y7rpr, 37.5fl/ for Example 2
ln', 55p7 for Example 3, 10 f/17/ for Comparative Example 1, 65 f for Comparative Example 2
A double-sided copper-clad laminate with a thickness of 0.8H was obtained by lamination-molding the laminates each having a copper foil coated with an adhesive layer at a molding pressure of 100 k4/c and 160°C for ω minutes. .
実施例1乃至3と比較例1及び2の積層板の性能は第1
表のようである。The performance of the laminates of Examples 1 to 3 and Comparative Examples 1 and 2 was the first.
It looks like a table.
第1表
本発明は上述した如く溝成されている。特許請求の範囲
適1項に記載し九構成を有する積層板の製造方法におい
ては反シを減少させる効果を有している。Table 1 The present invention is constructed as described above. The method for manufacturing a laminate having the nine configurations described in claim 1 has the effect of reducing warpage.
Claims (1)
面に、エポキシ樹脂を主成分とする接着剤を銅箔に15
〜60g/m^2塗布してなる接着剤層付銅箔を配設し
た積層体を積層成形し、厚さ1.2mm以下の積層板を
得ることを特徴とする積層板の製造方法。(1) Apply an adhesive mainly composed of epoxy resin to copper foil on the upper and/or lower surfaces of the required number of resin-impregnated base materials stacked on top of each other.
A method for manufacturing a laminate, which comprises laminating and molding a laminate on which copper foil with an adhesive layer coated at ~60 g/m^2 is provided to obtain a laminate having a thickness of 1.2 mm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19667588A JPH0245141A (en) | 1988-08-05 | 1988-08-05 | Manufacture of laminate board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19667588A JPH0245141A (en) | 1988-08-05 | 1988-08-05 | Manufacture of laminate board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0245141A true JPH0245141A (en) | 1990-02-15 |
Family
ID=16361724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19667588A Pending JPH0245141A (en) | 1988-08-05 | 1988-08-05 | Manufacture of laminate board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0245141A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0560660A (en) * | 1991-09-04 | 1993-03-12 | Nippon Denshi Kogyo Kk | Apparatus for measuring friction force and coefficient of friction of wheel |
JPH0560661A (en) * | 1991-09-04 | 1993-03-12 | Nippon Denshi Kogyo Kk | Apparatus for measuring coefficient of friction of wheel |
-
1988
- 1988-08-05 JP JP19667588A patent/JPH0245141A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0560660A (en) * | 1991-09-04 | 1993-03-12 | Nippon Denshi Kogyo Kk | Apparatus for measuring friction force and coefficient of friction of wheel |
JPH0560661A (en) * | 1991-09-04 | 1993-03-12 | Nippon Denshi Kogyo Kk | Apparatus for measuring coefficient of friction of wheel |
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