JPH01225517A - Manufacture of laminate - Google Patents

Manufacture of laminate

Info

Publication number
JPH01225517A
JPH01225517A JP5183188A JP5183188A JPH01225517A JP H01225517 A JPH01225517 A JP H01225517A JP 5183188 A JP5183188 A JP 5183188A JP 5183188 A JP5183188 A JP 5183188A JP H01225517 A JPH01225517 A JP H01225517A
Authority
JP
Japan
Prior art keywords
resin
thickness
cushioning material
laminates
constituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5183188A
Other languages
Japanese (ja)
Other versions
JPH0661786B2 (en
Inventor
Masato Matsuo
松尾 正人
Shigeaki Kojima
小島 甚昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5183188A priority Critical patent/JPH0661786B2/en
Publication of JPH01225517A publication Critical patent/JPH01225517A/en
Publication of JPH0661786B2 publication Critical patent/JPH0661786B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06Platens or press rams
    • B30B15/061Cushion plates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent defective molding of laminates by using a metal plate of given thickness when laminated material constituted of a resin impregnated base material and metallic foils is laminate molded by using metal plates, a cushioning material and a carrier plate. CONSTITUTION:Phenol resin, epoxy resin, fluorine resin or the like is used alone or used in the form of a mixture or the like as the resin for a resin impregnated base material, and woven cloth constituted of inorganic fibers, synthetic fibers and natural fibers, non-woven cloth or paper, or else combination of said materials is used as the base material, while copper, aluminum or the like is used for metallic foils. Iron, aluminum, copper or the like is used alone, as alloy or a composite product as a metal plate having a thickness of four times more of thickness unevenness of a cushioning material. An elastic material such as rubber, synthetic resin, paper, cloth, a plate or the like is used for the cushioning material. A plurality of units of laminates constituted of resin impregnated base materials and metallic foils are inserted between metal plates and overlapped, outside of which a carrier plate is provided through a cushioning material. The thickness unevenness of the cushioning material can be absorbed by the metallic plates by inserting the whole of said material units between platens and pressurizing and heating to prevent the laminates from getting uneven pressure and temperature.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は?!気機器、計算機器、通信機器等に用いられ
る電気用積層板の製造方法に関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] What is the present invention? ! The present invention relates to a method of manufacturing electrical laminates used for electrical equipment, computing equipment, communication equipment, etc.

〔従来の技術〕[Conventional technology]

従来、電気用積層板は樹脂含浸基材、金属箔からなる積
層体を金属プレートに挾んだものを1〜迅組重ねた外側
にクッション材を介してキャリア板を酎し熱盤間に挾み
加熱加圧積層成形して得られるものであるが、クツシラ
ン材としては紙、樹脂板、樹脂含浸紙布等を用いている
が厚みムラが5〜2G96あった。
Conventionally, electrical laminates have been made by laminating a laminate consisting of a resin-impregnated base material and metal foil sandwiched between metal plates, which is layered one or more times, with a carrier plate placed on the outside via a cushioning material, and then sandwiched between hot plates. Although paper, resin board, resin-impregnated paper cloth, etc. were used as the silica material, the thickness was uneven in the range of 5 to 2G96.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の技術で述べたようにクツシロン材として紙、樹脂
板、樹脂含浸紙布等を用いるとクツVラン性はよいが厚
みムラにより積層体への圧力不均一、温度不均一が発生
し、積層板にカスレ等の成形不良を発生する。本発明は
従来の技術における上述の問題点に鑑みてなされたもの
で、その目的とするところは、成形不良のない電気用積
層板の製造方法を提供することにある。
As described in the conventional technology, when paper, resin board, resin-impregnated paper cloth, etc. are used as the shoelace material, V-run properties are good, but due to uneven thickness, uneven pressure and temperature on the laminate occur, and the lamination Molding defects such as scratches occur on the plate. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a method of manufacturing an electrical laminate without forming defects.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は樹脂含浸基材、金属箔からなる積1体を金属デ
V−ト、クツシロン材、キャリア板を用いて積層成形す
るに際し、クフVWン材厚みムラの4倍以上の厚みを有
する金属プレートを用いることを特徴とする積層板の製
造方法のため、クランラン材に起因する不良発生原因を
金属プレートで吸収してしまい成形不良をなくすること
ができたもので、以下本発明を詳mrtc説明する。
In the present invention, when a laminated body consisting of a resin-impregnated base material and metal foil is laminated and molded using a metal V-det, a cut-off material, and a carrier plate, a metal having a thickness that is four times or more than the thickness unevenness of the Kufu VW material is used. Since the manufacturing method of the laminate is characterized by using plates, the causes of defects caused by Cranlan material are absorbed by the metal plates, and molding defects can be eliminated.The present invention will be described in detail below. explain.

本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステ〃樹脂、メフミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ポリスルフォン、
ポリフェニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
セトン、シクロヘキサノン、スチレン等のr6謀を添加
したもので、基材としては、ガラス、アスベスト等の無
機繊維やポリエステル、ポリアミド、ポリビニルアルコ
ール、アクリル等の有機合成繊維や木綿等の天然繊維か
らなる織布、不織布、マット或は紙又はこれらの組合せ
基材等である。金属箔としては銅、アルミニウム、鉄、
ニッケル、亜鉛等の単独、合金、複合品であシ、必要に
応じて接着面を化学処理及び又は物理処理し更に必要に
応じて接着剤層を設けたものである。金属プレートとし
ては厚さ1〜10 Wの鉄、アルミニウム、銅、ニッケ
ル等の単独、合金、複合品であシ、必要に応じて表面に
離型層を設けることができるがクツシロン材厚みムラの
4倍以上の厚みを有するものであることが必要である。
Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, mefmin resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, R6 such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. is used to adjust the viscosity. The base material is woven fabric, non-woven fabric, mat, or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. Or a combination base material etc. of these. Metal foils include copper, aluminum, iron,
It can be made of nickel, zinc, etc. alone, an alloy, or a composite product, and if necessary, the adhesive surface is chemically and/or physically treated, and an adhesive layer is further provided if necessary. The metal plate may be made of iron, aluminum, copper, nickel, etc. alone, alloy, or composite with a thickness of 1 to 10 W. If necessary, a release layer may be provided on the surface, but the thickness of the material may be uneven. It is necessary that the thickness is four times or more.

クツシロン材としてはゴム、合成樹脂、紙、布、板、合
板、樹脂含浸紙布のように弾性を存するものであればよ
く、厚みは工〜10IIIIであることが好ましい。キ
ャリア板については通常のものをそのまま用いることが
できる。
The rubber material may be any elastic material such as rubber, synthetic resin, paper, cloth, board, plywood, or resin-impregnated paper cloth, and preferably has a thickness of 1 to 10 mm. As for the carrier plate, a normal one can be used as is.

以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.

実施例1 厚さ0.2Nのがラス布に、エポキシ樹脂(シェル化学
株式会社與、品名エピコート10013100重量部(
以下単に部と記す)、ジシアンジアミド4部、ベンジ〜
ジメチルアミン0.2部、メチルオキシド−/l’10
0部からなるエポキシ樹脂フェスを、乾燥後樹脂量がω
重量%(以下単に%と記すンになるように含浸、乾燥し
て得た樹脂金&基材7枚の上、下面に厚さ0.035 
ewの銅箔を夫々配設した積層体を厚さ51nlのステ
ンレス鋼製金属プレートに挾んだものを10組重ねた外
側に厚みムラI RHの厚さ10 flのクフフト紙り
ツシーン材を介し厚さ5nの鉄製キャリア板を配設して
から熱盤間に挾み、成形圧力40 kg/cd、165
℃で120分間積層成形して10枚の厚さ1.6jFl
の両面鋼張積層板を得た。
Example 1 100 parts by weight of epoxy resin (manufactured by Shell Chemical Co., Ltd., product name: Epicoat 10013) was applied to a 0.2N thick lath cloth.
(hereinafter simply referred to as parts), 4 parts of dicyandiamide, benzene~
Dimethylamine 0.2 parts, methyl oxide -/l'10
After drying the epoxy resin face consisting of 0 parts, the resin amount is ω
Resin gold obtained by impregnating and drying so that weight % (hereinafter simply written as %) and 7 base materials with a thickness of 0.035
Ten sets of laminates each having copper foil of EW sandwiched between 51nl thick stainless steel metal plates were stacked on the outside with uneven thickness IRH through a 10fl thick Khufuft paper Tsushin material. After placing a 5n thick iron carrier plate, it was sandwiched between hot platens, and the molding pressure was 40 kg/cd, 165
Laminated and molded at ℃ for 120 minutes to make 10 sheets with a thickness of 1.6jFl
A double-sided steel clad laminate was obtained.

実施例2 クッション材として厚みムラ0.6flの厚さ2uの弗
素樹脂含浸布を用い、金属プレート厚みを4nにした以
外は実施例1と同様に処理して両面鋼張積層板を得た。
Example 2 A double-sided steel-clad laminate was obtained in the same manner as in Example 1, except that a 2U fluororesin-impregnated cloth with a thickness unevenness of 0.6fl was used as the cushioning material, and the metal plate thickness was 4n.

比較例! クツシロン材として厚みムラ181の厚さ1oarat
のクラフト紙りッシ曹ン材を用い、金属プレート厚みを
3all1gにした以外は実施例1と同様に処理して両
面鋼張積層板を得た。
Comparative example! Thickness 1 oarat with thickness unevenness of 181 as Kutsushiron material
A double-sided steel-clad laminate was obtained in the same manner as in Example 1, except that the kraft paper and carbon material was used and the thickness of the metal plate was 3 all 1 g.

比較例2 クツシロン材として厚みムラ0.6 Bの厚さ2nの弗
素樹脂含浸布を用い、金属プレート厚みを2nにした以
外は実施例1と同様に処理して両面銅張積層板を得た。
Comparative Example 2 A double-sided copper-clad laminate was obtained in the same manner as in Example 1, except that a fluororesin-impregnated cloth with a thickness unevenness of 0.6 B and a thickness of 2n was used as the shoelace material, and the metal plate thickness was changed to 2n. .

実施例1と2及び比較例1と2の積層板の成形不良発生
率は第1表のようである。
Table 1 shows the molding defect occurrence rates of the laminates of Examples 1 and 2 and Comparative Examples 1 and 2.

第1表 〔発明の効果〕 本発明は上述した如く構成されている。特許請求の範囲
第1項に記載した構成を有する積層板の製造方法におい
ては、積層板の成形不良率が大巾に低下する効果を有し
ている。
Table 1 [Effects of the Invention] The present invention is constructed as described above. The method for manufacturing a laminate having the configuration described in claim 1 has the effect of significantly reducing the molding defect rate of the laminate.

Claims (1)

【特許請求の範囲】[Claims] (1)樹脂含浸基材、金属箔からなる積層体を金属プレ
ート、クッション材、キャリア板を用いて積層成形する
に際し、クッション材厚みムラの4倍以上の厚みを有す
る金属プレートを用いることを特徴とする積層板の製造
方法。
(1) When forming a laminate consisting of a resin-impregnated base material and metal foil using a metal plate, cushioning material, and carrier plate, a metal plate having a thickness four times or more than the thickness unevenness of the cushioning material is used. A method for manufacturing a laminate.
JP5183188A 1988-03-04 1988-03-04 Laminated board manufacturing method Expired - Fee Related JPH0661786B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5183188A JPH0661786B2 (en) 1988-03-04 1988-03-04 Laminated board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5183188A JPH0661786B2 (en) 1988-03-04 1988-03-04 Laminated board manufacturing method

Publications (2)

Publication Number Publication Date
JPH01225517A true JPH01225517A (en) 1989-09-08
JPH0661786B2 JPH0661786B2 (en) 1994-08-17

Family

ID=12897814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5183188A Expired - Fee Related JPH0661786B2 (en) 1988-03-04 1988-03-04 Laminated board manufacturing method

Country Status (1)

Country Link
JP (1) JPH0661786B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114193899A (en) * 2020-09-18 2022-03-18 株式会社日本制钢所 Lamination molding pressing device, lamination molding system and lamination molding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114193899A (en) * 2020-09-18 2022-03-18 株式会社日本制钢所 Lamination molding pressing device, lamination molding system and lamination molding method

Also Published As

Publication number Publication date
JPH0661786B2 (en) 1994-08-17

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