JPH01222955A - Manufacture of laminated plate - Google Patents
Manufacture of laminated plateInfo
- Publication number
- JPH01222955A JPH01222955A JP5048088A JP5048088A JPH01222955A JP H01222955 A JPH01222955 A JP H01222955A JP 5048088 A JP5048088 A JP 5048088A JP 5048088 A JP5048088 A JP 5048088A JP H01222955 A JPH01222955 A JP H01222955A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- bending distortion
- paper
- paper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000005452 bending Methods 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、打抜き加工性に優ｎた積層板の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a laminate with excellent punching workability.
（従来の技術と発明が解決しようとする課題）最近、電
子機器に便用されるプリント配線板は、高密度化に伴っ
て非常に複雑なパターン形状となり、異形穴の多い集合
基板化が進んでいる。(Problems to be solved by conventional technology and inventions) Recently, printed wiring boards commonly used in electronic devices have become extremely complex in pattern shape as the density has increased, and there has been an increase in the use of assembled boards with many irregularly shaped holes. I'm here.
異形穴加工で（裏基板に大きな歪が生じ、基板の端面及
び異形穴の端面等の表層に割れが発生し１回路を切断す
る等の問題が起きる。When machining irregularly shaped holes (large distortion occurs on the back board, cracks occur on the surface layer such as the end face of the board and the end face of the irregularly shaped hole, and problems such as disconnection of one circuit occur).
従来、空間クラック、眉間剥離等の打抜き加工性は、樹
脂を可撓化し低弾性率化することで良好となることが知
らｎている。しかし、異形穴加工に際して発生する表層
割れについては対策がない。Conventionally, it has been known that punching processability such as spatial cracks and peeling between the eyebrows can be improved by making the resin flexible and lowering the elastic modulus. However, there is no countermeasure against surface cracks that occur when drilling irregularly shaped holes.
（１！！題を解決するための手段）
本発明者は、以上の課題にかんがみて検討の結果次の発
明を得た。(1!!Means for solving the problem) The present inventor obtained the following invention as a result of studies in view of the above problems.
本発明は、紙基材に樹脂を所定量含浸したプ ・リ
プレグを数枚重ね合わせて成形する積層板において、そ
の積層板の曲げ歪が五７％以下となるように紙基材を選
択することを特徴とするものである。In the present invention, in a laminate formed by stacking several sheets of pre-preg in which a paper base material is impregnated with a predetermined amount of resin, the paper base material is selected so that the bending strain of the laminate is 57% or less. It is characterized by this.
次に本発明の詳細な説明する。使用する紙基材は、成形
した積層板の曲げ歪が五７％以下となるように紙基材を
選択する。ｄセルロース分が９５％以上のリンター紙、
クラフト紙等を単独で使用すると、曲げ歪が五７％を越
えることがあるので、紙基材の構成を選ぶ必要がある。Next, the present invention will be explained in detail. The paper base material used is selected so that the bending strain of the formed laminate is 57% or less. dLinter paper with a cellulose content of 95% or more,
If kraft paper or the like is used alone, the bending strain may exceed 57%, so it is necessary to select the structure of the paper base material.
使用する樹脂は、フェノール樹脂、エボギシ樹脂、不飽
和ポリエステル樹脂、ボリイばド樹脂とする。樹脂を可
塑剤等で変性すると弾性率は低くなり曲げ歪を工大きく
なること、あるいは樹脂の単独または混合によって曲げ
歪が変わることを利用して、樹脂によって曲げ歪を調整
することができる。The resins to be used are phenol resin, ebogishi resin, unsaturated polyester resin, and polyamide resin. The bending strain can be adjusted by the resin by utilizing the fact that when the resin is modified with a plasticizer or the like, the modulus of elasticity is lowered and the bending strain becomes larger, or that the bending strain changes depending on whether resins are used alone or in combination.
（作用）
本発明によって、表層割ｊＬがないために、打抜き加工
あるいは外形加工でのせん断加工を速やかに行いうる。(Function) According to the present invention, since there is no surface layer splitting jL, punching or shearing in contour processing can be performed quickly.
（実施例）
αセルロース８７％のクラフト紙に桐油変性率５４％の
２エノール樹脂を含浸乾燥して基材とし、これを７枚と
接着剤付鋼箔１枚とを組付わせて摩さ１．６市の片面Ｈ
４張積層板を得た。(Example) Kraft paper with 87% α-cellulose was impregnated with 2-enol resin with 54% tung oil modification rate and dried, used as a base material, and seven sheets of this and one sheet of steel foil with adhesive were assembled and polished. 1.6 city single side H
A 4-layer laminate was obtained.
こ１ｔ−ＪＩＳ Ｃ６４８１によって曲げ試鋏を行い
、曲げ歪の値２．８％を得た。その打抜き加工性も併せ
表１に示す。A bending test was performed according to JIS C6481, and a bending strain value of 2.8% was obtained. The punching workability is also shown in Table 1.
（比叔例）
αセルロース９５％のりンター紙に桐油変性″４３２％
の２エノール樹脂を含浸乾燥して基材とし、ζｎを７枚
と接漕剤付鋼陥１枚とを組付わせて厚さ１． （Ｓ １
１１０１の片面鋼張積層板を得た。(Comparative example) 95% alpha cellulose linter paper modified with tung oil 432%
A base material was obtained by impregnating and drying 2 enol resins, and then assembling 7 sheets of ζn and 1 sheet of steel with a wetting agent to form a base material with a thickness of 1. (S 1
A single-sided steel clad laminate of No. 1101 was obtained.
実施例と同じ方法で得た曲げ歪の値は４．０％てあった
。その打抜き加工性も併せ表１に示す。The bending strain value obtained by the same method as in the example was 4.0%. The punching workability is also shown in Table 1.
表１
（発明の効果）
本発明によって、打抜き加工で表層割れを発生すること
がない積１−板を得た。Table 1 (Effects of the Invention) According to the present invention, a laminated board without surface cracking during punching was obtained.
Claims (1)
わせて成形する積層板において、その積層板の曲げ歪が
３．７％以下となるように紙基材を選択することを特徴
とする積層板の製造方法。A laminate formed by stacking several sheets of prepreg in which a paper base material is impregnated with a predetermined amount of resin, characterized in that the paper base material is selected so that the bending strain of the laminate is 3.7% or less. Method of manufacturing laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5048088A JPH01222955A (en) | 1988-03-03 | 1988-03-03 | Manufacture of laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5048088A JPH01222955A (en) | 1988-03-03 | 1988-03-03 | Manufacture of laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01222955A true JPH01222955A (en) | 1989-09-06 |
Family
ID=12860071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5048088A Pending JPH01222955A (en) | 1988-03-03 | 1988-03-03 | Manufacture of laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01222955A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7371425B2 (en) | 2003-05-16 | 2008-05-13 | Cinvention Ag | Method for coating substrates with a carbon-based material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595527A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Manufacture of laminate plate |
| JPS55164152A (en) * | 1979-06-08 | 1980-12-20 | Matsushita Electric Works Ltd | Copper lined laminated plate |
| JPS58116146A (en) * | 1981-12-29 | 1983-07-11 | 松下電工株式会社 | Manufacture of copper lined laminated board |
| JPS6032655A (en) * | 1983-08-02 | 1985-02-19 | 鐘淵化学工業株式会社 | One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof |
-
1988
- 1988-03-03 JP JP5048088A patent/JPH01222955A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595527A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Manufacture of laminate plate |
| JPS55164152A (en) * | 1979-06-08 | 1980-12-20 | Matsushita Electric Works Ltd | Copper lined laminated plate |
| JPS58116146A (en) * | 1981-12-29 | 1983-07-11 | 松下電工株式会社 | Manufacture of copper lined laminated board |
| JPS6032655A (en) * | 1983-08-02 | 1985-02-19 | 鐘淵化学工業株式会社 | One-surface metallic foil lined laminated board having improved warpage characteristic and manufacture thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7371425B2 (en) | 2003-05-16 | 2008-05-13 | Cinvention Ag | Method for coating substrates with a carbon-based material |
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