JPH0245141A - Manufacture of laminate board - Google Patents

Abstract

PURPOSE:To reduce the warpage of a thin laminated board by laminating and molding laminates in which copper foils with adhesive layers, in which specific quantities of adhesives mainly comprising an epoxy resin are applied onto copper foils, are arranged onto top faces and/or undersides in which required numbers of resin impregnated base materials are superposed. CONSTITUTION:Laminates in which copper foils with adhesive layers, in which adhesives mainly comprising an epoxy resin are applied onto copper foils in 15-60g/m<3>, are disposed onto top faces and/or undersides, in which required numbers of resin impregnated base materials are stacked, are laminated and molded, thus obtaining a laminated board in thickness of 1.2mm or less. Phenol resin, cresol resin, an epoxy resin, etc., are used as the resin of the resin impregnated base material. A woven fabric, a nonwoven fabric, etc., composed of inorganic fiber such as glass, asbestos, etc., organic synthetic fiber such as polyester, polyamide, etc., and natural fiber such as cotton are employed as the base material. A crosslinking agent, a curing agent, a curing accelerator, a coloring agent and a solvent are added to the epoxy resin as required as adhesives. It is favorable that the copper foil with a thickness of 0.018-0.07mm is used as the copper foil.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.

[Conventional technology]

The laminate has a wt9C circuit formed on the gold R foil on its surface and is used for printed wiring boards and multilayer printed wiring boards, but recently there has been a demand for more compactness, and laminates with a thickness of 1.611M have been the mainstream. Thickness 1.2 (1) g instead of board
, 0.8n thin laminates are becoming mainstream. However, as the thickness of the laminate becomes thinner, there is a problem in that the deformation of the laminate becomes larger, which impedes automation in handling and temporary processing.

[Problem that the invention seeks to solve]

As mentioned in the conventional technology, the thickness is 1.2#J1%0.81
Thin laminates have a large degree of warpage and require a rectification process during the wiring board processing process, resulting in poor production efficiency.

The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for manufacturing a laminate that can reduce the amount of warpage of thin laminates.

t [Means for solving all problems] The present invention applies an adhesive mainly composed of epoxy resin to the upper and/or lower surfaces of a required number of twisted resin-impregnated substrates using copper foil K15~! 1 Adhesive layer coated with iOpre 7 Copper 2
&p the distributed laminate! Layer bottom molding, thickness 1.2 (1)
! To obtain a laminate with a thickness of 1 or less
．． The oil and the coating material were able to reduce warpage with good puffiness, and the present invention will be described in detail below.

The resin for the resin-impregnated base material used in the present invention includes:

Phenol resin, creso/L' resin, epoxy resin,
Single or modified products of unsaturated polyether A/resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sacinate, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc.
A mixture is used, and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, or styrene is added to adjust the viscosity.As for the wood, it is made of inorganic uXi fibers such as plaster, asbestos, polyester, polyamide, polyvinyl μ, etc. These include woven fabrics, nonwoven fabrics, mats, paper, or combinations of these materials made of synthetic fibers such as alcohol and acrylic, and natural fibers such as cotton. As a contacting agent, it can be crosslinked as necessary to epoxy resins such as bisphenol type epoxy resin, Novohook type Evoki Vm resin, resol type epoxy resin, flexible epoxy resin, halogenated Evoki resin, Glycyl ester/L' type Evoki resin, etc. Add agent, curing agent, curing accelerator, coloring agent, and solvent, and then add P≠Fu 4/ Tree II! as necessary. -Rubber, phenol/L/resin,
Although it is made by adding melamine resin or the like, it is necessary that epoxy resin be the main component. It is preferable to use the steel foil with a thickness of o, ois to O, Q7 fl, but it is not particularly limited. The thickness of the adhesive applied to the steel foil is 15 to -fAf. That is, if it is less than 15 f/n1, sufficient adhesive force will not be obtained, and (a) if it exceeds νI, the resistance will increase. The thickness of the laminate needs to be 1.20 or less. In other words, the product N of 1.2ffJ exceeds 1.2ffJ! This is because the young fruits of the present invention, which are slightly warped in terms of wood quality, do not become noticeable in the case of Ikari. For molding and sound molding, a multi-stage press method, a multi-roll method, a double belt method, a pressureless lamination molding method, a vacuum molding method, etc. are used, and there are no particular limitations.

The present invention will be explained below based on Examples ζ.

Examples 1 to 3 and Comparative Examples 1 and 2 A 50% by weight (hereinafter simply referred to as %) phenol/I/resin phenol/I/resin phenol + III layer on kraft paper with a thickness of 0.2 and a resin amount of 50% after drying. The upper and lower surfaces of four resin-impregnated substrates obtained by impregnating and drying the resin to give ■ parts of butyfur resin, 120 parts of methyl ethyl ketone, 12 parts of toluene
For Example 1, an adhesive consisting of 0 parts and 47120 parts of methyl alcohol was applied to one side of a steel foil having a thickness of 0.035 gg.
0 y7rpr, 37.5fl/ for Example 2
ln', 55p7 for Example 3, 10 f/17/ for Comparative Example 1, 65 f for Comparative Example 2
A double-sided copper-clad laminate with a thickness of 0.8H was obtained by lamination-molding the laminates each having a copper foil coated with an adhesive layer at a molding pressure of 100 k4/c and 160°C for ω minutes. .

The performance of the laminates of Examples 1 to 3 and Comparative Examples 1 and 2 was the first.
It looks like a table.

Table 1 The present invention is constructed as described above. The method for manufacturing a laminate having the nine configurations described in claim 1 has the effect of reducing warpage.

Claims (1)

[Claims] (1) Apply an adhesive mainly composed of epoxy resin to copper foil on the upper and/or lower surfaces of the required number of resin-impregnated base materials stacked on top of each other.
A method for manufacturing a laminate, which comprises laminating and molding a laminate on which copper foil with an adhesive layer coated at ~60 g/m^2 is provided to obtain a laminate having a thickness of 1.2 mm or less.