JPS6163443A - Manufacture of laminated sheet - Google Patents

Abstract

PURPOSE:To constitute the titled laminated sheet so that creases are not generated on a joint part, by a method wherein an adhesive agent is applied in a slitlike state to the joint between base materials in continuous lengths, through which bonding and connection are performed. CONSTITUTION:An adhesive agent is applied in a slitlike state to a joint between base materials in continuous lengths and bonding and connection are performed in the slitlike state, in a manufacturing method of a laminated sheet to be constituted by laminating and molding laminated materials obtained by mounting a metallic foil according to necessity either on the top or bottom of an article obtained by laminating necessary sheets of base materials impregnated with resin which is obtained by impregnating the base materials in continuous lengths with resin varnish and drying the same. In other words, an adhesive agent is applied to the joint so that a slit of unbonded part whose width is 1-10mm at intervals of 1-100mm can be prepared. If the interval is less than 1mm the joint is separated from each other as the bonding and connection of the joint is insufficient. When the interval exceeds 100mm, nonbonded part becomes little and it becomes impossible to absorb a distortion. In addition to the above, when the width of the slit is less than 1mm, it is hard to absorb the distortion and when it exceeds 10mm, the bonding and connection of the joint is separated from each other.

Description

[Detailed description of the invention] [Technical field] Book f! The present invention relates to a method for manufacturing laminates used in magnetic devices, secondary devices for computers, communication systems, etc.

[Currency technology]

Conventionally, in the study of laminates, elongated substrates were treated with varnish and dried mulberry (1i: r varnish was impregnated with θ and dried mulberry). The joints between the two are connected using a screen tape coated with a thermosetting resin adhesive, a resistant polyester tape, or a night hardening oil adhesive coated, and then further glued. Zo to make the degree ditto.

Heat pressure at ~250°C 41. However, during crimping, the adhesive rots due to curing shrinkage of the thermosetting resin adhesive, and the tree 1
When it was impregnated with back varnish, the cedar sloughed up and wrinkled at the seams due to the difference in shrinkage f, and the resin-impregnated base material on side H'8 of the seam was found to be defective and was discarded. It is something.

[Defined: Purpose of ILl]

The object of the invention is to provide a method for producing an H1 layer plate that does not cause wrinkles at the joint between the long substrates.
It is something to do.

[Development of invention]

Wood opening #1 is a long base material impregnated with resin varnish, dried 1U resin-impregnated base material stacked in the required number of sheets, metal foil is placed on the top and/or bottom surface as necessary, and a laminate is bonded. ) DS
E ff < l, in the method for manufacturing a laminate, applying an adhesive to the joint 1ζ slit shape between the elongated base materials and adhesively connecting them in the slit shape Mi
Due to the manufacturing method of the Q4 board, there are unbonded parts at a predetermined interval in the joint part, so the strain caused by curing and shrinkage at the bonded part can be absorbed, and the impregnation process eliminates wrinkles even in diameter.J)
The present invention will be explained in detail below.

The long paulownia wood used for Mizumoto is glass and asbestos tiles. Polyester and polyac IJ
7, polyhini Ishia Ishij -
1, the active synthesis of polyalyl, etc. +
A mounting surface made of natural cotton f1G such as f-shin or cotton.

It is possible to use a nonwoven fabric, matte, paper, or a sweetened base material thereof, but it is more effective and desirable to apply it to a thick paper base material that absorbs the resin varnish during impregnation. It is. #As a fat varnish, phenol 4p fat,
A wide range of products including cresol resin, epoxy resin, SYFUU polynisdel resin, melamine resin-polyimide, polypudadiene, polyamide, polyamideimide, polyM phone, polybutylene terephthalate, polyether di-reketone, fluoride resin, etc. , modified substances, mixtures, etc. are used to adjust the viscosity as necessary. Recole, Pseton, Cyclo to Sanon, Styrene'J (7
) This is an amendment or addition to Molten K. Copper foil is a good metal foil! Reminium, stainless steel foil, nickel
Foil 4 can be used and is not particularly limited.

The adhesive is not particularly limited as long as it is an adhesive whose main component is thermosetting A≠ fat, but it is necessary to apply the adhesive in the form of slits, preferably 1 to 10
It is desirable to apply the product so that slits in the unhaired area are formed at intervals of 0.01 and widths of 1 to 10. In other words, if the distance is less than 1 m, the adhesive connection at the seam will be insufficient and the first piece will tend to separate, and if the distance exceeds 1 m, there will be less unbonded parts and there will be no strain absorption. . Also, if the slit width is less than 1 silk, it is difficult to absorb strain, and if it exceeds [Qff], the adhesive connection at the seam tends to separate.

The direction of the slits and ends is preferably 90 degrees with respect to the seam, but is not particularly limited.

The present invention will be explained below using examples. ) Example 1 The unbonded part of width 21 was removed with a thermosetting resin adhesive at the seam of a long sheet of paper material with a thickness of 0.2 silk and a width of 1050 ff1l+.

The resin was coated so that the particles were spaced at 90 mm intervals, heat-pressed at 170°C, and then impregnated with phenol/L/resin so that the amount of resin was approximately 50 mm, and dried to obtain a resin-impregnated base material. A laminate in which six sheets of the resin-impregnated base materials were stacked and a copper foil with adhesive of 0.035 mm thick was placed on the bottom surface was molded under a molding pressure of 100 K (
J/Cd, laminate molding was performed at 160°C for 60 minutes and the laminate was rolled.

Example 2 The seam of a long glass cloth base material with a thickness of 0.2cm and a medium size of 10501ffj+ was glued with a thermosetting resin adhesive so that the slits in the unbonded part with a width of 8M were placed at 2 silk intervals, and heated at 175°C. After heat-compression bonding, 4 resins are added to the hardening agent-containing ebogishi resin varnish.
Seven resin-impregnated substrates obtained by impregnating and drying to a concentration of 5% by weight were layered, and copper scraps with a thickness of 0.035 r were placed on the lower surface, forming a laminate at a molding pressure of 5 ol Vq/d.

The cedar was laminated at 170° C. for 90 minutes to obtain an i-board.

Conventional Examples 1 and 2 Laminated plates were obtained in the same manner as in Examples 1 and 2, except that the joints were bonded over the entire surface.

〔Effect of the invention〕

Regarding the performance of the laminates of Examples 1 and 2 and Conventional Examples 1 and 2, in Examples 1 and 2 there were no wrinkles in the resin-impregnated base material around the seams, and the production efficiency was significantly improved, but in Conventional Examples 1 and 2, the production efficiency was significantly improved. 2
In this case, the laminate was wrinkled in a 10 m area at the front and back, centering on the seam, making it unusable, confirming the superiority of the method for manufacturing the laminate of the present invention.

Claims (1)

[Claims] (1) A laminate formed by laminating and molding a laminate in which a required number of elongated base materials are impregnated with resin varnish and dried, and metal foil is placed on the upper and/or lower surfaces as necessary. 1. A method for producing a laminate, characterized in that adhesive is applied in the form of slits to the joints between the elongated base materials, and the adhesive is connected in the form of slits.